CN108155112B - Self-locking system and self-locking method for defect detection machine and SMIF - Google Patents
Self-locking system and self-locking method for defect detection machine and SMIF Download PDFInfo
- Publication number
- CN108155112B CN108155112B CN201611100689.0A CN201611100689A CN108155112B CN 108155112 B CN108155112 B CN 108155112B CN 201611100689 A CN201611100689 A CN 201611100689A CN 108155112 B CN108155112 B CN 108155112B
- Authority
- CN
- China
- Prior art keywords
- wafer
- detected
- defect detection
- detection machine
- smif
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Abstract
The invention provides a self-locking system and a self-locking method of a defect detection machine and SMIF (small input mechanical interface), which comprise the following steps: SMIF, a production operation system and a defect detection machine platform; the production operation system is suitable for storing data information of the wafer to be detected; the defect detection machine is suitable for detecting the defects of the wafer to be detected and recording the data information of the detected wafer; the SMIF is connected with the production operation system and the defect detection machine table, is suitable for placing the wafer to be detected on the defect detection machine table to realize self-locking with the defect detection machine table, compares the data information of the detected wafer recorded by the defect detection machine table with the data information of the wafer to be detected stored by the production operation system after the wafer to be detected is detected by the defect detection machine table, and releases the self-locking with the defect detection machine table when the comparison and the matching are carried out. The invention can realize the self-locking of the defect detection machine and the SMIF only by the existing working system, completely prevents illegal operation, and does not need to set additional equipment or systems, thereby greatly saving the cost.
Description
Technical Field
The invention belongs to the technical field of semiconductors, and particularly relates to a self-locking system and a self-locking method for a defect detection machine and SMIF.
Background
When the defect detection machine of the prior art performs defect detection on a wafer, a basic flow is as shown in fig. 1, and first, after a production operation system (OSF system) selects a wafer number to be scanned, an SMIF (standard mechanical interface device) is required to be externally configured to complete capturing a wafer cassette (cassette) onto a carrying table (stage) of the defect detection machine and automatically opening the wafer cassette; secondly, the defect detection machine selects the serial number and the used program of the scanned wafer, senses that a wafer box is arranged on the bearing table, and starts scanning; the scanning action comprises the following steps: 1. the bearing table rotates the wafer box to a direction which can be grabbed by a mechanical arm of the defect detection machine table; 2. a mechanical arm of the defect detection machine station grabs the wafer into the machine station; 3. the defect detection machine platform scans the grabbed wafer; 4. after scanning, the mechanical arm of the defect detection machine station transmits the wafer back to the wafer box and uploads the scanning data to a defect data acquisition and analysis system (IDSA system); then, the bearing table returns to the initial position before defect detection; then, unlocking the wafer box from the bearing table, and enabling the mechanical arm of the SMIF to grab the wafer box on the defect detection machine table; and finally, finding out defect scanning data from the defect data acquisition and analysis system and uploading the defect scanning data to the production operation system.
However, if the defect detection machine executes any step of the scanning process during the defect detection of the wafer by the defect detection machine, and the SMIF is mistakenly pressed by an operator to unlock the defect detection machine, the robot of the SMIF directly grabs the wafer cassette being scanned, the robot of the SMIF may hit the wafer cassette, and a wafer fragment in the wafer cassette or a risk of breaking the robot of the SMIF may be caused.
In view of the above problems, the following methods are generally used: adding a 'machine end motion judging structure' to the SMIF and the defect detection machine to realize self-locking of the SMIF and the defect detection machine, namely before the SMIF does not receive a signal that the bearing platform returns to the initial position, the unload operation of the SMIF realizes self-locking, and even if the SMIF is mistakenly pressed, the unload operation belongs to invalid operation. The corresponding flow chart of the method is shown in fig. 2.
However, the above-mentioned solutions have the following problems: the machine table end movement judgment structure is high in manufacturing cost and installation cost, fixed in a self-locking mode, and when SMIF has problems, the self-locking relation needs to be established with SMIF of other models again, otherwise, the machine table cannot work, and replacement and maintenance are not convenient.
Disclosure of Invention
In view of the above drawbacks of the prior art, an object of the present invention is to provide a self-locking system and a self-locking method for a defect detection platform and a SMIF, which are used to solve the problems of high manufacturing cost and installation cost, fixed self-locking mode, inconvenience in replacement and maintenance, etc. due to the fact that a platform end motion judgment structure is additionally provided to realize self-locking of the SMIF and the defect detection platform in the prior art.
To achieve the above and other related objects, the present invention provides a self-locking system for a defect inspection machine and a SMIF, including: SMIF, a production operation system and a defect detection machine platform;
the production operation system is suitable for storing data information of the wafer to be detected;
the defect detection machine is suitable for detecting the defects of the wafer to be detected and recording the data information of the detected wafer;
the SMIF is connected with the production operation system and the defect detection machine, is suitable for placing a wafer to be detected on the defect detection machine to realize self-locking with the defect detection machine, compares the data information of the detected wafer recorded by the defect detection machine with the data information of the wafer to be detected stored by the production operation system after the defect detection machine detects the wafer to be detected, and releases the self-locking with the defect detection machine when the comparison and matching are carried out.
As a preferred solution of the self-locking system of the defect detecting machine and the SMIF of the present invention, the defect detecting machine comprises:
the scanning system is suitable for scanning the wafer to be detected so as to detect defects;
and the defect data acquisition and analysis system is connected with the scanning system and the SMIF and is suitable for recording data information of the detected wafer.
As a preferred embodiment of the self-locking system of the defect detection machine and the SMIF of the present invention, the SMIF includes an automatic operation system, the automatic operation system is connected to the production operation system and the defect detection machine, and is adapted to place the wafer to be detected on the defect detection machine, to self-lock the SMIF and the defect detection machine, to compare the data information of the wafer, which is recorded by the defect detection machine and is detected by the defect detection machine, with the data information of the wafer to be detected, which is stored by the production operation system, after the wafer to be detected is detected by the defect detection machine, and to release the self-locking of the SMIF and the defect detection machine when the comparison is matched.
As a preferred embodiment of the self-locking system of the defect inspection machine and the SMIF, the data information of the wafer to be inspected, which is stored in the production operating system, and the data information of the wafer after the inspection, which is recorded by the defect inspection machine, both include the number of the wafers and the wafer numbers.
The invention also provides a self-locking system of the defect detection machine and the SMIF, which comprises: SMIF, a production operation system, a defect detection machine table and a comparison system;
the production operation system is suitable for storing data information of the wafer to be detected;
the defect detection machine is suitable for detecting the defects of the wafer to be detected and recording the data information of the detected wafer;
the SMIF is connected with the defect detection machine table and is suitable for placing a wafer to be detected on the defect detection machine table to realize self-locking with the defect detection machine table;
the comparison system is connected with the SMIF, the production operation system and the defect detection machine, is suitable for comparing the data information of the detected wafer recorded by the defect detection machine with the data information of the detected wafer stored by the production operation system after the defect detection machine detects the wafer to be detected, and releases the self-locking of the SMIF and the defect detection machine when the comparison is matched.
As a preferred solution of the self-locking system of the defect detecting machine and the SMIF of the present invention, the defect detecting machine comprises:
the scanning system is suitable for scanning the wafer to be detected so as to detect defects;
and the defect data acquisition and analysis system is connected with the scanning system and the comparison system and is suitable for recording the data information of the detected wafer.
As a preferred embodiment of the self-locking system of the defect inspection machine and the SMIF of the present invention, the SMIF includes an automatic operation system, and the automatic operation system is connected to the defect inspection machine and the comparison system, and is adapted to self-lock the SMIF and the defect inspection machine after placing the wafer to be inspected on the defect inspection machine, and release the self-locking of the SMIF and the defect inspection machine when the comparison system feeds back the comparison matching information.
As a preferred embodiment of the self-locking system of the defect inspection machine and the SMIF, the data information of the wafer to be inspected, which is stored in the production operating system, and the data information of the wafer after the inspection, which is recorded by the defect inspection machine, both include the number of the wafers and the wafer numbers.
The invention also provides a self-locking method of the defect detection machine and the SMIF, which comprises the following steps:
the method comprises the following steps of placing a wafer to be detected on a defect detection machine table by using SMIF (Small-sized object interface), and realizing self-locking of the SMIF and the defect detection machine table;
using the defect detection machine to detect the defects of the wafer to be detected, and recording the data information of the detected wafer;
and comparing the recorded data information of the detected wafer with the pre-stored data information of the wafer to be detected, and releasing the self-locking of the SMIF and the defect detection machine when the comparison is matched.
As a preferred scheme of the self-locking method for the defect inspection machine and the SMIF of the present invention, pre-stored data information of the wafer to be inspected is stored in the production operating system.
As a preferred scheme of the defect detection machine and the SMIF self-locking method of the present invention, the SMIF compares the recorded data information of the detected wafer with the pre-stored data information of the wafer to be detected, and releases the self-locking with the defect detection machine when the comparison is matched.
As a preferred scheme of the defect detection machine and the SMIF self-locking method of the present invention, a comparison system independent of the SMIF is used to compare the recorded data information of the detected wafer with the pre-stored data information of the wafer to be detected, and the self-locking of the SMIF and the defect detection machine is released when the comparison is matched.
As described above, the self-locking system and the self-locking method for the defect detection machine and the SMIF of the present invention have the following advantages: the self-locking system of the defect detection machine and the SMIF can realize the self-locking of the defect detection machine and the SMIF only by means of the conventional working system, completely prevents illegal operation, and does not need to set extra equipment or systems, thereby greatly saving the cost; meanwhile, when the SMIF has a problem, the defect detection machine table and the SMIF self-locking system only need to replace the SMIF when the SMIF needs to be maintained, and the work of the defect detection machine table cannot be influenced.
Drawings
Fig. 1 shows a structure and a work flow diagram of a defect inspection machine and a SMIF without a self-locking system in the prior art.
Fig. 2 is a diagram showing a structure and a work flow of a defect inspection machine and a SMIF in the prior art, which use a machine end motion determination structure to realize self-locking.
Fig. 3 is a block diagram illustrating a structure of a defect detection tool and a self-locking system of SMIF according to an embodiment of the present invention.
Fig. 4 is a structural and workflow diagram of a defect inspection tool and a SMIF self-locking system according to an embodiment of the present invention.
Fig. 5 is a block diagram illustrating a structure of a defect inspection tool and a self-locking system of SMIF according to a second embodiment of the present invention.
Fig. 6 is a flowchart illustrating a defect detection tool and a SMIF self-locking method according to a third embodiment of the present invention.
Description of the element reference numerals
11 SMIF
12 production operating system
13 defect detecting machine
14 machine end movement judging structure
21 SMIF
211 automatic operation system
22 production operating system
23 defect detecting machine
231 scanning system
232 defect data acquisition and analysis system
24 alignment system
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 3 to 5. It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and although the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation, the type, quantity and proportion of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
Example one
Referring to fig. 3, the present invention provides a defect inspection tool and a SMIF self-locking system, including: SMIF21, production operating system 22, and defect inspection tool 23; the production operating system 22 is adapted to store data information of the wafer to be detected; the defect detecting machine 23 is adapted to perform defect detection on the wafer to be detected and record data information of the detected wafer; the SMIF21 is connected to the production operating system 22 and the defect detecting machine 23, and is adapted to place the wafer to be detected on the defect detecting machine 23 to realize self-locking between the SMIF21 and the defect detecting machine 23, compare the data information of the wafer to be detected recorded by the defect detecting machine 23 with the data information of the wafer to be detected stored in the production operating system 22 after the wafer to be detected is detected by the defect detecting machine 23, and release the self-locking with the defect detecting machine 23 when the comparison and matching are performed.
As an example, the defect detecting machine 23 includes: the scanning system 231, the scanning system 231 is adapted to scan the wafer to be detected for defect detection; a defect data collection and analysis system 232, wherein the defect data collection and analysis system 232 is connected to the scanning system 231 and the SMIF21, and is adapted to record data information of the inspected wafer.
As an example, the SMIF21 includes an automatic operation system 211, the automatic operation system 211 is connected to the production operation system 22 and the defect inspection machine 23, and is adapted to place the wafer to be inspected on the defect inspection machine 23, to self-lock the SMIF21 with the defect inspection machine 23, to compare the data information of the wafer, which is recorded by the defect inspection machine 23 and is detected by the defect inspection machine 23, with the data information of the wafer to be inspected, which is stored by the production operation system 22, after the wafer to be inspected is inspected by the defect inspection machine 23, and to release the self-locking between the SMIF21 and the defect inspection machine 23 when the comparison is matched. That is, after the defect detection machine 23 detects the wafer to be detected, the SMIF21 compares the data information of the detected wafer recorded by the defect detection machine 23 with the data information of the wafer to be detected stored in the production operation system 22.
As an example, the data information of the wafer to be detected stored by the production operating system 22 and the data information of the detected wafer recorded by the defect detecting machine 23 both include the number of the wafers and the wafer numbers.
A working flow chart of the defect detection machine and the SMIF self-locking system in this embodiment is shown in fig. 4, and the working principle thereof is substantially as follows: firstly, the production operation system 22 selects and stores the number of the wafers to be defect-detected and the serial numbers of the wafers to be defect-detected; secondly, after receiving a start instruction of the production operation system 22, the SMIF21 uses a robot to place the wafer cassette on the carrying table of the defect detecting table 23, and simultaneously self-locks the SMIF21 and the defect detecting table 23; then, the defect detecting machine 23 selects the serial number and the program of the scanned wafer, starts to detect the defect of the wafer, records the data information of the detected wafer, and uploads the data information to the SMIF 21; finally, the SMIF21 compares the data information (the number and the serial number of the detected wafers) of the detected wafers recorded by the defect detection machine 23 with the data information (the number and the serial number of the stored wafers to be detected) of the wafers to be detected stored by the production operation system 22, if the data information (the number and the serial number of the detected wafers) of the detected wafers recorded by the defect detection machine 23 is not identical to the data information (the serial number and the serial number of the stored wafers to be detected) of the wafers to be detected stored by the production operation system 22, the self-locking between the SMIF21 and the defect detection machine 23 is not released, and if the data information (the serial number and the serial number of the detected wafers) of the detected wafers recorded by the defect detection machine 23 is identical to the data information (the serial number and the serial number of the stored wafers to be detected) of the production.
The self-locking system of the defect detection machine table and the SMIF can realize the self-locking of the defect detection machine table 23 and the SMIF21 by means of the matching of the existing production operation system 22, the SMIF21 and the defect detection machine table 23 so as to completely prevent illegal operation without setting extra equipment or systems, thereby greatly saving the cost; meanwhile, when the SMIF21 goes wrong, the self-locking system of the defect detecting machine and the SMIF only needs to replace the SMIF21 while the SMIF21 needs to be maintained, and the work of the defect detecting machine 23 is not affected.
Example two
Referring to fig. 5, the present embodiment further provides a defect inspection tool and a SMIF self-locking system, where the defect inspection tool and the SMIF self-locking system include: SMIF21, production operating system 22, defect detection machine 23, and comparison system 24; the production operating system 22 is adapted to store data information of the wafer to be detected; the defect detecting machine 23 is adapted to perform defect detection on the wafer to be detected and record data information of the detected wafer; the SMIF21 is connected with the defect detection machine table 23 and is suitable for placing the wafer to be detected on the defect detection machine table 23 to realize self-locking of the SMIF21 and the defect detection machine table 23; the comparison system 24 is connected to the SMIF21, the production operation system 22 and the defect detection machine 23, and is adapted to compare the data information of the detected wafer recorded by the defect detection machine 23 with the data information of the detected wafer stored in the production operation system 22 after the defect detection machine 23 detects the wafer to be detected, and release the self-locking between the SMIF21 and the defect detection machine 23 when the comparison is matched.
As an example, the defect detecting machine 23 includes: the scanning system 231, the scanning system 231 is adapted to scan the wafer to be detected for defect detection; and a defect data acquisition and analysis system 232, wherein the defect data acquisition and analysis system 232 is connected with the scanning system 231 and the comparison system 24, and is adapted to record data information of the detected wafer and upload the recorded data information of the detected wafer to the comparison system 24.
As an example, the SMIF21 includes an automatic operation system 211, where the automatic operation system 211 is connected to the defect inspection machine 23 and the comparison system 24, and is adapted to place the wafer to be inspected on the defect inspection machine 23, to self-lock the SMIF21 and the defect inspection machine 23, and to release the self-locking of the SMIF21 and the defect inspection machine 23 when the comparison system 24 feeds back comparison matching information.
As an example, the data information of the wafer to be detected stored by the production operating system 22 and the data information of the detected wafer recorded by the defect detecting machine 23 both include the number of the wafers and the wafer numbers.
The working principle of the defect detection machine and the SMIF self-locking system in this embodiment is as follows: firstly, the production operation system 22 selects and stores the number of the wafers to be defect-detected and the serial numbers of the wafers to be defect-detected; secondly, after receiving a start instruction of the production operation system 22, the SMIF21 uses a robot to place the wafer cassette on the carrying table of the defect detecting table 23, and simultaneously self-locks the SMIF21 and the defect detecting table 23; then, the defect detecting machine 23 selects the serial number and the program of the scanned wafer, starts to detect the defect of the wafer, records the data information of the detected wafer, and uploads the data information to the comparing system 24; finally, the comparison system 24 compares the data information (the number and the serial number of the detected wafers) of the detected wafers recorded by the defect detection machine 23 with the data information (the number and the serial number of the stored to-be-detected wafers) of the to-be-detected wafers stored by the production operation system 22, if the data information (the number and the serial number of the to-be-detected wafers) of the detected wafers recorded by the defect detection machine 23 is not identical to the data information (the serial number and the serial number of the to-be-detected wafers) of the to-be-detected wafers stored by the production operation system 22, the self-locking between the SMIF21 and the defect detection machine 23 is not removed, and if the data information (the serial number and the serial number of the to-be-detected wafers) of the detected wafers recorded by the defect detection machine 23 is identical to the data information (the serial number and the serial number of the to-be-detected wafers stored.
The defect detection machine table and the SMIF self-locking system can realize the self-locking of the defect detection machine table 23 and the SMIF21 only by additionally arranging a comparison system 24 and by means of the matching of the existing production operation system 22, the SMIF21, the defect detection machine table 23 and the comparison system 24 so as to completely prevent illegal operation, and the comparison system 24 has much lower cost compared with a machine table end motion judgment structure in the prior art, thereby greatly saving the cost; meanwhile, when the SMIF21 goes wrong, the self-locking system of the defect detecting machine and the SMIF only needs to replace the SMIF21 while the SMIF21 needs to be maintained, and the work of the defect detecting machine 23 is not affected.
EXAMPLE III
Referring to fig. 6, the present embodiment provides a method for self-locking a defect inspection tool and a SMIF, where the method for self-locking a defect inspection tool and a SMIF includes the following steps:
s1: the method comprises the following steps of placing a wafer to be detected on a defect detection machine table by using SMIF (Small-sized object interface), and realizing self-locking of the SMIF and the defect detection machine table;
s2: using the defect detection machine to detect the defects of the wafer to be detected, and recording the data information of the detected wafer;
s3: and comparing the recorded data information of the detected wafer with the pre-stored data information of the wafer to be detected, and releasing the self-locking of the SMIF and the defect detection machine when the comparison is matched.
As an example, before performing step S1, the number and number of the wafers to be detected may be selected and stored by using the production operating system.
In an example, the recorded data information of the detected wafer may be compared with the data information of the wafer to be detected, which is stored in advance, by using the SMIF, and the self-locking with the defect detection machine is released when the comparison is matched.
In another example, a comparison system independent of the SMIF may be further used to compare the recorded data information (the number and the serial number of the detected wafers) of the detected wafers with the pre-stored data information (that is, the number and the serial number of the wafers to be detected, which are selected and stored by the production operating system) of the wafers to be detected, and when the comparison is matched, the self-locking between the SMIF and the defect detection machine is released.
In summary, the self-locking system and the self-locking method for a defect inspection machine and a SMIF according to the present invention include: SMIF, a production operation system and a defect detection machine platform; the production operation system is suitable for storing data information of the wafer to be detected; the defect detection machine is suitable for detecting the defects of the wafer to be detected and recording the data information of the detected wafer; the SMIF is connected with the production operation system and the defect detection machine, is suitable for placing a wafer to be detected on the defect detection machine to realize self-locking with the defect detection machine, compares the data information of the detected wafer recorded by the defect detection machine with the data information of the wafer to be detected stored by the production operation system after the defect detection machine detects the wafer to be detected, and releases the self-locking with the defect detection machine when the comparison and matching are carried out. The self-locking system of the defect detection machine and the SMIF can realize the self-locking of the defect detection machine and the SMIF only by means of the conventional working system, completely prevents illegal operation, and does not need to set extra equipment or systems, thereby greatly saving the cost; meanwhile, when the SMIF has a problem, the defect detection machine table and the SMIF self-locking system only need to replace the SMIF when the SMIF needs to be maintained, and the work of the defect detection machine table cannot be influenced.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (10)
1. A self-locking system of a defect inspection machine and a SMIF is characterized in that the self-locking system of the defect inspection machine and the SMIF comprises: SMIF, a production operation system and a defect detection machine platform;
the production operation system is suitable for storing data information of the wafer to be detected;
the defect detection machine is suitable for detecting the defects of the wafer to be detected and recording the data information of the detected wafer;
the SMIF is connected with the production operation system and the defect detection machine table, is suitable for placing a wafer to be detected on the defect detection machine table to realize self-locking with the defect detection machine table, compares the data information of the detected wafer recorded by the defect detection machine table with the data information of the wafer to be detected stored by the production operation system after the defect detection machine table detects the wafer to be detected, and releases the self-locking with the defect detection machine table when the comparison is matched;
the data information of the wafer to be detected stored by the production operating system and the data information of the detected wafer recorded by the defect detection machine station both comprise the number of the wafers and the wafer numbers.
2. The system of claim 1, wherein the self-locking system comprises: the defect detecting machine comprises:
the scanning system is suitable for scanning the wafer to be detected so as to detect defects;
and the defect data acquisition and analysis system is connected with the scanning system and the SMIF and is suitable for recording data information of the detected wafer.
3. The system of claim 1, wherein the self-locking system comprises: the SMIF comprises an automatic operation system, the automatic operation system is connected with the production operation system and the defect detection machine, and is suitable for placing a wafer to be detected on the defect detection machine and then self-locking the SMIF and the defect detection machine, comparing data information of the detected wafer recorded by the defect detection machine with data information of the wafer to be detected stored by the production operation system after the wafer to be detected is detected by the defect detection machine, and removing the self-locking of the SMIF and the defect detection machine when the comparison and the matching are carried out.
4. A self-locking system of a defect inspection machine and a SMIF is characterized in that the self-locking system of the defect inspection machine and the SMIF comprises: SMIF, a production operation system, a defect detection machine table and a comparison system;
the production operation system is suitable for storing data information of the wafer to be detected;
the defect detection machine is suitable for detecting the defects of the wafer to be detected and recording the data information of the detected wafer;
the SMIF is connected with the defect detection machine table and is suitable for placing a wafer to be detected on the defect detection machine table to realize self-locking with the defect detection machine table;
the comparison system is connected with the SMIF, the production operation system and the defect detection machine, is suitable for comparing the data information of the detected wafer recorded by the defect detection machine with the data information of the detected wafer stored by the production operation system after the defect detection machine detects the wafer to be detected, and releases the self-locking of the SMIF and the defect detection machine when the comparison is matched;
the data information of the wafer to be detected stored by the production operating system and the data information of the detected wafer recorded by the defect detection machine station both comprise the number of the wafers and the wafer numbers.
5. The system of claim 4, wherein the self-locking system comprises: the defect detecting machine comprises:
the scanning system is suitable for scanning the wafer to be detected so as to detect defects;
and the defect data acquisition and analysis system is connected with the scanning system and the comparison system and is suitable for recording the data information of the detected wafer.
6. The system of claim 4, wherein the self-locking system comprises: the SMIF comprises an automatic operation system, the automatic operation system is connected with the defect detection machine and the comparison system, and is suitable for self-locking the SMIF and the defect detection machine after a wafer to be detected is placed on the defect detection machine, and releasing the self-locking of the SMIF and the defect detection machine when the comparison system feeds back comparison matching information.
7. A self-locking method for a defect detection machine and SMIF is characterized by comprising the following steps:
the method comprises the following steps of placing a wafer to be detected on a defect detection machine table by using SMIF (Small-sized object interface), and realizing self-locking of the SMIF and the defect detection machine table;
using the defect detection machine to detect the defects of the wafer to be detected, and recording the data information of the detected wafer;
comparing the recorded data information of the detected wafer with the pre-stored data information of the wafer to be detected, and releasing the self-locking of the SMIF and the defect detection machine when the comparison is matched;
the data information of the wafer to be detected stored by the production operating system and the data information of the detected wafer recorded by the defect detection machine station both comprise the number of the wafers and the wafer numbers.
8. The method of claim 7, wherein the defect inspection tool and the SMIF are self-locking together, and further comprising: and the pre-stored data information of the wafer to be detected is stored in the production operation system.
9. The method of claim 7, wherein the defect inspection tool and the SMIF are self-locking together, and further comprising: and the SMIF compares the recorded data information of the detected wafer with the pre-stored data information of the wafer to be detected, and releases self-locking with the defect detection machine when the data information is compared and matched.
10. The method of claim 7, wherein the defect inspection tool and the SMIF are self-locking together, and further comprising: and comparing the recorded data information of the detected wafer with the prestored data information of the wafer to be detected by using a comparison system independent of the SMIF, and releasing the self-locking of the SMIF and the defect detection machine when the comparison is matched.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611100689.0A CN108155112B (en) | 2016-12-05 | 2016-12-05 | Self-locking system and self-locking method for defect detection machine and SMIF |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611100689.0A CN108155112B (en) | 2016-12-05 | 2016-12-05 | Self-locking system and self-locking method for defect detection machine and SMIF |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108155112A CN108155112A (en) | 2018-06-12 |
| CN108155112B true CN108155112B (en) | 2021-04-23 |
Family
ID=62470578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611100689.0A Active CN108155112B (en) | 2016-12-05 | 2016-12-05 | Self-locking system and self-locking method for defect detection machine and SMIF |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108155112B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040069908A (en) * | 2003-01-30 | 2004-08-06 | 아남반도체 주식회사 | A method for wafer edge defect inspection |
| TW200931558A (en) * | 2008-01-03 | 2009-07-16 | Jt Corp | Apparatus for inspecting semiconductor chip and method thereof |
| KR20110123177A (en) * | 2010-05-06 | 2011-11-14 | 주식회사 성도하이테크 | Led chip inspection extraction device |
-
2016
- 2016-12-05 CN CN201611100689.0A patent/CN108155112B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040069908A (en) * | 2003-01-30 | 2004-08-06 | 아남반도체 주식회사 | A method for wafer edge defect inspection |
| TW200931558A (en) * | 2008-01-03 | 2009-07-16 | Jt Corp | Apparatus for inspecting semiconductor chip and method thereof |
| KR20110123177A (en) * | 2010-05-06 | 2011-11-14 | 주식회사 성도하이테크 | Led chip inspection extraction device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108155112A (en) | 2018-06-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20090074286A1 (en) | Data management equipment used to defect review equipment and testing system configurations | |
| EP1112550B1 (en) | An automated wafer defect inspection system and a process of performing such inspection | |
| KR100742425B1 (en) | A method of inspecting a semiconductor wafer and a computer-readable medium bearing instructions for inspecting a semiconductor wafer | |
| US11929271B2 (en) | Apparatus and method for inspecting wafer carriers | |
| KR20000023667A (en) | Automatic semiconductor wafer sorter/prober with extended optical inspection | |
| WO2019196126A1 (en) | Quality detection system, method and apparatus for micro spring | |
| JP7224048B2 (en) | Substrate defect inspection device and method | |
| JP4789630B2 (en) | Semiconductor manufacturing apparatus, semiconductor appearance inspection apparatus, and appearance inspection method | |
| KR101643713B1 (en) | Method for inspecting of product using learning type smart camera | |
| US7719300B2 (en) | Method for testing a semiconductor wafer and apparatus thereof | |
| CN108155112B (en) | Self-locking system and self-locking method for defect detection machine and SMIF | |
| US6477265B1 (en) | System to position defect location on production wafers | |
| KR20110100403A (en) | Vision system of test heander in socket and the method thereof | |
| CN216411102U (en) | Silicon chip edge detection system | |
| JP4789629B2 (en) | Semiconductor visual inspection apparatus, visual inspection method, and semiconductor manufacturing apparatus | |
| US20130258328A1 (en) | Disk surface inspection method and disk surface inspection device | |
| CN114113132A (en) | Image acquisition method, image acquisition apparatus, and wafer inspection apparatus | |
| CN109065468B (en) | Defect filtering system, defect filtering method and computer storage medium | |
| JP3137459B2 (en) | Die bonding equipment | |
| US6674888B1 (en) | Tuning method for a processing machine | |
| JPH1194763A (en) | Method and apparatus for detecting defect by image processing | |
| WO2019200622A1 (en) | Quality inspection system, method, and apparatus for receiver in calling device | |
| KR100369832B1 (en) | Managing apparatus and method for hindrance article | |
| CN210456593U (en) | Object taking device and detection device | |
| JP2007095766A (en) | Prober and method of inspecting semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 401331 No. 25 Xiyong Avenue, Shapingba District, Chongqing Applicant after: Huarun Microelectronics (Chongqing) Co., Ltd. Address before: 401331 No. 25 Xiyong Avenue, Xiyong Town, Shapingba District, Chongqing Applicant before: China Aviation (Chongqing) Microelectronics Co., Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |