JP2905070B2 - Carrier tape for packaging chip-type electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package having a function of protecting chip-type electronic components from contamination, and aligning and taking out the chip-type electronic components for mounting on electronic circuit boards when storing, transporting and mounting the chip-type electronic components. The present invention relates to a plastic carrier tape having a storage pocket.

[0002]

2. Description of the Related Art In recent years, transistors such as ICs, transistors, diodes, capacitors, piezoelectric element resistors,
Chip-type electronic components for surface mounting, such as packaging, consist of a plastic carrier tape that continuously forms embossed pockets that can be stored according to the shape of the electronic component, and a cover tape that can be sealed to the carrier tape. It is supplied packaged in the body. The electronic components of the contents are transported and stored in a state of being housed in a carrier tape, and after the cover tape of the package is peeled off, they are automatically taken out and surface-mounted on an electronic circuit board. With the development of the surface mounting technology, electronic components to be formed into chips are gradually expanding from mechanical components to highly integrated components such as ICs and LSIs. These highly integrated components can cause cracks during solder mounting when the sealing resin that protects the electronic circuit absorbs atmospheric humidity, which is a major problem. After passing through a baking process, it is taped on a carrier tape, sealed in an Al moisture-proof bag called a dry pack, and transported and stored to prevent moisture absorption. In addition, since it takes time to mount the electronic components in one reel of the carrier tape during mounting, it is necessary to repeat the process of transferring to a tray again, baking and using the tray. For this reason, the process is complicated and the carrier tape is further wrapped and re-baking is performed twice, so that simplification of the process while maintaining moisture proof of the product has been strongly desired. In addition, since the material molded for the carrier tape is mainly selected for its moldability that can correspond to the shape of various electronic components, it has no moisture proof function and is not a material having heat resistance higher than the baking temperature.

[0003]

SUMMARY OF THE INVENTION The present invention relates to a thermoplastic resin having a moisture proof function on at least one layer of a plastic embossed tape in which storage pockets for storing chip-type electronic components are continuously formed. By providing a polymer alloy layer in which the following amorphous polyolefin and high-density polyethylene are blended, and by making the dispersed particle diameter of the resin constituting the layer fine, molding workability, rigidity, scratch resistance, impact resistance, It is an object of the present invention to provide a novel highly moisture-proof carrier tape having an extremely good balance of physical properties such as chemical resistance, water resistance and moisture resistance.

[0004]

SUMMARY OF THE INVENTION According to the present invention, two types of resins having substantially the same refractive index and good moisture proofness as resins, and having excellent compatibility because of the same polyolefin resin, are used. Heat deformation temperature of 10 with excellent moisture resistance
An amorphous polyolefin (A) having a temperature of 0 ° C. or lower as a sea component,
Only by finely dispersing the high density polyethylene (B) of the island component, moldability, rigidity, scratch resistance,
The present inventors have found that a novel high moisture-proof carrier tape having an extremely good balance of physical properties such as impact resistance and moisture resistance can be obtained, and have completed the present invention. That is, according to the present invention, at least one layer of a plastic embossed tape in which storage pockets for storing chip-type electronic components are continuously formed has a heat deformation temperature of 1.
The present invention relates to a high-moisture-proof carrier tape provided with a polymer alloy layer containing an amorphous polyolefin (A) at a temperature of 00 ° C. or lower and a high-density polyethylene (B).

The heat deformation temperature used in the present invention is 100 ° C.
The base resin of the following amorphous polyolefin (A)
It is a polymer having a cyclic olefin structure, and can be said to be an amorphous polyolefin from its structure and properties. Examples of the amorphous polyolefin include an amorphous polymer represented by the following general formula. (Where n is a positive integer of 1 or more, m is a positive integer of 1 or more, R ₁ is a hydrogen atom, a halogen atom, CH ₂ CH
Represents ₃ groups or C ₆ H ₄ R ₂ groups, wherein R ₂ represents a hydrogen atom, a hydrocarbon group, an alkoxy group, a halogenated hydrocarbon group or a halogen atom. X represents an addition reaction product of cyclopentadiene or a derivative thereof with norbornadiene or a derivative thereof or a hydrogenated product thereof, or an addition reaction product of dicyclopentadiene or a derivative thereof with ethylene. )

The general formula of a hydrogenated product of an addition reaction product of cyclopentadiene or a derivative thereof with norbornadiene or a derivative thereof, or an addition reaction product of dicyclopentadiene or a derivative thereof with ethylene is shown below.

Embedded image (Where n is a positive integer of 1 or more, and R _{1 to} R
₁₂ each independently represent a hydrogen atom, a halogen atom, and atoms or groups selected from hydrocarbon groups, R ₉ to R
₁₂ may combine with each other to form a monocyclic or polycyclic ring. )

The hydrogenated product of the addition product of cyclopentadiene or its derivative with norbornadiene or its derivative, or the addition product of dicyclopentadiene or its derivative with ethylene is, for example, tetracyclo-3-dodecene, 8-methyltetracyclo-3
-Dodecene, 8-ethyltetracyclo-3-dodecene,
8-propyltetracyclo-3-dodecene, 8-butyltetracyclo-3-dodecene, 8-isobutyltetracyclo-3-dodecene, 8-hexyltetracyclo-3-
Dodecene, 8-stearyltetracyclo-3-dodecene, 5,10-dimethyltetracyclo-3-dodecene,
2,10-dimethyltetracyclo-3-dodecene, 8,
9-dimethyltetracyclo-3-dodecene, 8-ethyl-9-methyltetracyclo-3-dodecene, 11,12
-Dimethyltetracyclo-3-dodecene, 2,7,9-
Trimethyltetracyclo-3-dodecene, 9-ethyl-
2,7-dimethyltetracyclo-3-dodecene, 9-isobutyl-2,7-dimethyltetracyclo-3-dodecene, 9,11,12-trimethyltetracyclo-3-dodecene, 9-ethyl-11,12- Dimethyltetracyclo-3-dodecene, 9-isobutyl-11,12-dimethyltetracyclo-3-dodecene, 5,8,9,10-
Tetramethyltetracyclo-3-dodecene, 8-ethylidenetetracyclo-3-dodecene, 8-ethylidene-9
-Methyltetracyclo-3-dodecene, 8-ethylidene-9-ethyltetracyclo-3-dodecene, 8-ethylidene-9-isopropyltetracyclo-3-dodecene,
8-ethylidene-9-butyltetracyclo-3-dodecene, 8-n-propylidenetetracyclo-3-dodecene, 8-n-propylidene-9-methyltetracyclo-
3-dodecene, 8-n-propylidene-9-ethyltetracyclo-3-dodecene, 8-n-propylidene-9-
Isopropyltetracyclo-3-dodecene, 8-n-propylidene-9-butyltetracyclo-3-dodecene,
8-isopropylidenetetracyclo-3-dodecene, 8
-Isopropylidene-9-methyltetracyclo-3-dodecene, 8-isopropylidene-9-ethyltetracyclo-3-dodecene, 8-isopropylidene-9-isopropyltetracyclo-3-dodecene, 8-isopropylidene-9 -Butyltetracyclo-3-dodecene, 8-chlorotetracyclo-3-dodecene, 8-bromotetracyclo-3-dodecene, 8-fluorotetracyclo-3-
Dodecene, 8,9-dichlorotetracyclo-3-dodecene, hexacyclo-4-heptadecene, 12-methylhexacyclo-4-heptadecene, 12-ethylhexacyclo-4-heptadecene, 12-isobutylhexacyclo-4-heptadecene, 1,6,10-trimethyl-1
2-isobutylhexacyclo-4-heptadecene, octacyclo-5-docosene, 15-methyloctacyclo-
5-docosene, 15-ethyloctacyclo-5-docosene, pentacyclo-4-hexadecene, 1,3-dimethylpentacyclo-4-hexadecene, 1,6-dimethylpentacyclo-4-hexadecene, 15,16-dimethylpenta Cyclo-4-hexadecene, heptacyclo-5
-Eicosene, heptacyclo-5-heneicosene, pentacyclo-4-pentadecene, 1,3-dimethylpentacyclo-4-pentadecene, 1,6-dimethylpentacyclo-4-pentadecene, 14,15-dimethylpentacyclo-4-pentadecene , Pentacyclo-4,10
-Pentadecadiene and the like. Further, as the styrene derivative, for example, styrene, o-methylstyrene,
m-methylstyrene, p-methylstyrene, α-methylstyrene, o-chlorostyrene, m-chlorostyrene,
p-Chlorostyrene, o-ethylstyrene, m-ethylstyrene, p-ethylstyrene, p-methoxystyrene, p-chloroethylstyrene, p-methyl-α-methylstyrene and the like are used. These can be used as a mixture of two or more kinds.

The high-density polyethylene (B) used in the present invention has a density of 0.94 to 0.98 (g / ml), and among them, a density of 0.96 to 0.98 (g / ml) is preferable. The moisture-proof layer used in at least one of the highly moisture-proof carrier tapes according to the present invention contains 80 to 45% by weight, preferably 65 to 4% by weight of an amorphous polyolefin (A) having a heat distortion temperature of 100 ° C or less.
5% by weight, high density polyethylene (B) 20-55% by weight
Preferably, a sheet blended in the range of 35 to 55% by weight must be used. (A) The content of the component is 45% by weight.
If the amount is less than the above, the moldability, moisture resistance and rigidity are not sufficient. If the amount is more than 80% by weight, favorable properties in impact resistance cannot be obtained. If it is more than 65% by weight, chemical resistance tends to decrease. Further, if necessary, compatibilizers and additives such as dyes and pigments, stabilizers, plasticizers, antistatic agents, ultraviolet absorbers, antioxidants, lubricants, fillers, and flexibility as long as the basic properties are not impaired. And the like which imparts the same can also be added. The thickness of the layer is preferably 100 to 300 μm, more preferably 150 to 250 μm.
Is preferred. If it is less than 100 μm, the moisture-proof effect is insufficient, and if it exceeds 300 μm, the moldability will be significantly reduced and the cost will be increased. May be. or,
For the purpose of imparting conductive performance, an antistatic agent, conductive powder, or the like may be kneaded or coated on the resin of one layer or both outer layers, and the surface resistance value is 10 ⁹ Ω / □.
It needs to be adjusted to: If it exceeds 10 ⁹ Ω / □, the ability to suppress static electricity becomes insufficient. Further, regarding the moisture proof performance, the moisture permeability of the composite sheet is in accordance with JIS Z020.
840 At least 1.
0 g / m ² · 24 hr or less is required, and more preferably 0.5 g / m ² · 24 hr or less. 1.0g / m ² · 24
If it exceeds hr, the function of preventing cracks in the sealing resin at the time of solder mounting is insufficient, and it is necessary to perform protection and storage by packaging in a moisture-proof bag or re-baking in a later step. Further, the layer constituting the carrier tape may be a composite film of three or more layers having the above two layers as a basic unit.

[0009]

EXAMPLES Examples of the present invention are shown below, but the present invention is not limited by these examples. << Examples 1, 2, 3, 4, 5, 7, 8, 9, Comparative Examples A, B,
C, D >> A three-layer structure in which a polymer alloy sheet made of a thermoplastic resin with excellent moisture resistance is processed to a thickness of 250 μm, and a coating material in which carbon is dispersed in a urethane-based binder is coated on both surfaces with a gravure roll. A composite sheet for a carrier tape was obtained. The obtained composite sheet was embossed by a pressure molding machine to obtain a carrier tape having a width of 24 mm. Also, the moisture permeability of the composite sheet is determined according to JIS Z 020.
Method 8 Measured at 40 ° C. and 90% RH. Next, the electronic component QFP 52P was housed in an emboss, and sealed with a cover tape using PET with a biaxially stretched film and an acrylic adhesive for a sealant layer in the layer configuration shown in FIG. After the sample was placed in a 30 ° C., 70% RH environment for 60 days, the cover tape was peeled off, and the change in weight of the sealing resin of the electronic component due to moisture absorption was measured to calculate the moisture absorption rate. Next, the removed electronic component is subjected to IR reflow (240 ° C., 1
0 second) and observed for cracks with an engineering microscope (× 100).
It was shown to. The moisture absorption rate is 30 after sealing in a carrier tape.
Q in carrier tape treated at ℃ 70% RH for 60 days
It was calculated from the weight change of FP 52P (14 mm × 14 mm × 2 mmt). The crack was evaluated by soldering the electronic component taken out of the carrier tape and observing the surface of the sealing resin at that time.

(Examples 1 and 2) As the component (A) of the polymer alloy sheet, Apel APL6509 [APO
A heat distortion temperature of 72 ° C. (ASTM D648 18.6)
kg / cm ² ) manufactured by Mitsui Petrochemical Industry Co., Ltd.]
As the component (B), Ace Polyethylene HD F6080
V [HDPE; density 0.961 g / cm ³ (JIS
K6760) (manufactured by Showa Denko KK). (Examples 3 and 4) As the component (A) of the polymer alloy sheet, Apel APL6011 [APO; heat deformation temperature of 95 ° C (ASTM D648 18.6 kg / cm ² )]
Ace Polyethylene HD S6002 [HDPE; density 0.954 g / cm ³ (JIS K6760) manufactured by Showa Denko KK] was used as the component (B). (Comparative Example 1) As the component (A) of the polymer alloy sheet, Apel APL6509 [APO; manufactured by Mitsui Petrochemical Industries, Ltd.] was used. (Comparative Example 2) As the component (A) of the polymer alloy sheet, Apel APL6509 [APO;
C. (ASTM D648 18.6 kg / cm ² ) manufactured by Mitsui Petrochemical Industry Co., Ltd.]
Ace Polyethylene HD F6080V [HDPE; density 0.961 g / cm ³ (JIS K6760) manufactured by Showa Denko KK] was used. (Comparative Example 3) As the component (A) of the polymer alloy sheet, Apel APL6515 [APO;
5 ° C. (ASTM D648 18.6 kg / cm ² ) manufactured by Mitsui Petrochemical Industry Co., Ltd.], and as the component (B), Ace Polyethylene HD F6080V [HDPE;
The density used was 0.961 g / cm ³ (JIS K6760, manufactured by Showa Denko KK).

[0011]

[Table 1]

[0012]

According to the present invention, the electronic components housed in the carrier tape do not absorb moisture during transportation and storage of the electronic components without being repackaged by a dry pack in a later process, and can be used during the mounting process. There is no need for re-baking, and the occurrence of cracks in the sealing resin in the soldering process can be prevented. At the same time, the dry pack packaging step and the re-baking step can be omitted, and the number of steps can be significantly reduced.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a layer configuration of a carrier tape of the present invention.

FIG. 2 is a cross-sectional view showing an example of a layer configuration of a cover tape to be sealed on the carrier tape of the present invention.

Continued on the front page (51) Int.Cl. ⁶ Identification code FI H01L 23/28 H01L 23/28 L

Claims (5)

(57) [Claims] 1. A plastic embossed tape in which storage pockets for storing chip-type electronic components are continuously formed, wherein at least one layer has a heat deformation temperature of 100 ° C. or less.
Crystalline polyolefin (A) and high density polyethylene (B)
Is a thermoplastic resin having an embossable and moisture-proof function, wherein the sheet has a moisture permeability of JIS Z
[0208] 1.0 g according to the measurement method at 40 ° C and 90% RH
/ M ² · 24 hr or less, carrier tape for packaging chip-type electronic components. 2. The mixing ratio of the amorphous polyolefin (A) and the high-density polyethylene (B) is 80% by weight: 20% by weight.
The carrier tape for packaging chip-type electronic components according to claim 1, wherein the carrier tape is 55 to 45% by weight. 3. The high-density polyethylene (B) has a density of 0.
The carrier tape for packaging chip-type electronic components according to claim 1 or 2, wherein the carrier tape is 960 or more. 4. An amorphous polyolefin (A) is an addition reaction product of cyclopentadiene or a derivative thereof and norbornadiene or a derivative thereof or a hydrogenated product thereof.
4. The carrier tape for packaging chip-type electronic components according to claim 1, which is an addition reaction product of dicyclopentadiene or a derivative thereof with ethylene. 5. The chip-type electronic component packaging according to claim 1, wherein a conductive layer is provided on at least one side of the sheet so as to have a surface resistance of 1 × 10 ⁹ Ω / □ or less. For carrier tape.