JP2865096B2 - Lead molding equipment for semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a lead forming apparatus for a semiconductor device, and more particularly to a lead forming apparatus for a semiconductor device having an inspection function.

[0002]

2. Description of the Related Art Generally, a lead forming machine for forming leads of a semiconductor device does not have a function for inspecting a lead shape. For this reason, regarding the shape of the lead molding, the lead after the lead molding is generally inspected visually or by another device dedicated to inspecting the shape of the lead molding. A method of an appearance inspection method relating to such inspection is disclosed in Japanese Patent Application Laid-Open No. Hei 6-147848.

[0003]

However, in the conventional lead forming apparatus for a semiconductor device, the solder treated on the lead surface is liable to adhere to the die or punch of the molding die. When it occurs,
The inconvenience that a shape defect occurs during lead molding often occurs.

[0004] In this case, the inspection often depends on the sampling inspection of the production lot, or is performed by inspection of the molding shape (dimension) performed by another lead molding shape inspection apparatus after the production lot is completely molded. Will be For this reason, in any case, there is a problem that a large number of defective molded products are sometimes produced.

[0005]

SUMMARY OF THE INVENTION An object of the present invention is to provide a lead forming apparatus for a semiconductor device capable of improving the disadvantages of the conventional example, in particular, effectively reducing the occurrence of defective products in the lead forming shape and thereby improving the productivity. Its purpose is to provide.

[0006]

In order to achieve the above object, according to the first aspect of the present invention, after a lead forming step of a semiconductor device, a lead forming inspection provided with an inspection unit for inspecting a lead forming shape of the semiconductor device. A process is provided. Then, a suction transfer hand mechanism for sucking and transferring the semiconductor device along a series of flows from the lead forming to the lead forming inspection is provided.

Therefore, according to the first aspect of the present invention,
First, in the lead molding process, a hanging pin cut mold,
Then, the workpiece is sequentially pressed by the lead molding die, and then the suction / transport hand mechanism enters the die to suck the workpiece M and transport it to the next step (the left side in FIG. 1). As a result, the workpiece (semiconductor device) M that has been subjected to the lead molding is sequentially transferred to the inspection unit, and the inspection unit inspects the molded shape. As a result, only the non-defective product (semiconductor device) M is automatically stored in the storage tray by the suction storage hand.

According to a second aspect of the present invention, in the lead forming apparatus of the first aspect, the suction storage hand mechanism for loading the semiconductor device into the storage tray after the lead forming inspection step is replaced with the suction transfer hand mechanism. The semiconductor device is mounted in a direction orthogonal to the suction conveyance direction of the semiconductor device.

Therefore, in the invention according to claim 2,
In addition to having the same function as the above-described first aspect of the present invention, only a non-defective product (semiconductor device) M can be reliably stored in the storage tray automatically by the suction storage hand mechanism.

According to a third aspect of the present invention, in the lead molding apparatus according to the first or second aspect, when the lead molding failure information is output from the inspection unit, the information is displayed on a display unit, and the information is displayed on the display unit. A system drive control unit is provided to stop and control the operation of each mechanism in the lead forming process.

Therefore, in the invention according to claim 3,
In addition to having the same operation and effect as the above-mentioned claim 1 or 2, information on a defective product found as a result of inspection by the inspection unit is immediately notified to the system drive control unit. Thereby, the system drive control unit displays the information on the shape defect on the display unit, and simultaneously activates the operation stop control function to stop and control the operation of the drive unit of each mechanism unit in the lead forming process described above. . This makes it possible to almost completely reduce the occurrence of a workpiece (semiconductor device) M having a defective shape.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, after a lead forming step of a semiconductor device (hereinafter, referred to as “workpiece”) M, a lead forming inspection step including an inspection unit 20 for inspecting a lead forming shape of the workpiece M is provided. Have been.

The lead forming step is installed on the same line in the left-right direction of FIG. 1, and the end of the supply rail 1 for carrying in the workpiece M is arranged at the right end of FIG. A mold 11 for cutting a suspension pin and a mold 12 for forming a lead are sequentially provided. In addition, a suction transfer hand mechanism 15 that suctions the above-described workpiece M and sequentially transfers it to the next molding position is provided along a series of flows from the lead molding to the lead molding inspection.

Here, the suction / transport hand mechanism 15 has a plurality of arms 15A having a retractable structure having a suction portion 15a at a front end thereof, holding each of the arms 15A at a rear end thereof, and holding each of the arms 15A. It has a main body 15B for guiding the movement of the arm 15A along the plurality of lead forming areas, and a transport holding mechanism 15C mounted on the main body 15B for transporting or stopping the above-described arms 15A. .

The suction transfer hand mechanism 15
It operates under the control of a system drive control unit 30 described later,
After the lead forming step, the workpiece M is inspected by the inspection unit 20.
Can be transferred to the equipment location. Arrows A and B
Indicates the moving direction of the arm 15A. Here, the arrow A indicates the forward direction of the moving direction of the arm 15A, and the arrow B indicates the backward direction of the moving direction of the arm 15A. In FIG. 1, the return path is set to the lower side in the outward path.

Reference numeral 21 denotes a storage tray for storing the workpiece M after the above-described lead forming inspection process. The storage tray 21 is disposed below the installation position of the inspection unit 20 in FIG. Along with the storage tray 21, the suction storage hand mechanism 22 for carrying the workpiece M into the storage tray 21 is moved by the suction transport hand mechanism 15 at the left end in FIG.
Are arranged in a direction (vertical direction in FIG. 1) perpendicular to the suction conveyance direction.

Here, the suction and storage hand mechanism 22 is configured similarly to the suction and transfer hand mechanism 15 described above.
That is, a plurality of arms 22A having a telescopic structure having a suction portion 22a at a front end portion, each arm portion 22A is held at a rear end portion, and each arm portion 22A moves along a plurality of lead forming areas. 22B to guide the user
And a transport holding mechanism 22 mounted on the main body 22A to transport or stop each of the above-described arms 22A.
C.

The suction and storage hand mechanism 22 includes:
It operates under the control of a system drive control unit 30 described later,
The workpiece M after the completion of the inspection can be carried into a predetermined position of the storage tray 21. The arrow C indicates the moving direction of the workpiece M.

FIG. 2 shows the drive control system of the above embodiment. In FIG. 2, reference numeral 30 denotes a system drive control unit. The system drive control unit 30 has a display control function of displaying the lead molding failure information on the display unit 31 when the lead molding failure information is output from the above-described inspection unit.
An operation stop control function is provided to stop and control the operation of the driving means 33 of each mechanism in the lead forming process described above. Reference numeral 34 denotes an information input unit for inputting reference information and the like necessary for the operation to the system drive control unit 30.

In the above embodiment, first,
In the lead forming step, the workpiece M is sequentially pressed by the hanging pin cut mold 11 and the lead molding die 12, and then the suction transfer hand mechanism 15 enters the mold and the workpiece M is pressed.
And transported to the next step (left side). by this,
The workpiece (semiconductor device) M that has been subjected to the lead molding is sequentially transferred to the inspection unit 20, and the inspection unit 20 inspects the molded shape.

The inspection unit 20 immediately notifies the system drive control unit 30 as soon as the result of the inspection determines that the shape is defective. As a result, the system drive control unit 30 displays the information on the shape defect on the display unit 31 as described above, and simultaneously activates the operation stop control function, thereby driving the drive unit 33 of each mechanism unit in the above-described lead forming process.
Control to stop the operation of the device and stop the entire device.

As a result, only the non-defective products are automatically stored in the storage tray 21 by the suction storage hand mechanism 22. As a result, in the above-described embodiment, since the entire number is inspected in the next step of the lead forming step, the apparatus can be stopped at the time when the lead forming shape defect occurs. Can be almost completely reduced.

[0024]

Since the present invention is constructed and functions as described above, according to the present invention, the apparatus can be stopped at the time when a shape defect occurs during lead molding. In this respect, it is possible to provide an unprecedented and excellent lead forming apparatus for a semiconductor device, which can effectively reduce the power consumption and ensure the improvement of the productivity and the uniformity of the quality.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing an embodiment of the present invention.

FIG. 2 is a block diagram showing an operation control system of the apparatus disclosed in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Supply rail 11 Hanging pin cut type 12 Lead forming type 15 Suction transfer hand mechanism 20 Inspection unit 21 Storage tray 22 Suction storage hand mechanism 30 System drive control unit 31 Display unit M Workpiece as a semiconductor device

Claims (3)

(57) [Claims] 1. A lead forming inspection step including an inspection unit for inspecting a lead forming shape of a semiconductor device is provided after a lead forming step of a semiconductor device, and a lead forming inspection step is performed along a series of flows from the lead forming to the lead forming inspection. A lead forming apparatus for a semiconductor device, comprising a suction transfer hand mechanism for sucking and transferring the semiconductor device. 2. The semiconductor device lead forming apparatus according to claim 1, wherein the suction and storage hand mechanism for loading the semiconductor device into a storage tray after the lead forming inspection step is suctioned by the suction and transfer hand mechanism. A lead forming device for a semiconductor device, provided in a direction perpendicular to a transport direction. 3. The lead molding apparatus for a semiconductor device according to claim 1, wherein when lead inspection failure information is output from the inspection unit, the information is displayed on a display unit, and the information of each part of the lead molding step described above is displayed. A lead forming apparatus for a semiconductor device, comprising a system drive control unit for stopping and controlling the operation of a mechanism.