JP2825731B2 - IC lead frame surface treatment equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface treatment apparatus for carrying out pretreatment, plating and the like while transporting an IC lead frame by a conveyor (for example, a roller conveyor).

[0002]

2. Description of the Related Art The structure of a conventional surface treatment apparatus is shown in FIG.
In the figure, reference numeral 1 denotes a conveyor (roller conveyor) having a plurality of rollers 2 arranged at a predetermined pitch. Reference numeral 10 denotes an overflow type processing tank, and reference numeral 20 denotes an overflow receiving tank. A liquid circulation device 25 includes a supply pipe 26, a recovery pipe 27, a circulation pump 28, a management tank 29, and the like.

When the circulating pump 28 of the liquid circulating device 25 is driven to circulate and supply the processing liquid in the control tank 29 to the processing tank 10 through the supply pipe 26, an ascending liquid flow is generated in the processing tank 10. A swelling treatment liquid Qu having a predetermined height is formed between the two weirs 12 and 14. An IC conveyed on each roller 2 of the roller conveyor 1 in the swelling treatment liquid Qu
The surface treatment is performed by continuously passing the lead frame W.

Incidentally, the IC lead frame W is irregularly pushed up by the rising liquid flow in the processing tank 10 when it is transported in the bulging processing solution Qu, so that the transport becomes unstable and collides with other components. In some cases, the surface cannot be smoothly treated.

That is, the contact pressure between the IC lead frame W and each roller 2 is irregularly reduced by the action of the lifting force due to the rising liquid flow. As a result, the feed bias by each roller 2 becomes insufficient and uneven. May be. In an extreme case, the IC lead frame W may be lifted from each roller 2 and may not be transported.

In particular, at present, the length of the processing tank 10 in the transport direction tends to be long in order to increase the transport rate of the IC lead frame W and increase the production quantity while securing a predetermined processing time. For this reason, the entire IC lead frame W is likely to enter the swelling processing liquid Qu and be transported, and the above-mentioned inconvenience is more likely to occur.

Therefore, in order to eliminate the above-mentioned transport failure,
It is conceivable to reduce the push-up force due to the rising liquid flow by reducing the amount of circulating supply liquid to the processing tank 10. However, in this case, even if the IC lead frame W can be stably transported, the height of the swelling treatment liquid Qu becomes low, and the surface treatment cannot be performed smoothly and reliably.

Therefore, in order to prevent a poor transport of the IC lead frame W while accepting that a certain amount of lifting force acts on the IC lead frame W by the rising liquid flow, as shown by a two-dot chain line in FIG. In most cases, a pressing roller 5 for pressing the IC lead frame W is provided corresponding to each roller 2 in the processing tank 10. By the pressing roller 5, a decrease in the contact pressure between the IC lead frame W and each roller 2 is eliminated, and the IC lead frame W
Can be smoothly and reliably transported and passed through the treatment liquid Qu to complete the treatment.

[0009]

By the way, the IC lead frame W is becoming increasingly thinner (for example, having a thickness of 0.075 to 0.1 m) in accordance with the miniaturization and high performance of current ICs.
m), the number of lead wires has been increased and thinned, resulting in weaker stiffness. As described above, when the IC lead frame W becomes extremely thin and becomes weak in rigidity, the above-described conventional structure provided with the pressing roller 5 may deform or damage the IC lead frame W. It has been confirmed that the deformation of the IC lead frame W occurs not only in the vertical direction but also in the plane direction, that is, three-dimensionally. Such deformation of the IC lead frame W is a fatal defect for the surface treatment apparatus.

Therefore, in order to prevent such inconvenience,
By changing the material and form of the press roller 5 in various ways, and by further increasing the time and finely adjusting the pressure contact amount of the press roller 5 against the roller 2, the pressing force is reduced as much as possible within a range where the IC lead frame W does not cause conveyance failure. However, the above-mentioned deformation problem could not be solved.

A similar problem occurs when the conveyor is a belt conveyor, a net conveyor, or the like.

SUMMARY OF THE INVENTION In view of the above circumstances, it is an object of the present invention to enable an IC lead frame to be transported smoothly and completely processed without being deformed or damaged even if the IC lead frame is extremely thin and weakly rigid.
An object of the present invention is to provide a surface treatment device for a C lead frame.

[0013]

Each of the pressing rollers mechanically frictionally engages with the IC lead frame conveyed in the swelling treatment liquid to three-dimensionally suppress the free displacement of the IC lead frame. In addition, the IC lead frame may not only be deformed in the vertical direction by directly receiving the ascending liquid flow, but also may be deformed in the vertical direction, due to variations in the pressing force of each pressing roller and irregularities in the pressing force of the ascending liquid flow. It has been found from various experimental results that when a state in which the feeding biasing force to the lead frame is different occurs, the state is expanded and contracted in a plane direction and deformed. That is, it has been found that no matter how the shape and the like of the pressing roller are changed, the problem of deformation of the IC lead frame cannot be solved by the structure in which the pressing roller is mechanically engaged with the IC lead frame and pressed.

Therefore, attention is paid to the processing liquid circulated and supplied to the processing tank, and the IC lead frame is pressed against the conveyor (roller conveyor) side without mechanical frictional engagement by the discharge liquid pressure of the processing liquid. Thus, the object is achieved.

That is, the surface treatment apparatus for an IC lead frame according to the present invention is characterized in that the surface of the IC lead frame is conveyed by using a conveyor in the swelling processing liquid formed above the overflow type processing tank. In a surface treatment apparatus for an IC lead frame for performing processing, a processing liquid discharge box having a plurality of discharge holes on a lower surface disposed above the processing tank and at a position where a raised processing liquid is formed; A liquid supply means for pressurizing and supplying the processing liquid in the discharge box, and discharging the processing liquid from each discharge hole of the processing liquid discharge box toward the IC lead frame passing through the rising processing liquid; The frame is configured to be pressed against the conveyor side by a discharge liquid pressure.

[0016]

According to the present invention, the IC lead frame is transported on the conveyor to the processing tank. This IC
When the lead frame enters the tank and can be transported through the processing liquid, the IC lead frame is pushed up by the rising liquid flow in the processing tank and the processing liquid discharged from the discharge hole of the processing liquid discharge box. Is pressed against the conveyor side by the liquid pressure of.

At this time, by adjusting the pressing force by the discharge liquid pressure to be larger than the lifting force by the rising liquid flow, the IC lead frame can be prevented from floating and can be smoothly transported. Even if the urging force for the lead frame becomes uneven due to irregularities in the rising liquid flow, etc., the discharge processing liquid is not mechanically frictionally engaged with the IC lead frame. Does not constrain the free displacement in the plane direction. Therefore,
Even if the IC lead frame is extremely thin and has a low rigidity, it is not deformed or damaged.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. As shown in FIG. 1 and FIG. 2, the surface treatment apparatus of the present IC lead frame has a basic configuration (a roller conveyor (1), a processing tank 10, an overflow receiving tank 20, a liquid circulation device 25, etc.) as a conventional example (FIG. 3). )
An IC that is transported and passed through the processing liquid Qu on the processing tank 10 by the discharge liquid pressure supplied from the processing liquid discharge box 30.
By pressing the lead frame W against the conveyor (1) without mechanical frictional engagement, the lead frame W is formed so as to compensate for a decrease in the feed urging force without deformation.

The same components as those in the conventional example (FIG. 3) are denoted by the same reference numerals, and description thereof will be omitted or simplified.

More specifically, the surface treatment apparatus is provided with a processing liquid discharge box 30 and a liquid supply means 40 for supplying a processing liquid to the processing liquid discharge box 30 by pressurization. The processing liquid is discharged from each of the discharge holes (31) of the box 30 toward the IC lead frame W conveyed by the roller conveyor 1) and passing through the rising processing liquid Qu, and the IC lead frame W is discharged by the discharge liquid pressure. It is configured to be pressed against the conveyor (1).

First, the discharge holes of the processing liquid discharge box 30 are moved in the transport direction of the IC lead frame W so that the entire surface of the IC lead frame W can be pressed with uniform force and pressed against the roller conveyor 1. The slits 31 have the same shape and are arranged at a predetermined pitch.
Each slit 31 has a length equivalent to the width of the IC lead frame W, and has a constant width. The processing liquid discharge box 30 has a capacity such that the processing liquid supplied under pressure from the liquid supply means 40 can be stably discharged from each of the discharge holes (31) at a constant pressure.

The liquid supply means 40 is means for supplying the processing liquid into the processing liquid discharge box 30 under pressure. In this embodiment, the liquid supply means 40 actively uses the management tank 29 and the like of the liquid circulation device 25 so as to achieve the homogenization of the processing liquid and to achieve downsizing and cost reduction by sharing parts. It is configured.

That is, the liquid supply means 40 has one end connected to a portion of the supply pipe 26 of the liquid circulation device 25 downstream of the circulation pump 28 and the other end connected to the liquid supply port of the processing liquid discharge box 30. 32, and is driven by the circulating pump 28 so that the connection pipe 41 is connected.
The processing liquid in the management tank 29 is supplied from the liquid supply port 32 into the box 30 in a state where the processing liquid is pressurized.

More specifically, a pressure regulating valve (not shown) is provided in the connecting pipe 41, and the pressure due to the discharge hydraulic pressure is slightly larger than the pressure due to the rising liquid flow by the pressure regulating valve. The pressure is adjusted so as to be adjusted.

The processing liquid discharged from each of the discharge holes (31) of the processing liquid discharge box 30 forms a part of the raised processing liquid Qu, and is circulated and supplied into the processing tank 10 through the supply pipe 26. The pushing-up force due to the rising liquid flow can be reduced by reducing the amount of the processing liquid. Therefore, the decrease in contact pressure between the IC lead frame W and each roller 2 can be further suppressed, and smoother transport can be achieved. Further, even if the circulation pump 28 is used as a driving source of the liquid supply means 40, it is not necessary to particularly increase the capacity.

Next, the operation of this embodiment will be described.
The IC lead frame W is transported on the rollers 2 of the roller conveyor 1 toward the processing tank 10. When the IC lead frame W enters the tank and is transported in the processing liquid Qu, the IC lead frame W is pushed up by the rising liquid flow in the processing tank 10, and
The processing liquid discharged from the discharge hole (31) of the processing liquid discharge box 30 is pressed against the roller conveyor 1 by the liquid pressure.

At this time, since the pressing force due to the discharge liquid pressure is adjusted to be slightly larger than the lifting force due to the rising liquid flow, it is possible to prevent the contact pressure between the IC lead frame W and each roller 2 from decreasing. It can be transported smoothly. Also,
Even if the urging force of each roller 2 becomes non-uniform due to irregularities in the rising liquid flow, etc., the discharge processing liquid is
Since there is no mechanical frictional engagement with the lead frame W, the free displacement of the IC lead frame W in the planar direction is not restricted. Therefore, even if the IC lead frame W is extremely thin and has low rigidity, it is not deformed or damaged.

Since the processing liquid discharged from the processing liquid discharge box 30 forms a part of the raised processing liquid Qu, the surface of the IC lead frame W can be processed more smoothly and reliably.

According to this embodiment, the processing liquid discharge box 30 and the liquid supply means 40 for supplying the processing liquid to the box 30 under pressure are provided. A processing liquid is discharged from the discharge hole (31) of the box 30 toward the IC lead frame W passing through the processing liquid Qu, and the frame W is pressed against the roller conveyor 1 by the discharge liquid pressure. Therefore, even if the IC lead frame W is extremely thin and has a low rigidity, the IC lead frame W can be smoothly transported and surface-treated without being deformed or damaged.

The processing liquid discharged from the processing liquid discharge box 30 forms a part of the swelling processing liquid Qu. Therefore, the amount of the processing liquid circulated to the processing tank 10 is reduced, and the processing liquid is pushed up by the upstream liquid flow. Power can be reduced. Therefore, the decrease in the contact pressure between the IC lead frame W and each of the rollers 2 can be more effectively suppressed, and the conveyance can be further stabilized. Further, it is not necessary to increase the capacity of the circulation pump 28 as a driving source of the liquid supply means 40.

Further, since each of the discharge holes (31) of the processing liquid discharge box 30 is formed in a slit shape and is formed at a predetermined pitch in the IC lead frame transport direction, the swelling processing liquid Q is formed.
The entire surface of the IC lead frame W in u can be pressed against the roller conveyor 1 with a uniform force. Therefore, the ultra-thin and weakly rigid IC lead frame W can be transported more smoothly while preventing deformation and the like.

The pressure of the liquid discharged from each of the discharge holes (31) of the processing liquid discharge box 30 is minimized within a pressure range which can prevent the transfer failure of the IC lead frame W passing through the processing liquid Qu. As a result, the IC lead frame W is not deformed by the discharge liquid pressure.

Further, the entire surface of the IC lead frame W can be pressed against the roller conveyor 1 with a uniform force by the processing liquid discharged from each of the discharge holes (31) of the processing liquid discharge box 30. The contact pressure therebetween can be made as uniform as possible, and the generation of a planar force can be suppressed. Therefore, the IC lead frame W can be accurately transported in the transport direction.

Further, since the liquid supply means 40 is constructed by positively utilizing the liquid circulation device 25, the size of the device can be reduced.
Cost can be reduced.

In the above embodiment, each discharge hole of the processing liquid discharge box 30 is formed in a slit shape. However, the IC lead frame W passing through the swelling processing liquid Qu is discharged to the roller conveyor 1 side by the discharge liquid pressure. Any structure can be used as long as the decrease in the contact pressure between the two can be compensated for by the rising liquid flow by pressing. For example, each discharge hole of the processing liquid discharge box 30 may be formed by a circular hole provided at a predetermined pitch in the left-right direction in FIG. 1 and the direction perpendicular to the paper surface in FIG.

Although the roller conveyor 1 is used as the conveyor, another conveyor (belt conveyor, net conveyor, etc.) may be used.

[0037]

According to the present invention, a processing liquid discharge box and a liquid supply means for supplying a processing liquid to the processing liquid discharge box by pressurizing the processing liquid are provided, and an IC lead which passes through the raised processing liquid on the processing tank is provided. Since the processing liquid is discharged from the discharge holes of the box toward the frame and the frame is pressed against the conveyor with the discharge liquid pressure, even if the IC lead frame is extremely thin and weak, it may be deformed or damaged. The swelling can be carried smoothly through the processing solution without adding a mark.

[Brief description of the drawings]

FIG. 1 is a diagram for explaining a main part of an embodiment of the present invention.

FIG. 2 is a perspective view for explaining a positional relationship between a processing liquid discharge box and a processing tank.

FIG. 3 is a diagram showing a configuration of a conventional IC lead frame surface treatment apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Roller conveyor (conveyor) 10 Processing tank 30 Processing liquid discharge box 31 Slit (discharge hole) 40 Liquid supply means

Continuing on the front page (72) Inventor Noriyuki Yuguchi 1-1-1, Ichigaya-Kaga-cho, Shinjuku-ku, Tokyo Inside Dai Nippon Printing Co., Ltd. (72) Inventor Takuya Hayashi 1-1-1-1, Ichigaga-cho, Shinjuku-ku, Tokyo Inside Dai Nippon Printing Co., Ltd. (72) Inventor Teruo Omori 3-6-1 Hirao, Inagi-shi, Tokyo Inside Mitomo Engineering Co., Ltd. (72) Inventor Shogo Kurachi 3-6-1 Hirao, Inagi-shi, Tokyo Mitomo En Inside Engineering Co., Ltd. (72) Inventor Tetsuo Matsushita 3-6-1 Hirao, Inagi-shi, Tokyo Inside Mitomo Engineering Co., Ltd. (56) References JP-A-58-125857 (JP, A) JP-A-2- 73658 (JP, A) JP-A-6-283643 (JP, A) JP-A-6-295969 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) H01L 23/50 C25D 17 / 00,17 / 06 H01L 21/50

Claims (1)

(57) [Claims] 1. A conveyer using a conveyor in a raised processing liquid formed above an overflow type processing tank.
C surface treatment while passing through a lead frame
In a surface treatment apparatus for a C lead frame, a processing liquid discharge box having a plurality of discharge holes on a lower surface disposed above the processing tank and at a position where a raised processing liquid is formed; And a liquid supply means for supplying the processing liquid under pressure. The processing liquid is discharged from each discharge hole of the processing liquid discharge box toward the IC lead frame passing through the rising processing liquid to discharge the IC lead frame. A surface treatment apparatus for an IC lead frame, wherein the apparatus is configured to press against the conveyor side with pressure.