JP2835810B2 - Mold for resin sealing of semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin sealing mold for a semiconductor device, and more particularly, to a method for attaching a required number of chase blocks to upper and lower mold base plates.
The present invention relates to a conventional type resin sealing mold for a semiconductor device in which the matching of opposing chase blocks is improved.

[0002]

2. Description of the Related Art A lead frame on which a semiconductor device is mounted is resin-sealed using a resin-sealing mold. FIG.
FIG. 1 shows a main configuration of a resin sealing mold 50 according to a conventional example. A plurality of chase blocks 54 and 55 having a large number of cavities 53 formed in parallel are fixed on upper and lower base plates 51 and 52 so as to face each other. Then, a lead frame on which the semiconductor device is mounted is placed in the center of the cavity 53, and a sealing resin is injected from the central cull portion 56. As shown in FIG. 5, a plurality of positioning holes 57 are provided in the chase block 55 (the same applies to the chase block 54).
The positioning hole 58 having the same diameter is provided at the same position also in the position 2, and the chase block 55 is positioned and fixed to the base plate 52 using the dowel pin 59. The lower base plate 52 and the upper base plate 51 are positioned by a bush 59 provided at four corners and a post 60 fitted to the bush 59 so that the opposing cavities 53 of the chase blocks 54 and 55 match. Was supposed to.

[0003]

However, the chase blocks 54 and 55 are firstly placed on the base plate 5.
1 and 52, the base plates 51 and 5
2, the chase blocks 54 and 55 are fixed at predetermined positions, and the chase blocks 54 and 55 and the base plate 5 are fixed.
Since the positioning holes for inserting the base plates 1 and 52 are formed, the base plates 51 and 52 can be accurately mounted at predetermined positions. However, when the chase blocks 54 and 55 are replaced with different chase blocks, the base plate 51 ,
It is necessary to provide positioning holes in the chase blocks 54 and 55 in accordance with the positioning holes formed in the 52, which is extremely troublesome. If the positions of the chase blocks 54 and 55 are shifted even a little, defects such as off-center and mismatch may occur. There is a problem of occurrence. Also, if the positioning holes of the base plates 51 and 52 are repeatedly used, play will occur in the positioning holes, and accurate positioning cannot be performed. Therefore, it is necessary to gradually change the positioning holes to large-diameter positioning holes.
In this case, it is necessary to drill a positioning hole again,
There is a problem that an extra process is required. The present invention has been made in view of such circumstances, and has as its object to provide a resin-sealing mold for a semiconductor device in which positioning of upper and lower chase blocks can be accurately and easily performed.

[0004]

According to the present invention, there is provided a resin sealing mold for a semiconductor device according to the present invention, which seals a lead frame on which semiconductor elements are mounted on upper and lower base plates 11 and 12. A resin sealing mold for a semiconductor device is provided with opposing chase blocks 15 and 16 in which a plurality of cavities 18 and 19 are formed, respectively. 10, the positioning means has a U-shaped cross section which is fitted and fitted from at least two notches formed at diagonal positions on the outer peripheral end surfaces of the upper and lower chase blocks 15 and 16 facing each other. A pair of female positioning blocks 13 and 14, and a groove 27 having a U-shaped cross section is formed in the lower chase block 16 so as to face in the vertical direction. Decide block 14 is mounted,
On the upper chase block 15, a male positioning block 13 which is fitted closely into the groove 27 of the female positioning block 14 is mounted with its U-shaped cross-section groove 25 facing in the horizontal direction. The upper and lower edges of the groove of the positioning block 14 are cut obliquely to form an inner guide 14a, and the upper and lower edges of the male positioning block 13 are cut obliquely to form an outer guide 13a. doing.

[0005]

In the resin molding die for a semiconductor device according to the first aspect, the positioning means for engaging the opposite chase blocks is provided in advance, so that the upper and lower chase blocks are attached to the base plate. The upper and lower chase blocks are fixed to the upper and lower base plates using screws or the like, with the upper and lower base plates approaching a predetermined position in advance and the positioning means attached to the upper and lower chase blocks are engaged. I do.
Thus, it is not necessary to form a positioning hole in the chase block in accordance with a positioning hole formed in the base plate in advance, or to newly drill a positioning hole in which the dowel pin is fitted in the chase block and the base plate. Therefore, the paired chase blocks can be quickly and accurately mounted.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will now be described with reference to the accompanying drawings to provide an understanding of the present invention. Here, FIG. 1 is a perspective view of a resin sealing mold of the semiconductor device according to the first embodiment of the present invention, FIG. 2 is a perspective view of a positioning block used in the resin sealing mold, and FIG. FIG. 4 is a perspective view of a resin sealing mold of a semiconductor device according to a second embodiment of the present invention.

As shown in FIG. 1, in a resin sealing mold 10 for a semiconductor device according to a first embodiment of the present invention, upper and lower base plates 11 and 12 are provided with a pair of positioning means as an example. Four chase blocks 15 and 16 provided with positioning blocks 13 and 14, respectively, and a center block 17 are provided. A large number of cavities 18 and 19 are formed in the chase blocks 15 and 16 respectively. The cavities 19 formed in the center of the center block 17 are provided in the cavities 19 of the four lower chase blocks 16.
A runner 21a for guiding the sealing resin from 0 is provided.

[0008] 2 of the outer peripheral end face of the chase block 15
Notches 21 and 22 are formed at diagonal positions, and a male positioning block 13, which is an example of a positioning means, is mounted in the notches 21 and 22, corresponding to the outer peripheral end surface of the chase block 16. Notches 23, 2
A female positioning block 14 corresponding to the male positioning block 13 is fixed to the notches 23 and 24, respectively.

The positioning block 13 is made of an extremely hard material (for example, a super-hard alloy SKH-51). As shown in FIG. 26 are formed, and are tightly fitted and fixed in a state of protruding downward from the notches 21 and 22 of the chase block 15. On the other hand, the positioning block 14 is also made of an extremely hard material (for example, a super hard alloy SKH-51), has a horizontal U-shaped cross section as shown in FIG. 28 are formed, and are tightly fitted and fixed to the notches 23 and 24 of the chase block 16, respectively. The width W of the groove 27 is substantially the same as the width L of the positioning block 13 in which the groove 27 is inserted.
It is designed to fit into. The positioning block 1
3 has a chamfer (C) serving as an outer guide 13a.
1) and the positioning block 1
Chamfer (C
1) is formed, and the positioning block 13 is smoothly fitted into the groove 27 of the positioning block 14. The positions of the notches 21 to 24 are determined in advance so that the opposing cavities 18 and 19 formed therein match when the positioning blocks 13 and 14 are fitted.

A plurality of bolt holes 29, 30 are formed on both sides of the chase blocks 15, 16, respectively, and upper and lower base plates 11, 1 are formed by loosely fitting bolts.
2 can be fixed. In FIG. 1, reference numeral 31 denotes a post, and 32 denotes a bush into which the post 31 fits.

Therefore, the upper and lower chase blocks 15, 1
When the base plate 6 is mounted on the base plates 11 and 12, positioning blocks 13 and 14 are mounted in advance so that the cavities 18 and 19 formed on the inner surface coincide with each other.
1 and 12 are brought close to a predetermined position,
The opposed chase blocks 15, 16 positioned by 3, 3 are mounted on the base plates 11, 12 by screws. Thereby, the opposing cavity 1
8 and 19 coincide with each other, and the positioning of the chase blocks 15 and 16 becomes extremely simple.

Next, a resin sealing mold 35 for a semiconductor device according to a second embodiment of the present invention shown in FIG. 3 will be described. Instead of the positioning blocks 13 and 14, chase blocks 36 and 37 are used. A post 38, which is an example of a positioning means, and a bush 39 which engages with the post 38 are attached to two places, respectively, so that the position of a cavity (not shown) is adjusted. The post 38 is made of a hard material (e.g., SUJ-2), has a taper 40 for guide at the front end, and has a retaining groove 41 on the peripheral surface of the middle part. From the side, can be screwed. The bush 39 is made of a relatively hard material (for example, SKH-51).
, A retaining groove 42 is formed in the side portion, and can be fixed by screwing from the side surface of the chase block 37. Therefore, the resin sealing mold 3 of this semiconductor device is used.
When attaching 5 to a base plate (not shown), the upper and lower base plates are first lowered to predetermined positions, and the chase blocks 36 and 37 in which the post 38 is fitted to the bush 39 are screwed and fixed to the upper and lower base plates, respectively. .

In the above embodiment, a male positioning block or post is arranged on the upper chase block and a female positioning block or bush is provided on the lower chase block. The present invention is also applicable to a case where a positioning block or bush is disposed and a male positioning block or post is disposed in a lower chase block.
The center block can be easily positioned and fixed by the same method.

[0014]

According to the first aspect of the present invention, since the positioning means is provided in the chase block, the mold is replaced by changing the base plate. When the upper mold or the lower mold is set as the reference, the other can be assembled, for example, and the positioning can be performed simply and accurately. Also, when a plurality of chase blocks are mounted, their alignment can be performed individually, so that mounting and adjustment are easy, and product defects (off-center, Mismatch) can be significantly reduced. Further, since the upper and lower positioning blocks have a U-shaped cross section, the positioning is performed face-to-face, so that they are resistant to wear and have a long life.

[Brief description of the drawings]

FIG. 1 is a perspective view of a resin sealing mold of a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a perspective view of a positioning block used in the resin sealing mold.

FIG. 3 is a perspective view of a resin sealing mold of a semiconductor device according to a second embodiment of the present invention.

FIG. 4 is a perspective view of a resin sealing mold of a semiconductor device according to a conventional example.

FIG. 5 is an enlarged view of the same part.

[Explanation of symbols]

Reference Signs List 10 Mold for resin sealing of semiconductor device 11 Base plate 12 Base plate 13 Positioning block (Positioning means) 14 Positioning block (Positioning means) 15 Chase block 16 Chase block 17 Center block 18 Cavity 19 Cavity 20 Cull part 21 Notch 21a Runner 22 Notch 23 Notch 24 Notch 25 Groove 26 Screw hole 27 Groove 28 Screw 29 Bolt hole 30 Bolt hole 31 Post 32 Bush 35 Resin mold for semiconductor device 36 Chase block 37 Chase block 38 Post (positioning means) 39 Bush (positioning means) 40 taper 41 retaining groove 42 retaining groove

Claims (1)

(57) [Claims] An upper and lower base plate;
2 is provided with opposing chase blocks 15 and 16 in which a plurality of cavities 18 and 19 for sealing a lead frame on which a semiconductor element is mounted are respectively engaged with the opposing chase blocks 15 and 16. For molding a resin of a semiconductor device provided with respective positioning means
0, a male member having a U-shaped cross section, wherein the positioning means matches and fits into notches formed in at least two diagonal positions of the outer peripheral end surfaces of the opposed upper and lower chase blocks 15 and 16 and is attached from the outside. Female pair of positioning blocks 13, 14
A female positioning block 14 is attached to the lower chase block 16 with a U-shaped groove 27 facing up and down, and the upper chase block 15 is provided with the female positioning block 14. The male positioning block 13 that fits tightly into the groove 27 is mounted with its U-shaped cross section 25 facing in the horizontal direction, and the upper and lower edges of the female positioning block 14 are cut diagonally. The inner guide 14a is formed to form an outer guide 13a, and the upper and lower peripheral edges of the male positioning block 13 are cut obliquely to form an outer guide 13a. Mold.