JP2883574B2 - Self-diagnosis method for semiconductor measuring device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a self-diagnosis method for a semiconductor measuring apparatus, and more particularly to a self-diagnosis method for disconnecting a test head from a handler during a low-temperature test.

[0002]

2. Description of the Related Art In a semiconductor IC test process, particularly in a final process, an IC is tested by a system in which a tester and a handler are connected.

When an IC test is performed by setting the measurement portion of the handler at a high or low temperature with respect to room temperature, a self-diagnosis may be performed to maintain the measurement accuracy of the tester even during a low-temperature test. . At this time, as shown in FIG. 3, in order to release the test head 1 indicated by a solid line from the handler 11, it is necessary to separate the test head 1 from the handler 11. This separation is performed by removing the device board 3 to be measured from the handler 11 and opening the board mounting opening 13 of the handler 11 closed by the device board 3 to be measured.

When the board mounting opening 13 of the handler 11 is opened during the low temperature test, warm air at room temperature is introduced into the inside of the cold handler 11, so that the handler 11
Condensation occurs in the interior or IC due to moisture contained in the air.

Conventionally, in order to prevent the occurrence of the condensation,
With the handler 11 and the test head 1 still connected, the inside of the handler 11 is once heated to a high temperature for 30 minutes to 1 minute.
It has been maintained for about an hour. Thereafter, the handler 11 and the test head 1 are separated, and the self-diagnosis is performed by replacing the measurement performance board 2 mounted on the test head 1 with the self-diagnosis performance board 12.

After the self-diagnosis is completed, the self-diagnosis performance board 12 is replaced with the measurement performance board 2, and the device mounting board 3 of the measurement performance board 2 is used to open the board mounting opening 13 of the handler 11. The test head 1 is connected to the handler 11 again by closing and fixing. After the connection, the inside of the handler 11 is returned to a low temperature again, and then the low-temperature test is restarted.

By the way, when the self-diagnosis is performed, if the device board 3 to be measured of the measurement performance board 2 is not removed from the handler 11 and is left as it is, and only the test head 1 can be separated from the handler 11,
Since the temperature in the handler 11 can be maintained at a low temperature, self-diagnosis should be easier. Nevertheless, the reason why the device-under-measurement board 3 of the measurement performance board 2 is detached from the handler 11 is because of the mechanism for attaching and detaching the conventional measurement performance board 2 to and from the test head 1.

That is, as shown in FIG. 4, a holding frame 15 pivotally mounted on one side is mounted on the test head 1 so as to be openable and closable, and the performance board 2 is clamped between the test head 1 and the holding frame 15. By closing the holding frame 15, the performance board 2 is held by the holding frame 15 and fixed on the test head 1. For this reason, as shown in FIG. 3, even if the test head 1 is detached from the handler 11 with the device board 3 to be measured attached to the handler 11, the holding frame 15 disturbs the test head 1 from the handler 11. This is because they cannot be separated.

[0009]

As described above, in the prior art, when a self-diagnosis of a semiconductor measuring device is to be performed during a low-temperature test, the device mounting opening of the handler must be opened. Once the inside of the handler is set to a high temperature to prevent condensation inside the handler, disconnect the handler from the test head.
After connecting the test head to the handler, it is necessary to return the handler to a low temperature and then perform a low-temperature test. For this reason, there is a problem that the test efficiency of the low-temperature test including the self-diagnosis is significantly reduced.

An object of the present invention is to solve the above-mentioned problems of the prior art and to maintain a low-temperature state inside the handler during a self-diagnosis performed during a low-temperature test.
It is an object of the present invention to provide a method for self-diagnosis of a semiconductor measuring device, which can significantly improve the measurement efficiency of a low-temperature test.

[0011]

According to a first aspect of the present invention, a performance board for measurement, to which a device board to be measured is connected, is attached to a test head of a semiconductor measuring apparatus, and the temperature of the device to be measured is measured. The test head is connected to the handler by closing and fixing the board mounting opening of the handler with the device board under test to perform the test, and the temperature inside the handler is changed, and the test head is mounted on the device board under test in the handler When performing a temperature test on the device under test and performing a self-diagnosis of the semiconductor measuring device during the low-temperature test of the temperature test, in order to maintain the low-temperature state in the handler, place the opening for mounting the board of the handler on the device under test. With the board closed and fixed, remove the performance board for measurement from the test head and leave it on the handler side Disconnect the test head from the handler by a, which is constituted such that self-diagnosis by attaching the performance board for self-diagnosis in place of the measurement performance board to the test head, separated from the handler.

In the second invention, after the self-diagnosis, the self-diagnosis performance board is detached from the test head, the measurement performance board deposited on the handler side is attached to the test head, and the low-temperature test is performed again. It is like that.

In the present invention, the mechanism for attaching and detaching the performance board for measurement to and from the test head is not a mechanism for pressing the performance board for measurement onto the test head from above with a holding frame, but rather pulling the performance board for measurement from below into the test head. It is a mechanism to attach. With such a mechanism, the performance board for measurement can be removed from the test head while the test head is connected to the handler. On the other hand, the handler has a strong structure that can support the weight even if the removed performance board for measurement is left in the handler and suspended.

The measuring performance board to which the device board to be measured is connected is mounted on the test head in such a manner as to be pulled in from below as described above. After the mounting, in order to connect the test head to the handler, the board mounting opening of the handler is closed and fixed with the device board to be measured of the measuring performance board mounted on the test head. Here, the temperature inside the handler is changed to a high temperature and a low temperature, and a high temperature test and a low temperature test of the device under test mounted on the device under test board in the handler are performed.

During the low-temperature test, the semiconductor measuring device may be self-diagnosed in order to maintain the accuracy of the semiconductor measuring device. At the time of the self-diagnosis, the measurement is performed with the measuring performance board connected to the handler. The performance board from the test head and disconnect the test head from the handler. The detached measurement performance board loses the support of the test head and is suspended from the handler.However, the handler has a strong structure that can support the weight of the measurement performance board. Is retained. At this time, the board mounting opening of the handler is closed and fixed with the device board to be measured.
The state inside the handler can be maintained at a low temperature.

A self-diagnosis performance board is mounted on the test head separated from the handler in place of the measurement performance board, and self-diagnosis is started.
After the self-diagnosis is completed, the performance board for the self-diagnosis is removed, and the performance board for measurement in a suspended state is attached to the test head. After installation, restart the low temperature test. At this time, since the low temperature before the self-diagnosis is maintained in the state in the handler, the low temperature test can be restarted immediately.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for self-diagnosis of a semiconductor measuring device according to the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory diagram of a handler and a test head for performing a self-diagnosis method of a semiconductor measuring device according to the present embodiment.
FIG. 2 is an explanatory view showing a structure for attaching a performance board to a test head.

To automatically perform a temperature test of an IC test, a test head connected to a main body of a semiconductor measuring apparatus is connected to a handler, and a part of a device board to be measured of a performance board for measurement attached to the test head. Is inserted into the handler, and the IC is tested by setting the measurement portion in the handler to a higher or lower temperature than room temperature.

The test head 1 connected to the handler is
As shown in FIG. 2, a performance board 2 is mounted on a test head 1 and a device board 3 to be measured is further connected thereto. A mechanism for attaching and detaching the measurement performance board 2 to and from the test head 1 is shown. Is as follows:

The measuring performance board 2 has four sides surrounded by a reinforcing frame 4. In the reinforcement frame 4,
A plurality of engagement grooves 5 dug obliquely upward from the lower surface are formed (a), and the engagement portions 6 provided on the test head 1 side engage with the engagement grooves 5 (b), and the engagement is performed. When the measurement performance board 2 is pushed deep into the groove 5 (c), the measurement performance board 2 is strongly pressed onto the test head 1 to be fixed. The engagement portion 6 provided on the test head 1 is slidably moved in a horizontal direction by an actuator 7 such as a cylinder, and slid in a direction opposite to the engagement direction to release the engagement. The self-diagnosis performance board 12 is also attached to and detached from the test head 1 by the attachment / detachment mechanism, similarly to the measurement performance board 2.

Now, as shown in FIG.
The test head 1 is mounted on a cart 10 so as to be able to move up and down. To connect to the handler 11, the test head 1 is erected as shown by a dashed line.
And fall down as shown by the two-dot chain line. The performance board for measurement 2 to which the device board 3 to be measured is connected is mounted on the test head 1 by the performance board attaching / detaching mechanism 8 described above.

In order to connect the measurement performance board 2 to the handler 11, the trolley 10 is moved to the handler 11 with the test head 1 standing upright, and a part of the device board 3 to be mounted with an IC is mounted. To handler 1
1 is inserted into the board mounting opening 13 provided in 1, and the opening 13 is closed and fixed with the rest of the board 3. Fixing means 14
Is optional, but not only the device under test 3
The structure is such that the weight of the performance board for measurement 2 can be supported. Here, the handler 11 corresponds to a thermostat, and the device-under-test board 3 corresponds to a lid that covers an opening of the thermostat.

The temperature of the IC mounted on the device board 3 to be measured is tested by setting the inside of the handler 11 to a temperature higher or lower than room temperature. Here, when performing a self-diagnosis of the semiconductor measuring device during the low-temperature test, the following is performed.

First, the board mounting opening 13 of the handler 11 is closed and fixed with the device board 3 to be measured. Since the lid of the thermostat is closed, the handler 1
1 can be kept in a low temperature state. The actuator is operated to disengage the engagement portion from the engagement groove, and the measurement performance board 2 is removed from the test head 1.
At this time, the performance board for measurement 2 is deposited in a suspended state on the handler 11 side via the device board 3 to be measured. The handler 11 has a strong structure that can support the weight of the measurement performance board 2, so that it can be suspended in the air. After removing the performance board for measurement 2, the carriage 10 is moved away from the handler 11 to separate the test head 1 from the handler 11.

Next, the test head 1 detached from the handler 11 is laid down in a horizontal state, a self-diagnosis performance board 12 is mounted on the test head 1 in place of the measurement performance board 2, and the actuator is actuated to operate. The self-diagnosis performance board 12 is fixed at a predetermined position on the test head 1 by engaging the joint portion with the engagement groove. After fixing, perform self-diagnosis.

After the self-diagnosis is completed, the self-diagnosis performance board 12 is removed, the test head 1 is erected, and the carriage 10 is moved to the handler 11 side. 2 and the test head 1
Attach to After installation, restart the low temperature test. At this time, since the internal temperature of the handler 11 is maintained at the low temperature before the self-diagnosis, the low temperature test can be restarted immediately.

As described above, in this embodiment, the handler 1
A mechanism capable of holding the measurement performance board 2 and a sufficient strength are provided on one side, and the mechanism on the test head 1 side can also open the measurement performance board 2 with the test head 1 connected to the handler 11. Since the self-diagnosis can be performed while maintaining the low-temperature state inside the handler 11 by using the mechanism, the dew condensation preventing time for maintaining the temperature from a low temperature to a high temperature as in the related art, In addition, it is possible to omit the restoring time until returning to the low temperature. As a result, switching between the low-temperature test and the self-diagnosis can be quickly performed, and the low-temperature test efficiency can be significantly improved.

In the above embodiment, the mechanism for opening the measurement performance board 2 while the test head 1 is connected to the handler 11 is provided as a mechanism.
Although the engagement portion of the test head is engaged with the engagement groove of the performance board using the actuator, the performance board 2 can be opened while the test head 1 is connected to the handler 11. Any mechanism may be used.

[0029]

According to the present invention, the performance board is separated from the test head while closing the board mounting opening of the handler so that the inside of the handler can be kept at a low temperature even during self-diagnosis. This eliminates the need to maintain the temperature inside the handler, which was used as a measure to prevent condensation due to opening the board mounting opening, and to reduce the temperature again inside the handler, which was used to restart the low-temperature test after self-diagnosis. In addition, the measurement efficiency of the low-temperature test including the self-diagnosis can be remarkably improved.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a self-diagnosis method of a semiconductor measurement device according to an embodiment of the present invention.

FIG. 2 is an explanatory view showing a mechanism for attaching a performance board to a test head for performing a self-diagnosis method according to the present embodiment.

FIG. 3 is an explanatory view showing a self-diagnosis method of a semiconductor measuring device according to a conventional example.

FIG. 4 is an explanatory view showing a mechanism for attaching a performance board to a conventional test head.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Test head 2 Measurement performance board 3 Device under test 11 Handler 12 Self-diagnosis performance board 13 Board mounting opening

Claims (2)

(57) [Claims] 1. A performance board for measurement to which a device board to be measured is connected is attached to a test head of a semiconductor measuring apparatus, and a board mounting opening of a handler is mounted on the device board for measurement in order to conduct a temperature test of the device to be measured. The test head is connected to the handler by closing and fixing, and the temperature inside the handler is changed to perform the temperature test on the device under test mounted on the device under test board inside the handler. When performing self-diagnosis of the semiconductor measuring device on the way, remove the performance board for measurement from the test head while keeping the opening for mounting the board of the handler closed with the device board to be measured in order to maintain the low temperature inside the handler. The test head is separated from the handler by depositing it on the handler side, and the handler Self-diagnosis method of a semiconductor measuring device, characterized in that the self-diagnosis by attaching the performance board for self-diagnosis instead et disconnected test head to measuring performance board. 2. After the self-diagnosis, the self-diagnosis performance board is removed from the test head, the measurement performance board deposited on the handler side is attached to the test head, and the low-temperature test is performed again. Item 2. A self-diagnosis method for a semiconductor measurement device according to item 1.