CN217404816U - Fixing mechanism - Google Patents
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- CN217404816U CN217404816U CN202220812339.1U CN202220812339U CN217404816U CN 217404816 U CN217404816 U CN 217404816U CN 202220812339 U CN202220812339 U CN 202220812339U CN 217404816 U CN217404816 U CN 217404816U
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- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
【技术领域】【Technical field】
本实用新型是有关于一种固定机构。更具体地来说,本实用新型有关于一种用于将电子装置以可拆卸的方式连接至连接器的固定机构。The utility model relates to a fixing mechanism. More specifically, the present invention relates to a fixing mechanism for detachably connecting an electronic device to a connector.
【背景技术】【Background technique】
在例如个人电脑或服务器的电子系统中,通常会包括数个电子装置。在安装该多个电子装置时,往往需使用螺丝等固定器具。然而,若安装空间较狭窄时,使用者将难以将螺丝固定,安装上并不方便,且零散的固定器具也容易遗失。因此,如何解决前述各项问题始成一重要的课题。In an electronic system such as a personal computer or a server, several electronic devices are usually included. When installing the plurality of electronic devices, fixing tools such as screws are often required. However, if the installation space is narrow, it is difficult for the user to fix the screws, which is inconvenient to install, and the scattered fixing tools are also easy to lose. Therefore, how to solve the aforementioned problems has become an important issue.
【实用新型内容】【Content of utility model】
为了解决上述已知的问题点,本实用新型提供一种固定机构,用以将一电子装置以可拆卸的方式连接至一连接器。前述固定机构包括一壳体、一支撑元件、以及一框架模块。壳体包括一板体、一连接部、以及一凸出部。板体具有一表面,连接部连接板体且朝向远离表面的方向延伸,凸出部连接连接部且朝向板体凸出。连接器固定于板体上。支撑元件可拆卸地连接壳体,且包括一卡合部、一支撑部、以及一夹持部。卡合部具有一卡合槽,支撑部连接卡合部,夹持部连接支撑部且具有可挠性,其中,支撑部位于卡合部和夹持部之间。当支撑元件连接壳体时,凸出部进入卡合槽中。框架模块包括一本体和一基座。本体设置于支撑部上,基座连接本体且具有一支撑表面。当电子装置通过固定机构连接至连接器时,电子装置的一端被夹持于夹持部和支撑表面之间,且电子装置的另一端与连接器连接。In order to solve the above-mentioned known problems, the present invention provides a fixing mechanism for connecting an electronic device to a connector in a detachable manner. The aforementioned fixing mechanism includes a casing, a supporting element, and a frame module. The casing includes a plate body, a connecting portion, and a protruding portion. The plate body has a surface, the connecting portion connects the plate body and extends in a direction away from the surface, and the protruding portion connects the connecting portion and protrudes toward the plate body. The connector is fixed on the board body. The supporting element is detachably connected to the housing, and includes a clamping part, a supporting part, and a clamping part. The engaging portion has an engaging groove, the supporting portion is connected to the engaging portion, and the clamping portion is connected to the supporting portion and has flexibility, wherein the supporting portion is located between the engaging portion and the clamping portion. When the supporting element is connected to the housing, the protruding portion enters the engaging groove. The frame module includes a body and a base. The body is arranged on the support part, and the base is connected with the body and has a support surface. When the electronic device is connected to the connector through the fixing mechanism, one end of the electronic device is clamped between the clamping portion and the support surface, and the other end of the electronic device is connected to the connector.
本实用新型一些实施例中,前述框架模块更包括一延伸部和一凸起。延伸部连接本体且朝向远离本体的一底面的方向延伸。凸起连接延伸部,且朝向底面凸出。支撑部具有一孔洞,且当框架模块设置于支撑部上时,底面接触支撑部,凸起进入孔洞中。In some embodiments of the present invention, the aforementioned frame module further includes an extension portion and a protrusion. The extension part is connected to the body and extends in a direction away from a bottom surface of the body. The protrusion is connected to the extension part and protrudes toward the bottom surface. The support portion has a hole, and when the frame module is arranged on the support portion, the bottom surface contacts the support portion, and the protrusion enters the hole.
本实用新型一些实施例中,前述本体包括一导槽,且支撑元件包括一导引部。当框架模块设置于支撑部上时,导引部进入导槽中。于一些实施例中,导槽具有一渐扩结构。In some embodiments of the present invention, the aforementioned body includes a guide groove, and the support element includes a guide portion. When the frame module is arranged on the support portion, the guide portion enters the guide groove. In some embodiments, the guide groove has a tapered structure.
本实用新型一些实施例中,前述框架模块更包括一弹性元件,且电子装置通过弹性元件固定于本体上。弹性元件可包括一第一段部、一第二段部、以及一第三段部。第一段部具有一第一内凹结构。第二段部连接第一段部,且第一段部的延伸方向相异于第二段部的延伸方向。第三段部具有一第二内凹结构,且第三段部的延伸方向相异于第二段部的延伸方向。In some embodiments of the present invention, the aforementioned frame module further includes an elastic element, and the electronic device is fixed on the body through the elastic element. The elastic element may include a first segment, a second segment, and a third segment. The first segment has a first concave structure. The second segment is connected to the first segment, and the extending direction of the first segment is different from the extending direction of the second segment. The third segment has a second concave structure, and the extending direction of the third segment is different from the extending direction of the second segment.
本实用新型一些实施例中,前述本体包括一底板、一第一侧壁、以及一第二侧壁。第一侧壁连接底板且具有一第一槽孔,第二侧壁连接底板且具有一第二槽孔,且第一侧壁和第二侧壁分别位于底板的相反侧。当电子装置通过弹性元件固定于框架上时,电子装置设置于第二段部和底板之间,第一内凹结构进入第一槽孔中,且第二内凹结构进入第二槽孔中。于一些实施例中,第一槽孔和第二槽孔具有U字型结构。In some embodiments of the present invention, the aforementioned body includes a bottom plate, a first side wall, and a second side wall. The first side wall is connected to the bottom plate and has a first slot hole, the second side wall is connected to the bottom plate and has a second slot hole, and the first side wall and the second side wall are respectively located on opposite sides of the bottom plate. When the electronic device is fixed on the frame by the elastic element, the electronic device is disposed between the second segment and the bottom plate, the first concave structure enters the first slot hole, and the second concave structure enters the second slot hole. In some embodiments, the first slot hole and the second slot hole have a U-shaped structure.
本实用新型一些实施例中,前述板体更包括一平台,凸出于前述表面,且壳体更包括一另一连接部和一另一凸出部。另一连接部设置于平台上且朝向远离表面的方向延伸,另一凸出部连接另一连接部且朝向板体凸出。于一些实施例中,另一连接部设置于连接部和连接器之间。In some embodiments of the present invention, the plate body further includes a platform protruding from the surface, and the housing further includes another connecting portion and another protruding portion. The other connecting portion is arranged on the platform and extends in a direction away from the surface, and the other protruding portion is connected to the other connecting portion and protrudes toward the plate body. In some embodiments, another connecting portion is disposed between the connecting portion and the connector.
【附图说明】【Description of drawings】
根据以下的详细说明并配合所附附图可以更加理解本实用新型实施例。应注意的是,根据本产业的标准惯例,附图中的各种部件并未必按照比例绘制。事实上,可能任意的放大或缩小各种部件的尺寸,以做清楚的说明。The embodiments of the present invention can be better understood according to the following detailed description and the accompanying drawings. It should be noted that, in accordance with standard practice in the industry, the various components in the figures are not necessarily drawn to scale. In fact, the dimensions of various components may be arbitrarily enlarged or reduced for clarity of illustration.
图1是表示本实用新型一实施例的固定结构的爆炸图。FIG. 1 is an exploded view showing a fixing structure according to an embodiment of the present invention.
图2是表示本实用新型一实施例中的壳体、电路板和连接器的局部示意图。FIG. 2 is a partial schematic diagram showing a housing, a circuit board and a connector in an embodiment of the present invention.
图3是表示图2中沿A-A方向的剖视图。FIG. 3 is a cross-sectional view taken along the direction A-A in FIG. 2 .
图4是表示本实用新型一实施例中的支撑元件的示意图。FIG. 4 is a schematic diagram showing a support element in an embodiment of the present invention.
图5是表示本实用新型一实施例中的框架模块的示意图。FIG. 5 is a schematic diagram showing a frame module in an embodiment of the present invention.
图6是表示本实用新型一实施例中的框架模块的前视图。6 is a front view showing a frame module in an embodiment of the present invention.
图7A是表示本实用新型一实施例中,电子装置安装于框架模块上的示意图。7A is a schematic diagram showing an electronic device mounted on a frame module in an embodiment of the present invention.
图7B是表示本实用新型一实施例中,框架模块和支撑元件连接的示意图。7B is a schematic diagram showing the connection between the frame module and the supporting element in an embodiment of the present invention.
图7C是表示图7B中沿B-B方向的剖视图。FIG. 7C is a cross-sectional view taken along the direction B-B in FIG. 7B .
图7D是表示本实用新型一实施例中,电子装置通过固定机构与连接器连接的示意图。FIG. 7D is a schematic diagram showing that an electronic device is connected to a connector through a fixing mechanism in an embodiment of the present invention.
图7E是表示图7D中沿C-C方向的剖视图。FIG. 7E is a cross-sectional view taken along the C-C direction in FIG. 7D.
图8A是表示本实用新型一实施例中,另一电子装置通过壳体、另一支撑元件、以及另一框架模块与连接器连接的示意图。8A is a schematic diagram showing that another electronic device is connected to a connector through a casing, another supporting element, and another frame module in an embodiment of the present invention.
图8B是表示图8A中沿D-D方向的剖视图。FIG. 8B is a cross-sectional view taken along the D-D direction in FIG. 8A .
【符号说明】【Symbol Description】
10:连接器10: Connector
11:连接孔11: Connection hole
20:电路板20: circuit board
100:壳体100: Shell
110:板体110: Board body
111:表面111: Surface
112:缺口112: Notch
113:平台113: Platform
120,120’:卡合结构120,120': snap-fit structure
121,121’:连接部121, 121': connecting part
122,122’:凸出部122,122': protrusion
123.123’:倾斜部123.123': inclined part
200,200’:支撑元件200, 200’: support element
210:卡合部210: Engagement part
211:卡合槽211: snap groove
220:直立部220: Upright
230:支撑部230: Support Department
231:孔洞231: Hole
240:夹持部240: Clamping part
250:导引部250: Guidance Department
300:框架模块300: Frame Module
310:本体310: Ontology
311:底板311: Bottom plate
312:第一侧壁312: First side wall
312A:导槽312A: Guide groove
312B:第一槽孔312B: The first slot
313:第二侧壁313: Second side wall
313A:导槽313A: Guide groove
313B:第二槽孔313B: The second slot
314:凸点314: bump
315:底面315: Underside
320:基座320: Pedestal
321:支撑表面321: Support Surface
330:延伸部330: Extensions
340:凸起340: Raised
350:弹性元件350: Elastic element
351:第一段部351: The first paragraph
352:第二段部352: Second paragraph
353:第三段部353: The third paragraph
D1:距离D1: Distance
D2:距离D2: Distance
E,E’:电子装置E, E': electronic device
F:固定机构F: fixed mechanism
S1:第一内凹结构S1: The first concave structure
S2:第二内凹结构S2: Second concave structure
T:散热装置T: heat sink
【具体实施方式】【Detailed ways】
以下说明本实用新型的固定机构。然而,可轻易了解本实用新型提供许多合适的实用新型概念而可实施于广泛的各种特定背景。所揭示的特定实施例仅仅用于说明以特定方法使用本实用新型,并非用以局限本实用新型的范围。The fixing mechanism of the present invention will be described below. However, it can be readily appreciated that the present disclosure provides many suitable disclosure concepts that can be embodied in a wide variety of specific contexts. The disclosed specific embodiments are only used to illustrate a specific method for using the present invention, and are not intended to limit the scope of the present invention.
除非另外定义,在此使用的全部用语(包括技术及科学用语)具有与此篇公开所属的一般技艺者所通常理解的相同涵义。能理解的是该多个用语,例如在通常使用的字典中定义的用语,应被解读成具有一与相关技术及本实用新型的背景或上下文一致的意思,而不应该以一理想化或过度正式的方式解读,除非在此特别定义。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill of the art to which this disclosure belongs. It is understood that the terms, such as those defined in commonly used dictionaries, should be construed as having a meaning consistent with the background or context of the related art and the present invention, and should not be interpreted in an idealistic or excessive manner. Read in a formal manner, unless specifically defined herein.
本说明书以下的公开内容是叙述各个构件及其排列方式的特定范例,以求简化实用新型的说明。当然,该多个特定的范例并非用以限定本实用新型。例如,若是本说明书以下的公开内容叙述了将一第一特征形成于一第二特征的上或上方,即表示其包含了所形成的上述第一特征与上述第二特征是直接接触的实施例,亦包含了尚可将附加的特征形成于上述第一特征与上述第二特征之间,而使上述第一特征与上述第二特征可能未直接接触的实施例。再者,为了方便描述附图中一特征与另一特征的关系,可使用空间相关用语,例如「下面」、「下方」、「的下」、「上方」、「的上」、以及类似的用语等。除了附图所示出的方位之外,空间相关用语涵盖装置在使用或操作中的不同方位。所述装置也可被另外定位(旋转90度或在其他方位上),且同样可对应地解读于此所使用的空间相关描述。The following disclosure of this specification is to describe specific examples of various components and their arrangement in order to simplify the description of the utility model. Of course, the specific examples are not intended to limit the present invention. For example, if the following disclosure of this specification describes that a first feature is formed on or over a second feature, it means that it includes embodiments in which the first feature and the second feature are formed in direct contact with each other. , and also includes embodiments in which additional features may be formed between the first and second features, so that the first and second features may not be in direct contact. Furthermore, to facilitate describing the relationship of one feature to another feature in the drawings, spatially relative terms such as "below", "below", "below", "above", "above", and the like may be used terms, etc. In addition to the orientation shown in the figures, spatially relative terms encompass different orientations of the device in use or operation. The device may also be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptions used herein interpreted accordingly.
首先请参阅图1,本发明一实施例的固定机构F主要包括一壳体100、一支撑元件200、以及一框架模块300,其中,壳体100例如可为机箱的壁面的一部分,但并不限定于此。待具有连接器10的电路板20固定于壳体100上后,使用者可借由固定机构F将一电子装置以可拆卸的方式连接至前述连接器10,而不需要使用其他外部工具(例如螺丝起子或钉枪)。举例而言,前述电子装置可为固态硬盘(例如M.2固态硬盘、mSATA固态硬盘、PCI-E固态硬盘、或IDE固态硬盘)、存储器(例如只读存储器(Read Only Memory,ROM)、快闪存储器(flash memory)、或随机存取存储器(Random Access Memory,RAM))、或显示卡,但并不限定于此。Referring first to FIG. 1 , a fixing mechanism F according to an embodiment of the present invention mainly includes a
以下分别说明固定机构F中各元件的结构和连接关系。如图1至图3所示,壳体100可包括一板体110和至少一卡合结构120。板体110具有一表面111,电路板20可透过螺丝、铆钉或其他固定元件固定于板体110的表面111上。卡合结构120包括至少一连接部121、至少一凸出部122、以及至少一倾斜部123。连接部121连接板体110,且朝向远离表面111的方向延伸。于本实施例中,连接部121可具有L字型剖面,且板体110在对应连接部121的位置形成有缺口112。凸出部122与连接部121连接,且朝向板体110凸出。倾斜部123在连接部120未与板体110连接的一侧与其连接,且相对于板体110倾斜。需特别说明的是,于本实施例中,壳体100包括有多个卡合结构120,每个卡合结构120上的倾斜部123朝向相同方向倾斜,且具有大致相同的倾斜角度。The structure and connection relationship of each element in the fixing mechanism F will be described below. As shown in FIGS. 1 to 3 , the
在本实施例中,板体110更包括一平台113,凸出于板体110的表面111,且在此平台113上形成有至少一卡合结构120’。与卡合结构120相同,卡合结构120’包括至少一连接部121’、至少一凸出部122’、以及至少一倾斜部123’。连接部121’连接板体110,且朝向远离表面111的方向延伸。凸出部122’与连接部121’连接,且朝向板体110凸出。倾斜部123’在连接部120’未与板体110连接的一侧与其连接,且相对于板体110倾斜。于本实施例中,壳体100包括有多个卡合结构120’,每个卡合结构120’上的倾斜部123’朝向相同方向倾斜,且具有大致相同的倾斜角度。In this embodiment, the
当电路板20安装于板体110上时,从垂直于板体110的方向观察(图中为Z轴方向,如图2),卡合结构120和卡合结构120’未被电路板20遮蔽,连接器10的连接孔11面向卡合结构120和卡合结构120’,且卡合结构120’设置于连接器10和卡合结构120之间。When the
请参阅图4,支撑元件200包括至少一卡合部210、至少一直立部220、一支撑部230、以及一夹持部240。卡合部210大致具有平板状结构,且一卡合槽211形成于卡合部210上。直立部220在卡合部210和支撑部230之间连接两者,且一孔洞231形成于支撑部230上。于本实施例中,直立部220和支撑部230同样大致具有平板状结构,且支撑部230大致平行于卡合部210,直立部220大致垂直于卡合部210和支撑部230。夹持部240为具有可挠性的弹性片。于本实施例中,夹持部240具有L字型结构且与支撑部230连接,且支撑部230位于夹持部240和卡合部210之间。Referring to FIG. 4 , the supporting
此外,支撑元件200可更具有与支撑部230连接的至少一导引部250,且导引部250的至少部分延伸至支撑部230上方。于一些实施例中,导引部250亦可与直立部220连接且延伸至支撑部230上方。In addition, the
请参阅图5和图6,框架模块300包括一本体310、一基座320、一延伸部330、一凸起340、以及至少一弹性元件350。本体310包括一底板311、一第一侧壁312、以及一第二侧壁313,其中,底板311在第一侧壁312和第二侧壁313之间连接两者,且第一侧壁312上形成有一导槽312A和至少一第一槽孔312B,第二侧壁313上形成有一导槽313A和至少一第二槽孔313B。导槽312A和导槽313A的一端具有开口,且导槽312A和导槽313A从各自的底部到开口形成渐扩结构。第一槽孔312B和第二槽孔313B各自具有U字型结构,因此将分别围绕凸点314。Referring to FIGS. 5 and 6 , the
基座320设置于底板311上,且具有一支撑表面321。延伸部330连接本体310的底板311,且朝向远离底板311的底面315的方向延伸。凸起340连接延伸部330,并朝向底面315凸出。The
弹性元件350具有一第一段部351、一第二段部352、以及一第三段部353,其中,第二段部352在第一段部351和第三段部353之间连接两者,且第二段部352的延伸方向相异于第一段部351和第三段部353的延伸方向。第一段部351和第三段部353上分别形成有第一内凹结构S1和第二内凹结构S2,且当弹性元件350未受到外力时,第一内凹结构S1和第二内凹结构S2之间的距离大于第一槽孔312B和第二槽孔313B之间的距离。The
以下说明利用固定机构F将电子装置E固定并连接至连接器10的步骤。首先,如图7A所示,使用者可将电子装置E及与其连接的散热装置T放置于框架模块300的本体310上,且利用弹性元件350将电子装置E和散热装置T固定。详细而言,当电子装置E和散热装置T通过弹性元件350固定时,第一内凹结构S1和第二内凹结构S2会分别穿过第一槽孔312B和第二槽孔313B并接触第一槽孔312B和第二槽孔313B中的凸点314,电子装置E和散热装置T会位于第二段部352和本体310的底板311之间。如此一来,弹性元件350可将电子装置E和散热装置T固定于本体310上,除非使用者打算拆除电子装置E而沿着特定的方向施加外力予弹性元件350。The steps of fixing and connecting the electronic device E to the
接着,如图7B和图7C所示,使用者可使框架模块300与支撑元件200结合。具体来说,支撑元件200的导引部250可进入框架模块300的导槽312A、313A中,使得本体310相对于支撑元件200移动至一固定位置。本体310的底板311可与支撑部230接触,支撑部230可位于延伸部330和底板311之间,且凸起340可进入孔洞231中。因此,框架模块300可被固定于支撑元件200上。Next, as shown in FIGS. 7B and 7C , the user can combine the
特别的是,如图7C所示,当电子装置E设置于框架模块300上,且框架模块300被固定于支撑元件200上时,电子装置E的一端可被夹持部240夹设于夹持部240和基座320的支撑表面321之间。因此,电子装置E可被更稳固地固定。Particularly, as shown in FIG. 7C , when the electronic device E is disposed on the
最后,如图7D和图7E所示,使用者可使支撑元件200和框架模块300的组合朝向连接器10移动。支撑元件200的卡合部210可进入连接部121和板体110的表面111之间,且凸出部122可进入卡合槽211中,因此,支撑元件200和框架模块300的组合可被固定于壳体100上。同时,电子装置E的未被夹持的一端可插入连接孔11,以与连接器10连接。Finally, as shown in FIGS. 7D and 7E , the user can move the combination of
应注意的是,于本实施例中,连接器10与板体110的表面111之间的距离D1大致相同于卡合部210和支撑部230之间的距离D2,因此,电子装置E可水平地插入连接孔11,而不会产生因倾斜而无法插入的问题。It should be noted that, in this embodiment, the distance D1 between the
如图8A和图8B所示,当使用者欲将尺寸不同的电子装置E’连接至连接器10时,可将电子装置E’安装于框架模块300’上,再将框架模块300’与支撑元件200’结合,最后通过卡合结构120’将支撑元件200’固定于壳体100上即可。支撑元件200’和支撑元件200的结构完全相同,两者的差异仅在Z轴方向上的厚度不同,故于此不再赘述。于本实施例中,支撑元件200’的厚度加上平台113凸出于表面111的距离大致相同于连接器10与表面111之间的距离D1。框架模块300’和框架模块300的结构完全相同,两者的差异仅在X轴方向上的长度不同,故于此不再赘述。As shown in FIG. 8A and FIG. 8B , when the user wants to connect electronic devices E′ of different sizes to the
综上所述,本实用新型提供一种固定机构,用以将一电子装置以可拆卸的方式连接至一连接器。前述固定机构包括一壳体、一支撑元件、以及一框架模块。壳体包括一板体、一连接部、以及一凸出部。板体具有一表面,连接部连接板体且朝向远离表面的方向延伸,凸出部连接连接部且朝向板体凸出。连接器固定于板体上。支撑元件可拆卸地连接壳体,且包括一卡合部、一支撑部、以及一夹持部。卡合部具有一卡合槽,支撑部连接卡合部,夹持部连接支撑部且具有可挠性,其中,支撑部位于卡合部和夹持部之间。当支撑元件连接壳体时,凸出部进入卡合槽中。框架模块包括一本体和一基座。本体设置于支撑部上,基座连接本体且具有一支撑表面。当电子装置通过固定机构连接至连接器时,电子装置的一端被夹持于夹持部和支撑表面之间,且电子装置的另一端与连接器连接。To sum up, the present invention provides a fixing mechanism for connecting an electronic device to a connector in a detachable manner. The aforementioned fixing mechanism includes a casing, a supporting element, and a frame module. The casing includes a plate body, a connecting portion, and a protruding portion. The plate body has a surface, the connecting portion connects the plate body and extends in a direction away from the surface, and the protruding portion connects the connecting portion and protrudes toward the plate body. The connector is fixed on the board body. The supporting element is detachably connected to the housing, and includes a clamping part, a supporting part, and a clamping part. The engaging portion has an engaging groove, the supporting portion is connected to the engaging portion, and the clamping portion is connected to the supporting portion and has flexibility, wherein the supporting portion is located between the engaging portion and the clamping portion. When the supporting element is connected to the housing, the protruding portion enters the engaging groove. The frame module includes a body and a base. The body is arranged on the support part, and the base is connected with the body and has a support surface. When the electronic device is connected to the connector through the fixing mechanism, one end of the electronic device is clamped between the clamping portion and the support surface, and the other end of the electronic device is connected to the connector.
虽然本实用新型的实施例及其优点已公开如上,但应该了解的是,任何所属技术领域中具有通常知识者,在不脱离本实用新型的精神和范围内,当可作更动、替代与润饰。此外,本实用新型的保护范围并未局限于说明书内所述特定实施例中的制程、机器、制造、物质组成、装置、方法及步骤,任何所属技术领域中具有通常知识者可从本实用新型揭示内容中理解现行或未来所发展出的制程、机器、制造、物质组成、装置、方法及步骤,只要可以在此处所述实施例中实施大抵相同功能或获得大抵相同结果皆可根据本实用新型使用。因此,本实用新型的保护范围包括上述制程、机器、制造、物质组成、装置、方法及步骤。另外,每一申请专利范围构成个别的实施例,且本实用新型的保护范围也包括各个申请专利范围及实施例的组合。Although the embodiments of the present invention and the advantages thereof have been disclosed above, it should be understood that any person with ordinary knowledge in the technical field can make changes, substitutions and modifications without departing from the spirit and scope of the present invention retouch. In addition, the protection scope of the present invention is not limited to the process, machine, manufacture, material composition, device, method and steps in the specific embodiments described in the specification. Anyone with ordinary knowledge in the technical field can learn from the present invention In the disclosure, it is understood that the current or future processes, machines, manufactures, compositions of matter, devices, methods and steps, as long as substantially the same functions can be implemented or substantially the same results can be achieved in the embodiments described herein, all can be based on the present invention. New use. Therefore, the protection scope of the present invention includes the above-mentioned manufacturing process, machine, manufacture, material composition, device, method and steps. In addition, each claimed scope constitutes a separate embodiment, and the protection scope of the present invention also includes the combination of each claimed scope and the embodiments.
虽然本实用新型以前述数个较佳实施例公开如上,然其并非用以限定本实用新型。本实用新型所属技术领域中具有通常知识者,在不脱离本实用新型的精神和范围内,当可做些许的更动与润饰。因此本实用新型的保护范围当视后附的申请专利范围所界定者为准。此外,每个申请专利范围建构成一独立的实施例,且各种申请专利范围及实施例的组合皆介于本实用新型的范围内。Although the present invention is disclosed in the foregoing several preferred embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the appended patent application. In addition, each claimable scope constitutes a separate embodiment, and the various claimsable scopes and combinations of embodiments are within the scope of the present invention.
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