JPH043637B2 - - Google Patents

Description

[Detailed Description of the Invention] A. Field of Industrial Application The present invention provides an elastic material for electrical components when a predetermined semiconductor device (particularly a semiconductor integrated circuit chip (hereinafter referred to as an IC chip)) is mounted. The present invention relates to a socket having a contact that can be pressed to make electrical contact, such as a socket for IC chip testing.

B. Prior Art Conventionally, in order to test an IC chip (for example, a heat resistance test), the IC chip is placed in a heating furnace to determine whether it is good or bad.

FIG. 7 shows a socket 1 for mounting an IC chip used in such a test. A large number of pin-shaped contacts 4 are provided which are connected to a test circuit (not shown) and guided to a test circuit (not shown), and the IC chip 2 is inserted into the mounting space 51 from above so as to be surrounded by these contacts.

To explain this mounting operation, first, each contact 4
The lead legs 6 are guided downward and fixed between the base 7 and the bottom plate 3 thereof, and the upper end of the straight portion 5 has a bent portion 8 bent into a curved shape. However, inside this, a contact 15 is provided which elastically presses into contact with the pin 31 of the IC chip 2.
Note that the lead leg portions 6 of the contactor 4 are inserted into lead insertion holes of a printed circuit board 33 connected to a test circuit, and fixed with solder 34.

According to such a socket 1, the contacts 4 are arranged to be elastically deformable, so when the IC chip 2 is pushed into the mounting space 51 from above, the contacts 4 are elastically spread outward by the pressure. Due to this elastic restoring force, the IC chip 2 is clamped and held from the sides by the contacts 4 (specifically, the contacts 15) as shown in the figure. That is, since the contact 15 comes into elastic contact with the J-shaped pin 31 of the IC chip 2,
The IC chip 2 will be connected to the test circuit via the contacts 4. To take out the IC chip 2, the IC chip 2 can be picked up with fingers and pulled out from the side where the contacts 4 are not present, in a reverse operation to the above.

However, in such a socket 1, the bent portion 8 of the contact 4, where the contact 15 is located, is connected to the IC chip 2.
However, since the bending directions of the left and right bent portions 8 are opposite to each other, incorrect insertion may occur if the left and right shapes are not selected when attaching both contacts 4 to the socket base 7. will occur. For this reason, the workability of attaching the contactor decreases.

C. Purpose of the Invention An object of the present invention is to provide a socket for mounting a semiconductor device such as an IC chip, in which a contact can be easily attached and the contact can make sufficient contact with the semiconductor device. .

D. Structure of the Invention That is, the present invention includes a socket base body for mounting a semiconductor device (for example, an IC chip), and a plurality of socket base bodies each disposed along at least an opposing surface of the semiconductor device to elastically press the semiconductor device. A socket having a contactor, wherein one end portion of the contactor is attached to the socket base, the other end portion of the contactor is connected to the one end portion via a connecting portion, and the other end portion has the contactor. A protruding contact point that can be electrically connected to a semiconductor device is formed, and the other end portion is symmetrical with respect to a center line along the length direction of the connecting portion, and free ends are provided on both sides of the connecting portion. A pair of supporting parts having the following properties are each connected in a direction from the one end to the other end at a certain distance from the connecting part, and are held by the socket base. This relates to sockets.

E. Embodiments Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

1 to 3 show a socket for IC chip testing according to a reference example shown for understanding the present invention.

The appearance of the socket 21 according to this reference example is basically similar to the conventional one shown in FIG. 7, but the mounting mechanism for the IC chip 2 is uniquely configured.

That is, as particularly shown in FIG. 1, the contact 24 is fixed between the socket base 7 and the lead leg 26 passing through the socket bottom plate 3.
The upper portion of the straight portion 35 has bent portions 28a and 28b curved at two upper and lower locations, respectively, and the inside of each of these bent portions has contact points 25a and 28b.
5b. The straight portion 35 is formed to be elastically deformable, and when the IC chip 2 is installed, it elastically presses each contact 25a or 25b toward the side or inward of the IC chip 2 as shown in the figure.

What is important here is that when the IC chip 2 is mounted with the front side facing up as shown by 2a, only the lower contact 25a of the above two contacts contacts the pin 31 of the IC chip 2, and the upper The contact point 25b is in a non-contact state. Also, conversely, set IC chip 2 to 2.
As shown in b, when mounted with the back side up, only the upper contact 25b contacts the pin 31,
The lower contact point 25a is in a non-contact state.

In this way, by providing the two contacts 25a and 25b on the contactor 24 above and below, the IC chip 2 can be mounted either front or back.
Electrical contact can be easily made to the IC chip 2 in each mounting state. Therefore, I.C.
Test chip 2 with 1 on both its front and back sides.
This can be done with one socket 21, there is no need to prepare multiple types of sockets, and costs can be reduced.

FIG. 4 shows an embodiment of the invention.

In this example, the contact 24 is placed at its center line 3.
The contact point 25a, 25b is formed in a symmetrical shape with respect to 0 as the center, and one set of the above-mentioned contacts 25a and 25b are provided on each left and right side surface. Further, support plate portions 32 having spring properties are continuously provided on both sides of the straight portion 35 of the contactor 24 with a certain distance from the straight portion 35 .

Therefore, as in the example of FIG. 1, the presence of the two contacts 25a and 25b allows the IC chip 2 to be mounted with either the front or the back side (the front side is facing up in FIG. 4). However, since one socket 21 can be used for each type of socket, testing is easy and costs can be reduced. In addition, since the contacts 24 are made bilaterally symmetrical with respect to the center line 30, each of the contacts 25a and 25b contacts the pin 31 equally on either the left or right side. Therefore, when attaching the contact 24 to the socket base 7, the contact 24 is inserted into the base 7 from above, but the left and right shapes of the contact 24 are not selected at the time of insertion. Even if each contactor 24 is attached as shown in FIG. 2 (here, the position of the pin 26 is different), each contactor 24 can contact the IC chip 2 in exactly the same way. Therefore, the work of attaching or assembling the contactor 24 becomes easier, reducing time and eliminating incorrect assembly.The contactor 24 itself only needs to have one type of shape and can be formed by punching or the like, further reducing costs. This will allow you to further reduce the damage.

When the contacts 24 become smaller and a large number of contacts 24 are arranged close to each other as shown in FIGS. 2 and 3, the positions of the leads 26 of the adjacent contacts 24 may be changed to the left or right. For example, it may be desirable to alternately arrange them in a staggered manner in order to prevent contact between them. In this case, the contactor 24 can be used in either the left or right position, which is extremely convenient and easy to install.

Furthermore, since the support plate portions 32 are elastically brought into close contact with the inner wall surfaces of the socket base 7 on the left and right sides, the contactor 24 can be firmly and stably fixed within the socket. In this case, the contact 24 is stably held on the socket base 7 by the support plate part 32,
Since the upper end of the contact 24 is connected to the straight part 35, the elastic deformation of the straight part 35 allows the upper end of the contact 24 to independently hold the IC chip 2 without receiving reaction force from the socket. . Furthermore, even if the mounting direction of the IC chip 2 changes, the upper end of the contact 24 can move in an arc shape due to the deformation and movement of the linear portion 35. 2 can always be maintained well. Furthermore, since the contact 24 can be inserted into the socket base 7 from above, the socket base 7 can be integrally molded, and there is no need to separately provide the bottom plate 3 as in the example shown in FIG.

FIG. 5 shows a second embodiment of the invention.

According to this example, as in the example shown in FIG. The spring properties of the plate portion 32 are utilized. That is, when the contactor 24 is inserted into the socket base 7 from below as shown in the figure, the support plate portion 32 is elastically contracted inward by the pressure received from the inner wall surface of the socket base, and its head portion is further compressed. Immediately after the socket 32a emerges from the inner space 36 having a somewhat larger diameter, each support plate 32 strongly bites into the inner wall surface of the socket base due to the spring force that tries to restore the socket 32a to the outside. In addition to this, each shoulder 3 provided on the contactor 24
7 engages with the socket base, once the contact 24 is attached, it is firmly held by the spring force without play, and at the same time the contact 24 is prevented from coming off by the engagement. Further, since the contactor 24 can be assembled into the socket by simply inserting it from below, automation of this work is facilitated.

FIG. 6 shows a reference example to facilitate understanding of the present invention, and the point that the contact 24 is bilaterally symmetrical with respect to its center line 30 is similar to the above-described embodiment. However, only one contact point 25 is provided on each side. Moreover, the support plate part 32 as shown in FIG. 4 is not provided at the lower part of the contactor 24.

According to this reference example, in addition to not having to select the left and right shapes when attaching the contact 24, the lead leg 26 (soldering part) comes into contact as shown in the left half of FIG. If the contacts are staggered (studded or staggered), since the left and right shapes of the contacts 24 are the same, they can be attached no matter which side is inserted, and incorrect insertion can be prevented. As already mentioned, this also applies to the example shown in FIG. However, since there is no support plate part 35 at the bottom of the contactor 24, the attachment of the contactor in the socket tends to become unstable, and therefore it is necessary to provide the bottom plate part 3 to fix it.

Although the present invention has been illustrated above, the embodiments described above can be further modified based on the technical idea of the present invention.

For example, the shape, number, etc. of the above-mentioned bent portions and contact points may be changed in various ways. Regarding the contact points, there are two or more contacts instead of one in each mounting state.
The number and arrangement can be changed to make contact with the IC chip. For reference, even if the contact indicated by the solid line in Figure 7 and the contact indicated by the dashed-dotted line in the same figure are installed at the same time in one socket, it will not work either on the front or back side of the IC chip. Tests can be performed even if the device is attached. In the above example, the IC chip is clamped by contacts on two sides, but a structure in which the IC chip is clamped from four sides or from four directions can also be used. The present invention is of course applicable to semiconductor devices other than the above-mentioned IC chips.

F. Effects of the Invention As described above, in the present invention, the contacts are provided with protruding contacts, and these parts are made symmetrical with respect to the center line. itself) will come into contact with the semiconductor device equally on both the left and right sides. For this reason, when attaching the contact to the socket base,
Even if the contacts are inserted into the base without selecting the left and right shapes of the contacts, each contact can come into contact with the semiconductor device in exactly the same way. Therefore, the work of attaching or assembling the contact becomes easy, reducing time and eliminating incorrect assembly.The contact itself only needs to have one type of shape and can be formed by punching, etc., further reducing costs. This will help you achieve even better results.

Further, the contactor is stably held on the socket base body by support portions having free ends that are arranged on both sides of the connecting portion at a certain distance from the connecting portion. Since the other end of the contact is connected to the connecting part, the other end can hold the semiconductor device independently without receiving reaction force from the socket, and even if the mounting direction of the semiconductor device changes. Since the other end portion can move in an arc shape as the connecting portion moves, the semiconductor device can always be held well with a predetermined elasticity with a simple configuration.

[Brief explanation of drawings]

Figures 1 to 5 are for explaining the present invention; Figure 1 is an enlarged sectional view of an IC chip test socket attached to a printed circuit board; Figure 2 is a plan view of the socket; FIG. 3 is a partially sectional front view of the socket corresponding to the - line in FIG. 2, and FIGS. 4 and 5 are sectional views of the socket according to the first and second embodiments of the present invention. FIG. 6 is a sectional view of a socket according to a reference example of the present invention. 7 and 8 show a conventional example, in which FIG. 7 is a sectional view of a socket, and FIG. 8 is a perspective view of an IC chip. In addition, in the symbols shown in the drawings, 2...IC chip, 7...Socket base, 12...Stage,
21...Socket, 24...Contact, 25, 25
a, 25b... Contact, 26... Lead leg, 28
a, 28b...Bending portion, 30...Center line, 31...
...J-shaped pin, 33...printed circuit board, 34...solder, 35...straight portion, 51...mounting space.

Claims (1)

[Scope of Claims] 1. A socket having a socket base for mounting a semiconductor device, and a plurality of contacts arranged along at least an opposing surface of the semiconductor device and elastically pressing the semiconductor device. , one end of the contact is attached to the socket base, the other end of the contact is connected to the one end via a connecting part, and the other end can be electrically connected to the semiconductor device. a protruding contact point is formed, and the other end portion has a symmetrical shape with respect to a center line along the length direction of the connecting portion, and a pair of supporting portions having free ends are provided on both sides of the connecting portion. A socket characterized in that the connecting portions are arranged in succession along the direction from the one end to the other end at a predetermined distance, and are held by the socket base.