JP2885167B2 - Semiconductor device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device in which a semiconductor element is packaged by resin sealing. 2. Description of the Related Art Conventionally, a semiconductor device of this type is constructed as shown in FIG. 3. In FIG. 3, reference numeral 1 denotes a strip-shaped pad (hereinafter also referred to as a tab) on which a semiconductor element 2 is mounted.
The electrode 3 of the semiconductor element 2 is located on the short side of the tub 1. Reference numeral 4 denotes a lead composed of an internal lead 4a and an external lead 4b, which is connected to the electrode 3 of the semiconductor element 2 on the tab 1 by a wire 5. Reference numeral 6 denotes a pad lead (also referred to as a tab lead) for holding the tab 1 on an outer frame (not shown) of a lead frame until completion of assembly, and A denotes a resin package for sealing the semiconductor element 2 and the internal lead 4a. is there. FIGS. 4A and 4B are a plan view and a side view of the semiconductor device, respectively. In assembling a semiconductor device having such a structure, a semiconductor element 2 is bonded on a tab 1, and then an electrode 3 of the semiconductor element 2 is connected to an internal lead 4 a by a wire 5. 2 and internal lead 4
This is performed by packaging a with a sealing resin. However, in the conventional semiconductor device, since the external lead 4b is located on the long side of the package A, the external shape of the package A cannot be reduced in size as it is. , Printed circuit board (not shown)
However, there has been a problem that it is not possible to respond to recent high-density mounting for such devices. That is, in this type of semiconductor device, all the internal leads 4a must be located near the electrode 3 of the semiconductor element 2, and therefore, some of the leads 4 are pulled toward the short side of the package A to be longer. Since it is necessary to protrude to the side, it has not been possible to respond to high-density mounting. The present invention has been made in view of such a problem, and can reduce the size of a package.
Accordingly, it is an object to provide a semiconductor device capable of achieving high-density mounting on a printed circuit board or the like. According to a first aspect of the present invention, there is provided a semiconductor device having a flat rectangular shape having a pair of long sides and short sides opposed to each other. A semiconductor element having a plurality of electrodes locally arranged on the side, a pad provided in the resin package and having the semiconductor element fixed thereto, and connected to each of the electrodes of the semiconductor element via a lead wire; is provided with a plurality of lead derived from the inside to the outside in the short side of each of the above resin package, all of said plurality of leads is arranged to be derived from a pair of short sides of the resin package And wherein the respective leads are arranged inside the resin package and external leads arranged outside the resin package. The external lead portions of all the leads extend in a direction substantially parallel to the long sides of the resin package, and the inner ends of the internal lead portions of all the leads are connected to the electrodes of the semiconductor element. are arranged adjacent, further, the resin package of the above among the plurality of leads
Internal lead near the center located near the center of the short side
The part is wider at its inner end than at its outer end.
And a lead near the center of the plurality of leads.
Leads placed outside of the lead
It has a bent part bent in the extension direction . A semiconductor device according to a second aspect of the present invention is a resin package having a flat rectangular shape having a pair of long sides and short sides opposed to each other, and is built in the resin package and arranged locally on the short side. Semiconductor element having a plurality of electrodes, a pad provided in the resin package and having the semiconductor element fixed thereto, and each of the electrodes of the semiconductor element connected to each of the electrodes via a lead wire from the inside of the resin package. It has a plurality of leads led out to the outside, all of the plurality of leads are arranged so as to be led out from a pair of short sides of the resin package, and each of the leads is connected to the resin package. An internal lead portion disposed inside and an external lead portion disposed outside the resin package; It is extended in a direction substantially parallel to the long sides of the resin package and the inner end of said inner lead portions of all leads are arranged adjacent to the electrodes of the semiconductor element, further of the plurality of leads Above
Center located near the center of the short side of the resin package
The inner lead of the nearby lead is located at its outer end
Having a wider portion wider than the plurality of leads
Inside the lead near the center
Is bent in the direction of extension of its external lead
A first electrode group having a bent portion , the plurality of electrodes being closer to a short side of the resin package; and a first electrode group being farther from the short side of the resin package than the first electrode group, and having the first electrode group.
At least one second electrode closer to the long side of the resin package than the electrode group of the above, and among the plurality of leads connected to the second electrode, the internal lead portion of the resin lead A portion extending substantially parallel to a long side of the package, the portion extending to a center side of the pad longer than a distance from a short side of the resin package to the pad; everything that is connected to the electrode group, the long side direction of the inner lead portions
The length is shorter than the distance from the short side of the resin package to the pad. Preferably, in the first invention, of the plurality of leads located on both sides, the internal leads on the resin package inner side are parallel to the long sides of the package and the internal leads of the other leads are provided. The inner lead portion extends longer than the inner lead portion, and the inner end portion of the internal lead portion is disposed close to an electrode located on the side edge of the semiconductor element opposite to the long side of the resin package. The end is connected to the electrode by the lead wire.
Alternatively, preferably, in the first or second aspect of the present invention, a pad lead is provided extending from the pad to a pair of long sides of the resin package. More preferably, the first invention or the first invention
In the invention of the second aspect, the pad lead is provided on the pad.
A total of four are provided on each of the left and right sides of each long side . In the semiconductor device according to the first aspect of the present invention, internal leads, pad leads, and pads are sealed with a resin package, and electrodes of the semiconductor element are localized on the short side of the resin package. The leads connected to the electrodes are led from the inside to the outside on the short side of the resin package. Especially the short side of the resin package in this lead
Near the center of its inner end is wider than its outer end
Has a large wide part, so the length of the internal lead
Even if the length is short and linear,
Effectively retains while reducing the size of the short side of the page
Can be achieved. Also, in the semiconductor device according to the second aspect of the present invention , the lead connected to the second electrode is half.
Extends parallel to the long side of the conductor element and the short side of the package
And extends beyond the pad to approach the second electrode. Yo
The lead is derived from the short side without bypass
You. Moreover, the lead connected to the first electrode group
All the internal leads are from the short side of the resin package
The lead width is shorter than the distance to the pad, so the lead width is
It does not increase the size of the orientation. Therefore, all Lee
The size can be reduced by deriving the cable from the short side direction.
On that can further miniaturization of the short side direction may FIG Rukoto. Further, in the first or second invention,
According to a new aspect, the pad lead is moved from the pad to the resin
The package extends to a pair of long sides of the package, for example , two pads are provided on each long side of the pad, so that a total of four pads are provided. In this case, the rigidity of the die pad can be reliably improved with a simple configuration. Alternatively, a desirable embodiment in the first invention
Is located on both sides of multiple leads
But its internal leads are parallel to the long side of the resin package.
And extend longer than the inner lead of the other lead, and its inner end
Part of the semiconductor element facing the long side of the resin package
And the internal lead
By connecting the inner end of the portion to the electrode by a lead wire, it is possible to prevent the wire from sagging in the bonding connection between some of the electrodes arranged on the long side of the resin package and the internal lead portion, Moreover, at this time, there is no hindrance to miniaturization of the package. [0014] PREFERRED EMBODIMENTS hereinafter, one embodiment of the present invention
One will be described with reference to the drawings. FIG. 1 shows an embodiment of the present invention.
2 (a) and 2 (b) show the appearance of one semiconductor device, in which A is a flat rectangular resin package having a pair of opposed long side surfaces and short side surfaces. A semiconductor element 2 having a plurality of electrodes 3 arranged along the side surface so as to be localized on the short side is built therein. 1 is provided within the resin package A, the semiconductor element 2 (also referred to as tabs) bonded pads 11 inside the resin package A, Ru outside of the inner lead portion 11a and the outer lead portion 11b Tona
In multiple leads, those located on both sides of the internal lead portion 11a is extended longer than the other inner lead portions
ing. Specifically, pad from the short side of resin package A
Extend to the center of pad 1 longer than the distance to 1
I have. The plurality of electrodes 3 are located on the first side near the short side of the resin package.
The first electrode group 31 and the first side from the short side of the resin package A
It is farther than the electrode group 31 and more dense than the first electrode group 31.
And a second electrode 32 near the long side of the resin package A.
It is. And the lead 11 connected to the second electrode 32
The inner lead portion 11a is substantially flat with the long side of the resin package A.
The end (inner end) 11c has a
And a bent portion 11d close to the second electrode 32.
You. The plurality of leads 11 are located in the short side of the resin package A.
A first having at least one lead located near the center
The lead group 111 and the outside of the first lead group 111,
The longer side of the resin package A than the first lead group 111
And the second lead group 112 located at First Li
Lead 11c of the lead 11 belonging to the lead group 111
Is the side of the root of the internal lead portion 11c on the inner end side.
, That is, the inner lead of the entrance of the tree package A
Having a wide portion 11g wider than the width of the main body 11f.
I have. In addition, the lead 11 belonging to the second lead group 112
Is that the internal lead 11c extends from the external lead 11b.
It has a bent portion 11e bent in the longitudinal direction.
There is something. Of the lead 11 connected to the second electrode 32
The bent portion 11d of the internal lead portion 11c is
Bent substantially perpendicularly against one of the external lead 11b
So it can be seen as a wide part. Reference numeral 5 denotes a plurality of lead wires (also referred to as wires) for connecting each of the electrodes 3 to one of the plurality of leads 5 in the resin package A, and reference numeral 12 denotes a semiconductor element when the apparatus is assembled. A short pad lead (also referred to as a tab lead) that elastically holds the pad 1 on an outer frame (not shown) of a lead frame while being bonded to the pad, and extends from the pad 1 to the long side surface. As described above, four packages are arranged in parallel with the short side surface of the package. Hereinafter, the structure of the plurality of leads 11 will be described in detail. [0017] Of the plurality of leads 11, it is located on both sides
Shall the inner lead portion 11a of the long side face parallel to the other lead 11 of the inner lead portion 11a resin package A
Extended longer, yet the distal end portion 11c of the inner lead portion 11a, you face the long side face of the resin package A
It is disposed in proximity to the second electrode 32 positioned on the side edges of the semi-conductor elements 2. The bent portion which is bent to the long side face perpendicular direction of the resin package <br/> cage A of the distal end 11c Waso
11d, and is connected to the second electrode 32 by the lead wire 5 at the bent portion 11d . The leads 11 belonging to the first lead group 111 are
A wide portion 11g is provided at the tip of the internal lead portion 11a.
And the lead-wire 5 at the wide portion 11g.
It is connected to the first electrode group 31. Second lead group 1
The lead 11 belonging to 12 is located beyond the internal lead portion 11a.
The end portion has bent portions 11d and 11e.
First electrode at 1d, 11e by lead wire 5
It is connected to the group 31 or the second electrode 32. In addition,
The method of assembling the semiconductor device according to the present embodiment is the same as that of the related art, and a description thereof will be omitted. Next, the function and effect will be described. In the semiconductor device configured as described above, all the internal leads 11 are provided so as to be parallel to the long side of the resin package A and exposed from the short side over the inside and outside of the resin package A. There is no need to extend the lead 11a to the short side of the package A, so that the resin package A for sealing the internal leads 11a and the semiconductor element 2 can be reduced in size, and high-density mounting on a printed circuit board or the like can be achieved. . Further, leads belonging to the first lead group 111
The internal lead portion 11a of the first connector 11
c) at the outer end (the root 11) of the internal lead portion 11a.
It has a wide portion 11g wider than f). Also the second
The lead 11 belonging to the lead group 112 has an internal lead.
Is folded in the extending direction of the external lead portion 11b.
Some have a bent portion 11e. Generally half
Pitch P1 of electrode 3 of conductor element 2, wire bond of lead
Pitch P2 of the lead portion and pitch of the external lead portion of the lead.
H3 has a relationship of P1 <P2 <P3, and the resin package
Since the semiconductor element is located in the center of the
The lead near the center of the short side of the page has a short length,
Also extend linearly, and the retention tends to be weaker
There is. Form a bent part for the lead near this center.
If you try to keep it in place,
The end must be close to the corresponding tip electrode,
Even if it is bent in the middle of the short internal lead,
Is bent again to return to the vicinity of the electrode of the semiconductor element
Need arises. In this case, bends provided for retaining
The size of the lead is limited due to its size,
As it is limited to the narrow area of the space, the retaining effect is sufficient
It is difficult to get to. In the structure shown in the embodiment, the first
In the short side of the resin package A belonging to the lead group 111
Wide portions 11g are formed for the four leads 11 near the center
Therefore, the wide portion 11g is connected to the internal lead portion 11a.
Formed at the inner end of the
Bonding with the lead wire 5 is ensured by the wide portion 11g.
Can be achieved. On the other hand, the long side of resin package A
Of the second lead group 112 arranged in the
Means that the plurality of electrodes 3 of the semiconductor element 2 are localized on the short side.
Lined inside so that it is easy to connect with it
The lead portion 11a is provided with bent portions 11d and 11e.
You. Therefore, the size of the short side of the resin package A is reduced.
First, the lead can be prevented from coming off. In addition, the following effects can be obtained by using the above-described structure for the leads 11 on both sides. That is, even if the electrode 3 of the semiconductor element 2 is localized on the short side of the resin package A , at least one
One electrode 3 must be provided on the long side as a second electrode 32. When connecting the electrode 3 and the internal lead portion 11a with the wire 5, the two electrodes 3 are brought as close as possible to prevent the wire 5 from hanging down. Need to be placed. Therefore, in the above structure, attention is paid to the fact that there is room in the resin package A for extending the leads 11 on both sides along the pad 1.
Since only the lead extending along the long side face of the resin package A, the sag of the wire 5 can be prevented without inhibiting the miniaturization of the outer shape of the resin bobbin A. However, the leads 1 on both sides are
When the internal lead 11a is extended along the side surface on the long side, the margin of the lead can be taken into the resin package A. However, the width of the lead must be small so as not to contact the pad. In this case, when the wires 5 are connected as they are, the width is too narrow, so that reliable bonding cannot be performed. Therefore, in this embodiment, the bent portions 11 are formed at the tip portions 11c of the leads 11 on both sides.
By forming d, it is brought close to the second electrode 32, whereby a narrow gap that may come into contact with the pad 1 can be minimized, reliability can be secured, and good bonding can be performed. Of the leads 11, those connected to the electrodes 32 on both sides extend in parallel along the long side of the semiconductor element 2, extend from the short side of the resin package A beyond the pad 1, and connect to the electrodes on both sides. Be close. Therefore, the lead 11 is derived from the short side without detour. Moreover, electrode groups other than both sides
Lead 11 is connected to 31, its all internal lead portion 11a, the long side length of the resin package A <br/> is shorter than the distance from the short sides of the resin package A to the pad 1 Therefore, the width of the lead 11 does not increase the dimension in the short side direction. Therefore, the size can be reduced by leading out all the leads 11 from the short side direction, and further downsizing in the short side direction is achieved. Certainly theory, it is needless to say that stable support of the pad 1 by the pad lead 12 provided in pairs in the long side of the pad 1 can be achieved. As described above, according to the semiconductor device of the first aspect of the present invention, the lead connected to the electrode is prevented from coming off.
While giving effect to say stop, yet can be reduced in size. According to the semiconductor device of the second aspect of the present invention , all the leads are led out from the short side direction.
In addition to downsizing, miniaturization in the short side direction
Can be achieved . Further, when the resin sealing during set upright, Ru can be reliably improved rigidity of the die pad at the time of injecting the molding resin from the top and bottom with a simple structure. Alternatively , it is possible to prevent the wire from sagging in the bonding connection between some of the electrodes arranged on the long side of the resin package and the internal lead portion without hindering the miniaturization of the package.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view showing a configuration of a semiconductor device according to one embodiment of the present invention. FIG. 2 is an external view of the semiconductor device. FIG. 3 is a plan view illustrating a configuration of a conventional semiconductor device. FIG. 4 is an external view of the semiconductor device. [Description of Signs] 1 tab, 2 semiconductor elements, 3 electrodes, 5 wires, 1
1 lead, 11a internal lead, 11b external lead,
11c tip, 11 g wide portion, 11d, 11e析曲portion, 11f inside lead body 12 tab lead, 3
1 First electrode group, 32 Second electrode, 111 First electrode
Lead group, 112 second lead group, A package.

Continuation of front page       (56) References JP-A-60-10651 (JP, A)                 JP-A-62-42552 (JP, A)                 JP-A-59-72757 (JP, A)                 JP-A-61-269348 (JP, A)                 Actually open 1953-1661 (JP, U)                 Showa 53-24256 (JP, U)                 Shokai 61-203564 (JP, U)                 Shokai Sho 56-167549 (JP, U)

Claims (1)

(57) [Claims] A planar rectangular resin package having a pair of opposing long sides and short sides, a semiconductor element having a plurality of electrodes built in the resin package and locally arranged on the short side, provided in the resin package. provided are pads the semiconductor element is fixed, and a plurality of lead derived from the inside to the outside in the short side of each respective said resin package are connected via a lead wire of the electrodes of the semiconductor element All of the plurality of leads are disposed so as to be led out from a pair of short sides of the resin package, and each of the leads is connected to an internal lead portion disposed inside the resin package and the resin. External leads disposed outside the package, and the external leads of all the leads are substantially parallel to the long sides of the resin package. And the inner ends of the internal lead portions of all the leads are arranged so as to be close to the electrodes of the semiconductor element, and the resin package in the plurality of leads is further extended.
Near the center of the short side of the
The inner lead is wider at its inner end than at its outer end.
Having a wide portion, and
Leads placed outside the lead near the center are
The bent part bent in the extension direction of the lead part
A semiconductor device comprising: 2. A planar rectangular resin package having a pair of opposed long sides and short sides, a semiconductor element having a plurality of electrodes built in the resin package and locally arranged on the short side, provided in the resin package. A pad to which the semiconductor element is fixed, and a plurality of leads connected to each of the electrodes of the semiconductor element via a lead wire and led out of the resin package to the outside thereof. Are arranged so as to be led out from a pair of short sides of the resin package, and the respective leads are arranged outside the resin package with an internal lead portion arranged inside the resin package. And the external leads of all the leads extend in a direction substantially parallel to the long side of the resin package. Are, also the inner end of the inner lead portions of all leads are arranged adjacent to the electrodes of the semiconductor element, further the resin package in the plurality of leads
Near the center of the short side of the
The inner lead of the lead is closer to its inner end than its outer end.
Also has a wide portion and a large width.
The lead arranged outside of the above-described center vicinity lead portion of
Folds bent in the extension direction of the external lead
A plurality of electrodes, the plurality of electrodes being a first electrode group close to a short side of the resin package;
At least one second electrode farther than the first electrode group and closer to the long side of the resin package than the first electrode group, and is connected to the second electrode of the plurality of leads. The internal lead portion has a portion extending substantially parallel to the long side of the resin package, and the portion extends toward the center of the pad longer than the distance from the short side of the resin package to the pad, All of the plurality of leads connected to the first electrode group have a length of the internal lead portion in the long side direction longer than a distance from a short side of the resin package to the pad. A semiconductor device characterized in that it is also short. 3. 3. The semiconductor device according to claim 1 , further comprising a pad lead extending from the pad to a pair of long sides of the resin package. 4. 4. 4. The semiconductor device according to claim 3 , wherein a total of four pad leads are provided on each of the left and right sides of each of the long sides of the pad. 5. 2. The semiconductor device according to claim 1, wherein one of the plurality of leads located on both sides has an internal lead portion on an inner side of the resin package parallel to a long side of the package and an internal lead portion of another lead. The inner end of the internal lead portion is disposed in close proximity to an electrode located on the side edge of the semiconductor element opposite to the long side of the resin package, and the inner end of the internal lead portion is provided. Is connected to the electrode by the lead wire.