JP2826486B2 - Grinding tape peeling machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a grinding tape peeling machine for peeling a protective grinding tape from the front surface of a wafer whose back surface has been ground.

[0002]

2. Description of the Related Art Usually, in a grinding process for a backside of a wafer in the manufacture of semiconductor devices, this tape stripping machine for grinding uses a grinding tape for the purpose of protecting the wafer surface during the backside grinding, and after the backside grinding is completed, the grinding tape is removed. Used for peeling purposes.

FIG. 4 is a perspective view of a conventional grinding tape peeling machine. FIG. 4 shows a conventional grinding tape peeling machine.
As shown in the figure, the carrier station B12 in which the ground wafer 11 is transported and stored, the wafer positioning unit 7 from which the ground wafer 11 is taken out by the manipulator and the orientation flat is aligned, and the ground wafer 11 Vacuum stage 6 to be adsorbed, roller 3 for applying tape to apply tape 2 to grinding tape 4, peeling tape winding unit 1 for winding peeling tape 2, and roll 8 for supplying peeling tape 2 And an arm 10 for taking out a wafer for accommodating the wafer 11 from which the grinding tape 4 has been removed in the carrier station A9.

Next, the operation of the grinding tape peeler will be described. First, the carrier station B1 storing the ground wafer 11 having the back surface of the wafer ground.
The ground wafer 1 is transferred from the wafer 2 to the wafer positioning unit 7, and the orientation flat is aligned. Next, the ground wafer 11 is transported onto the vacuum stage 6, which is a tape peeling section, and fixed by suction. Next, the tape applying roller 3 moves to the ground wafer 11 on the vacuum stage 6 and the peeling tape 2 is removed from the grinding tape 4.
Paste in. After that, the peeling tape winding unit 1 rotates,
As the peeling tape 2 is wound up, the grinding tape 4 is peeled off from the wafer 11, and the grinding tape 4 is removed from the wafer 11.
When the tape is completely peeled off, the tape applying roller 3 also returns to the original position.

Next, the wafer 11 from which the grinding tape 4 has been peeled off is stored in the carrier station A9 by the wafer take-out arm 10 from the vacuum stage 6, and a series of operations is completed. By repeating such a series of operations, the grinding tape 4 of the ground wafer of the carrier station B12 is peeled off, and the carrier station A
Was stored in.

[0006]

In the conventional grinding tape peeling machine described above, the adhesion between the peeling tape and the grinding tape caused by the adhered substance such as Si (silicon) scraps adhered in the back surface grinding step often occurs. There is a problem that the grinding tape cannot be peeled off from the wafer by one peeling operation. As a result, the peeling tape must be re-tensioned, and the work efficiency (throughput) deteriorates. In addition, there is a disadvantage in that the length of a part of the tape is cut off due to the re-stretching of the peeling tape, and the amount of consumption increases.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a grinding tape peeling machine for firmly attaching a peeling tape to a grinding tape without wasting the peeling tape, and for reliably peeling the grinding tape from a wafer. is there.

[0008]

A feature of the present invention is to remove dust adhering to a surface of a grinding tape attached to the surface of a wafer whose back surface has been ground while moving in one direction on the surface of the grinding tape. A grinding tape peeling machine comprising a vacuum cleaning mechanism for sucking, and a grinding tape peeling mechanism for affixing a peeling tape to the grinding tape and peeling the grinding tape together with the peeling tape from the back surface of the wafer. .

It is preferable that the vacuum cleaning mechanism has a plurality of flexible thin tubes having a suction port communicating with a vacuum exhaust pipe, which are arranged in parallel and perpendicular to the moving direction.

[0010]

Next, the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of a grinding tape peeling machine showing an embodiment of the present invention. As shown in FIG. 1, this grinding tape peeler removes a wafer 1 whose back surface is ground.
A vacuum cleaning mechanism 5 that absorbs dust adhering to the surface of the grinding tape 4 attached to the surface of the grinding tape 4 while moving in the direction of an arrow on the surface of the grinding tape 4 is provided. Otherwise, as in the conventional example, a roller 3 for applying the peeling tape 2 to the grinding tape 4 and a peeling tape winding unit 1 for peeling and winding the grinding tape 4 from the back surface of the wafer 11 together with the peeling tape 2 are provided. A grinding tape removing mechanism, a roll 8 for supplying the peeling tape 2, a wafer positioning unit 7 for adjusting the orientation flat position, and a take-out arm 10.

FIG. 2 is an enlarged view of the vacuum cleaning mechanism of FIG. As shown in FIG. 2, for example, the vacuum cleaning mechanism connects a flexible thin tube 5a such as vinyl chloride having an inner diameter of 1 to 3 mm and a length of about 10 to 20 mm to a wafer diameter (10 mm).
(0-200 mm) is derived from the main body 5b vertically and horizontally. When the main body 5b moves on the surface of the wafer, the thin tube 5a comes into contact with the surface of the grinding tape 4 of the wafer 11 and the tip thereof is appropriately bent, and the dust adhered to the grinding tape by the subsequent repulsion is separated from the surface. ,
It has a function of absorbing dust removed by a vacuum pump connected to the main body 5b via a pipe.

The vacuum cleaning mechanism 5 is attached to a vacuum stage 6 shown in FIG. 1 by a support arm (not shown) attached to a position 5 to 10 mm to the right. The support arm and the vacuum cleaning mechanism 5
100 to 2 in accordance with the wafer diameter in the direction of the arrow
It can reciprocate within a range of 00 mm.

Further, at this time, the thin tube 5a of FIG. 2 is attached so as to lightly contact the upper surface of the grinding tape 4. As a result, the thin tube 5a of the vacuum cleaning mechanism 5 performs an operation of removing the deposits adhering to the surface of the grinding tape 4 while moving on the surface of the grinding tape 4 on the wafer 11 on the vacuum stage 6. In the operation of peeling off the grinding tape 4, the vacuum cleaning mechanism 5 performs an operation of retracting to the side of the vacuum stage 6.

FIG. 3 is a flow chart for explaining the operation of the grinding tape peeler of FIG. Next, the operation of the grinding tape peeler will be described. First, in step A in FIG. 3, the ground wafer 11 is transferred from the carrier station B12 to the wafer positioning unit 7.
Next, in step B, in the wafer positioning unit 7,
The orientation flat alignment, which is the positioning necessary to peel off the grinding tape 4, is performed. Thereafter, in step C, the ground wafer 11 is transferred onto the vacuum stage 6 and sucked by vacuum.

Next, in step D, the vacuum cleaning mechanism 5 moves left and right in the direction of the arrow while bringing the tip of the thin tube 5a of FIG. The adhering matter is separated and absorbed and removed. next,
In step E, the surroundings are darkened and monochromatic light is projected onto the grinding tape 4 of the wafer 11 to check for the presence or absence of attached matter. Here, if Yes, the process proceeds to Step F, where the vacuum cleaning mechanism 5
Is retracted to the side of the vacuum stage 6, the tape applying roller 3 moves on the ground wafer 11, and the peeling tape 2 is applied to the grinding tape 4. If No in step E, the process returns to step D to clean the grinding tape 4.

Next, in step G, the peeling tape winding section 1
Is rotated to remove the grinding tape 4 from the wafer 11. Next, in step H, the vacuum of the vacuum stage 6 is released. Then, in step I, the wafer 11 is taken out of the vacuum stage 6 by the take-out arm 10 and stored in the carrier station A9.

As described above, prior to the attaching operation of the peeling tape 2 by the tape applying roller 3, the vacuum cleaning mechanism 5 is operated to remove the adhering matter adhering to the surface of the grinding tape 4 and to check for any foreign matter. After confirming the above, the peeling tape 2 and the grinding tape 4 were brought into close contact with each other, and the grinding tape 4 was reliably peeled off from the wafer 5 by one peeling operation.

[0019]

As described above, according to the present invention, a vacuum cleaning mechanism is provided for sucking dust that comes off while brushing the surface of the grinding tape attached to the wafer. After removing the dirt, the adhesion of the peeling tape to the grinding tape is improved, so that the adhesion between the peeling tape and the grinding tape is improved.
This has the effect that the grinding tape can be reliably peeled off from the wafer in a number of operations.

Further, the re-attachment of the peeling tape was eliminated, and as a result, the work efficiency (throughput) was improved by 20% as compared with the past, and the wasteful consumption of the peeling tape due to the re-work was also eliminated.

[Brief description of the drawings]

FIG. 1 is a perspective view of a grinding tape peeling machine showing an embodiment of the present invention.

FIG. 2 is an enlarged view showing the vacuum cleaning mechanism of FIG. 1;

FIG. 3 is a flowchart for explaining the operation of the grinding tape peeler of FIG. 1;

FIG. 4 is a perspective view of a conventional grinding tape peeling machine.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Peeling tape winding part 2 Peeling tape 3 Roller 4 Grinding tape 5 Vacuum cleaning mechanism 5a Small tube 5b Main body 6 Vacuum stage 7 Wafer positioning part 8 Roll 9 Carrier station A 10 Wafer take-out arm 11 Wafer 12 Carrier station B

Claims (2)

(57) [Claims] 1. A vacuum cleaning mechanism for removing and absorbing dust adhering to a surface of a grinding tape affixed to the surface of a wafer having a back surface, while moving in one direction on the surface of the grinding tape, A grinding tape peeling machine, comprising: a grinding tape peeling mechanism for attaching a peeling tape to a grinding tape and peeling the grinding tape from the back surface of the wafer together with the peeling tape. 2. The vacuum cleaning mechanism according to claim 1, wherein a plurality of flexible thin tubes having a suction port communicating with a vacuum exhaust pipe are arranged in parallel and orthogonal to the moving direction. The grinding tape peeling machine according to claim 1.