JP2833914B2 - Component placement position calculation system - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component placement position calculating system, and more particularly, to a component placement position calculating system used when arranging components on a printed circuit board.

[0002]

2. Description of the Related Art A conventional component placement position calculation system sets one type of component placement grid for a component placement area, and automatically calculates where and what components are to be placed on the component placement grid. A method of performing arrangement processing is employed.

[0003]

In the conventional component placement position calculation system, only one type of component placement grid can be set. Therefore, when components of various shapes and types are placed in the placement area, the shape of the components, Regardless of the type, placement processing was performed on the same component placement grid. For this reason, as shown in FIG. 4, there is a case where components 53 and 54 having small component shapes are first arranged at the grid positions 120 and 121 of the component placement grid where the component 57 having large component shape is to be arranged. However, since there is only a component position area around the lattice positions 120 and 121 but only the lattice positions 123 and 124, there is a disadvantage that a lattice position where the component 57 can be arranged cannot be found and waste occurs in the component arrangement region. Was.
Here, reference numerals 55 and 56 denote components, reference numeral 51 denotes a component disposable area, and reference numeral 52 denotes a component disposition grid.

[0004]

SUMMARY OF THE INVENTION It is an object of the present invention to improve the disadvantages of the prior art and, in particular, to provide a component arrangement position calculating system capable of always appropriately arranging components.

[0005]

According to the present invention, information relating to the size and shape of a component such as an IC or an LSI mounted on a printed circuit board and information relating to a component arrangement grid for arranging the relevant component are stored. And extracting, from the data storage device, information relating to the specified component when the component is specified, and sequentially extracting, from the data storage device, information relating to the component arrangement grid for arranging the specified component. A component placement grid that matches the component based on the size and shape of the component output from the processor, specify the location of the component placement grid, and specify the component location. And a component position selecting and arranging means for performing processing. This aims to achieve the above-mentioned object.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. The embodiment shown in FIGS. 1 to 3 stores information on the size and shape of a component such as an IC or LSI mounted on a printed circuit board, and information on a component arrangement grid for arranging the relevant component. When a component is specified, information on the component is extracted from the data storage device 4 and information on a component arrangement grid for arranging the specified component is sequentially read from the data storage device 4. And an arithmetic unit 3 for extraction. The arithmetic unit 3 selects a component arrangement grid that matches the component based on the size and shape of the component output from the arithmetic unit, specifies the arrangement position, and performs a component arrangement process. The component position selecting and arranging means 5 is also provided.

[0007] The component position selection and placement means 5 includes a component placement grid determination mechanism 11 for selecting a component placement grid that matches the specified component, and a placement position of the specified component in the selected component placement grid. And a component arrangement processing mechanism 13 for arranging the component at the specified arrangement position. Here, reference numeral 14 indicates component arrangement grid information, and reference numeral 15 indicates component shape type information.

Next, the operation of the above embodiment will be described.

FIG. 2 is a flowchart showing the operation of the component position selecting and arranging means 5 of FIG. 1, and FIG. 3 is an explanatory diagram of the operation.

First, an arrangement target component is extracted from the component shape / type information 15 of the data storage device 4 (step 2).
0). Here, the components to be incorporated in the lattices 32 to 34 in FIG. 3 are extracted. Next, the component placement grid information 14 in the data storage device 4 indicates on which of the component placement grids 32, 33, and 34 the extracted components are to be placed.
And from the part shape / type information 15 (step 2
11). Here, if it is determined that the component is a component to be placed on the component placement grid 62 or 64, a position where the component can be placed on the component placement grids 62 and 64 is determined from the component placement grid information 14 (step 221). If a position where a component can be placed is found, the component placement processing mechanism 13 performs component placement processing (step 231). If the position where the component can be arranged is not found, the process proceeds to the process of extracting the next component to be arranged without performing the component arrangement process of the component. The same processing is performed for all the placement target components.

[0011]

As described above, according to the present invention,
A plurality of component placement grids are set, the component placement grid is automatically determined for each component based on the shape and type of the component, and component placement processing is performed. It is possible to eliminate waste in the component placement area such that the calculation of the placement position is not possible, and to provide an excellent component placement position calculation system that can quickly and appropriately perform component placement.

[Brief description of the drawings]

FIG. 1 is a block diagram showing one embodiment of the present invention.

FIG. 2 is a flowchart showing the operation of FIG.

FIG. 3 is an explanatory diagram showing an example of automatic calculation of a component arrangement position.

FIG. 4 is an explanatory diagram showing a conventional example.

[Explanation of symbols]

 3 Arithmetic unit 4 Data storage unit 5 Component position selection and placement means 11 Component placement grid determination mechanism 12 Component placement position calculation mechanism 13 Component placement processing mechanism 32, 33, 34 Component placement grid 35, 36 Component to be placed

Claims (2)

(57) [Claims] 1. An IC or L mounted on a printed circuit board
A data storage device that stores information on the size and shape of a component such as SI, information on a component placement grid for arranging the component, and the like, and stores information on the component when the component is specified. An arithmetic unit for extracting from the data storage unit information relating to a component arrangement grid for arranging the specified component, the component being output from the arithmetic unit. A component placement grid that matches the component based on the size, shape, etc. of the component, specifies the location of the component placement grid, and performs component placement processing. Positioning position calculation system. 2. A component placement grid determining mechanism for selecting a component placement grid that matches the specified component, and a component placement grid deciding mechanism that selects the component placement grid in the selected component placement grid. 2. A component arrangement position calculating mechanism for determining a position of the component, and a component arrangement processing mechanism for arranging the part at the specified arrangement position.
The described component placement position calculation system.