JP2891594B2 - relay - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-channel relay driven by piezoelectric power which can be used as a micromachine.

[0002]

2. Description of the Related Art A micro-relay comprises a mechanism portion having a movable structure and driving means for driving the movable portion, and an electromagnetic force is generally used as a drive source for the mechanism portion. As a means for generating the electromagnetic force, a conductive wire is wound around a ferromagnetic material to flow an electric current to generate the electromagnetic force in many cases.

FIGS. 5 (a) and 5 (b) are an exploded perspective view of an example of a conventional micro relay and its C-
It is C 'sectional drawing.

In FIG. 5A, reference numeral 401 denotes a substrate of an electromagnet portion for generating a magnetic force. A copper wire is wound around grooves 403 and 404, and coils 403-1 and 404-1 are formed as shown in FIG. 5B. Is formed. Reference numeral 402 denotes a movable body having contact electrodes 408 and 409 for passing a control current, and magnetic metals 405 and 406 attracted to the electromagnet portion are attached to the movable body, respectively. This movable body 402 is moved by a shaft 407 as shown by an arrow in FIG.
You can do a seesaw exercise. The substrate 40 of the electromagnet portion facing the contact electrodes 408 and 409 of the movable body
At positions 1, fixed contacts 410a and 410b and 411a and 411b for inputting and outputting control current are formed. Further, the substrate 401 and the movable body 402 are bonded and fixed at fixed intervals by a spacer 412.

Next, the operation principle of the micro relay will be described. In FIG. 5B, when a current is applied to the copper wire on the coil 404-1 side of the substrate 401, an electromagnetic force is generated, and the magnetic metal 406 of the movable body 402 is attracted. When the magnetic metal 406 is attracted, the movable body 402 rotates about the shaft 407, and the contact electrodes 409 are fixed to the fixed contacts 411a and 411.
b, the circuit closes and the signal current passes. Next, the current flowing through the coil 404-1 is interrupted, and the coil 403-
When a current flows through one of the conductors, the movable body 402 rotates to the opposite side, and the contact electrode 408 contacts the fixed contacts 410a and 410b to close the circuit, and a signal current passes through these contacts. In this way, the signal current is switched, and the operation as a switching relay is performed.

[0006]

Since the above-mentioned micro relay has a limited number of channels of two, it cannot be used for switching three or more signals. In addition, there is a problem that current consumption is large due to electromagnetic driving.

[0007]

SUMMARY OF THE INVENTION A relay according to the present invention comprises a movable body substrate comprising a movable portion having a movable contact and an outer frame portion for fixing one end of the movable portion, and a spacer provided on the outer frame portion of the movable body substrate. It is constituted by an insulating substrate having a fixed contact opposed to the movable contact fixed to face through,
Dummy wiring of the same height as the movable contact is applied to the portion of the outer frame portion facing the insulating substrate where the movable contact is not formed, and the fixed contact of the portion facing the outer frame portion of the insulating substrate is provided. The dummy wiring having the same height as the fixed contact is provided in a portion where no fixed contact is formed.

[0008]

According to the present invention, a plurality of signals can be switched, the gap between each movable contact and the fixed contact is uniform, and the number of components is small, which is advantageous for assembly. Since the element can be miniaturized, it can be used as a micro relay.

[0009]

1 (a) is an exploded perspective view of an embodiment of the present invention, FIG. 1 (b) is a sectional view taken along the line AA 'of FIG. 1 (a), and FIG. It is BB 'sectional drawing of (a).

The movable body substrate 11 is a bimorph type piezoelectric element, which is diced and processed into, for example, five slits so as to form movable parts 11a, 11a... And a hatched outer frame part 11b. On the lower surface of the movable end of the movable portion 11a, movable contacts 12, 12,... Are formed by vapor deposition.

Glass substrate 21 facing movable body substrate 11
, Fixed contacts 22, 22,... Are formed by plating so as to face the movable contacts 12, 12,.

The movable body substrate 11 and the glass substrate 21 are joined with an adhesive mixed with a spacer 31 to maintain a predetermined gap.

The bimorph type piezoelectric element constituting the movable body substrate 11 is composed of two piezoelectric elements 1 having the same polarization direction.
3a, 13b and three drive electrode plates 14a, 14b, 14
c are alternately bonded.

A movable contact is formed on the movable body substrate 11,
In order to compensate for the difference in height between the part with and without the contact and to make the gap uniform when the fixed contact is formed on the glass substrate 21, the surface of the movable body substrate 11 on the movable contact side is provided. A dummy wiring 15 having the same thickness as that of the movable contact 12 is provided. A dummy wiring 23 having the same thickness as that of the fixed contact 22 is provided on the surface of the glass substrate 21, and a dummy wiring 16 having the same thickness as the drive electrode plates 14a and 14c is provided on the movable body substrate 11. It has been smoothed. The glass substrate 21 may be a silicon substrate having a thermal oxide film formed on its surface, or any other suitable insulating film.

First, a process for forming the movable substrate 11 will be described with reference to FIGS. 2 (a) to 2 (g) and 2 (a1) to 2 (g1). (A) to (g) are plan views of respective processes, and (a1) to (g1) are cross-sectional views corresponding to them.

First, in FIGS. 2A and 2A, two polarized piezoelectric bodies 111a and 111b are bonded together with a drive electrode plate 112b (eg, Al) sandwiched therebetween so that the polarization directions are the same. .

Next, as shown in (b) and (b1), drive electrode plates 112a and 112c are deposited on both surfaces.

Next, (c) and (c1) will be described. A photoresist is applied to the surface in the state of (b),
A pattern having a predetermined shape is formed, unnecessary portions are etched with an etchant, and the divided drive electrode plates 112a are formed.
And a dummy pattern (wiring) 113a is formed. Similarly, a drive electrode plate 112c and a dummy pattern 113c are formed on the other surface. Next, the photoresist is peeled off to complete the driving portion.

Next, as shown in (d) and (d1), insulating films 114a and 114c of, for example, SiO ₂
Is formed by sputtering.

Next, as shown in (e) and (e1), an Au film 115 is deposited on this surface.

Next, as shown in (f) and (f1), a photoresist is applied to form a predetermined pattern,
Unnecessary portions are etched by ion milling to form movable contacts 115 and dummy patterns 116.

Finally, as shown in (g) and (g1), the gap between the patterns of the movable contacts 115 is diced to a predetermined position and slits 117 are formed. Thus, the movable body substrate 11 is completed.

Next, a process for forming a fixed contact on a glass substrate will be described with reference to FIGS. 3 (a) to 3 (d) and (a1).
(D1) will be described. (A) to (d) are plan views, and (a1) to (d1) are cross-sectional views thereof.

In the case of a fixed contact, since the height of the contact from the substrate needs to be increased, the structure of the contact is made of Ni and Au.
It has a layer structure.

First, as shown in FIGS. 3A and 3A, a Ni thin film 212 is formed on a glass substrate 211 by sputtering. Next, FIGS.
As shown in 1), an electroformed Ni layer 213 is grown by electrolytic plating. The electrolytic plating of Ni is performed with sulfamic acid N
Perform in i-bath.

Next, as shown in FIGS. 3 (c) and (c1), a photoresist is applied to form a pattern of a predetermined shape, unnecessary portions are etched with a 0.5 NHNO ₃ solution, and fixed contacts are formed. The base 213 and the base 214 of the dummy pattern are formed.

Next, as shown in FIGS. 3D and 3D, the Au layer 21 is formed on the surface of the Ni by electroless plating.
5 and the fixed contact 216 and the dummy pattern 2
17 is assumed. The electroless plating of Au is performed in two steps using, for example, a plating solution for forming an underlayer of an acid substitution type and a plating solution for forming a thick film of an alkaline reduction type.

As described above, the fixed contact is completed on the glass substrate 211. Finally, as shown in FIGS. 1A and 1B, the back surface of the outer frame portion 11b of the movable body substrate 11 and the glass substrate 21 are joined with an adhesive mixed with a spacer 31 having a predetermined particle size, and a piezoelectric type is formed. The relay is completed. At this time, the movable portion 11a and the outer frame portion 1b are integrally molded products, and since the outer frame portion 11b has the dummy patterns 15 and 16, the gap between the movable contact 12 and the fixed contact 22 is maintained at the particle size of the spacer 31. Have been.

Next, the operation of the piezoelectric relay will be described with reference to FIG.
A description will be given according to (a) and (b) and FIG. 1 (c).

FIG. 4A shows a state where no electric field is applied to the bimorph type piezoelectric element, and FIG. 4B shows a state where an electric field is applied.

The two piezoelectric bodies 311 a and 3
11b (the arrow indicates the polarization direction) so that the polarization direction is the same, with the drive electrode plate 312b interposed therebetween.
Driving electrode plates 312a and 312c are vapor-deposited on both sides thereof and then patterned into a predetermined shape. Further, both sides thereof are sandwiched between insulating films 313a and 313b, and a movable contact 314 is vapor-deposited on one side thereof and patterned into a predetermined shape to form a movable substrate 310. On the other hand, a fixed contact 312 is formed on a glass substrate 321, and the fixed contact 312 and the movable body substrate 310 are joined with an adhesive mixed with a spacer 330.

In the case of FIG. 4A, since no electric field is applied to the bimorph type piezoelectric element, the piezoelectric element does not bend, so that the movable contact 314 and the fixed contact 320 do not close, so that a signal current flows. Absent.

Next, as shown in FIG. 4B, when the drive electrode plate 312b is grounded to the bimorph type piezoelectric element and a positive electric field is applied to the drive electrode plates 312a and 312c, the piezoelectric body 311a extends, Since the piezoelectric body 311b shrinks, the right end of the movable body substrate 310 makes a bending motion to bend downward. Therefore, the movable contact 314 and the fixed contact 320 are closed, and a signal current flows. When the voltage application is released, the movable contact 314 and the fixed contact 322 are opened because the piezoelectric element returns to the original shape as shown in FIG.

FIG. 1C is a cross-sectional view of the present invention, which operates as a piezoelectric multi-channel relay. The outer frame portion 11b of the movable body substrate 11 is fixed to the glass substrate 21 via a spacer 31 with an adhesive. Each of the channels A, B, C, and D makes an independent bending motion because the movable portion 11a is separated. In the figure,
Channels B and D are bent by application of an electric field and the contacts are closed. Channels A and C are not bent and the contacts are opened because no electric field is applied.

[0035]

According to the present invention, a plurality of signals can be switched, the gaps between the individual movable contacts and the fixed contacts are uniform, there is no variation in contact characteristics, and the number of components is small and assembly is easy. And become solid.

[Brief description of the drawings]

1A is an exploded perspective view of one embodiment of the present invention, FIG. 1B is a sectional view taken along the line AA ′ of FIG. 1A, and FIG. 1C is a sectional view taken along the line BB ′ of FIG. It is sectional drawing.

2 (a) to 2 (g) are plan views of a process for producing a movable body according to an embodiment of the present invention, and FIGS. 2 (a1) to 2 (g1) are cross-sectional views corresponding to FIGS. is there.

3 (a) to 3 (d) are plan views of a process for producing a fixed contact according to one embodiment of the present invention, and show (a1) to (d).
1) is a sectional view for each of (a) to (d).

FIG. 4A is a cross-sectional view in a state where no electric field is applied to the piezoelectric element, and FIG. 4B is a cross-sectional view in a state where an electric field is applied.

FIG. 5A is an exploded perspective view of an example of a conventional micro relay, and FIG. 5B is a cross-sectional view taken along the line CC ′.

[Explanation of symbols]

 REFERENCE SIGNS LIST 11 movable body substrate 11a movable part 11b outer frame part 12 movable contact 13a, 13b piezoelectric element 14a, 14b, 14c drive electrode plate 15, 16, 23 dummy pattern 18a, 18b insulating film 21 glass substrate 31 spacer

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Tetsuya Inui 22-22, Nagaikecho, Abeno-ku, Osaka-shi, Osaka Inside Sharp Corporation (72) Inventor Kenji 22-22, Nagaikecho, Abeno-ku, Osaka-shi, Osaka Sharp Corporation (56) References JP-A-63-121226 (JP, A) JP-A-2-100224 (JP, A) JP-A-56-99747 (JP, U) (58) Fields investigated (Int. Cl. ⁶ , DB name) H01H 57/00

Claims (1)

(57) [Claims] A movable substrate having a movable portion having a movable contact and an outer frame portion for fixing one end of the movable portion; and the movable substrate being opposed to and fixed to the outer frame portion of the movable substrate via a spacer. An insulating substrate having a fixed contact opposed to the movable contact; a dummy wiring having the same height as the movable contact is applied to a portion of the outer frame portion facing the insulating substrate where the movable contact is not formed. A dummy wiring having the same height as the fixed contact is provided on a portion of the insulating substrate facing the outer frame portion where the fixed contact is not formed.