JP2868463B2 - Electronic components - Google Patents
Electronic componentsInfo
- Publication number
- JP2868463B2 JP2868463B2 JP8136706A JP13670696A JP2868463B2 JP 2868463 B2 JP2868463 B2 JP 2868463B2 JP 8136706 A JP8136706 A JP 8136706A JP 13670696 A JP13670696 A JP 13670696A JP 2868463 B2 JP2868463 B2 JP 2868463B2
- Authority
- JP
- Japan
- Prior art keywords
- package
- electronic component
- suction
- external
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は電子部品に関し、特
にモールド樹脂パッケージの電子部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component, and more particularly to an electronic component in a molded resin package.
【０００２】[0002]
【従来の技術】従来の電子部品は、図４（Ａ），（Ｂ）
に示す様に、特に、プラスチック又はセラミックパッケ
ージそれ自体にプリント基板等の外部構造体との機械的
接合を目的とした構造を有していなかった。もちろん複
数回の脱着を考慮した構造も全く有していなかった。2. Description of the Related Art Conventional electronic parts are shown in FIGS.
As shown in the above, in particular, the plastic or ceramic package itself did not have a structure intended for mechanical joining with an external structure such as a printed circuit board. Of course, it did not have any structure that allows for multiple attachments and detachments.
【０００３】その機械的接合は、図５（Ａ）〜（Ｄ）に
示す様に、ＴＨＤ及びＳＭＤのＬリードタイプ，Ｊリー
ドタイプ，Ｉリードタイプの外部リード３とプリント基
板６の配線との電気的接合を目的とするもので各種タイ
プの外部リード３を半田付けを主体とした方式によりプ
リント基板６に固定していた。もちろん、この従来の半
田付けによる固定方式では、パッケージ４の脱着は不可
能であった。As shown in FIGS. 5 (A) to 5 (D), the mechanical bonding is performed between the external leads 3 of the L lead type, J lead type and I lead type of THD and SMD and the wiring of the printed circuit board 6. Various types of external leads 3 intended for electrical bonding are fixed to the printed circuit board 6 by a method mainly using soldering. Of course, with the conventional fixing method by soldering, it was impossible to attach and detach the package 4.
【０００４】[0004]
【発明が解決しようとする課題】第１の問題点は、前述
の従来技術は電気的接合と機械的接合を同時に実現して
いる為、複数回の脱着は、事実上不可であった。その理
由は、接合方式が半田付けに代表される様な治金的接合
であり、一度接合した後はパッケージを簡単に外すこと
は出来なかった。もちろん、従来のソケット等を有した
電子部品の場合、脱着は容易になるが、プリント基板上
にソケット等のかなり大きな接合用の構造体を配置しな
ければならない為、高価で複雑となり、最近の電気機器
の小型化には不向きである。The first problem is that the above-described prior art simultaneously realizes electrical connection and mechanical connection, so that a plurality of attachments and detachments are practically impossible. The reason for this is metallurgical joining such as the soldering method represented by soldering, and once joined, the package cannot be easily removed. Of course, in the case of a conventional electronic component having a socket or the like, attachment and detachment becomes easy, but since a considerably large joining structure such as a socket must be arranged on a printed circuit board, it becomes expensive and complicated. It is not suitable for miniaturization of electric equipment.
【０００５】本発明の目的は、非常に小型でかつ量産性
及び保守性に富んだ、電子部品を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component which is very small, and which is excellent in mass productivity and maintainability.
【０００６】[0006]
【課題を解決するための手段】本発明の電子部品は、プ
リント基板を含む外部構造体に搭載される電子部品にお
いて、パッケージの前記外部構造体との接合面に前記パ
ッケージの脱着可能な手段を付加したことを特徴とす
る。このパッケージの脱着可能な手段が、前記パッケー
ジの中央部に設けられた吸着パッドであるか、前記パッ
ケージの外周部に配置された外部リードのそれぞれに設
けられた吸着パッドであるか、又は、少くとも前記外部
リードと対応する位置に吸着用開口部を有する吸着シー
トである。According to the present invention, there is provided an electronic component mounted on an external structure including a printed circuit board. The electronic component includes means for detachably mounting the package on a joint surface of the package with the external structure. It is characterized by being added. Detachable means of the package, whether the suction pads provided on the central portion in said package, by the suction pads kicked set <br/> to respective arranged external leads on the outer periphery of the package Or a suction sheet having a suction opening at least at a position corresponding to the external lead.
【０００７】この為、本発明の電子部品は、特に、プリ
ント基板等の外部被接合構造体に接合用のソケット等の
大がかりな構造を有する必要が無く、それ自体にて機械
的かつ電気的接合が可能である。又、素子の不良やバー
ジョンアップの際に取り外すことも容易であることも容
易に理解できる。For this reason, the electronic component of the present invention does not need to have a large-scale structure such as a socket for bonding to an external bonded structure such as a printed circuit board. Is possible. In addition, it can be easily understood that the device can be easily removed when the device is defective or the device is upgraded.
【０００８】[0008]
【発明の実施の形態】次に本発明の実施の形態について
図面を参照して説明する。Embodiments of the present invention will now be described with reference to the drawings.
【０００９】図１（Ａ），（Ｂ）は本発明の第１の実施
の形態の電子部品の側面図及びプリント基板に搭載した
側面図である。FIGS. 1A and 1B are a side view of an electronic component according to a first embodiment of the present invention and a side view mounted on a printed circuit board.
【００１０】本発明の第１の実施の形態の電子部品は、
図１（Ａ），（Ｂ）に示す様に、図４（Ａ），（Ｂ）に
示す従来のモールドパッケージ４の底面に接着剤２によ
って吸着パッド１を設けたものである。この様に吸着パ
ッド１を設けることにより、外部リード３がプリント基
板６の配線５に吸着パッド１の吸引力により押し付けら
れパッケージ４の外部リード３とプリント基板６の配線
５とが電気的に接合が得られる。この時、特に注意を要
する点は、外部リード３の形状と材質及び表面処理であ
り、吸着パッド１のたわみにより発生する変位の吸収と
電気的接合の為に、外部リード３の形状は、図４
（Ａ），（Ｂ）に示す従来の外部リード３の形状よりも
斜めに傾斜したものとし、その材質は、弾性変形領域の
大きなベリリウム銅等が好ましい。又、より良い電気的
接合の為、外部リード３先端部には、ＡｕやＳｎ等のめ
っきを施し、良好な接続が得られる様にすることが必要
であり、吸着パッド１により得られる接合力と、電気的
接合を十分考慮した設計が必要である。又、被接合物と
なるプリント基板６等の構造体上には、吸着パッド１の
機密性が保持出来る平坦部を設け、パッケージ４の接合
を可能とする。平坦部は、もちろん、ベークライト等の
表面平滑な素材でも良いが、Ｃｕパターンを層状に配置
すると、良い接合性を得ると共に、電気的なグランド層
等にも利用出来る。An electronic component according to a first embodiment of the present invention comprises:
As shown in FIGS. 1A and 1B, a suction pad 1 is provided on the bottom surface of a conventional mold package 4 shown in FIGS. By providing the suction pad 1 in this manner, the external lead 3 is pressed against the wiring 5 of the printed board 6 by the suction force of the suction pad 1, and the external lead 3 of the package 4 and the wiring 5 of the printed board 6 are electrically joined. Is obtained. At this time, special attention must be paid to the shape, material, and surface treatment of the external lead 3. The shape of the external lead 3 must be as shown in FIG. 4
The external lead 3 is inclined obliquely to the shape of the conventional external lead 3 shown in (A) and (B), and its material is preferably beryllium copper having a large elastic deformation region. In order to achieve better electrical bonding, it is necessary that the tip of the external lead 3 be plated with Au, Sn, or the like so that a good connection can be obtained. In addition, a design that fully considers electrical connection is required. Further, on the structure such as the printed board 6 to be joined, a flat portion capable of maintaining the confidentiality of the suction pad 1 is provided to enable the package 4 to be joined. The flat portion may of course be made of a material having a smooth surface such as bakelite, but if a Cu pattern is arranged in a layer, good bonding properties can be obtained and the flat portion can be used as an electrical ground layer.
【００１１】図２は本発明の第２の実施の形態の電子部
品の側面図である。本発明の第２の実施の形態の電子部
品は、図２に示す様に、より高く、安定した機械的並び
に電気的接合を得るために、パッケージ４外周部に配置
された外部リード３のそれぞれに吸着パッド１を設けた
例である。このパッケージ４の場合も外部リード３の材
質、形状は、吸着パッド１により得られる接合力と、電
気的接合を十分考慮した設計が必要である。FIG. 2 is a side view of an electronic component according to a second embodiment of the present invention. As shown in FIG. 2, the electronic component according to the second embodiment of the present invention includes a plurality of external leads 3 arranged on the outer periphery of the package 4 in order to obtain a higher and more stable mechanical and electrical connection. This is an example in which a suction pad 1 is provided in the first embodiment. In the case of the package 4 as well, the material and shape of the external leads 3 need to be designed in consideration of the bonding force obtained by the suction pad 1 and the electrical bonding.
【００１２】図３（Ａ），（Ｂ）は本発明の第３の実施
の形態の電子部品の一部切り欠き側面図及びその底面図
である。本発明の第３の実施の形態の電子部品は、図３
（Ａ），（Ｂ）に示す様に、第１，第２の実施の形態の
パッケージ４の吸着パッド１の代りに、高密度，高強度
接合を得る為吸着シート１ａを用いた例である。吸着シ
ート１ａは、吸着パッド１と同様ＮＢＲ等のゴム系の素
材にて構成され、接着剤２によりパッケージ４に接合さ
れている。吸着シートａには外部リード３と対応する位
置はもちろんのこと、吸着力を向上させる為、多数の吸
着用開口部７を有している。FIGS. 3A and 3B are a partially cutaway side view and a bottom view of an electronic component according to a third embodiment of the present invention. The electronic component according to the third embodiment of the present invention is similar to that of FIG.
As shown in (A) and (B), this is an example in which a suction sheet 1a is used to obtain high-density, high-strength bonding, instead of the suction pad 1 of the package 4 of the first and second embodiments. . The suction sheet 1 a is made of a rubber-based material such as NBR like the suction pad 1, and is joined to the package 4 by the adhesive 2. The suction sheet a has not only the position corresponding to the external lead 3 but also a large number of suction openings 7 for improving the suction force.
【００１３】尚、上述した本発明の第１，第２，第３の
実施の形態の電子部品に使用される吸着パッド１，吸着
シート１ａ及び接着剤２は、特に高耐熱性の要求は必要
なく、プリント基板６との吸着性が優れた材料の選択が
必要である。その理由は、パッケージ４は、その実装が
半田付け等の熱処理が完了した後に、単にプリント基板
６に押し付けるだけの操作で可能となり、又、その剥離
はひっぱるのみの操作で可能となり着脱が容易となるか
らである。The suction pad 1, the suction sheet 1a and the adhesive 2 used for the electronic components according to the first, second and third embodiments of the present invention need to have particularly high heat resistance. In addition, it is necessary to select a material having an excellent adsorptivity to the printed circuit board 6. The reason for this is that the package 4 can be mounted by simply pressing the printed circuit board 6 after the completion of heat treatment such as soldering, and the package 4 can be peeled off only by pulling and easy to attach and detach. Because it becomes.
【００１４】[0014]
【発明の効果】第１の効果は、本発明の電子部品の脱着
は、単に規定の圧力での押し付け、引きはがしといった
単純なものであり、安価で量産性，保守性の高いという
ことである。その理由は、パッケージ側にプリント基板
等の外部構造体への接合の為の吸着機構を有している為
である。The first effect is that the attachment / detachment of the electronic component of the present invention is as simple as pressing and peeling at a specified pressure, and is inexpensive and has high mass productivity and high maintainability. . The reason is that the package has a suction mechanism for bonding to an external structure such as a printed circuit board.
【００１５】第２の効果は、ソケット等の大型の構造体
をその脱着の為に必要としない為非常に小型化に向いて
いる為である。その理由は、パッケージ側にプリント基
板等の外部構造体への接合の為の吸着機構を有している
ためである。The second effect is that a large-sized structure such as a socket is not required for attachment and detachment, so that it is very suitable for miniaturization. The reason is that the package has a suction mechanism for bonding to an external structure such as a printed circuit board.
【図１】（Ａ），（Ｂ）は本発明の第１の実施の形態の
電子部品の側面図及びプリント基板に搭載した側面図で
ある。FIGS. 1A and 1B are a side view and a side view of an electronic component mounted on a printed circuit board according to a first embodiment of the present invention.
【図２】本発明の第２の実施の形態の電子部品の側面図
である。FIG. 2 is a side view of an electronic component according to a second embodiment of the present invention.
【図３】（Ａ），（Ｂ）は本発明の第３の実施の形態の
電子部品の一部切り欠き側面図及びその底面図である。FIGS. 3A and 3B are a partially cutaway side view and a bottom view of an electronic component according to a third embodiment of the present invention.
【図４】（Ａ），（Ｂ）はそれぞれ従来の電子部品の構
成を示す断面図である。FIGS. 4A and 4B are cross-sectional views each showing a configuration of a conventional electronic component.
【図５】（Ａ）〜（Ｄ）はそれぞれ従来のＴＨＤ及びＳ
ＭＤのＬリート・タイプ，Ｊリード・タイプ，Ｉリード
・タイプの外部リードとプリント基板との接合構造を説
明する断面図である。FIGS. 5A to 5D show conventional THD and S, respectively.
FIG. 6 is a cross-sectional view illustrating a bonding structure between an external lead of an MD L-type, a J-lead type, and an I-lead type and a printed circuit board.
１ 吸着パッド １ａ 吸着シート ２ 接着剤 ３ 外部リード ４ パッケージ ５ 配線 ６ プリント基板 ７ 吸着用開口部 DESCRIPTION OF SYMBOLS 1 Suction pad 1a Suction sheet 2 Adhesive 3 External lead 4 Package 5 Wiring 6 Printed circuit board 7 Suction opening
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H01L 23/04 H01L 23/28 H05K 1/18 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 6 , DB name) H01L 23/04 H01L 23/28 H05K 1/18
Claims (3)
れる電子部品において、パッケージの前記外部構造体と
の接合面に前記パッケージの脱着可能な手段を有し、前
記パッケージの脱着可能な手段が前記パッケージの中央
部に設けられた吸着パッドであることを特徴とする電子
部品。1. An electronic component mounted on an external structure including a printed board, comprising: means for detaching the package at a joint surface of the package with the external structure, wherein the means for detaching the package is electronic component, characterized in that the suction pads provided on the central portion in said package.
パッケージの外周部に配置された外部リードのそれぞれ
に設けられた吸着パッドであることを特徴とする請求項
１記載の電子部品。2. The electronic component of claim 1, wherein the detachable means of the package is suction pads to provided et the respective arranged external leads on the outer periphery of the package.
とも外部リードと対応する位置に吸着用開口部を有する
吸着シートであることを特徴とする請求項１記載の電子
部品。3. The electronic component according to claim 1, wherein the detachable means of the package is a suction sheet having a suction opening at a position corresponding to at least an external lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8136706A JP2868463B2 (en) | 1996-05-30 | 1996-05-30 | Electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8136706A JP2868463B2 (en) | 1996-05-30 | 1996-05-30 | Electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09321180A JPH09321180A (en) | 1997-12-12 |
| JP2868463B2 true JP2868463B2 (en) | 1999-03-10 |
Family
ID=15181587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8136706A Expired - Lifetime JP2868463B2 (en) | 1996-05-30 | 1996-05-30 | Electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2868463B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101092616B1 (en) * | 2008-04-29 | 2011-12-13 | 일진머티리얼즈 주식회사 | Metal frame for electronic part |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0742965U (en) * | 1993-12-28 | 1995-08-11 | オンキヨー株式会社 | IC flat package mounting structure |
-
1996
- 1996-05-30 JP JP8136706A patent/JP2868463B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH09321180A (en) | 1997-12-12 |
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