JP2914653B2 - Electronic device and printed circuit board fixing method - Google Patents

Electronic device and printed circuit board fixing method

Info

Publication number
JP2914653B2
JP2914653B2 JP10888496A JP10888496A JP2914653B2 JP 2914653 B2 JP2914653 B2 JP 2914653B2 JP 10888496 A JP10888496 A JP 10888496A JP 10888496 A JP10888496 A JP 10888496A JP 2914653 B2 JP2914653 B2 JP 2914653B2
Authority
JP
Japan
Prior art keywords
substrate
holder
fixing
case
screw
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP10888496A
Other languages
Japanese (ja)
Other versions
JPH09293979A (en
Inventor
朋美 松下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Ten Ltd
Original Assignee
Denso Ten Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Ten Ltd filed Critical Denso Ten Ltd
Priority to JP10888496A priority Critical patent/JP2914653B2/en
Publication of JPH09293979A publication Critical patent/JPH09293979A/en
Application granted granted Critical
Publication of JP2914653B2 publication Critical patent/JP2914653B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は電子機器及びプリン
ト基板の固定方法に関し、より詳細には電子部品が実装
された複数枚のプリント基板が装備された電子機器及び
これらプリント基板をケース内に一体的に固定するプリ
ント基板の固定方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device and a method for fixing a printed circuit board, and more particularly, to an electronic device equipped with a plurality of printed circuit boards on which electronic components are mounted, and integrating these printed circuit boards in a case. The present invention relates to a method of fixing a printed circuit board to be fixed.

【0002】[0002]

【従来の技術】従来のこの種電子機器の一例を図2及び
図3に示す。
2. Description of the Related Art FIGS. 2 and 3 show an example of a conventional electronic device of this type.

【0003】図中、30は表ケースを示しており、表ケ
ース30には裏ケース40が嵌合され、これら表ケース
30と裏ケース40とにより形成される空間内に下基板
32、中基板34、及び上基板37が固定的に収納され
ている。
In FIG. 1, reference numeral 30 denotes a front case, and a back case 40 is fitted into the front case 30, and a lower substrate 32 and a middle substrate are provided in a space formed by the front case 30 and the back case 40. 34 and the upper substrate 37 are fixedly accommodated.

【0004】表ケース30は長方形板形状の前面部30
a及び前面部30aに対して略垂直方向に延設された枠
部30bから成り、枠部30bの先端部には段部30c
が形成されている。また前面部30a内側面の対向する
2箇所には略円柱形状をしたケース固定用ボス部30d
が突出形成され、ケース固定用ボス部30dの外側面に
はねじ用凹部30eが形成され、前面部30a内側面の
角部近傍4箇所には略円柱形状をした下基板固定用ボス
部30fが突出形成され、下基板固定用ボス部30fの
外側面にはねじ用凹部30gが形成され、さらにこれら
下基板固定用ボス部30fの中心寄り4箇所には下基板
固定用ボス部30fよりも高さの高い中基板固定用支柱
30hが突出形成されている。中基板固定用支柱30h
の上部にはそれぞれねじ孔30iが形成されている。
The front case 30 has a rectangular plate-shaped front part 30.
a and a frame portion 30b extending substantially perpendicularly to the front surface portion 30a, and a step portion 30c is provided at the tip of the frame portion 30b.
Are formed. A substantially cylindrical case fixing boss portion 30d is provided at two opposing positions on the inner side surface of the front portion 30a.
A screw recess 30e is formed on the outer surface of the case fixing boss 30d, and a substantially columnar lower substrate fixing boss 30f is formed at four locations near the corners on the inner surface of the front surface 30a. The lower substrate fixing boss portion 30f has a screw recess 30g formed on the outer surface of the lower substrate fixing boss portion 30f, and four lower portions of the lower substrate fixing boss portion 30f closer to the center are higher than the lower substrate fixing boss portion 30f. A tall middle substrate fixing post 30h is formed to protrude. Post 30h for fixing the middle board
The screw holes 30i are formed in the upper part of each.

【0005】下基板32にはケース固定用ボス部30d
に対応する箇所に2個のケースボス逃げ孔32aが形成
され、また下基板固定用ボス部30fに対応して4個の
固定ねじ挿通孔32bが形成され、さらに中基板固定用
支柱30hを貫通させるための4個の支柱貫通孔32c
が形成され、これらケースボス逃げ孔32a、固定ねじ
挿通孔32b、支柱貫通孔32cを避けてプリント配線
(図示せず)が形成され、LSI等の電子部品(図示せ
ず)が両面実装されている。
The lower substrate 32 has a case fixing boss 30d.
, Two case boss escape holes 32a are formed at locations corresponding to the above, four fixing screw insertion holes 32b are formed corresponding to the lower substrate fixing boss portion 30f, and further penetrate the middle substrate fixing post 30h. Four pillar through holes 32c
A printed wiring (not shown) is formed avoiding the case boss escape hole 32a, the fixing screw insertion hole 32b, and the support column through hole 32c, and an electronic component (not shown) such as an LSI is mounted on both sides. I have.

【0006】中基板34には角部近傍に中基板固定用支
柱30hに対応して4個のねじ挿通孔34aが形成され
ている。
[0006] Four screw insertion holes 34a are formed near the corners of the middle substrate 34 so as to correspond to the middle substrate fixing columns 30h.

【0007】上基板37にはケース固定用ボス部30d
に連結される中継用ボスねじ41に対応して2個のケー
スボス逃げ孔37aが形成され、また下基板固定用ボス
部30fに連結される中継用ボスねじ38に対応して4
個のねじ挿通孔37bが形成されている。
The upper substrate 37 has a case fixing boss 30d.
Two case boss relief holes 37a are formed corresponding to the relay boss screw 41 connected to the lower board fixing boss screw 41, and four case boss relief holes 37a are formed corresponding to the relay boss screw 38 connected to the lower substrate fixing boss portion 30f.
A plurality of screw insertion holes 37b are formed.

【0008】裏ケース40は長方形板形状の本体40a
及び本体40aに対して略垂直方向に延設された枠部4
0bから成り、枠部40bの先端部には段部40cが形
成されている。またケース固定用ボス部30dに対向す
る2箇所には中継用ボスねじ41の一端部を固定するた
めのボスねじ支持部40dが形成されている。
The back case 40 has a rectangular plate-shaped main body 40a.
And a frame 4 extending substantially perpendicular to the main body 40a.
0b, and a step portion 40c is formed at the tip of the frame portion 40b. Further, boss screw support portions 40d for fixing one end of the relay boss screw 41 are formed at two places facing the case fixing boss portion 30d.

【0009】そしてこれら表ケース30、裏ケース4
0、下基板32、中基板34、及び上基板37を一体的
に組立てる際には、まず表ケース30上に下基板32を
位置合せし、下基板固定用ボス部30fのねじ用凹部3
0gに下基板固定ねじ43を挿入し、下基板固定ねじ4
3に対応させて中継用ボスねじ38を配置し、下基板3
2を表ケース30にねじ止め固定する。次に、中基板固
定用支柱30h上に中基板34を位置合せし、中基板3
4の上方から中基板固定ねじ44をねじ孔30iに螺合
させて中基板34を表ケース30に固定する。
The front case 30 and the back case 4
When assembling the lower substrate 32, the middle substrate 34, and the upper substrate 37 integrally, the lower substrate 32 is first positioned on the front case 30, and the screw recess 3 of the lower substrate fixing boss 30f is formed.
0g, the lower substrate fixing screw 43 is inserted.
3 and the relay boss screw 38 is arranged corresponding to the lower substrate 3.
2 is fixed to the front case 30 with screws. Next, the middle board 34 is positioned on the middle board fixing support 30h, and the middle board 3 is fixed.
4, the middle substrate fixing screw 44 is screwed into the screw hole 30 i from above to fix the middle substrate 34 to the front case 30.

【0010】次に、表ケース30に固定された中継用ボ
スねじ38に対し、上基板37のねじ挿通孔37bを位
置合せし、上基板固定ねじ45を中継用ボスねじ38の
ねじ孔38aに螺合させ、上基板37を中継用ボスねじ
38を介して表ケース30に固定する。そして最後に表
ケース30のねじ用凹部30eにケース固定ねじ42を
挿入し、段部30cと段部40cとを嵌合させ、裏ケー
ス40に固定しておいた中継用ボスねじ41にケース固
定ねじ42を螺合させて表ケース30と裏ケース40と
の一体化を図る。
Next, the screw insertion hole 37b of the upper substrate 37 is aligned with the relay boss screw 38 fixed to the front case 30, and the upper substrate fixing screw 45 is inserted into the screw hole 38a of the relay boss screw 38. The upper substrate 37 is fixed to the front case 30 via the relay boss screw 38. Finally, the case fixing screw 42 is inserted into the screw recess 30 e of the front case 30, the step 30 c and the step 40 c are fitted, and the case is fixed to the relay boss screw 41 fixed to the back case 40. The front case 30 and the back case 40 are integrated by screwing the screws 42 together.

【0011】[0011]

【発明が解決しようとする課題】上記した従来の電子機
器及びプリント基板の固定方法にあっては、以下に示す
ような課題があった。
The above-mentioned conventional electronic equipment and printed circuit board fixing method have the following problems.

【0012】すなわち、下基板32、中基板34、上基
板37の固定、表ケース30と裏ケース40との一体化
には多くのねじ(4個の下基板固定ねじ43、4個の中
基板固定ねじ44、4個の上基板固定ねじ45、及び2
個のケース固定ねじ42)が使用されており、ねじ締め
工数が多くて組み立てに手間取る。
That is, many screws (four lower substrate fixing screws 43 and four middle substrate fixing screws 43) are used to fix the lower substrate 32, the middle substrate 34, and the upper substrate 37, and to integrate the front case 30 and the rear case 40. Fixing screw 44, four upper board fixing screws 45, and 2
Since the case fixing screws 42) are used, the number of screw tightening steps is large, and the assembly takes time.

【0013】また、下基板32には2個のケースボス逃
げ孔32a、4個の固定ねじ挿通孔32b、及び4個の
支柱貫通孔32cが形成されており、電子部品の実装面
積及びプリント配線に使用できる面積が小さくなってお
り、電子機器の小型化、多機能化に不利となっている。
またプリント配線の引き回しに制約が多くなり、設計に
手間取るといった課題があった。
The lower substrate 32 is provided with two case boss escape holes 32a, four fixing screw insertion holes 32b, and four support through holes 32c, so that the mounting area of electronic components and printed wiring are provided. The area that can be used for electronic devices is small, which is disadvantageous for downsizing and multifunctional electronic devices.
In addition, there is a problem in that the layout of the printed wiring is more restricted, and it takes time to design.

【0014】本発明は上記課題に鑑みなされたものであ
って、大幅に組立て工程を削減することができ、またプ
リント基板における電子部品の実装可能面積及びプリン
ト配線可能面積を大幅に増やすことができ、電子機器の
小型化、多機能化を有利にし、パターン設計の自由度を
高めることができる電子機器及びプリント基板の固定方
法を提供することを目的としている。
SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and can greatly reduce the number of assembling steps, and can greatly increase the area where electronic components can be mounted on a printed circuit board and the area where printed wiring can be performed. It is an object of the present invention to provide an electronic device and a method for fixing a printed circuit board, which can advantageously reduce the size and multifunctionality of the electronic device and increase the degree of freedom in pattern design.

【0015】[0015]

【課題を解決するための手段及びその効果】上記目的を
達成するために、本発明に係る電子機器は、電子部品が
実装された複数枚のプリント基板がケース内に固定され
た電子機器において、表ケースには下基板の外周部を支
持する受けリブ、及び中基板を支持し、複数枚のプリン
ト基板を連結するホルダを固定するための支柱が形成さ
れ、下基板には前記支柱を貫通させる貫通孔が形成さ
れ、中基板の4隅部にはねじ止め用の貫通孔が形成さ
れ、上基板には前記ホルダを挿通させる挿通孔及び前記
ホルダを係止させる係止部が形成され、前記ホルダは前
記下基板の押え片、前記中基板の押え部、該押え部に形
成されたねじ挿通孔、二股部、前記上基板の係止部が嵌
合する係止溝、裏ケースの固定片、及び該固定片に形成
されたねじ孔を有すると共に弾性材により構成され、前
記裏ケースには複数個のねじ挿通孔、及び前記下基板押
えリブが形成されていることを特徴としている。
In order to achieve the above object, an electronic device according to the present invention is an electronic device in which a plurality of printed boards on which electronic components are mounted are fixed in a case. A support rib for supporting the outer peripheral portion of the lower board, and a support for supporting the middle board and fixing a holder for connecting a plurality of printed boards are formed in the front case, and the support is made to penetrate the lower board. A through hole is formed, a through hole for screwing is formed at four corners of the middle substrate, an insertion hole for inserting the holder and a locking portion for locking the holder are formed on the upper substrate, The holder includes a holding piece of the lower substrate, a holding portion of the middle substrate, a screw insertion hole formed in the holding portion, a forked portion, a locking groove into which the locking portion of the upper substrate is fitted, and a fixing piece of the back case. , And a screw hole formed in the fixing piece Are both composed of an elastic material, it is characterized in that a plurality of screw insertion holes, and the lower substrate holding ribs are formed in the back casing.

【0016】上記電子機器によれば、下基板に形成され
る貫通孔を例えば従来の10個から4個に、上基板に形
成される貫通孔を例えば従来の6個から2個に大幅に削
減することができる。従ってプリント基板における電子
部品の実装可能面積及びプリント配線可能面積を大幅に
増大させることができ、電子機器の小型化、多機能化を
有利にし、パターン設計の自由度を大幅に高めることが
できる。
According to the above electronic apparatus, the number of through holes formed in the lower substrate is greatly reduced from, for example, 10 to four, and the number of through holes formed in the upper substrate is reduced, for example, from six to two. can do. Therefore, the area in which the electronic components can be mounted and the area in which the printed wiring can be printed on the printed circuit board can be significantly increased.

【0017】また本発明に係る電子機器におけるプリン
ト基板の固定方法は、電子部品が実装された複数枚のプ
リント基板をケース内に固定する電子機器におけるプリ
ント基板の固定方法において、下基板に形成された貫通
孔に表ケースに形成された支柱を貫通させ、前記下基板
を前記表ケースに形成された受けリブで支持させる工
程、中基板を前記支柱の上面に置き、前記中基板の上か
らホルダを位置合せしてねじ止めし、該ホルダに形成さ
れた押え片により前記下基板を押え付けると共に前記中
基板を前記支柱上面に固定する工程、上基板に形成され
挿通孔に前記ホルダに形成された固定片を挿通させ、
前記上基板に形成された係止部を前記ホルダに形成され
係止溝に嵌合させて前記上基板を前記ホルダに係止さ
せる工程、及び裏ケースと前記表ケースとの位置合せを
行い、前記裏ケースのねじ挿通孔にねじを挿通させて前
記固定片のねじ孔に前記ねじを螺合させ、前記裏ケース
を前記ホルダに固定すると共に前記裏ケースに形成され
下基板押えリブにより前記下基板を押え付けて全体的
な一体化を図る工程を含んでいることを特徴としてい
る。
Further, according to the method of fixing a printed circuit board in an electronic device according to the present invention, a plurality of boards on which electronic parts are mounted are provided.
In electronic equipment that fixes the printed circuit board in the case,
In the method of fixing a printed circuit board, a step of passing a support formed on a front case through a through hole formed on a lower board and supporting the lower board with a receiving rib formed on the front case ; The holder is positioned over the middle substrate and screwed in place.
Pressing the lower substrate by the pressed holding pieces and fixing the middle substrate to the upper surface of the support , formed on the upper substrate
The fixing piece formed in the holder through the insertion hole,
An engaging portion formed on the upper substrate is formed on the holder.
Step locking groove to be fitted engaging the said substrate on the holder has, and performs alignment between the back casing and the table case, the fixed by inserting the screw into the screw insertion hole of the back casing The screw is screwed into one of the screw holes, the back case is fixed to the holder, and the back case is formed in the back case.
And a step of holding down the lower substrate by a lower substrate holding rib to achieve overall integration.

【0018】上記電子機器におけるプリント基板の固定
方法によれば、例えば従来14個のねじ締め工程が存在
していたのを6個のねじ締め工程にまで減少させること
ができ、大幅に組立て工程を削減してコストダウンを図
ることができる。
According to the method for fixing a printed circuit board in the above-mentioned electronic equipment, for example, the conventional process of 14 screw tightening steps can be reduced to 6 screw tightening steps. It is possible to reduce the cost and reduce the cost.

【0019】[0019]

【発明の実施の形態】以下、本発明に係る電子機器及び
プリント基板の固定方法の実施の形態を図面に基づいて
説明する。図1は実施の形態に係る電子機器を示した部
分断面分解斜視図であり、図中10は表ケースを示して
いる。表ケース10は長方形板形状をした前面部10a
と、この前面部10aに対して略垂直方向に延設された
枠部10bとから成り、前面部10aの内面外周部の所
定の8箇所には下基板12を支持するための四角柱形状
の小形の受けリブ10cが突出形成されている。また受
けリブ10cの形成位置よりも少し内側位置の四角部近
傍には中基板14を固定するための略円柱形状をした支
柱10dが突出形成され、支柱10dの上部にはねじ穴
(図示せず)が形成されている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an electronic apparatus and a method for fixing a printed circuit board according to the present invention will be described below with reference to the drawings. FIG. 1 is an exploded partial cross-sectional perspective view showing an electronic apparatus according to an embodiment. In FIG. 1, reference numeral 10 denotes a front case. The front case 10 has a rectangular plate-shaped front part 10a.
And a frame portion 10b extending substantially perpendicularly to the front surface portion 10a. At predetermined eight locations on the inner peripheral portion of the inner surface of the front surface portion 10a, there are formed quadrangular prisms for supporting the lower substrate 12. A small receiving rib 10c is formed to protrude. A column 10d having a substantially columnar shape for fixing the middle substrate 14 is formed protrudingly in the vicinity of the square portion slightly inside the position where the receiving rib 10c is formed, and a screw hole (not shown) is formed above the column 10d. ) Is formed.

【0020】受けリブ10c上に配置される下基板12
には、支柱10dを貫通させるための4個の貫通孔12
aが四角部近傍に形成されている。
Lower substrate 12 arranged on receiving rib 10c
Has four through holes 12 for penetrating the column 10d.
a is formed near the square.

【0021】中基板14は支柱10dの上面で支持され
るようになっており、中基板14の四角部近傍にはねじ
24挿通用の貫通孔14aが形成され、これら4個のね
じ24を支柱10dの上部に形成された前記ねじ穴に螺
合させることにより、中基板14及びホルダ15が支柱
10dに固定されるようになっている。
The middle substrate 14 is supported on the upper surface of the column 10d. A through hole 14a for inserting a screw 24 is formed in the vicinity of the square portion of the middle substrate 14, and these four screws 24 are The middle substrate 14 and the holder 15 are fixed to the column 10d by being screwed into the screw holes formed on the upper part of the column 10d.

【0022】ホルダ15は支柱10d及び裏ケース20
にねじ止め固定され、下基板12を押え付けると共に上
基板17を係止させるためのものであり、弾性を有する
例えばリン青銅板等を用いて形成されている。ホルダ1
5の本体は二股部15aからなり、二股部15aの両端
下部には下基板12を押え付けるための押え片15dが
形成され、押え片15dの上方には中基板14を押え付
ける押え部15bが延設され、押え部15bにはねじ2
4を挿通させるねじ挿通孔15cが形成されている。二
股部15aの上方には上基板17を係止させる係止溝1
5eが形成され、さらに係止溝15eの上方には二股部
15aに対して垂直方向に延設された固定片15fが形
成され、固定片15fの中央部にはねじ22を螺合させ
るねじ孔15gが形成され、固定片15fと係止溝15
eとの間隔は上基板17と裏ケース20との距離を保つ
スペーサとしての機能を有している。
The holder 15 comprises a support 10d and a back case 20.
The upper substrate 17 is pressed down and the upper substrate 17 is locked, and is formed using an elastic phosphor bronze plate or the like. Holder 1
5 has a forked portion 15a, a holding piece 15d for holding down the lower substrate 12 is formed at a lower portion of both ends of the forked portion 15a, and a holding portion 15b for holding down the middle substrate 14 is provided above the holding piece 15d. It is extended and the screw 2 is
4 is formed with a screw insertion hole 15c. A locking groove 1 for locking the upper substrate 17 above the forked portion 15a.
5e is formed, and a fixing piece 15f is formed above the locking groove 15e so as to extend in a direction perpendicular to the forked portion 15a, and a screw hole for screwing the screw 22 is formed in the center of the fixing piece 15f. 15g are formed, and the fixing piece 15f and the locking groove 15 are formed.
The distance e has a function as a spacer for keeping the distance between the upper substrate 17 and the back case 20.

【0023】上基板17には固定片15fを挿通させる
ための2個の挿通孔17aが形成され、挿通孔17aの
根元部は細くなって係止溝15eに係止させるための係
止部17bとなっている。
The upper substrate 17 is formed with two insertion holes 17a through which the fixing pieces 15f are inserted, and the base of the insertion hole 17a becomes narrower so that a locking portion 17b for locking the locking groove 15e is formed. It has become.

【0024】裏ケース20は長方形板形状をした本体2
0aと、この本体20aに対して略垂直方向に延設され
た枠部20bとからなり、枠部20bの先端部には段部
20cが形成されている。本体20aにはねじ孔15g
に対向する2箇所にねじ挿通孔20dが形成され、ねじ
挿通孔20dの周囲にはねじ22のヘッドを収納させる
ための凹部20eが形成されている。また本体20aの
内側面には受けリブ10cに対応させて8個の押えリブ
20fが形成され、受けリブ10cと押えリブ20fと
により下基板12を挟持できるようになっている。
The back case 20 is a main body 2 having a rectangular plate shape.
0a and a frame portion 20b extending substantially perpendicular to the main body 20a, and a step portion 20c is formed at the tip of the frame portion 20b. 15g screw hole in body 20a
A screw insertion hole 20d is formed at two places facing the screw insertion hole, and a recess 20e for accommodating the head of the screw 22 is formed around the screw insertion hole 20d. Eight holding ribs 20f are formed on the inner surface of the main body 20a so as to correspond to the receiving ribs 10c, so that the lower substrate 12 can be sandwiched between the receiving ribs 10c and the holding ribs 20f.

【0025】そしてこれら表ケース10、裏ケース2
0、下基板12、中基板14、ホルダ15、及び上基板
17を一体的に組立てる際には、まず表ケース10上に
下基板12を位置合せすべく貫通孔12aに支柱10d
を挿通させて下基板12の外周端部に受けリブ10cを
位置させる。次に支柱10dに中基板14の貫通孔14
aを位置合せして中基板14を支柱10dの上面で支持
させ、中基板14の両端部にホルダ15を配置して4個
のねじ24をそれぞれねじ挿通孔15c及び貫通孔14
aに挿通させて支柱10dの上部に形成された前記ねじ
穴に螺合させて一度に中基板14とホルダ15を支柱1
0dに固定する。この固定により下基板12も押え片1
5dにより受けリブ10c側に押圧され、表ケース10
に固定される。次に上基板17を係止溝15eに係止さ
せるべく、挿通孔17aに固定片15fを挿通させ、係
止部17bにおいて係止溝15eに係止させる。この時
ホルダ15の弾性を利用して一旦ホルダ15を少し外側
に押し広げておき、係止部17bに係止溝15eを係止
させる際にこの押し広げの応力を解いてやる。こうする
ことにより、ホルダ15の弾性を利用してホルダ15間
に上基板17をしっかりと固定することができる。
The front case 10 and the back case 2
When assembling the lower substrate 12, the middle substrate 14, the holder 15, and the upper substrate 17 integrally, first, the pillars 10d are inserted into the through holes 12a to position the lower substrate 12 on the front case 10.
Through which the receiving rib 10c is positioned at the outer peripheral end of the lower substrate 12. Next, the through hole 14 of the middle substrate 14 is
a, the middle substrate 14 is supported on the upper surface of the column 10d, the holders 15 are arranged at both ends of the middle substrate 14, and four screws 24 are respectively inserted into the screw insertion holes 15c and the through holes 14d.
a, and screwed into the screw hole formed in the upper part of the support 10d to simultaneously connect the middle substrate 14 and the holder 15 to the support 1d.
Fixed to 0d. By this fixation, the lower substrate 12 also holds the holding piece 1
5d, the receiving rib 10c is pressed toward the receiving case 10c.
Fixed to Next, in order to lock the upper substrate 17 in the locking groove 15e, the fixing piece 15f is inserted through the insertion hole 17a, and locked in the locking groove 15e in the locking portion 17b. At this time, the elasticity of the holder 15 is used to push the holder 15 slightly outward, and the stress of the pushing is released when the locking groove 15e is locked in the locking portion 17b. By doing so, the upper substrate 17 can be firmly fixed between the holders 15 by utilizing the elasticity of the holders 15.

【0026】次に裏ケース20のねじ挿通孔20dを固
定片15fのねじ孔15gに位置合せし、2個のねじ2
2をねじ挿通孔20dに挿通させながらねじ孔15gに
螺合させ、裏ケース20をホルダ15に固定する。この
時、段部20cは枠部10bの内側に嵌合すると共に、
押えリブ20fにより下基板12を受けリブ10c側に
押圧して下基板12をより強固に固定することができ、
裏ケース20をホルダ15を介して表ケース10に固定
することができる。また、裏ケース20とホルダ15と
をねじ止めすることにより、ホルダ15のたわみが規制
され、上基板17をホルダ15に確実に固定することが
できる。
Next, the screw insertion hole 20d of the back case 20 is aligned with the screw hole 15g of the fixing piece 15f.
2 is screwed into the screw hole 15g while being inserted through the screw insertion hole 20d, and the back case 20 is fixed to the holder 15. At this time, the step 20c fits inside the frame 10b,
By pressing the lower substrate 12 toward the rib 10c side by the holding rib 20f, the lower substrate 12 can be more firmly fixed,
The back case 20 can be fixed to the front case 10 via the holder 15. Further, by screwing the back case 20 and the holder 15, the bending of the holder 15 is regulated, and the upper substrate 17 can be securely fixed to the holder 15.

【0027】上記した電子機器にあっては、下基板12
に貫通孔は支柱10d挿通用の貫通孔12aの4個しか
形成されておらず、また受けリブ10c及び押えリブ2
0fは下基板12の外周端部の電子部品の実装やプリン
ト配線には差し支えのない箇所に位置させられており、
図2に示した10個もの貫通孔が形成された従来の下基
板32とは大きく異なり、電子部品実装可能面積及びプ
リント配線可能面積を大幅に増大させることができる。
上基板17に形成される貫通孔も従来の6個から貫通孔
12aの2個に大幅に減少させることができ、下基板1
2の場合と同様に電子部品実装可能面積及びプリント配
線可能面積を大幅に増大させることができる。従って電
子機器の小型化、多機能化を有利にし、パターン設計の
自由度を大幅に高めることができる。
In the electronic device described above, the lower substrate 12
Only four of the through holes 12a for inserting the support post 10d are formed in the support rib 10c and the holding rib 2c.
0f is located at a position on the outer peripheral edge of the lower substrate 12 where there is no hindrance to mounting of electronic components and printed wiring,
This is significantly different from the conventional lower substrate 32 in which as many as ten through-holes are formed as shown in FIG. 2, and the area in which electronic components can be mounted and the area in which print wiring can be performed can be greatly increased.
The number of through holes formed in the upper substrate 17 can be greatly reduced from the conventional six to two through holes 12a.
As in the case of 2, the area in which electronic components can be mounted and the area in which print wiring can be performed can be greatly increased. Therefore, it is possible to advantageously reduce the size and multifunction of the electronic device, and to greatly increase the degree of freedom in pattern design.

【0028】また上記した電子機器におけるプリント基
板の固定方法によれば、6個のねじ22、24の締め付
けにより、表ケース10、裏ケース20、下基板12、
中基板14、及び上基板17のすべての組立てが完了
し、従来、例えば14個のねじ締め工程を必要としてい
たものに比べて大幅に組立て工程を削減することができ
る。
According to the method of fixing a printed circuit board in an electronic device described above, the front case 10, the rear case 20, the lower substrate 12,
All the assembly of the middle board 14 and the upper board 17 is completed, so that the number of assembling steps can be greatly reduced as compared with the conventional case which requires, for example, 14 screwing steps.

【0029】上記した実施の形態ではプリント基板が3
枚の場合を例に挙げて説明したが、プリント基板の枚数
は何ら3枚に限定されるものではなく、例えば4枚であ
ってもよく、この場合はホルダ15にさらにもう一箇所
係止溝15eを形成してプリント基板を係止させる構成
としてもよい。
In the above embodiment, the printed circuit board is 3
Although the number of printed circuit boards has been described by way of example, the number of printed circuit boards is not limited to three, and may be, for example, four. 15e may be formed to lock the printed circuit board.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施の形態に係る電子機器を示す部分
断面分解斜視図である。
FIG. 1 is an exploded perspective view, partly in section, showing an electronic apparatus according to an embodiment of the present invention.

【図2】従来の電子機器の一例を示す断面図である。FIG. 2 is a cross-sectional view illustrating an example of a conventional electronic device.

【図3】従来の電子機器の一例を示す部分断面分解斜視
図である。
FIG. 3 is a partial cross-sectional exploded perspective view showing an example of a conventional electronic device.

【符号の説明】[Explanation of symbols]

10 表ケース 10c 受けリブ 10d 支柱 12 下基板 12a 貫通孔 14 中基板 14a 貫通孔 15 ホルダ 15a 二股部 15b 押え部 15c ねじ挿通孔 15d 押え片 15e 係止溝 15f 固定片 15g ねじ孔 17 上基板 17a 挿通孔 17b 係止部 20 裏ケース 20d ねじ挿通孔 20f 押えリブ 22、24 ねじ Reference Signs List 10 front case 10c receiving rib 10d support 12 lower substrate 12a through hole 14 middle substrate 14a through hole 15 holder 15a forked part 15b holding part 15c screw insertion hole 15d holding piece 15e locking groove 15f fixing piece 15g screw hole 17 upper board 17a insertion Hole 17b Locking portion 20 Back case 20d Screw insertion hole 20f Holding rib 22, 24 Screw

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 電子部品が実装された複数枚のプリント
基板がケース内に固定された電子機器において、 表ケースには下基板の外周部を支持する受けリブ、及び
中基板を支持し、複数枚のプリント基板を連結するホル
ダを固定するための支柱が形成され、 下基板には前記支柱を貫通させる貫通孔が形成され、 中基板の4隅部にはねじ止め用の貫通孔が形成され、 上基板には前記ホルダを挿通させる挿通孔及び前記ホル
ダを係止させる係止部が形成され、 前記ホルダは前記下基板の押え片、前記中基板の押え
部、該押え部に形成されたねじ挿通孔、二股部、前記上
基板の係止部が嵌合する係止溝、裏ケースの固定片、及
び該固定片に形成されたねじ孔を有すると共に弾性材に
より構成され、前記裏ケースには複数個のねじ挿通孔、
及び前記下基板押えリブが形成されていることを特徴と
する電子機器。
1. An electronic device in which a plurality of printed boards on which electronic components are mounted are fixed in a case, wherein a front case supports a receiving rib for supporting an outer peripheral portion of a lower board; A pillar for fixing a holder connecting the two printed boards is formed, a through hole is formed in the lower board to penetrate the pillar, and a through hole for screwing is formed in four corners of the middle board. An insertion hole for inserting the holder and an engagement portion for engaging the holder are formed on the upper substrate, and the holder is formed on a holding piece of the lower substrate, a holding portion of the middle substrate, and the holding portion. The rear case has a screw insertion hole, a forked portion, a locking groove in which the locking portion of the upper substrate is fitted, a fixing piece of the back case, and a screw hole formed in the fixing piece, and is made of an elastic material. Has several screw insertion holes,
And the lower substrate holding rib is formed.
【請求項2】 電子部品が実装された複数枚のプリント
基板をケース内に固定する電子機器におけるプリント基
板の固定方法において、 下基板に形成された貫通孔に表ケースに形成された支柱
を貫通させ、前記下基板を前記表ケースに形成された
けリブで支持させる工程、 中基板を前記支柱の上面に置き、前記中基板の上からホ
ルダを位置合せしてねじ止めし、該ホルダに形成された
押え片により前記下基板を押え付けると共に前記中基板
を前記支柱上面に固定する工程、 上基板に形成された挿通孔に前記ホルダに形成された固
定片を挿通させ、前記上基板に形成された係止部を前記
ホルダに形成された係止溝に嵌合させて前記上基板を前
記ホルダに係止させる工程、 及び裏ケースと前記表ケースとの位置合せを行い、前記
裏ケースのねじ挿通孔にねじを挿通させて前記固定片の
ねじ孔に前記ねじを螺合させ、前記裏ケースを前記ホル
ダに固定すると共に前記裏ケースに形成された下基板押
えリブにより前記下基板を押え付けて全体的な一体化を
図る工程を含んでいることを特徴とする電子機器におけ
るプリント基板の固定方法。
2. A plurality of prints on which electronic components are mounted.
Printed board for electronic equipment that fixes the board in the case
In the method of fixing a plate, a step in which a support formed in a front case is penetrated through a through hole formed in a lower substrate , and the lower substrate is supported by a receiving rib formed in the front case ; The substrate is placed on the upper surface of the support, the holder is positioned and screwed from above the middle substrate, and the lower substrate is pressed by a holding piece formed on the holder , and the middle substrate is pressed. Fixing the support to the upper surface of the support, inserting a fixing piece formed in the holder into an insertion hole formed in the upper substrate, and fixing the locking portion formed in the upper substrate to the
A step of fitting the upper substrate to the holder by fitting it into a locking groove formed in the holder, and aligning the back case with the front case, and inserting a screw into the screw insertion hole of the back case. Then, the screw is screwed into the screw hole of the fixing piece, the back case is fixed to the holder, and the lower substrate is pressed down by the lower substrate pressing rib formed on the back case, so that the whole substrate is integrated. A method for fixing a printed circuit board in an electronic device, the method including:
JP10888496A 1996-04-30 1996-04-30 Electronic device and printed circuit board fixing method Expired - Fee Related JP2914653B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10888496A JP2914653B2 (en) 1996-04-30 1996-04-30 Electronic device and printed circuit board fixing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10888496A JP2914653B2 (en) 1996-04-30 1996-04-30 Electronic device and printed circuit board fixing method

Publications (2)

Publication Number Publication Date
JPH09293979A JPH09293979A (en) 1997-11-11
JP2914653B2 true JP2914653B2 (en) 1999-07-05

Family

ID=14496044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10888496A Expired - Fee Related JP2914653B2 (en) 1996-04-30 1996-04-30 Electronic device and printed circuit board fixing method

Country Status (1)

Country Link
JP (1) JP2914653B2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4973488B2 (en) * 2007-12-26 2012-07-11 富士電機株式会社 Semiconductor device
JP2014033129A (en) * 2012-08-06 2014-02-20 Sharp Corp Display device
JP5966864B2 (en) * 2012-10-31 2016-08-10 株式会社デンソー Electronic equipment
JP2016207781A (en) * 2015-04-20 2016-12-08 日本電気株式会社 Housing structure
JP2017011104A (en) 2015-06-23 2017-01-12 株式会社リコー Image forming device

Also Published As

Publication number Publication date
JPH09293979A (en) 1997-11-11

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