JP2834967B2 - Jet type soldering equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component, such as a network resistor, in which an element such as a resistor is mounted on one or both sides of a substrate made of ceramic or the like. The present invention relates to an improvement in a jet-type soldering apparatus used for soldering an element or a lead wire to a semiconductor device or plating a printed circuit board with solder.

[0002]

2. Description of the Related Art This type of jet soldering apparatus is conventionally known as shown in FIG.
And as shown in FIG. 6, the solder bath 11, upwardly provided with an opening with a cylindrical ejection box 12, the ejection box
A supply rail 15 for mounting the lead frame B with the lead portion B1 facing downward is provided above the solder bath 11 while supplying the molten solder C to the blade 12 through the impeller 13 and the solder supply path 14. While the electronic component A attached to the lead portion B1 of the lead frame B is being transferred,
Injection to come upward from the opening hole at the top of the jet boxes 12
It is configured to be immersed in the molten solder C to be discharged .

[0003]

In this type of jet-type soldering apparatus, it is necessary to ensure that the solder spreads to the details of the electronic component A and that the excess solder is prevented from adhering. Is the upper surface of the jet box 12
It is desirable that the flow rate of the molten solder C ejected upward from the opening hole is as fast as possible, in other words, that the molten solder C hits the electronic component A vigorously.

In this case, in the jet type soldering apparatus, the molten solder C is ejected from the opening in the upper surface of the ejection box 12 and falls naturally in four directions due to gravity. The flow velocity of the molten solder C ejected to the nozzle increases with increasing distance from the opening.
Accordingly, in a configuration in which the ejection box 12 is merely formed in a cylindrical shape as in the related art, two portions at the front and rear ends of the opening hole from which the molten solder is ejected are located along the path of the electronic component A. Only the fastest flow velocity in
Since there is only a short time during which the molten solder C is vigorously applied to the electronic component A, the molten solder C cannot be spread to the details of the electronic component A, and therefore, a defective product with insufficient solder adhesion. There was a problem that occurred.

If the length of the opening hole in the jet box 12 is increased to extend the immersion time of the electronic component A in the molten solder C, the solder excessively adheres or the electronic component is broken by thermal shock. Or the solder is cracked, which is not a good idea. SUMMARY OF THE INVENTION It is an object of the present invention to provide an apparatus that can reliably perform soldering in a short time.

[0006]

In order to achieve this object, the present invention provides a transfer means for continuously transferring an object to be processed,
A rectangular opening extending along the transfer means is provided on the upper surface.
And the total length along the longitudinal direction of this opening hole
Ejection port configured to eject molten solder upward
The object to be processed, which is being transferred by the transfer means, is
Melt spouting upward from the opening in the spout box
In a jet- type soldering apparatus provided so as to pass through molten solder , a plurality of opening holes in the jet box are provided.
In the direction of transfer of the workpiece.
Are arranged in a line with a gap between the openings
On the other hand, the left
Connect the right side plates to each opening on the top of the
Incline inward toward the hole. " .

[0007]

[Operation and effect of the invention] In this way, put the jet box
And a plurality of the opening holes are formed.
A gap is provided between each of the openings along the physical transfer direction.
By arranging them in a row , the flow rate of the molten solder is increased at the front and rear sides of each of the opening holes. The molten solder having a high flow velocity is exposed at each of the front and rear sides. In other words, the number of times that the molten solder vigorously hits the object to be processed can be increased a plurality of times as compared with the related art.

Therefore, according to the present invention, the number of times the molten solder hits the workpiece at a high flow rate can be greatly increased as compared with the conventional technique, so that the immersion time of the workpiece in the molten solder is not increased, and Since the molten solder can be spread to the details of the object to be processed, the solder can be surely soldered without excessive adhesion of the solder or being hindered by heat, and as a result, This has the effect of significantly reducing the incidence of defective products in the soldering process.

In addition, the transfer method in the ejection box
Left and right side plates parallel to the direction
The flow rate of the molten solder ejected upward from each of the opening holes is reduced by being inclined inward toward each of the opening holes.
Since the speed can be faster than before, the solder
Not only can be further improved, but also
The oxide film on the surface of the solder
Can be prevented and soldering failure can be more reliably prevented.
It also has

[0010]

Next, an embodiment in which the present invention is applied to soldering of an electronic component will be described with reference to the drawings (FIGS. 1 to 4). 1 to 3 show a first embodiment. In these figures, reference numeral 1 denotes a fixed type transport rail as an example of a means for transporting an electronic component A. A lead frame B in which lead portions B1 for each book are formed at appropriate intervals is mounted so that each lead frame B1 faces downward, and each lead portion B1 of the lead frame B is mounted.
Is mounted with an electronic component A having an element A1 such as a resistor mounted or printed on one or both sides of a substrate.

[0011] The said solder bath 2 disposed below the transport rail 1, projecting a jet box 3 connected to the solder supply path 14 similar to Figure 6, the upper end of該噴out box 3,
Two rectangular open <br/> port hole 4, the both opening holes along the transfer direction of the electronic component A for ejecting upward molten solder C
4 are arranged in a line with a gap therebetween . The location of the opening 4 in the jet box 3 is formed as an upper constriction in which the distance between the left and right side plates is reduced toward the upper end. That is, the transfer method in the jet box 3
The left and right side plates parallel to the direction
Are inclined inward toward each of the opening holes 4.
In addition, both opening holes 4 are opened laterally at both front and rear ends (the lateral opening is indicated by reference numeral 4a).

In the above arrangement, the lead frame B is transported while the molten solder C is being ejected from the opening holes 4, and the electronic component A is immersed in the molten solder C ejected from the ejection portions 4. A1 and the lead portion B1 are soldered. In this case, since the molten solder C is ejected from the two opening holes 4 and falls in all directions, the flow rate of the molten solder C at a location along the transfer path of the electronic component A is determined by the two opening holes 4.
Since the speed is the fastest on both sides of the electronic component A,
In the course of passing over the ejection part 3, the molten solder C is vigorously immersed in four places on both front and rear sides of both the opening holes 4. In addition to this, transfer in the jet box 3
Place the left and right side plates parallel to the direction on the ejection box 3
Inclined inward toward each opening 4 in the surface
The molten solder ejected upward from each of the opening holes 4
Flow rate becomes fast, and Therefore, it is not necessary to prolong the soaking time of the molten solder C, it can be molten solder C causes span goes to the detail of the electronic component A.

By the way, when the electronic component A is transferred horizontally, there is an advantage that the whole device can be made compact as compared with the case where the electronic component A is transferred in an inclined shape. If the speed is slow, the solder will accumulate on the square element A1 or the upper end surface of the printed surface of the electronic component A due to the surface tension, and the solder from the electronic component A will not be sharp.

On the other hand, according to the present invention, since the flow rate of the molten solder C is high, no extra solder is attached, and the sharpness of the solder from the electronic component A is improved. Can be prevented from being excessively adhered. In addition, when the locations of the two opening holes 4 in the ejection box 3 are formed to be constricted upward, in other words, the ejection box 3
The left and right side plates parallel to the transfer direction at
Inward toward each opening hole 4 on the upper surface of the box 3
When inclined , the upward flow velocity of the molten solder C ejected from the opening hole 4 is increased, so that not only can the sharpness of the solder be further improved, but also the molten solder C ejects vigorously.
Since an oxide film can be prevented from being generated on the surface of the ejected solder, there is also an advantage that a soldering failure can be more reliably prevented.

Further, when the lateral openings 4a are formed in both the opening holes 4 as in the embodiment, the molten solder C is spouted from the lateral openings 4a in a substantially horizontal direction and vigorously. Can be faster. FIG. 4 shows a second embodiment applied to a method of transferring an electronic component A in a state of being inclined with respect to a horizontal plane. In this case,
It is desirable to change the height of the opening 4.

In both of the above embodiments, two ejection holes 4 are provided. However, it goes without saying that three or more ejection holes 4 may be provided.

[Brief description of the drawings]

FIG. 1 is a perspective view of a first embodiment.

FIG. 2 is a sectional view of the first embodiment.

FIG. 3 is a sectional view taken along line III-III of FIG. 2;

FIG. 4 is a side view of a main part of a second embodiment.

FIG. 5 is a diagram showing a conventional technique.

FIG. 6 is a diagram showing a conventional technique.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Conveyance rail 2 Solder bath 3 Spout box 4 Opening hole A Electronic component B Lead frame C Fused solder

Claims (1)

(57) [Claims] A transfer means for continuously transferring an object to be processed;
A rectangular opening extending along the transfer means is provided on the upper surface.
And the total length along the longitudinal direction of this opening hole
Ejection port configured to eject molten solder upward
The object to be processed, which is being transferred by the transfer means, is
Melt spouting upward from the opening in the spout box
In a jet- type soldering apparatus provided so as to pass through the molten solder, a plurality of opening holes in the jet box are provided.
A plurality of opening holes are formed in each of the openings along the transfer direction of the workpiece.
While arranged in a row with a gap between the opening holes,
Left and right side plates parallel to the transfer direction in the spout box
To each opening hole on the upper surface of the jet box.
A jet type soldering device characterized by being inclined inward .