JP2850057B2 - IC socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[Object of the Invention]

[0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket.

[0003]

2. Description of the Related Art In recent years, a component called an IC package in which an element such as an IC chip is hermetically sealed in a package has been frequently used. Then, in order to conduct an electrical test or the like of such a component, as shown in FIG. 6, a plurality of pairs of spring-like contact pins 2 with which leads of an IC package or the like come into contact are mounted on an insulating socket base 1. A jig called an IC socket, which is opposed to each other at a predetermined interval, is used. Here, the contact pin 2 is formed by connecting an arc-shaped spring portion 4 and a contact portion 5 with a lead to an upper portion of a horizontal straight rod-shaped base portion 3 and vertically inserting a vertical rod-shaped insertion portion to a lower portion of the base portion 3. The insertion part 6 has a shape in which the part 6 is suspended.
Is embedded in the insulating substrate 1, and a small-diameter portion inserted into the circuit board at the tip protrudes below the insulating substrate 1. In order to dispose the contact pin 2 having such a shape, a force is vertically applied to both ends of the base portion 3 using a jig for press-fitting, and the contact pin 2 is pierced at a predetermined position on the insulating substrate 1. A method of press-fitting the inserted insertion hole 7 from the insertion portion 6 is adopted. Note that the contact pins 2
The outer diameter of the insertion portion 6 is smaller than the inner diameter of the insertion hole 7, but a small projection 8 is provided on the outer peripheral surface of the insertion portion 6. The small projections 8 function as press-fitting margins and increase the frictional resistance between the small projections 8 and the inner wall surface of the insertion hole 7, so that the contact pins 2 are securely fixed and prevented from coming off.

[0004]

However, in such a conventional IC socket, as shown in FIG.
At the time of press-fitting, while a vertically downward press-fit is applied to both left and right ends of the base portion 3 of the contact pin 2, the small protrusion 8 as a press-fit margin is inserted into the insertion portion 6 away from the point where the press-fit works. , An upward reaction force is generated on a vertical line passing through the small projection 8. Therefore, no matter how strong a pressure input is applied, the base portion 3 of the contact pin 2 bends in a convex shape to cancel the press input, and the contact pin 2 is not completely inserted. Since the insertion depth of the contact pins 2 becomes unstable in this manner, there is a problem that the heights of the contact portions 5 that come into contact with the leads of the IC package or the like become uneven. .

The present invention has been made in order to solve such a problem, and does not cause undesired deformation of the contact pin when the contact pin is pressed into the insulating substrate, and the height of the contact portion is reduced. An object of the present invention is to provide an IC socket capable of obtaining a complete and complete insertion state and making stable contact with a lead of an IC component.

[0006]

Configuration of the Invention

[0007]

According to the IC socket of the present invention, a plurality of pairs of insertion holes formed at predetermined positions of an insulating substrate at predetermined intervals are provided so that a lead pair of an IC component is elastically contacted. A plurality of pairs of spring-like contact pins to be inserted and fixed, respectively, in the vicinity of a portion to which a press input is directly applied when the contact pins are inserted, the friction between the pair of spring-like contact pins and the inner wall surface of the insertion hole. It is characterized in that a protruding portion is provided to locally increase the resistance.

[0008]

In the IC socket according to the present invention, the protrusion which increases the frictional resistance between the inner wall surface of the insertion hole and functions as a press fit is provided in the vicinity of a portion to which the press input of the contact pin is directly applied. Therefore, the reaction force generated by the press-fit margin acts upward at a position very close to both ends of the base portion of the contact pin on which the press-fit acts. Therefore, there is almost no need to consider the action of this reaction force, and the applied pressure input works effectively, so that the contact pin is completely inserted. In particular, when the protrusion as the press-fitting margin is provided outside the portion to which the press-in is applied, such as both end surfaces of the contact pin base portion, the reaction force acts outside the point of application of the press-in. As a result, the base portion flexes in a concave shape, contrary to the conventional case, and is completely pressed into the insulating base in order from the central portion of the base portion below the flexure to both ends.

As described above, in the IC socket according to the present invention, the contact pins have good press-fitting accuracy and the unevenness of the height of the pin contact portions is eliminated, so that stable electrical contact with the leads of the IC component can be obtained. .

[0010]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view showing an embodiment of the IC socket of the present invention, and FIG. 2 is an enlarged sectional view showing a main part thereof. FIG. 3 is a diagram showing a dynamic relationship when press-fitting a contact pin in this embodiment.

In these figures, reference numeral 9 denotes an insulating substrate, and a plurality of pairs of insertion holes 10 are formed at predetermined positions, respectively. Spring-like contact pins 13 with which the elastic members 12 come into contact with each other are press-fitted and implanted. These contact pins 13 are provided on an upper part of a horizontal straight rod-shaped base part 14, and a contact part 1 with an arc-shaped spring part 15 and a lead 12.
6 are connected to each other, and the base portion 14
A vertical bar-shaped insertion portion 17 is provided at a lower portion of the base portion 14, and a step-shaped projection 18 is formed on both end surfaces of the base portion 14.

In the IC socket of the embodiment configured as described above, when the contact pins 13 are press-fitted by using a press-fitting jig, a downward pressure input as shown by arrows is applied to both ends of the base portion 14. However, at this time, the projecting portions 18 formed on both end surfaces of the base portion 14 serve as press-fitting portions, and the reaction force generated by the press-fitting portions acts on a position extremely close to a portion to which the press-fitting is applied. Therefore, there is almost no need to consider the action due to the reaction force, and the press-in is effectively applied, so that the contact pin 13 can be completely inserted in a predetermined state. In addition, since the projecting portions 18 are provided on both end surfaces of the contact pin base portion 14 and a reaction force is applied to a portion outside the point of application of the press-fit, as shown in FIG. 14 is bent in a concave shape, contrary to the conventional case, and is press-fitted into the insulating base 9 in order from the center to the both ends of the base 14 below the bend. As described above, in the embodiment, since the contact pins 13 are completely inserted into the insulating substrate 9 and the heights of the contact portions 16 are uniform, a stable and good contact can be obtained when testing the leads 12 of the IC package 11. Is obtained.

Next, a contact pin used in another embodiment of the present invention will be described.

In the contact pin 13 shown in FIG. 4, large-diameter enlarged portions 19 are formed at both ends of the base portion 14, and these portions reduce the frictional resistance between the contact hole 13 and the inner wall surface of the insertion hole 10. It acts as a press-fit margin that increases locally.

In the contact pin 13 shown in FIG. 5, projections 20 are formed on one surface of both ends of the base portion 14 by cutting and bending or embossing, respectively. It is functioning.

When the contact pin 13 having such a structure is used, the press force applied at the time of press-fitting and the reaction force generated by the press-fit margin are arranged on substantially the same straight line, and the base portion 14 of the contact pin 13 is formed. Acts on substantially the same portions at both ends of the, so that the effect of the reaction force can be ignored. Accordingly, the contact pin can be press-fitted with high precision without causing the base portion 14 to bend, and unevenness in the height of the contact portion 16 can be eliminated. Therefore, IC package 1
Stable electrical contact with one lead 12 is obtained.

[0018]

As is apparent from the above description, in the IC socket of the present invention, since the protrusion functioning as a press-fitting margin is provided in the vicinity of a portion to which the contact pin is directly pressed, the press-fitting is performed. Accuracy is good, and the height of the contact point is well aligned. Therefore, stable electrical contact with the leads of components such as an IC package can be obtained.

[Brief description of the drawings]

FIG. 1 is a sectional view showing one embodiment of an IC socket of the present invention.

FIG. 2 is an enlarged sectional view showing a main part of the embodiment.

FIG. 3 is a diagram illustrating a dynamic relationship when press-fitting a contact pin in the embodiment.

FIG. 4 is a front view and a top view showing the shape of a contact pin used in another embodiment of the present invention.

FIG. 5 is a front view and a side view showing a shape of a contact pin used in another embodiment of the present invention.

FIG. 6 is an enlarged sectional view showing a main part of a conventional IC socket.

FIG. 7 is a diagram showing a dynamic relationship when press-fitting a contact pin in a conventional IC socket.

[Explanation of symbols]

1, 9 ... insulating substrate 2, 13 ... spring-like contact pin 3, 14 ... base part 4, 15 ... spring part 5, 16 ... contact part 6, 17 ... insertion part 7, 10 ... insertion hole 8 ... Small protrusion 11 IC package 12 Lead 18 Step-shaped protrusion 19 Large-diameter enlarged portion 20 Projection formed by cutting or embossing

Claims (1)

(57) [Claims] 1. A plurality of pairs of spring-like contact pins, into which a pair of leads of an IC component elastically contact, are inserted into a plurality of pairs of insertion holes formed at predetermined positions on an insulating substrate at predetermined intervals.
In an IC socket which is inserted and fixed, a protrusion which locally increases frictional resistance between the inner wall surface of the insertion hole and the vicinity where a press-in is directly applied when the contact pin is inserted. I characterized by comprising
C socket.