JP2868485B2 - Radiator for electronic equipment housing - Google Patents

Radiator for electronic equipment housing

Info

Publication number
JP2868485B2
JP2868485B2 JP34966896A JP34966896A JP2868485B2 JP 2868485 B2 JP2868485 B2 JP 2868485B2 JP 34966896 A JP34966896 A JP 34966896A JP 34966896 A JP34966896 A JP 34966896A JP 2868485 B2 JP2868485 B2 JP 2868485B2
Authority
JP
Japan
Prior art keywords
housing
air
outer housing
heat
internal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP34966896A
Other languages
Japanese (ja)
Other versions
JPH10190266A (en
Inventor
文仁 横尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Saitama Ltd
Original Assignee
NEC Saitama Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Saitama Ltd filed Critical NEC Saitama Ltd
Priority to JP34966896A priority Critical patent/JP2868485B2/en
Publication of JPH10190266A publication Critical patent/JPH10190266A/en
Application granted granted Critical
Publication of JP2868485B2 publication Critical patent/JP2868485B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、通信基地局等にお
ける通信用電子機器筐体における放熱装置に関し、特に
通信基地局にて屋外設置使用が可能な電子機器筐体の放
熱装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiating device for a communication electronic device housing in a communication base station or the like, and more particularly to a heat radiating device for an electronic device housing that can be installed outdoors in a communication base station.

【0002】[0002]

【従来の技術】従来、この種放熱装置には、例えば特開
平5−99578号公報に記載された熱交換器がある。
この場合、冷却される内気が流通する内気通路と、内気
冷却用に取り込まれる外気が流通する外気通路とを仕切
って形成し、さらに複数の冷却ファンを設置している
他、各ファンに冷却風ダクトを設けるなどして構成され
ている。
2. Description of the Related Art Conventionally, as this kind of heat radiator, there is a heat exchanger described in, for example, Japanese Patent Application Laid-Open No. 5-99578.
In this case, an internal air passage through which the internal air to be cooled flows and an external air passage through which the external air taken in for cooling the internal air flow are formed, and a plurality of cooling fans are installed. It is configured by providing a duct.

【0003】また、別の従来例として、特開平2−87
597号公報に記載された制御装置の冷却装置の場合、
発熱する電子、電気機器を収納した制御装置とは別に冷
却装置が設けられ、この冷却装置では冷却ファンによっ
て冷却風を送風ダクトと排熱ダクトに強制循環させるよ
うになっている。
[0003] Another conventional example is disclosed in Japanese Patent Application Laid-Open No. 2-87.
In the case of the cooling device of the control device described in Japanese Patent No. 597,
A cooling device is provided separately from a control device that contains heat-generating electronic and electrical devices. In this cooling device, a cooling fan is used to forcibly circulate cooling air to a ventilation duct and a waste heat duct.

【0004】[0004]

【発明が解決しようとする課題】ところで、前者および
後者のいずれの装置にあっても、筐体内部に複数の冷却
用の送風ファン、ダクトおよびヒートパイプ等を設けた
複雑な冷却構造となっており、必然的に装置全体が大型
化する。そのため、コストが非常に高騰し、しかも保守
点検に熟練を要するなどの問題があり、特に屋外使用時
の条件に制約が伴う不都合がある。
Incidentally, in either of the former and the latter devices, a complicated cooling structure having a plurality of cooling fans, ducts, heat pipes and the like provided inside the housing is provided. As a result, the size of the entire apparatus is inevitably increased. Therefore, there is a problem that the cost is extremely high, and furthermore, maintenance and inspection require skill, and there is a disadvantage that the conditions for outdoor use are particularly limited.

【0005】したがって、本発明の目的は、部材点数を
削減して構造のコンパクト化を図ることで、保守点検が
簡易化され、小型軽量でかつ低コストの電子機器筐体の
放熱装置を提供することにある。
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a heat radiating device for an electronic device housing which is simplified in maintenance and inspection by reducing the number of members and making the structure compact, and which is small, lightweight and low-cost. It is in.

【0006】[0006]

【課題を解決するための手段】本発明の電子機器筐体の
放熱装置は、密閉構造の外筐体と、前記外筐体の内部に
設置されて、前記外筐体の内面との間に単一空間からな
る空気循環路を形成すると共に、前記空気循環路に連通
する内部空気戻し口が開けられた内筐体と、前記内部空
気戻し口を介して、前記内筐体の内部に収納された電子
部品からの発熱を伴う前記内筐体の内部空気を、前記内
筐体と前記空気循環路との間で循環させ、前記内部空気
と前記外筐体外部から直接取り入れた外部空気との間で
熱交換を行熱交換機とを備えて構成されている。
According to the present invention, there is provided a heat radiating device for an electronic equipment housing, comprising: an outer housing having a closed structure ;
It is installed and has a single space between it and the inner surface of the outer casing.
That together form the air circulation path, a housing inner internal air return port is opened in communication with the air circulation path, the internal space
Via the gas return port, the air inside the inner casing with the heat generated from the electronic component housed in the interior of said housing, said
Circulating between the housing and the air circulation path, the internal air
Heat exchange and a line Cormorant heat exchanger is configured with an external air taken directly from the outer housing outside the.

【0007】この場合、一側壁面を介して前記内筐体を
前記外筐体の側壁内面に取り付けることにより、前記
筐体の上下左右面及び取付対向面と前記外筐体の内面と
の間に前記空気循環路が形成される。
[0007] In this case, the inner casing is connected via one side wall surface.
The Rukoto attached to the side wall inner surface of the outer casing, vertical and horizontal surfaces and mounting the opposing surface of the inner housing and the inner surface of the outer housing
The air circulation path is formed between them.

【0008】また、外筐体は蓋扉式のカバーで閉塞され
る前面開口部を有している場合、この前面開口部に内筐
体が一面を形成する側壁でもって取り付けられ、この側
壁には電子部品を組み込むための開口部が設けてある。
取付後、外筐体のカバーによって内筐体の前記一面の側
壁に設けた開口部を密閉することができる。
Further, when the outer casing has a front opening which is closed by a cover of a lid type, the inner casing is attached to the front opening with a side wall forming one surface. Has an opening for incorporating an electronic component.
After the attachment, the opening provided on the one side wall of the inner housing can be sealed by the cover of the outer housing.

【0009】一方、熱交換器としては、外部空気が流通
する外部空気流路部、内筐体から取り込んだ内部空気を
流通させて再び内筐体に戻す内部空気流路部を有してい
る。この場合、外部空気流路部は、外筐体から外部大気
に臨んで設けられ、内部空気流路部は内筐体の内部に臨
みかつ空気循環路に連通している。
On the other hand, the heat exchanger has an external air flow passage through which external air flows, and an internal air flow passage through which internal air taken in from the inner housing flows and returns to the inner housing again. . In this case, the external air flow path is provided facing the outside atmosphere from the outer housing, and the internal air flow path faces the inside of the inner housing and communicates with the air circulation path.

【0010】本発明は、好ましくは内筐体の内部空気戻
し口は天地方向の下位に設けられ、そこの近傍位置で内
筐体の内部に送風ファンを設置し、内部空気を強制循環
させることができる。
According to the present invention, preferably, the internal air return port of the inner casing is provided at a lower position in the vertical direction, and a blower fan is installed in the inner casing at a position near the lower end to forcibly circulate the internal air. Can be.

【0011】以上の構成によって、内外の筐体を二重に
組み立てるのみで、内蔵電子部品からの発熱を伴う内部
空気が熱交換器を経由して循環流通する空気循環路が形
成されるので、従来の冷却風導入ダクトや排熱ダクトを
わざわざ形成する必要はなく、構造は簡素であり、関連
部材はほぼ皆無である。
With the above arrangement, an air circulation path is formed in which the internal air with heat generated from the built-in electronic components is circulated and circulated through the heat exchanger only by assembling the inner and outer casings in a double manner. There is no need to form the conventional cooling air introduction duct or exhaust heat duct, the structure is simple, and there are almost no related members.

【0012】[0012]

【発明の実施の形態】以下、本発明による電子機器筐体
の放熱装置について、図面を参照して詳細に説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a heat radiating device for an electronic device housing according to the present invention will be described in detail with reference to the drawings.

【0013】図1に示すように、プリント回路基板等の
各種電子部品を収納した外筐体1は、三方面に側壁を有
しその前面開口部が扉蓋式のカバー2で閉塞される密閉
構造式のものである。この外筐体1の内部には、前面開
口部からカバー2を開いて一回り小型の通常シェルフと
呼ばれる内筐体10が取り付けられ、大小2つの筐体の
二重箱構造となっている。内筐体10の取り付けは、こ
の内筐体10の前面の開口部両側に設けた取付用フラン
ジ11を、外筐体1の前面開口部の両側に設けた支持ブ
ラケット3にボルト締結などして固定される。
As shown in FIG. 1, an outer housing 1 containing various electronic components such as a printed circuit board has side walls on three sides, and a front opening thereof is closed by a door lid type cover 2. It is of structural formula. Inside the outer housing 1, a cover 2 is opened from the front opening and an inner housing 10, which is called a small-sized normal shelf, is attached to form a double box structure of two large and small housings. The inner housing 10 is attached by fastening the mounting flanges 11 provided on both sides of the front opening of the inner housing 10 to the support brackets 3 provided on both sides of the front opening of the outer housing 1. Fixed.

【0014】図2は、外筐体1の内部に内筐体10を互
いに前面開口部を揃えて二重箱構造に組み立てた状態の
平面断面図を示している。内外の両筐体1、10の組立
後は、外筐体1に囲まれた内筐体10の上下と側方の四
方または五方の各側壁との間の空隙が空気循環路A(図
中の斜線部)として形成される。即ち、一側壁面を介し
て内筐体10を外筐体1の側壁内面に取り付けることに
より、内筐体10の上下左右面及び取付対向面と外筐体
1の内面との間に、単一空間からなる空気循環路Aが形
成される。この空気循環路Aに連通して、内筐体10の
三方の側壁12には、それぞれ矩形状の内部空気(図3
中の白矢印で表す符号B)の戻し口13が開口して設け
られている。
FIG. 2 is a plan sectional view showing a state in which the inner casing 10 is assembled into a double box structure with the front openings thereof aligned in the outer casing 1. After the assembling of the inner and outer casings 1 and 10, a gap between the upper and lower sides of the inner casing 10 surrounded by the outer casing 1 and the four side walls or the five side walls is formed in the air circulation path A (FIG. (Shaded area in the middle). That is, through one side wall surface
To attach the inner housing 10 to the inner surface of the side wall of the outer housing 1
The upper, lower, left and right surfaces and the mounting opposing surfaces of the inner housing 10 and the outer housing
1, an air circulation path A consisting of a single space is formed.
Is done. Each of the three side walls 12 of the inner casing 10 communicating with the air circulation path A has rectangular internal air (FIG. 3).
A return port 13 indicated by a symbol B) indicated by a white arrow in the middle is open and provided.

【0015】一方、外筐体1においては、天地方向でい
うその上部の天板部4に取付孔5が開口して設けられ、
ここから外筐体1の内部に熱交換器20を入れ込んで収
容可能となっている。内筐体10においても、その上部
の天板部12に例えばU字形の切欠部13が形成してあ
り、この切欠部13は外筐体1の取付孔5から入れ込ま
れた熱交換器20が係入する大きさを有している。
On the other hand, in the outer housing 1, a mounting hole 5 is provided in the top plate portion 4 in the upper part in the top and bottom direction, and is provided.
From here, the heat exchanger 20 can be inserted and housed in the outer housing 1. Also in the inner casing 10, for example, a U-shaped notch 13 is formed in the top plate 12 at the upper part thereof, and the notch 13 is formed by the heat exchanger 20 inserted through the mounting hole 5 of the outer casing 1. Has a size that can be engaged.

【0016】縦型円筒状の熱交換器20は、その高さ方
向の本体21の中間部に固定フランジ22を有してい
る。この固定フランジ22は、熱交換器20を外筐体1
の取付孔5と内筐体10の切欠部13に挿入して組み立
てる際に、外筐体1の天板部12に当てることで位置規
制してボルト23で固定する部分である。
The vertical cylindrical heat exchanger 20 has a fixing flange 22 at an intermediate portion of a main body 21 in the height direction. The fixing flange 22 is used to connect the heat exchanger 20 to the outer casing 1.
When assembling by inserting the mounting hole 5 into the notch 13 of the inner housing 10 and assembling the same, the position is regulated by being applied to the top plate 12 of the outer housing 1 and fixed with the bolt 23.

【0017】この熱交換器20の上部21aは、内外の
両筐体1、10に組立後、外筐体1の天板部4上で外部
露出して外気に晒される形となる。そのため、熱交換器
20の上部21aは箱形の保護カバー24で被覆保護さ
れ、この保護カバー24に設けた多数の通気孔25から
外部空気(図3中の黒矢印で表す符号C)が吸入され、
かつ排出可能である。すなわち、上部21aには外部空
気Cが流通する外部空気流路部が形成されている。それ
に対して、熱交換器20の下部21bは内部空気Bの取
込部として形成された内部空気流路部となっている。ま
た、上下部21a、21bを取り巻く円周に沿って放熱
フィン26が形成されている。
After assembling the upper part 21a of the heat exchanger 20 into the inner and outer casings 1 and 10, the upper part 21a is externally exposed on the top plate 4 of the outer casing 1 and is exposed to the outside air. For this reason, the upper portion 21a of the heat exchanger 20 is covered and protected by the box-shaped protective cover 24, and external air (the symbol C indicated by the black arrow in FIG. 3) is sucked in from the many vent holes 25 provided in the protective cover 24. And
And can be discharged. That is, an external air passage portion through which the external air C flows is formed in the upper portion 21a. On the other hand, the lower part 21b of the heat exchanger 20 is an internal air passage formed as a part for taking in the internal air B. Further, a radiation fin 26 is formed along a circumference surrounding the upper and lower portions 21a and 21b.

【0018】次に、以上の構成による本実施の形態の作
用について、図3を中心に各図で説明する。
Next, the operation of the present embodiment having the above configuration will be described with reference to FIGS.

【0019】図2のように、外筐体1と内筐体10との
組立によって、両筐体間の五方側壁面間に空気流路Aが
形成され、熱交換器20が組み込まれる。すなわち、外
筐体1によって囲まれる内筐体10の五方面の外側に空
気循環路Aが形成され、内筐体10内には回路基板等か
らなる各種電子部品が収納される。
As shown in FIG. 2, by assembling the outer casing 1 and the inner casing 10, an air flow path A is formed between the five side walls between the two casings, and the heat exchanger 20 is incorporated. That is, the air circulation path A is formed outside the five sides of the inner housing 10 surrounded by the outer housing 1, and various electronic components including a circuit board and the like are stored in the inner housing 10.

【0020】これから明らかなように、内外の筐体1、
10を二重に組み立てるのみで空気循環路Aが形成さ
れ、従来の冷却風導入ダクトや排熱ダクトをわざわざ形
成する必要はない。すなわち、構造は極めて簡素であ
り、関連部材は皆無に近い。
As is clear from this, the inner and outer casings 1,
The air circulation path A is formed only by assembling the 10 in duplicate, and it is not necessary to separately form the conventional cooling air introduction duct and the exhaust heat duct. That is, the structure is extremely simple, and there are almost no related members.

【0021】図3のように、内筐体10で電子部品等か
らの発生熱を伴って温度上昇した内部空気Bは、熱交換
器20の下部21bに取り込まれて内部空気流路部を流
通する。このとき、熱交換器20の上部21aからは外
部空気Cが冷却用冷気として取り込まれて外部空気流路
部を流通する。温度上昇した内部空気Bは冷気の外部空
気Cとの間で熱交換が行われ、放熱される。放熱後の内
部空気Bは外筐体1との間の空気循環路Aを通り、内筐
体10の三方側壁12に設けた戻し口13から再び内筐
体10の内部に導入される。内部空気Bは、このように
して熱交換器20を経由して放熱され、再度内筐体10
に戻る循環を繰り返す。
As shown in FIG. 3, the internal air B whose temperature has risen with the heat generated from the electronic components and the like in the inner casing 10 is taken into the lower portion 21b of the heat exchanger 20 and flows through the internal air flow path. I do. At this time, the external air C is taken in from the upper part 21a of the heat exchanger 20 as cooling air for cooling and flows through the external air flow path. The internal air B, whose temperature has risen, exchanges heat with the cool external air C and is radiated. The internal air B after the heat radiation passes through the air circulation path A between the outer housing 1 and the air B, and is again introduced into the inner housing 10 from the return port 13 provided in the three-sided wall 12 of the inner housing 10. The internal air B is thus radiated through the heat exchanger 20 in this manner, and is again
Repeat the cycle back to.

【0022】その間、熱交換器20では、上部21aに
取り込まれた外部空気Cを下部21bを流通する内部空
気Bとの間で熱交換を行わせた後、上部21a側の円周
放熱フィン26から外部大気に放出され、以下それを繰
り返す。外部空気Cの取込と放出は保護カバー24の通
気孔25を通して行われる。
In the meantime, in the heat exchanger 20, heat is exchanged between the external air C taken into the upper part 21a and the internal air B flowing through the lower part 21b, and then the circumferential radiating fins 26 on the upper part 21a side. Is released to the outside atmosphere, and so on. The intake and release of the external air C are performed through the ventilation holes 25 of the protective cover 24.

【0023】なお、本実施の形態では、他部品との干渉
が避けられ、設置スペースやコスト面での事情が許す範
囲内であれば、内筐体10の内部に送風ファンを設置
し、内部空気Bを強制循環させることも可能である。ま
た、構造も極めて簡素でかつ密閉が得られるから、専門
技術による特別な保守点検が不要となるなど、使用条件
に制約がないために屋外使用にも好適である。
In this embodiment, a blower fan is installed inside the inner casing 10 if the interference with other parts is avoided and the installation space and cost are within the allowable range. It is also possible to forcibly circulate the air B. In addition, since the structure is extremely simple and airtightness is obtained, special maintenance and inspection by specialized techniques are not required, and there is no restriction on use conditions, so that it is suitable for outdoor use.

【0024】[0024]

【発明の効果】以上説明したように、本発明による電子
機器筐体の放熱装置は、一側壁面を介して内筐体10を
外筐体1の側壁内面に取り付け、内外2つの筐体を二重
に組み立てるのみで、内筐体10と外筐体1の間に単一
空間からなる空気循環路が形成され、従来の冷却風導入
ダクトや排熱ダクトをわざわざ形成する必要はなく、構
造は極めて簡素であり、かつ部品点数は皆無に近い。そ
の結果、保守点検も熟練が不要で極めて簡単に行われ、
小型軽量でかつ低コストを実現できる。
As described above, in the heat radiating device for an electronic equipment housing according to the present invention, the inner housing 10 is connected to the inner housing 10 via one side wall surface.
It is attached to the inner surface of the side wall of the outer housing 1 and the inner and outer two housings are simply assembled in a double manner.
An air circulation path consisting of a space is formed, and it is not necessary to separately form a conventional cooling air introduction duct and a heat exhaust duct, the structure is extremely simple, and the number of parts is almost nil. As a result, maintenance and inspection are extremely easy and require no skill,
Small size and light weight and low cost can be realized.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明による実施の形態の電子機器筐体の放熱
装置を示す分解斜視図である。
FIG. 1 is an exploded perspective view showing a heat radiating device for an electronic device housing according to an embodiment of the present invention.

【図2】本実施の形態の平面組立断面図である。FIG. 2 is a plan assembly sectional view of the present embodiment.

【図3】本実施の形態の内筐体における外部空気と内部
空気の流通態様を模式的に示す斜視図である。
FIG. 3 is a perspective view schematically showing the flow of external air and internal air in the inner housing of the present embodiment.

【符号の説明】[Explanation of symbols]

1 外筐体 2 蓋扉式のカバー 3 内筐体取付用のブラケット 5 熱交換器の取付孔 10 内筐体 11 取付用のフランジ 12 三方の側壁 13 内部空気戻し口 15 熱交換器の取付切欠部 20 熱交換器 21a 上部の外部空気流路部 21b 下部の内部空気流路部 24 保護カバー 25 通気孔 26 放熱フィン DESCRIPTION OF SYMBOLS 1 Outer housing 2 Cover of lid type 3 Bracket for mounting inner housing 5 Mounting hole for heat exchanger 10 Inner housing 11 Flange for mounting 12 Three side walls 13 Internal air return port 15 Notch for mounting heat exchanger Part 20 Heat exchanger 21a Upper external air flow path part 21b Lower internal air flow path part 24 Protective cover 25 Vent hole 26 Radiation fin

Claims (6)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】密閉構造の外筐体と、前記外筐体の内部に設置されて、前記外筐体の内面との
間に単一空間からなる空気循環路を形成すると共に、前
空気循環路に連通する内部空気戻し口が開けられた
筐体と、前記内部空気戻し口を介して、前記内筐体の内部に収納
された 電子部品からの発熱を伴う前記内筐体の内部空気
、前記内筐体と前記空気循環路との間で循環させ、前
記内部空気と前記外筐体外部から直接取り入れた外部空
気との間で熱交換を行熱交換機とを備えることを特徴
とする電子機器筐体の放熱装置。
An outer housing having a sealed structure and an inner surface of the outer housing installed inside the outer housing.
An air circulation path consisting of a single space is formed between
Serial and housing inner internal air return port is opened in communication with the air circulation path, through the inner air return opening, accommodated in the said housing
Has been the air inside the inner casing with the heat generated from the electronic component, it is circulated between the air circulation passage and the inner housing, prior to
Serial heat dissipation device of an electronic apparatus housing, characterized in that it comprises a heat exchange line cormorants heat exchanger with an external air taken directly from the outer housing outside the interior air.
【請求項2】一側壁面を介して前記内筐体を前記外筐体
の側壁内面に取り付けることにより、前記内筐体の上下
左右面及び取付対向面と前記外筐体の内面との間に前記
空気循環路が形成されることを特徴とする請求項1に記
載の電子機器筐体の放熱装置。
2. The outer housing is connected to the inner housing via one side wall.
The Rukoto attached to the inner surface of the side wall, top and bottom of the inner housing
The heat radiating device for an electronic device housing according to claim 1 , wherein the air circulation path is formed between the left and right surfaces and the mounting opposing surface and the inner surface of the outer housing .
【請求項3】前記外筐体は蓋扉式のカバーで閉塞される
前面開口部を有し、この前面開口部に前記内筐体が一面
を形成する側壁でもって取り付けられて、この側壁には
前記電子部品を組み込むための開口部が設けてあり、取
付後に前記外筐体のカバーによって内筐体の前記一面の
側壁に設けた開口部が密閉されるようになっていること
を特徴とする請求項2に記載の電子機器筐体の放熱装
置。
3. The outer casing has a front opening which is closed by a cover of a lid type, and the inner casing is attached to the front opening with a side wall forming one surface, and is attached to the side wall. Is provided with an opening for incorporating the electronic component, and the opening provided on the one side wall of the inner housing is sealed by the cover of the outer housing after mounting. The heat radiating device for an electronic device housing according to claim 2.
【請求項4】前記熱交換器は、前記外部空気が流通する
外部空気流路部を有し、かつ前記内筐体から取り込んだ
前記内部空気を流通させて再び内筐体に戻す内部空気流
路部を有していることを特徴とする請求項1に記載の電
子機器筐体の放熱装置。
4. The heat exchanger has an external air flow passage through which the external air flows, and flows the internal air taken in from the internal housing and returns the internal air to the internal housing again. The heat radiating device for an electronic device housing according to claim 1, further comprising a road portion.
【請求項5】前記外部空気流路部は前記外筐体から外部
大気に臨んで設けられ、前記内部空気流路部は前記内筐
体の内部に臨みかつ前記空気循環路に連通していること
を特徴とする請求項4に記載の電子機器筐体の放熱装
置。
5. The external air passage portion is provided facing the outside atmosphere from the outer housing, and the internal air passage portion faces the inside of the inner housing and communicates with the air circulation path. The heat radiating device for an electronic device housing according to claim 4, wherein:
【請求項6】前記内筐体の内部空気戻し口は天地方向の
下位に設けられ、そこの近傍位置で内筐体の内部に送風
ファンが設置されていることを特徴とする請求項1〜5
のいずれかに記載の電子機器筐体の放熱装置。
6. The internal air return port of the inner casing is provided at a lower position in the vertical direction, and a blower fan is installed in the inner casing at a position near the lower part. 5
A heat radiating device for an electronic device housing according to any one of the above.
JP34966896A 1996-12-27 1996-12-27 Radiator for electronic equipment housing Expired - Fee Related JP2868485B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34966896A JP2868485B2 (en) 1996-12-27 1996-12-27 Radiator for electronic equipment housing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34966896A JP2868485B2 (en) 1996-12-27 1996-12-27 Radiator for electronic equipment housing

Publications (2)

Publication Number Publication Date
JPH10190266A JPH10190266A (en) 1998-07-21
JP2868485B2 true JP2868485B2 (en) 1999-03-10

Family

ID=18405299

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34966896A Expired - Fee Related JP2868485B2 (en) 1996-12-27 1996-12-27 Radiator for electronic equipment housing

Country Status (1)

Country Link
JP (1) JP2868485B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006351645A (en) * 2005-06-14 2006-12-28 Hitachi Ltd Control device
JP7108943B2 (en) * 2018-01-18 2022-07-29 パナソニックIpマネジメント株式会社 electrical equipment

Also Published As

Publication number Publication date
JPH10190266A (en) 1998-07-21

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