JP2871636B2 - LSI module and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high-density LSI module which can use ordinary LSI chip as it is and can eliminate the need for an area for mounting leads or wires, and a method for manufacturing the module. SOLUTION: A plurality of LSIs 1 to 4 having respective electrode leading pads 1a to 4a are stacked and the pads are integrally molded with resin 5 to 7. Each of the LSIs 1 to 4 is formed with a hole 8 which is passed through the LSI in the stacked layer direction at its electrode leading pad position, and the hole 8 is filled with a conductive resin 9 The conductive resin 9 causes the electrode leading pads 1a to 4a of the LSIs 1 to 4 to be electrically connected with each other. Elimination of the need for leads or wires enables realization of a high mounting density. Further, elimination of the need for special-structured electrode leading pads enables application of the invention to ordinary LSIs.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit (LSI) device, and more particularly to an LSI module in which a plurality of LSIs are three-dimensionally stacked to increase the density and a method of manufacturing the same.

[0002]

2. Description of the Related Art In response to recent demands for higher density of LSIs, three-dimensional LSI modules have been proposed in which a plurality of LSIs are stacked and integrated and electrically connected to each other. Conventionally, as this kind of three-dimensional LSI module,
There is a structure shown in FIGS. In the configuration of FIG. 3, the first chip 31a of the LSI is mounted on the printed wiring board 30, and the second and third chips 31b, 3b are further mounted thereon.
1c is mounted. Then, the respective electrode extraction pads 32a, 32b, 32c of the first, second and third chips 31a, 31b, 31c and the electrode pads 32d on the printed wiring board 30 are electrically connected to each other by the metal wires 33. Is done. Further, the configuration of FIG.
This is an example in which 1a and 41b are mounted on a printed wiring board 40 in a laminated state, and are electrically connected by leads 43 formed on a film carrier.

However, in these module configurations, since each LSI to be modularized is connected by a lead or a wire, a mounting area for the lead or the wire is required in addition to the size of the LSI chip, and the mounting density is increased. In addition, there is a problem that it is not advantageous in reducing the size of the module. In order to solve this problem, a leadless structure which does not require leads and wires has been proposed. For example, FIG. 5 shows an example of a three-dimensional LSI module disclosed in JP-A-56-55067.

In FIG. 5, LSI chips 51a, 51
b and 51c are stacked and mounted on the printed wiring board 50, and each chip is directly connected to an electrode extraction pad provided for each chip. That is, the through conductive layer 55 made of eutectic silicon and aluminum is formed by radiating and heating the aluminum layer formed on the part corresponding to the electrode extraction pad on the LSI chip 51a from the upper surface at 500 ° C. or higher. The electrode extraction pads 52a, 52a ', 52b, 52
b ', 52c and 52c' are provided. Between the LSI chips 51a, 51b, 51c and the printed wiring board 50 constituting the module, between the electrode extraction pads 52a 'and 52b, between 52b' and 52c, and 52, respectively.
solder bumps 53a, 53b provided between c ′ and 54,
53c.

[0005]

With the structure shown in FIG. 5, an LSI having a three-dimensional structure with a minimum necessary mounting area is unnecessary because the mounting area for the above-mentioned lead or wire is unnecessary.
Module becomes feasible. However, since it is necessary to previously provide electrode extraction pads that are electrically connected to each other on both the front surface and the back surface of each LSI chip constituting the module, the electrode extraction pads are formed only on the front surface or the back surface of the LSI chip. It is not possible to construct a module using a general LSI chip as it is, and it is necessary to develop a dedicated LSI chip for creating a three-dimensional module, and the design and manufacturing for that purpose are complicated. However, there is a problem that the utility value as a general-purpose technology is low.

An object of the present invention is to provide a high-density LSI module which can use a general LSI chip as it is and does not require a mounting area for leads or wires, and a method of manufacturing the same.・

[0007]

According to an LSI module of the present invention, a plurality of LSIs each having an electrode extraction pad are integrated in a stacked state, and at least two or more LSIs are arranged at the electrode extraction pad position. A penetrating opening is provided, and an electrode extraction pad of each LSI is electrically connected to each other by a conductive resin filled in the opening.

Further, the method of manufacturing an LSI module according to the present invention comprises a step of laminating a plurality of LSIs with respective electrode extraction pads positioned and bonding them with an insulating resin to integrate them. Forming a hole in the LSI in the stacking direction with a laser at the position of the electrode extraction pad, and filling the hole with a conductive resin.

[0009]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows an LSI having a three-dimensional structure according to the present invention.
FIG. 2 is a cross-sectional view of the module in the process of being manufactured, and FIG. First, as shown in FIG. 1, a plurality of LSIs constituting a module, here, four LSIs 1, 2,
Reference numerals 3 and 4 denote a state in which a required element is formed on a silicon chip and a part of a wiring connected to the element is provided at a plurality of positions on the back surface of the silicon chip, or a state in which the element is electrically connected to the wiring, similarly to the conventional LSI. Electrode extraction pads 1a, 2a, 3
a, 4a are formed. Here, the electrode take-out pads 1a, 2a, 3a, and 4a are formed, for example, in the peripheral portion of the silicon chip so that elements and other wirings are not formed at least at positions overlapping in the thickness direction of the silicon chip. It is arranged along.

Each of these LSIs 1 to 4 has a
After the electrode extraction pads 1a to 4d of I are aligned so as to overlap in the vertical direction, they are bonded by insulating resins 5, 6, 7 so as to be sequentially laminated. Here, the insulating resins 5 to 7 are supplied so that the gaps 5a, 6a, and 7a remain in the electrode extraction pads 1a to 4a of the LSIs 1 to 4. The gaps 5a to 7a are, for example, LS
If an insulating resin is used, which has adhesion to the protective film on the surface of the I surface but does not adhere to the metal material forming the electrode extraction pad, it can be easily formed by the surface tension of the resin on the LSI surface. Is possible.

Next, as shown in FIG.
A laser beam is projected onto the front surface of the LSI 1 at the top of I or the back surface of the LSI 4 on the opposite side, and an opening 8 penetrating through each of the LSIs 1 to 4 is formed at the positions of the electrode take-out pads 1a to 4a vertically overlapping. Then, a conductive resin 9 is injected into the opening 8 and each LSI
Are electrically connected to each other in the stacking direction of the LSI. At this time, since the gaps 5a to 7a are provided in portions corresponding to the respective electrode extraction pads 1a to 4a, the gaps 5a to 7a are provided.
7a are filled with a part of the conductive resin 9, and each LSI
4 can stabilize the electrical connection at the electrode extraction pads 1a to 4a.

As described above, in this configuration, the connection between the plurality of LSIs 1 to 4 to be modularized can be performed collectively by injecting the conductive resin 9, and therefore, compared to a method in which LSIs are stacked one by one. Since the number of steps for assembling the module can be reduced and there is no need for a mounting area for arranging leads and wires, an LSI module having a three-dimensional structure can be realized with a minimum necessary mounting area (mounting area and mounting height). It becomes feasible. Further, each of the LSIs 1 to 4 constituting the module can use a general LSI chip as it is, and there is no need to design and manufacture a special LSI such as providing an electrode extraction pad on the back surface of the chip.

Here, in the above-described embodiment, the void is formed in the resin for bonding the LSI, but the electrical connection of each electrode extraction pad is possible without providing a void. Further, in the above-described embodiment, the openings are opened for all the electrode extraction pads and the conductive resin is filled.
It is also possible to make electrical connection with the conductive resin only to the selected electrode extraction pad or only to the selected LSI electrode extraction pad by appropriately setting the depth of the opening.

When the LSI module thus configured is mounted on a printed wiring board, in the case of the above-described embodiment, bumps such as solder are provided on electrode extraction pads of the lowermost LSI, and the flip-chip method is employed. Therefore, when mounted on a printed wiring board, higher density mounting can be realized.

[0015]

As described above, in the LSI module of the present invention, the electrode extraction electrodes of each LSI constituting the module are electrically connected to each other by the conductive resin filled in the opening penetrating each LSI. Therefore, a module having a three-dimensional structure can be configured by using a general LSI chip as it is, and since a lead or a wire is not required for connection between the LSIs, a minimum mounting area is required. There is an effect that modularization can be realized.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a state in the course of manufacture of an embodiment of an LSI module of the present invention.

FIG. 2 is a sectional view showing a completed state of an LSI module of the present invention.

FIG. 3 is a cross-sectional view of an example of a conventional LSI module having a three-dimensional structure.

FIG. 4 is a sectional view of another example of an LSI module having a conventional three-dimensional structure.

FIG. 5 is a cross-sectional view of an improved example of a conventional LSI module having a three-dimensional structure.

[Explanation of symbols]

 1-4 LSI 1a-4a Electrode take-out pad 5-7 Insulating resin 5a-7a Void 8 Opening 9 Conductive resin

Claims (5)

(57) [Claims] A plurality of LSIs each having an electrode extraction pad formed thereon are integrated in a stacked state;
An opening is provided in the SI at least at two or more LSIs at the position of the electrode extraction pad, and the electrode extraction pads of each of the LSIs are electrically connected to each other by a conductive resin filled in the opening. An LSI module, characterized in that: 2. A plurality of LSIs are provided with electrode lead-out pads at the same location on a plane, and the corresponding electrode lead-out pads of each LSI are electrically connected by the conductive resin in the LSI stacking direction. Item 1. The LSI module according to item 1. 3. The LSI to be laminated is bonded with an insulating resin interposed between the two LSIs, and a gap is formed in the insulating resin at an electrode extraction pad portion, and a conductive resin is formed in the gap. 3. The LSI module according to claim 1, wherein 4. A step of laminating a plurality of LSIs with their respective electrode take-out pads positioned and bonding them with an insulating resin to integrate them, and further comprising the steps of: Forming a hole with a laser in the stacking direction, and filling the hole with a conductive resin.
A method for manufacturing an I module. 5. The method for manufacturing an LSI module according to claim 4, wherein the insulating resin is formed so as not to be present at a portion of the electrode extraction pad.