JP2899025B2 - Laminate - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a laminate of a transparent and heat-resistant plastic film with improved adhesiveness.

[Conventional technology and its problems]

Polyetheretherketone, polyethersulfone, etc. have been developed as plastic films that have excellent transparency and heat resistance of 180 ° C or more in terms of heat resistance. In the case of bonding objects, there is a big problem in the adhesiveness, and at present, no suitable adhesive has been found. Therefore, when these heat resistant films are used as a support substrate for a semiconductor device or the like, they have been a major obstacle.

It is generally known that there is no adhesive for polyolefin-based resins.However, as a method for imparting an adhesive function to these films, there is a known method for improving the adhesiveness of the film surface by surface modification such as corona discharge treatment. is there. However, this treatment method does not exhibit a sufficient effect on transparent heat-resistant films such as polyetheretherketone and polyethersulfone. The present inventors have conducted research on coating various inorganic materials on a plastic film and found that a certain kind of nitride can be formed on these heat-resistant plastic films with good adhesion strength. Reached.

[Disclosure of the Invention]

That is, the present invention provides a transparent heat-resistant plastic film laminate characterized in that a silicon nitride layer is formed on the surface of a plastic film selected from polyetheretherketone and polyethersulfone to improve the surface adhesive properties. ,.

In other words, regarding the adhesion of this kind of poorly adhesive plastic film, especially a transparent heat-resistant film such as polyetheretherketone or polyethersulfone, it is essential to coat a certain kind of nitride film layer on the film surface. In general, it was possible to dramatically improve the adhesiveness of a plastic film having no adhesive performance, and to enable adhesion between films and adhesion to other objects. More specifically, by forming a transparent silicon nitride layer on a transparent and heat-resistant plastic film, particularly polyetheretherketone and polyethersulfone, a thermosetting type such as polyester, acrylic, epoxy, etc. This is an improvement in the adhesiveness to a wire-curable adhesive.

 Hereinafter, the components of the present invention will be described in more detail.

The nitride film layer in the present invention can be formed by applying a corresponding metal such as silicon by a vacuum deposition method or a sputtering method in a nitrogen or ammonia atmosphere. Also, when each nitride is used, it can be formed by a high frequency sputtering method. Further, an effective nitride layer can be formed from a gas phase such as silane and ammonia by a chemical vapor deposition method or the like.

The thickness of the nitride layer is not particularly limited. If the thickness of the nitride thin film is sufficient to cover the film surface, the adhesion to the adhesive is improved. Therefore, even if a thin film having a thickness of about 100 mm is formed, the adhesion to the adhesive is improved, and there is no practical problem. However, if the film thickness is too large, the optical transmittance of the film is reduced, which causes problems such as transparency damage, reduced film flexibility, and peeling of the nitride layer. In addition, the film thickness is too thin 50
If it is less than Å, the adhesion may be reduced, depending on the densification of the film, etc., and it is more preferably more than 100 °. More preferably 200-2
000Å.

Examples of the base plastic film used in the present invention include polyether ether ketone and polyether sulfone. Even if these copolymers and mixtures are used, there is no significant difference in transparency and heat resistance, and any case is included in the scope of the present invention. The thickness is not particularly limited, but is about 10 to 10,000 μm.

[Example 1] Each film of polyetheretherketone and polyethersulfone having a thickness of 50 to 100 µm was formed to a thickness of 1000 mm.
Was formed by a high frequency sputtering method using an argon gas using a silicon nitride target. These film laminates were tested for adhesion to silicon wafers using an ultraviolet-curing adhesive (Aronix UV-3100, trade name, manufactured by Toa Gosei Chemical Industry Co., Ltd.). Was able to adhere.
At this time, the adhesion strength between the film and the silicon wafer was all 0.5 kg / cm or more.

Example 2 A silicon nitride thin film was formed on 100 μm polyetheretherketone and polyethersulfone. The silicon nitride film layer was formed by vacuum-depositing silicon in a nitrogen atmosphere by an electron beam evaporation method. When the adhesion of these films to a silicon wafer was examined using ARONIX UV-3100, adhesion strength of 0.5 kg / cm or more was obtained without any peeling phenomenon.

(Comparative example)

When Aronix UV-3100 was used directly on 50 and 100 μm polyetheretherketone and polyethersulfone films, the adhesive peeled off easily and did not function as an adhesive.

〔The invention's effect〕

By coating a polyetheretherketone and polyethersulfone film, which are transparent plastics having heat resistance, with the nitride thin film layer specified in the present invention, the adhesive properties of the surface are dramatically improved, and a commercially available adhesive can be used. It was confirmed that the conventional bonding process became possible and the applicability of this type of base material was greatly expanded.

Claims (1)

(57) [Claims] 1. A transparent heat-resistant plastic film laminate, wherein a silicon nitride layer is formed on the surface of a plastic film selected from polyetheretherketone and polyethersulfone to improve the surface adhesive properties.