JP2908473B2 - Component mounting device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting device used in a device for surface mounting electronic components such as fixed resistors and multilayer capacitors on a printed circuit board and the like, and particularly to a simple device. The present invention relates to a novel supply structure capable of reliably supplying components to a component receiving portion with a simple structure.

[Conventional technology]

In general, a surface mount device is a device that sucks an electronic component supplied to a component receiving portion by, for example, a suction head, moves the head in the X and Y directions, and places the electronic component at a target position on a printed circuit board. is there.

Conventionally, as an electronic component supply device for supplying the electronic components one by one to the component receiving portion, for example, a so-called ski slope type shown in FIG. 5 is generally used.

In the drawing, reference numeral 30 denotes a base member mounted on a frame of a surface mounting apparatus (not shown). The base member 30 is provided with a ski slope-shaped supply path 30a. This supply path 3
The leading end of the horizontal portion 0 is a component receiving portion 30b, and a suction head (not shown) comes above the portion. Reference numeral 30c is a cover that covers the supply path 30a. A dispensing mechanism 32 for dispensing the electronic components W one by one is provided in the middle of the supply path 30a, and a compressed air discharge nozzle 30d and a suction nozzle 30e are formed. The passage connecting to the nozzles 30d and 30e is opened and closed by moving the rod-shaped valve body 33a forward and backward by the drive mechanism 33. A stick 31 made of a tubular body having a rectangular cross section is detachably attached to the upper end of the supply path 30a on the inclined side. Electronic components W are linearly packed in the stick 31.

In this conventional apparatus, the stick 31 is inserted and attached to the upper end of the supply path 30a in a state where the stick 31 is inclined. When the payout mechanism 32 pays out the leading electronic components W one by one, the electronic components W slide down by their own weight into the component receiving portion 30b due to the slope of the slope.

[Problems to be solved by the invention]

However, in the above-described conventional device, it is difficult to reliably supply the electronic component to the receiving portion only by the slope of the slope,
Therefore, as described above, it is necessary to blow out compressed air from the nozzle 30d and suck it from the nozzle 30e, and to apply vibration, and there is a problem that the structure becomes complicated, such as a mechanism for opening and closing an air passage connected to the nozzle. In addition, there is a problem that it is difficult to process the above-mentioned slope-shaped supply path, which causes an increase in cost.

In addition, it is necessary to mount the stick on the base member while inclining the stick. In this case, however, there is a problem that the electronic component is easily spilled from the stick, and the stick mounting operation requires skill.

Furthermore, the surface mounting apparatus needs to handle various electronic components having different shapes and dimensions. For this purpose, the above-mentioned base member is required only for the type of the electronic components. However, there is a problem that the supply path becomes long, the arrangement space becomes large, and the layout is difficult.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described conventional problems, and has a simple structure and can surely supply components one by one to a component receiving portion, and can surely suction and mount components on a printed circuit board. It is intended to provide a device.

[Means for solving the problem]

The present invention relates to a component mounting apparatus which supplies components one by one to a component receiving portion, sucks the component by a suction head, and mounts the component on a printed circuit board. The component is formed so that it can be held and taken out from above, and the cylindrical body in which the component is linearly packed is attached to the base member such that the opening of the cylindrical body is close to the component receiving portion. The base member is rotatably supported, and the base member is provided with an inclined supply angle position at which one component in the cylindrical body flows out to the component receiving portion by its own weight, and the component flows out. Rotating means for rotating between a substantially horizontal holding angle position without causing the base member to rotate the component receiving portion and the cylindrical body integrally to the supply angle position. Parts by their own weight Is supplied to the receiving unit, the suction head from above when rotated to the holding angular position is characterized in that so as to pick up the components.

[Action]

In the component mounting apparatus according to the present invention, the mounting of the tubular body is performed in a state where the base member is positioned substantially horizontally at the holding angle position. In supplying the components, the base member is rotated to the supply angle position. Then, the cylindrical body rotates together with the base member, and the component is at an angle at which the component flows out, and the leading component flows out to the component receiving portion located at the opening of the cylindrical body.
In this state, the base member is returned to the holding angle position, the component is sucked by the suction head, and transported to a predetermined position.

As described above, in the present invention, by rotating the base member, the component receiving portion and the cylindrical body are integrally rotated between the inclined supply angle position and the substantially horizontal holding angle position. Therefore, the components can be reliably supplied to the component receiving portion one by one with a simple structure, and can be reliably sucked and mounted on the substrate by the suction head. In this case, the dispensing mechanism, the compressed air nozzle, and the opening / closing mechanism of the nozzle passage as in the above-described conventional example are not required, and the slope-shaped processing is not required, so that the structure can be simplified and the cost can be reduced.

In addition, by mounting the tubular body with the base member positioned at the holding angle position, the components do not flow out, so that the work of mounting the tubular body can be easily performed.

Furthermore, parts can be directly supplied from the cylindrical body to the parts receiving portion, and the arrangement space can be reduced as much as an unnecessary supply path such as the conventional slope-shaped supply path can be eliminated. It can respond and does not cause layout problems.

〔Example〕

 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

FIGS. 1 to 4 are views for explaining mounting of electronic components according to an embodiment of the present invention.

In the figure, reference numeral 1 denotes a surface mounting apparatus provided with the apparatus of the present embodiment, and a printed board 26 on which electronic components (hereinafter, referred to as chips) W are mounted on a surface of a cabinet 2 serving as a base of the apparatus 1 is transported. A conveyor 3 is provided above the conveyor 3, and three sets of suction heads 4 are arranged above the conveyor 3 so as to be movable in the X-axis direction and the Y-axis direction. In addition, 5 is a cover, 6 is an operation panel.

A chip supply device 7 according to the present embodiment is provided on the side of the conveyor 3. This chip supply device 7
A support bracket 8 is bolted and fixed on the frame 2a of the surface mount device 1, and the support 8 is supported by the support bracket 8 so as to be rotatable about a rotation shaft 10. The tray 11 is structured to be fixed with mounting bolts 12a.

The tray 11 is a flat plate having a rectangular shape in a plan view. On the upper surface of the tray 11, a component receiving portion 13 is formed in a recessed shape and size capable of accommodating only one chip W to be handled. A mounting groove is provided to extend each of the
14 is recessed. In each of the mounting grooves 14, a stick that is a rectangular cylindrical body having a cross-sectional shape corresponding to each chip is provided.
15 ends are inserted. Also on this tray 11,
A holding shaft 16 is arranged so as to straddle the mounting groove 14, and both ends are fixed to the tray 11 by mounting bolts 12b. A holding ring 16a made of rubber or the like is mounted on the holding shaft 16, and the holding ring 16a is
5 Press the top surface.

On the opposite side of the support bracket 8 from the component receiving portion 13, a portal bracket 17 made of sheet metal is disposed so as to straddle above the support bracket 8. At the upper end of the side wall 17a of the portal bracket 17, an end of a holding arm 18 is pivotally supported. The holding arm 18 is for holding the upper surface of the chip W supplied to the component receiving portion 13 to prevent the position of the component from being displaced. It has a structure in which it is bent into a substantially L-shape when viewed, and a holding roll 19 is attached to the left and right connection sides 18a. An urging spring, one end of which is fixed to the portal bracket 17, is provided on the vertical side 18 b of the holding arm 18.
The other end of the hook 20 is hooked, whereby the holding arm 18 is urged clockwise in FIG.

A support arm 8a is formed in the vicinity of the support bracket 8 below the portal bracket 17, and the air cylinder 21 is swingably supported by the arm 8a. A connecting bracket 23 is connected to a fork bracket 22 connected to a piston rod of the air cylinder 21 by a connecting pin.
The connecting bracket 23 is rotatably connected by a connecting bracket 23, and the connecting bracket 23 is fixed to the receiving base 9. Reference numeral 25 denotes a cover for the air cylinder 21.

 Next, the operation and effect of this embodiment will be described.

Prior to the mounting operation, only the necessary types of sticks 15 packed with chips W are mounted on the tray 11. In this case, the air cylinder 21 is contracted to set the tray 11 in a horizontal state (holding angle position). The stick 15 is inserted into the mounting groove 14 substantially horizontally from the left side in FIG. 1 in this state. Then, since the stick 15 is in a substantially horizontal state, the internal chip W is inserted without spilling, and the vicinity of its front end is pressed by the pressing ring 16a of the pressing shaft 16,
Thereby, the stick 15 is mounted. At this time, the holding arm 18 is in the state of the solid line in the drawing, and the holding roll 19 is located at a position forward of the component receiving portions 13 of the tray 11.

Next, when the mounting operation of the chip W is started, first, the air cylinder 21 is extended and the tray 11 is rotated together with the receiving stand 9 to the supply angle position indicated by the two-dot chain line in the drawing. With this rotation, the pressing arm 18 is rotated clockwise to the position shown by the two-dot chain line in FIG.
Are located on the upper surface of each of the component receiving portions 13. Also tray 11
With the inclination of the stick 15, the leading chip W flows out of the stick 15 into the component receiving portion 13, and the movement of the following chip W is stopped at the leading chip W. Parts receiving part 13 one by one
Supplied to At this time, the pressing roll 19 is positioned with a slight gap from the upper surface of the supplied chip W.

Next, when the air cylinder 21 contracts and the tray 11 is rotated together with the receiving stand 9 to a horizontal holding angle position, the pressing roll 19 moves again forward of the component receiving portion 13 and in this state, the suction head 4 Moves onto the component receiving portion 13 to suck the chip W in the component receiving portion 13, transports the chip W to a predetermined mounting position on the printed circuit board 26, and places the chip W at the predetermined mounting position.

As described above, in the present embodiment, the chips 11 are supplied to the component receiving unit 13 one by one by rotating the tray 11 on which the stick 15 is mounted between the holding angle position and the supply angle position. The dispensing mechanism, the compressed air nozzle, and the opening / closing mechanism thereof as in the above-described conventional example are not necessary, and the chips can be supplied to the component receiving portion 13 one by one with ease and reliability while simplifying the structure. Further, when the tray 11 is at the supply angle position, the pressing roll 19 is located on the component receiving portion 13, so that occurrence of chip displacement and the like can be prevented. When the tray 11 is at the holding angle position, the holding roll 19 moves forward of the component receiving portion 13, so that there is no trouble in the suction operation.

In this embodiment, the stick 15 is
The chip 15 can be mounted on the stick 11, and the chip does not spill out of the stick as in the case of mounting in a conventional inclined state, and the mounting work of the stick 15 is very easy.

Further, in the device of the present embodiment, the component receiving portion 13 is formed so as to be in contact with the outlet opening of the stick 15, and an extra supply path in the form of a conventional ski slope is unnecessary, and the arrangement space can be reduced accordingly. In addition, since a slope-shaped special processing is not required, the cost can be reduced.

Furthermore, since the tray 11 of the present embodiment can be separated from the receiving table 9, when supplying chips having different shapes, it is possible to cope with various types of chips by replacing the tray with a chip corresponding to the chip shape. The cost can be reduced also from the viewpoint.

In the above embodiment, the rotating means is an air cylinder. However, the rotating means may be other than an air cylinder. In the above embodiment, the mounting of the electronic component has been described. However, the present invention can of course be applied to the mounting of a component other than the electronic component.

〔The invention's effect〕

As described above, according to the component mounting apparatus of the present invention, the base member integrally rotates the component receiving portion and the tubular body between the inclined supply angle position and the substantially horizontal holding angle position. The components are supplied one by one when rotated to the supply angle position, and the components are sucked from above when rotated to the holding angle position. Is repeated for each part,
With a simple structure, it is possible to supply parts one by one, and it is possible to securely adsorb and mount the parts on a printed circuit board. Further, since there is no need for an extra supply path, the layout space is reduced and the size of the apparatus is reduced. There is an effect that can be achieved.

[Brief description of the drawings]

1 to 4 are views for explaining a chip supply device according to an embodiment of the present invention, wherein FIG. 1 is a side view, FIG. 2 is a plan view, and FIG. 3 is III in FIG. FIG. 4 is a perspective view of a surface mounting device employing the device, and FIG.
FIG. 1 is a sectional side view showing a conventional chip supply device. In the figure, 1 is a surface mounting device (component mounting device), 7 is a chip supply device (component supply device), 11 is a tray (base member), 13 is a component receiving portion, 15 is a stick (tubular body),
21 is an air cylinder (rotating means), and W is a chip (part).

Claims (1)

(57) [Claims] In a component mounting apparatus, components are supplied one by one to a component receiving portion, and the components are sucked by a suction head and mounted on a printed circuit board. The parts are formed so that the individual parts are held and can be taken out from above, and the cylindrical body in which the parts are linearly packed is attached to the base member such that the opening of the cylindrical body is close to the part receiving portion. Attachment, the base member is rotatably supported, and the base member is provided with an inclined supply angle position at which one component in the cylindrical body flows out to the component receiving portion by its own weight, and the component flows out. A rotating means for rotating between a substantially horizontal holding angle position where the rotation is not performed, and the base member integrally rotating the component receiving portion and the cylindrical body to the supply angle position. Parts by their own weight Is supplied to the goods receiving section, the component mounting apparatus in which the suction head from above when rotated to the holding angular position is characterized in that so as to pick up the components.