JP2003078228A - Flexible printed board - Google Patents
Flexible printed boardInfo
- Publication number
- JP2003078228A JP2003078228A JP2001262133A JP2001262133A JP2003078228A JP 2003078228 A JP2003078228 A JP 2003078228A JP 2001262133 A JP2001262133 A JP 2001262133A JP 2001262133 A JP2001262133 A JP 2001262133A JP 2003078228 A JP2003078228 A JP 2003078228A
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- circuit board
- printed circuit
- opening
- coverlay film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子機器に搭載さ
れるフレキシブルプリント基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed board mounted on electronic equipment.
【０００２】[0002]
【従来の技術】フレキシブルプリント基板に関する従来
技術としては、例えば図５及び図６に示されたものがあ
る。図５は両面フレキシブルプリント基板の一部を上面
からみた平面図であり、通常、フレキシブルプリント基
板においては、図５に示すように絶縁皮膜として基板全
面を覆っているカバーレイフィルムの開口部３内にチッ
プ部品１が部品ランド５，６上に実装され、更にもう１
つのカバーレイフィルム開口部４内にチップ部品２が部
品ランド７，８上に実装されている。これらのチップ部
品１,２同士をカバーレイフィルムで覆われている部分
９で相互接続している。また同様の構成で、図中下にも
う一組のチップ部品が配置され、同じく相互接続してい
る。2. Description of the Related Art As a conventional technique relating to a flexible printed circuit board, there is one shown in FIGS. 5 and 6, for example. FIG. 5 is a plan view of a part of the double-sided flexible printed circuit board seen from the upper surface. Usually, in the flexible printed circuit board, as shown in FIG. 5, the inside of the opening 3 of the coverlay film covering the entire surface of the substrate as an insulating film. Chip component 1 is mounted on component lands 5 and 6, and
The chip component 2 is mounted on the component lands 7 and 8 in one coverlay film opening 4. These chip components 1 and 2 are interconnected at a portion 9 covered with a coverlay film. Also, with the same configuration, another set of chip components is arranged in the lower part of the figure and is also interconnected.
【０００３】図６には、図５の線分ＭＭに沿った断面構
造を断面図で示している。ポリイミドなどの絶縁材が用
いられるベース材１０を中心に上下に、不図示の接着剤
層を介して、導電材層１１と導電材層１２が形成されて
いる。さらに、不図示の接着剤層を介してカバーレイフ
ィルム層１３とカバーレイフィルム層１４がある。そし
て、チップ部品１およびチップ部品２が実装されている
部分は、カバーレイフィルム層１３が開口し、導電材層
１１が露出している。２つの部品ランド６，７同士が接
続されている部分９はカバーレイフィルム層１３で覆わ
れている。FIG. 6 is a sectional view showing a sectional structure taken along line MM of FIG. A conductive material layer 11 and a conductive material layer 12 are formed above and below a base material 10 made of an insulating material such as polyimide, with an adhesive layer (not shown) interposed therebetween. Further, there are a coverlay film layer 13 and a coverlay film layer 14 with an adhesive layer (not shown) interposed. The coverlay film layer 13 is opened and the conductive material layer 11 is exposed at the portions where the chip component 1 and the chip component 2 are mounted. A portion 9 where the two component lands 6 and 7 are connected to each other is covered with a coverlay film layer 13.
【０００４】近年、電子機器の小型化が進み、高密度に
部品実装する要求が増加傾向にある。そこでもう１つの
従来例として図７に例示した両面フレキシブルプリント
基板のように、高密度に部品を実装するため、例えば４
つのチップ部品２１，２２，２３，２４のカバーレイフ
ィルム開口部を結合し、図示したカバーレイフィルム開
口部３５の如く形成することによって、互いに隣り合っ
ているチップ部品との間隔を近づけた例も提案されてい
る。チップ部品２１，２２，２３，２４の部品ランド２
５，２６，２７，２８，２９，３０，３１，３２の大き
さは、図５で示したカバーレイフィルム開口部３と部品
ランド５の重なっている部分の大きさと等しく設定され
ているので、半田の付く面積は変わらない故に、実装上
は問題ない。In recent years, electronic devices have become smaller, and there is an increasing demand for high-density component mounting. Therefore, as another conventional example, in order to mount components at high density like the double-sided flexible printed circuit board illustrated in FIG.
There is also an example in which the cover lay film openings of the two chip parts 21, 22, 23, 24 are combined to form the cover lay film opening 35 shown in the drawing, thereby reducing the distance between the chip parts adjacent to each other. Proposed. Component land 2 for chip components 21, 22, 23, 24
The sizes of 5, 26, 27, 28, 29, 30, 31, 32 are set equal to the size of the overlapping portion of the coverlay film opening 3 and the component land 5 shown in FIG. Since the area to which the solder is attached does not change, there is no problem in mounting.
【０００５】また図８には、図７の線分ＮＮに沿った断
面構造を断面図で示している。ここでは、ポリイミドな
どの絶縁材が用いられるベース材４０を中心に上下に、
不図示の接着剤層を介して、導電材層４１と導電材層４
２が形成されている。さらに、不図示の接着剤層を介し
てカバーレイフィルム層４３とカバーレイフィルム層４
４がある。そして、チップ部品２１およびチップ部品２
２が実装されている部分は、カバーレイフィルム層４３
が開口し、導電材層４１が露出している。このように従
来のフレキシブルプリント基板は、電子機器に組み込み
可能に種々の部品を簡単に搭載し相互接続することがで
きるような構成になっていた。Further, FIG. 8 is a sectional view showing a sectional structure taken along a line segment NN in FIG. Here, the base material 40 made of an insulating material such as polyimide is used as the center of the upper and lower parts,
Conductive material layer 41 and conductive material layer 4 via an adhesive layer (not shown)
2 is formed. Further, the cover lay film layer 43 and the cover lay film layer 4 are provided via an adhesive layer (not shown).
There is 4. Then, the chip component 21 and the chip component 2
2 is mounted on the coverlay film layer 43.
Are opened, and the conductive material layer 41 is exposed. As described above, the conventional flexible printed circuit board has a structure in which various parts can be easily mounted and interconnected so as to be incorporated in an electronic device.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、図７中
の例えば部品ランド２６，２７同士が接続されている接
続部分３３もまた、カバーレイフィルム層４３が開口し
た所に在る設計である故に、このフレキシブルプリント
基板を所望の電子機器に組み込むなどの際、フレキシブ
ルプリント基板自体が変形して撓んだ時には、これら部
品ランド２６，２７同士を接続している接続部分３３に
大きな応力（はく離力、せん断力または引張力など）が
加わり、その基板の変形に伴って結線部（即ち接続部分
３３，３４）が断線しやすいという問題があった。However, since the connecting portion 33 where, for example, the component lands 26 and 27 are connected to each other in FIG. 7 is also located at the opening of the coverlay film layer 43, When the flexible printed circuit board itself is deformed and bent when the flexible printed circuit board is incorporated into a desired electronic device or the like, a large stress (peeling force, peeling force, There has been a problem that the connection parts (that is, the connection parts 33 and 34) are easily disconnected due to the deformation of the substrate due to the application of shearing force or tensile force.
【０００７】これに対して、部品実装面の裏側に「裏打
ち」として補強板を貼り付けるという対策がされること
があるが、その分の補強板部材と貼付け作業に係わる費
用がコストアップの要因になってしまう。一般的にもフ
レキシブルプリント基板は接続電気部材として、例えば
上述したカバーレイ開口部での結線の断線防止は必須な
要件であり、同時に、接続電気部材としてはある程度安
価な提供が必要とされる。On the other hand, there is a case where a reinforcing plate is attached as "lining" on the back side of the component mounting surface. However, the cost for the reinforcing plate member and the attaching work is a factor of cost increase. Become. Generally, the flexible printed circuit board is an essential requirement as a connecting electric member, for example, the prevention of disconnection of the connection at the above-mentioned coverlay opening, and at the same time, it is necessary to provide the connecting electric member at a somewhat low cost.
【０００８】そこで本発明は以上のような現状に鑑みて
成されたものであって、本発明の目的は、カバーレイフ
ィルム開口部に複数のチップ部品が実装され、部品ラン
ド同士が接続されている場合に、断線し難いフレキシブ
ルプリント基板を提供することにある。Therefore, the present invention has been made in view of the above situation, and an object of the present invention is to mount a plurality of chip components in the cover lay film opening and connect component lands to each other. The purpose of the present invention is to provide a flexible printed circuit board that is hard to be broken when it is present.
【０００９】[0009]
【課題を解決するための手段】上記課題を解決し目的を
達成するため、本発明では次のような手段を講じてい
る。即ち第１の態様によれば、少なくとも２個以上の部
品が１つのカバーレイフィルムの開口部内に実装されて
いるフレキシブルプリント基板において、そのカバーレ
イフィルム開口部の裏側に平面部を有する部品を実装し
たようなフレキシブルプリント基板を提案する。第２の
態様によれば、同じく少なくとも２個以上の部品が１つ
のカバーレイフィルムの開口部内に実装されているフレ
キシブルプリント基板において、そのカバーレイフィル
ム開口部の裏側にＣＯＦ（Chip on Flexible print Cir
cuit）実装部を配置し、封止用の樹脂を塗布したような
フレキシブルプリント基板を提案する。また、第３の態
様によれば、同様に少なくとも２個以上の部品が１つの
カバーレイフィルムの開口部内に実装されているフレキ
シブルプリント基板において、そのカバーレイフィルム
開口部の裏側に下地としてニッケルメッキを施した金メ
ッキ部を配置したようなフレキシブルプリント基板を提
案する。[Means for Solving the Problems] In order to solve the above problems and achieve the object, the present invention takes the following means. That is, according to the first aspect, in a flexible printed circuit board in which at least two or more components are mounted in the opening of one coverlay film, a component having a flat portion on the back side of the coverlay film opening is mounted. We propose such a flexible printed circuit board. According to the second aspect, in a flexible printed circuit board in which at least two components are mounted in the opening of one coverlay film, a COF (Chip on Flexible print Circuit) is provided on the back side of the coverlay film opening.
We propose a flexible printed circuit board where the mounting part is placed and a sealing resin is applied. According to the third aspect, similarly, in a flexible printed circuit board in which at least two or more components are mounted in the opening of one coverlay film, nickel plating is performed as a base on the backside of the coverlay film opening. We propose a flexible printed circuit board with a gold-plated part.
【００１０】[0010]
【発明の実施の形態】以下に、複数の実施形態を例に挙
げて本発明について詳しく説明する。
（第１実施形態）最初に、図１及び図２を参照して第１
実施形態としてのフレキシブルプリント基板について説
明する。ここでは、両面に部品を実装可能な両面フレキ
シブルプリント基板を例示する。図１に、両面フレキシ
ブルプリント基板の一部を上面から見た平面図を示す。
図７に例示した従来構造と同様に、この両面フレキシブ
ルプリント基板の表面には、高密度に部品を実装するた
めに、４つのチップ部品２１，２２，２３，２４の各カ
バーレイフィルム開口部を結合している。図１の例えば
カバーレイフィルム開口部３５のように相互結合するこ
とによって、互いに隣り合っているチップ部品２１，２
２およびチップ部品２３，２４との間隔を近づけて配設
された一例を示している。一方、この両面フレキシブル
プリント基板の裏面には、平面部を有する部品１００、
例えば集積回路モジュール等を、上述の表面に実装され
ている各チップ部品２１，２２，２３，２４の真下にく
るような位置に配設している。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below with reference to a plurality of embodiments. (First Embodiment) First, referring to FIG. 1 and FIG.
A flexible printed circuit board as an embodiment will be described. Here, a double-sided flexible printed circuit board on which components can be mounted on both sides is exemplified. FIG. 1 shows a plan view of a part of the double-sided flexible printed board viewed from the upper surface.
Similar to the conventional structure illustrated in FIG. 7, on the surface of the double-sided flexible printed circuit board, in order to mount the components at high density, the coverlay film openings of the four chip components 21, 22, 23, 24 are provided. Are connected. Chip components 21 and 2 which are adjacent to each other by being coupled to each other like the cover lay film opening 35 in FIG.
2 and the chip parts 23 and 24 are shown as being close to each other. On the other hand, on the back surface of this double-sided flexible printed circuit board, a component 100 having a flat surface portion,
For example, an integrated circuit module or the like is arranged at a position directly below each of the chip components 21, 22, 23, 24 mounted on the above-mentioned surface.
【００１１】さらに具体的に、上述した両面フレキシブ
ルプリント基板の層構造について説明する。図２は、図
１の線分ＡＡに沿ったこの両面フレキシブルプリント基
板の断面図であり、例えばポリイミドなどの絶縁材が用
いられるベース材４０を中心に上下に接着剤層(不図示)
を介して、導電材層４１および導電材層４２が形成され
る。そしてまた接着剤層(不図示)を介してカバーレイフ
ィルム層４３とカバーレイフィルム層４４が形成されて
いる。More specifically, the layer structure of the above-mentioned double-sided flexible printed circuit board will be described. FIG. 2 is a cross-sectional view of the double-sided flexible printed circuit board taken along the line AA of FIG. 1, in which an adhesive layer (not shown) is vertically arranged around a base material 40 using an insulating material such as polyimide.
Through, the conductive material layer 41 and the conductive material layer 42 are formed. The coverlay film layer 43 and the coverlay film layer 44 are formed again via an adhesive layer (not shown).
【００１２】チップ部品２１とチップ部品２２が実装さ
れている部分は、前述の如くカバーレイフィルム層４３
が開口し、導電材層４１の一部が露出している。部品ラ
ンド２６,２７同士が接続されている接続部分３３もカ
バーレイフィルム層４３が開口しているが、平面部を有
する部品１００を所定の絶縁材４５を介して、表面に実
装されているチップ部品２１，２２，２３，２４の真下
（即ち真裏）に配置することで、部品ランド２６,２７
（３０,３１）同士を接続している接続部分３３（３
４）に応力が加わらないようにして、この接続部分での
断線を防止している。The portion on which the chip component 21 and the chip component 22 are mounted has the coverlay film layer 43 as described above.
Is opened, and a part of the conductive material layer 41 is exposed. The cover layer film layer 43 is also opened in the connection portion 33 where the component lands 26 and 27 are connected to each other, but the component 100 having a flat surface is mounted on the surface via a predetermined insulating material 45. By arranging the parts 21, 22, 23, and 24 directly below (that is, right behind), the parts lands 26, 27
A connecting portion 33 (3 that connects (30, 31) to each other
No stress is applied to 4) to prevent disconnection at this connection.
【００１３】つまりこれは、平面部を有する部品１００
を、カバーレイフィルム層４３が開口した表面側の各チ
ップ部品２１，２２，２３，２４の接続部分３３（３
４）を含むこの両面フレキシブルプリント基板の裏面側
に沿って配設することによって、そのカバーレイフィル
ム開口部３５の領域に対応する当該基板全体を、変形に
強くなるように部品１００自体が「裏打ち」部材となっ
て補強する構成である。That is, this is a component 100 having a plane portion.
Is the connecting portion 33 (3) of each chip component 21, 22, 23, 24 on the front surface side where the coverlay film layer 43 is opened.
By arranging along the back surface side of this double-sided flexible printed circuit board including 4), the entire substrate corresponding to the area of the coverlay film opening 35 is “backed” by the component 100 itself so as to be resistant to deformation. It is a member that reinforces.
【００１４】このように、第１実施形態に係わる両面フ
レキシブルプリント基板によれば、平面部を有する部品
１００を裏面に配置することにより、その部分のフレキ
シブルプリント基板の変形が抑えられ、その結果、断線
を未然に防止できるようになる。As described above, according to the double-sided flexible printed circuit board according to the first embodiment, by disposing the component 100 having the flat surface portion on the back surface, deformation of the flexible printed circuit board in that portion is suppressed, and as a result, It becomes possible to prevent disconnection.
【００１５】（第２実施形態）次に、図３を参照して本
発明の第２実施形態としてのフレキシブルプリント基板
について説明する。ここでも、両面フレキシブルプリン
ト基板を例示する。図３には、表面に少なくとも２つ以
上のチップ部品２１，２２が実装されている部分に対応
する裏面に、ＣＯＦ（Chip on Flexible print Circui
t）実装をした場合の断面構造を断面図で示している。
ＩＣベアチップ１０１を直接的にこのフレキシブル基板
の裏面に搭載し、複数箇所でボンディングワイヤ１０２
によってその基板を構成する導電材層４２と接続してい
る。そして、その裏面のＩＣベアチップ１０１とそのボ
ンディングワイヤ１０２全体には封止用樹脂１０３を塗
布し、これらを一体的に覆って保護強化している。(Second Embodiment) Next, a flexible printed circuit board according to a second embodiment of the present invention will be described with reference to FIG. Here again, a double-sided flexible printed circuit board is exemplified. In FIG. 3, COF (Chip on Flexible print Circui) is provided on the back surface corresponding to the portion where at least two or more chip components 21 and 22 are mounted on the front surface.
t) A cross-sectional view showing the cross-sectional structure when mounted.
The IC bare chip 101 is directly mounted on the back surface of this flexible substrate, and the bonding wires 102 are attached at a plurality of locations.
Is connected to the conductive material layer 42 constituting the substrate. Then, a sealing resin 103 is applied to the entire IC bare chip 101 and the bonding wire 102 on the back surface of the IC bare chip 101 to integrally cover them for protection and reinforcement.
【００１６】つまりこの例は、カバーレイフィルム層４
３が開口した表面側の各チップ部品２１，２２の接続部
分３３を含むこの両面フレキシブルプリント基板の裏面
側に沿ってＩＣベアチップ１０１を配設し、その接続部
材のボンディングワイヤ１０２を含んで更に封止用樹脂
１０３を塗布することにより、その部分の基板の硬度は
上がり、部品ランド同士を接続している接続部分３３自
体に直接的に応力がかからないようにし、そのカバーレ
イフィルム開口部領域に対応する当該基板全体を変形に
強い構造にしてある。That is, in this example, the coverlay film layer 4 is used.
The IC bare chip 101 is arranged along the back surface side of the double-sided flexible printed circuit board including the connection portions 33 of the respective chip components 21 and 22 on the front surface side where 3 is opened, and further includes the bonding wire 102 of the connection member. By applying the stopping resin 103, the hardness of the substrate in that portion is increased, so that no stress is directly applied to the connecting portion 33 itself which connects the component lands to each other, and it corresponds to the coverlay film opening area. The entire substrate has a structure resistant to deformation.
【００１７】このように、第２実施形態に係わる両面フ
レキシブルプリント基板によれば、裏側にＣＯＢ実装を
することと、封止用樹脂がそこに塗布されることで、そ
の両面フレキシブルプリント基板の変形が抑えられ、断
線防止が可能となる。As described above, according to the double-sided flexible printed circuit board of the second embodiment, the double-sided flexible printed circuit board is deformed by performing COB mounting on the back side and applying the sealing resin thereto. It is possible to prevent wire breakage.
【００１８】（第３実施形態）次に図４を参照して、本
発明の第３実施形態のフレキシブルプリント基板につい
て説明する。ここでは、両面に部品を実装可能な両面フ
レキシブルプリント基板を例示する。図４には、表面に
少なくとも２つ以上のチップ部品２１，２２が実装され
ている領域の裏面に現われた導電材層４２の露出部に、
金(Ａｕ)による金メッキ処理を施した場合のフレキシブ
ルプリント基板の断面構造を示している。(Third Embodiment) Next, a flexible printed circuit board according to a third embodiment of the present invention will be described with reference to FIG. Here, a double-sided flexible printed circuit board on which components can be mounted on both sides is exemplified. In FIG. 4, in the exposed portion of the conductive material layer 42 that appears on the back surface of the region where at least two or more chip components 21 and 22 are mounted on the front surface,
The cross-sectional structure of the flexible printed circuit board when the gold plating treatment with gold (Au) is performed is shown.
【００１９】通常、金メッキ処理を行う場合には、下地
としてニッケルメッキを施すのが一般的である。ここで
用いるニッケル(Ｎｉ)は、銅(Ｃｕ)などから成る導電材
層４２に比べてかなり硬度が高いので、金メッキ処理を
施したメッキ部１０４は硬度が上がり、部品ランド同士
を接続している接続部分３３に直接応力が加わりづらく
し、結果的に断線を防止してくれる。Usually, when gold plating is performed, nickel plating is generally applied as a base. Since nickel (Ni) used here has a considerably higher hardness than the conductive material layer 42 made of copper (Cu) or the like, the plated portion 104 subjected to the gold plating treatment has a higher hardness and connects the component lands to each other. It is difficult to apply stress directly to the connection portion 33, and as a result, disconnection is prevented.
【００２０】つまりこの例は、上述した第１、第２実施
形態と異なり、搭載部品や封止材などではなく、メッキ
処理によって当該基板の所定部分を強化して、剛性を高
め補強する構成である。またメッキ部１０４は、所望に
より、図示しない部品などの搭載や接続にも兼用できる
裏面領域部分でもある。That is, this example is different from the above-described first and second embodiments in that the predetermined portion of the substrate is strengthened by plating, not the mounted parts or the sealing material, to enhance the rigidity and reinforcement. is there. Further, the plated portion 104 is also a back surface area portion that can also be used for mounting and connecting components (not shown) or the like, if desired.
【００２１】尚、金メッキ処理の仕様は通常でも、フレ
キシブルプリント基板を他の基板とを圧接して接続する
際のランド部や、回路チェックする際のランド部に用い
ており、特別なコストアップにはならない。また、裏面
に部品実装ができない場合には効果的な方法である。勿
論、下地のためのメッキ処理は、ニッケルの使用に限る
ものではない。The gold-plating specification is usually used for the land portion when the flexible printed circuit board is pressure-contacted with another substrate for connection, and the land portion when the circuit is checked, resulting in a special cost increase. Don't It is also an effective method when components cannot be mounted on the back surface. Of course, the plating process for the base is not limited to the use of nickel.
【００２２】このように、第３実施形態によれば、裏面
に金メッキ処理をすることにより、その際に下地に使用
するニッケルの硬度がかなり高い故に、このメッキ処理
された領域の剛性向上によって、フレキシブルプリント
基板の変形が抑えられ、その結果、断線を未然に防止可
能となる。As described above, according to the third embodiment, the back surface is plated with gold, and since the hardness of nickel used for the base at that time is considerably high, the rigidity of this plated area is improved. Deformation of the flexible printed circuit board is suppressed, and as a result, disconnection can be prevented in advance.
【００２３】（その他の変形例）部品同士をはじめとす
る接続部分の強度を高め、はく離、せん断および引張り
に対してより強くするためには、例えば、第１〜第３実
施形態の内容の適宜な組み合せや、従来技術との組み合
せによって、更に断線し難いフレキシブルプリント基板
を変形実施してもよい。このほかにも、本発明の要旨を
逸脱しない範囲で種々の変形実施が可能である。(Other Modifications) In order to increase the strength of the connecting portions including the parts and to make them stronger against peeling, shearing and pulling, for example, the contents of the first to third embodiments are appropriately selected. The flexible printed circuit board, which is more difficult to break, may be modified by various combinations or combinations with conventional techniques. Besides this, various modifications can be made without departing from the scope of the present invention.
【００２４】以上、実施形態に基づき説明したが、本明
細書中には次の発明が含まれる。
（１） 一組以上の電子部品が１つのカバーレイフィル
ムの開口部内に実装された両面フレキシブルプリント基
板であって、当該カバーレイ開口部の裏側に、平面部を
有する所定の電子部品を一体的に配置することを特徴と
する両面フレキシブルプリント基板を提供できる。Although the above description has been given based on the embodiments, the present invention includes the following inventions. (1) A double-sided flexible printed circuit board in which one or more sets of electronic components are mounted in an opening of one coverlay film, and a predetermined electronic component having a flat portion is integrally formed on the back side of the coverlay opening. It is possible to provide a double-sided flexible printed circuit board which is characterized in that
【００２５】（２） 一組以上の電子部品が１つのカバ
ーレイフィルムの開口部内に実装された両面フレキシブ
ルプリント基板であって、当該開口部の裏側にはＣＯＦ
実装が行なわれることを特徴とする両面フレキシブルプ
リント基板を提供できる。
（３） 一組以上の電子部品が１つのカバーレイフィル
ムの開口部内に実装されたフレキシブルプリント基板に
おいて、当該カバーレイ開口部の裏側に所定のメッキ処
理が施されることを特徴とするフレキシブルプリント基
板を提供できる。(2) A double-sided flexible printed circuit board in which one or more sets of electronic components are mounted in an opening of one coverlay film, and a COF is provided on the back side of the opening.
A double-sided flexible printed circuit board can be provided which is characterized by being mounted. (3) In a flexible printed circuit board in which one or more sets of electronic components are mounted in the opening of one coverlay film, the backside of the coverlay opening is subjected to predetermined plating treatment. A substrate can be provided.
【００２６】[0026]
【発明の効果】以上説明したように、本発明によれば、
カバーレイフィルム開口部に複数のチップ部品が実装さ
れ、接続されている時に、断線し難いフレキシブルプリ
ント基板を提供することが可能となる。As described above, according to the present invention,
It is possible to provide a flexible printed circuit board that is not easily broken when a plurality of chip components are mounted in the cover lay film opening and connected.
【図１】 本発明の第１実施形態としての両面フレキシ
ブルプリント基板を示し、その一部を透視して上面から
見た平面図。FIG. 1 is a plan view showing a double-sided flexible printed circuit board as a first embodiment of the present invention, a part of which is seen through and seen from above.
【図２】 図１の線分ＡＡに沿った両面フレキシブルプ
リント基板の断面図。FIG. 2 is a cross-sectional view of the double-sided flexible printed circuit board taken along the line segment AA in FIG.
【図３】 本発明の第２実施形態としての両面フレキシ
ブルプリント基板の断面図。FIG. 3 is a sectional view of a double-sided flexible printed circuit board according to a second embodiment of the present invention.
【図４】 本発明の第３実施形態としてのフレキシブル
プリント基板の断面図。FIG. 4 is a sectional view of a flexible printed circuit board according to a third embodiment of the present invention.
【図５】 従来例としてのフレキシブルプリント基板の
一部を上面から見た平面図。FIG. 5 is a plan view of a part of a flexible printed circuit board as a conventional example as seen from above.
【図６】 図５の線分ＭＭに沿ったフレキシブルプリン
ト基板の断面図。6 is a cross-sectional view of the flexible printed board taken along the line segment MM in FIG.
【図７】 もう１つの従来例としてのフレキシブルプリ
ント基板の一部を上面から見た平面図。FIG. 7 is a plan view of a part of another flexible printed circuit board as another conventional example, which is viewed from above.
【図８】 図７の線分ＮＮに沿ったフレキシブルプリン
ト基板の断面図。FIG. 8 is a cross-sectional view of the flexible printed circuit board taken along the line NN of FIG.
２１，２２，２３，２４…チップ部品、
２５,２６,２７,２８,２９,３０,３１,３２…部品ラン
ド、
３３，３４…接続部分、
３５…カバーレイフィルム開口部、
４０…ベース材（絶縁材）、
４１，４２…導電材層、
４３，４４…カバーレイフィルム層、
４５…絶縁材、
１００…平面部を有する部品、
１０１…ＩＣベアチップ、
１０２…ボンディングワイヤ、
１０３…封止用樹脂、
１０４…メッキ部。21, 22, 23, 24 ... Chip component, 25, 26, 27, 28, 29, 30, 31, 32 ... Component land, 33, 34 ... Connection portion, 35 ... Coverlay film opening portion, 40 ... Base material ( Insulating material), 41, 42 ... Conductive material layer, 43, 44 ... Coverlay film layer, 45 ... Insulating material, 100 ... Parts having flat surface portion, 101 ... IC bare chip, 102 ... Bonding wire, 103 ... Sealing resin , 104 ... Plating part.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０５Ｋ 3/28 Ｈ０１Ｌ 23/12 Ｚ Ｆターム(参考） 5E314 BB06 CC15 FF06 FF21 GG19 5E336 AA04 CC58 5E338 AA02 AA12 AA16 BB72 CC07 EE27 5E343 AA18 BB23 BB44 DD32 GG20─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) H05K 3/28 H01L 23/12 ZF term (reference) 5E314 BB06 CC15 FF06 FF21 GG19 5E336 AA04 CC58 5E338 AA02 AA12 AA16 BB72 CC07 EE27 5E343 AA18 BB23 BB44 DD32 GG20
Claims (3)
ーレイフィルムの開口部内に実装されているフレキシブ
ルプリント基板において、 前記カバーレイフィルムの開口部の裏側に、平面部を有
する部品を実装して成ることを特徴とするフレキシブル
プリント基板。1. A flexible printed circuit board in which at least two components are mounted in an opening of one coverlay film, wherein a component having a flat surface is mounted on the back side of the opening of the coverlay film. Flexible printed circuit board characterized by being made.
ーレイフィルムの開口部内に実装されているフレキシブ
ルプリント基板において、 前記カバーレイフィルムの開口部の裏側に、所定のＩＣ
ベアチップを配置し、封止用の樹脂を塗布して成ること
を特徴とするフレキシブルプリント基板。2. A flexible printed circuit board in which at least two components are mounted in the opening of one coverlay film, wherein a predetermined IC is provided on the back side of the opening of the coverlay film.
A flexible printed circuit board comprising a bare chip and a sealing resin applied thereto.
ーレイフィルムの開口部内に実装されているフレキシブ
ルプリント基板において、 前記カバーレイフィルムの開口部の裏側に、下地として
ニッケルメッキを施した金メッキ部を配置して成ること
を特徴とするフレキシブルプリント基板。3. A flexible printed circuit board in which at least two or more parts are mounted in an opening of one coverlay film, wherein a gold-plated portion having nickel plating as a base is provided on the back side of the opening of the coverlay film. A flexible printed circuit board comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001262133A JP2003078228A (en) | 2001-08-30 | 2001-08-30 | Flexible printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001262133A JP2003078228A (en) | 2001-08-30 | 2001-08-30 | Flexible printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003078228A true JP2003078228A (en) | 2003-03-14 |
Family
ID=19089072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001262133A Withdrawn JP2003078228A (en) | 2001-08-30 | 2001-08-30 | Flexible printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003078228A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007080858A (en) * | 2005-09-09 | 2007-03-29 | Fujikura Ltd | Multilayer printed wiring board and its manufacturing method |
| JP2015037089A (en) * | 2013-08-12 | 2015-02-23 | 株式会社東芝 | Method of manufacturing wiring board and method of manufacturing semiconductor device |
| KR102553123B1 (en) * | 2022-09-08 | 2023-07-11 | 주식회사 에이플렉스 | Flexible printed circuit board prevented demage of mounted chip |
-
2001
- 2001-08-30 JP JP2001262133A patent/JP2003078228A/en not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007080858A (en) * | 2005-09-09 | 2007-03-29 | Fujikura Ltd | Multilayer printed wiring board and its manufacturing method |
| JP2015037089A (en) * | 2013-08-12 | 2015-02-23 | 株式会社東芝 | Method of manufacturing wiring board and method of manufacturing semiconductor device |
| CN104378933A (en) * | 2013-08-12 | 2015-02-25 | 株式会社东芝 | Method for manufacturing wiring substrate and semiconductor device |
| TWI607546B (en) * | 2013-08-12 | 2017-12-01 | Toshiba Memory Corp | Wiring substrate manufacturing method and semiconductor device manufacturing method |
| KR102553123B1 (en) * | 2022-09-08 | 2023-07-11 | 주식회사 에이플렉스 | Flexible printed circuit board prevented demage of mounted chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20081104 |