JP2822726B2 - Combustion pressure sensor with built-in amplifier - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a combustion pressure sensor with a built-in amplifier and, more particularly, to a combustion pressure sensor with a built-in amplifier that can improve assembling workability.

[0002]

2. Description of the Related Art A conventional combustion pressure sensor with a built-in amplifier is disclosed, for example, in Japanese Utility Model Laid-Open No. 63-73648. In the combustion pressure sensor with a built-in amplifier disclosed in this publication, a piezoelectric element serving as a pressure detecting unit is provided at one end of a cylindrical sensor main body, and a circuit board that amplifies an input signal from the piezoelectric element has a substrate surface. Is provided in the sensor main body in a direction that is the same as the axial direction of the sensor main body. A lead wire from the piezoelectric element is disposed along the axial direction of the sensor body from one end of the sensor body toward the circuit board, and is connected to one end of the circuit board provided along the axial direction. ing. An output lead wire is connected to the other end of the circuit board opposite to the piezoelectric element.

[0003]

As a method of assembling the above-mentioned conventional combustion pressure sensor with a built-in amplifier, a sensor body on which a piezoelectric element and a lead wire from the piezoelectric element are disposed and a periphery of a circuit board are covered. A method of separately providing a cover, connecting a lead wire from a piezoelectric element and an output lead wire to the circuit board, and then attaching the cover covering the circuit board to the sensor body. Alternatively, the sensor main body and the cover are formed integrally, and a lead wire from the piezoelectric element is drawn out of the cover covering the periphery of the circuit board, and a lead wire from the piezoelectric element and an output lead wire are drawn. One of the assembling methods of connecting the circuit board to both ends of the circuit board, and then installing the circuit board in the cover while accommodating the lead wire from the piezoelectric element drawn out in the cover. In the former assembling method, the work of storing and fixing the circuit board in a state where the lead wires are already connected in the cover is troublesome, and in the latter assembling method, it is difficult to accommodate the lead wires to be stored. Care must be taken in housing the lead wires in order to avoid contact with and damage to components on the circuit board. As described above, the assembling workability of the conventional built-in amplifier type combustion pressure sensor is poor.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a combustion pressure sensor with a built-in amplifier that has improved assembling workability.

[0005]

In order to achieve the above object, the present invention provides a pressure detecting section for detecting a combustion pressure at one end of a cylindrical housing, and a lead wire from the pressure detecting section is provided. An opening provided at the other end of the housing and disposed in the housing along the axial direction of the housing and connected to the lead wire for processing a pressure signal from the pressure detection unit; It is configured to be mounted in the housing by mounting from the part , and,
The amplifier substrate is provided such that the substrate surface thereof is oriented in a direction orthogonal to the axial direction of the housing, and the lead wire penetrates the amplifier substrate, and the substrate surface of the amplifier substrate on the opposite side to the pressure detection unit. Connected to the amplifier board at
Combustion pressure sensor with a built-in amplifier
And disposed between the housing and the amplifier board.
The position of the amplifier board for positioning the amplifier board
Before the guide part is guided to a position penetrating the amplifier board.
Both the lead wire positioning part for positioning the lead wire
Characterized by providing a formed spacer
It is.

[0006]

In the present invention, the lead wire from the pressure detecting section penetrates the amplifier board provided in a direction orthogonal to the axial direction of the housing, and the amplifier board is mounted on the board surface of the amplifier board opposite to the pressure detecting section. Depending on the configuration connected to
The work of connecting the lead wires to the amplifier board can be performed from the side opposite to the pressure detecting unit, that is, from the opening provided for mounting the amplifier board. For this reason, after mounting the amplifier board on the housing, the amplifier board and the lead wire can be connected, and the work of attaching the amplifier board to the housing and the work of connecting the lead wire to the amplifier board become easy. In addition, amplifier board positioning to position the amplifier board
And the lead wire to a position where it penetrates the amplifier board.
The lead wire positioning part for positioning is formed together
Spacer is provided between the housing and the amplifier board.
The positioning of the amplifier board by the spacer
And positioning of the lead wire together. Therefore,
The relative movement between the lead wire and the amplifier board.
Before connecting the lead wire to the amplifier board.
In, the positioning accuracy of both was maintained high
The workability of assembly can be improved
After connecting the wires to the amplifier board,
Durability by preventing stress from being generated at the connection with the board
Can be improved.

[0007]

FIG. 1 is a sectional view showing the construction of an embodiment of a combustion pressure sensor with a built-in amplifier according to the present invention.

In the figure, reference numeral 2 denotes a semiconductor element corresponding to the pressure detecting section for outputting a voltage signal corresponding to pressure by a piezoresistance effect, and 3 denotes a lead wire connected to the semiconductor element 2. An element assembly 4 is constituted by the semiconductor element 2, the lead wire 3, and other assembled parts. The cylindrical housing 5 is a main body of the combustion pressure sensor 1 with a built-in amplifier of this embodiment, and is made of stainless steel (SU).
S430), and includes a small diameter portion 5a and a large diameter portion 5b. The element assembly 4 is a small diameter portion 5a of the housing 5.
Of the press-fitted to the tip portion, is provided by disposing the lead wire 3 to the small-diameter portion 5a axial (X ₁ -X ₂ direction) formed along been extending hole 5f of. Further, a screw portion 5c for screwing to a cylinder head of an engine (not shown) is formed on the outer peripheral portion of the small diameter portion 5a. A spacer 6 through which the lead wire 3 is inserted is provided at a joining portion between the extending hole 5f of the small diameter portion 5a and the space portion 5g formed in the large diameter portion 5b.
Is fitted.

FIGS. 2A and 2B are a sectional view and a front view of the spacer 6, respectively. FIG. 2A is the same as FIG.
It is sectional drawing which follows the IIa-IIa line. The spacer 6 is formed of resin (nylon), and includes a small-diameter portion 6a fitted in the extension hole 5f of the housing 5 and a large-diameter portion 6b fitted in the space 5g of the large-diameter portion 5b. Become. Small diameter part 6
a is formed with four insertion holes 6c through which the lead wires 3 are inserted, and the large-diameter portion 6b is provided with an outlet of the insertion hole 6c at one end and four groove portions 6d extending in the outer peripheral direction. Are formed. Further, a substantially rectangular concave portion 6e in which a cover 7 described later is fitted and a substantially circular concave portion 6f in which the amplifier board 10 is fitted are formed on the large diameter portion 6b so as to overlap each other.

FIGS. 3A and 3B are a side view and a front view of the cover 7, respectively. The cover 7 is formed of resin (nylon) similarly to the spacer 6, and has a substantially rectangular shape so as to be fitted in the recess 6e. In the end portion of the cover 7, at a position corresponding to the groove 6 d when the cover 7 is fitted in the recess 6 e, the cover 7 protrudes from the one flat portion 7 b as shown in FIG. As shown in (B), a protruding portion 7a protruding outward from an end portion forming a substantially rectangular shape is provided.

In FIG. 1, a lead wire 3 is
It is inserted directly into the insertion hole 6c, and
It is bent at a corner and wired along the groove 6d. And
The other end of the groove 6d is bent again and the cover 7
X again along the projection 7a of _TwoWired in the direction. Lee
The wire 3 is arranged along a groove 6d perpendicular to the axial direction.
The linearly extending vertical portion 3a reduces thermal stress due to thermal expansion.
The occurrence is prevented.

The spacer 6 is provided with a protrusion 6g at a position facing the housing 5, so that even when a difference in expansion and contraction occurs between components in the axial direction of the sensor due to heat, the protrusion 6g crushes the generated stress. This can be alleviated. Instead of providing the projection 6g on the spacer 6, a wave washer or rubber washer having higher flexibility than the resin can be provided in this portion.

The amplifier board 10 is a ceramic multilayer board called HIC (hybrid IC), and is fitted in the recess 6 f of the spacer 6. FIG. 4 shows the amplifier board 10.
Through 1 shows a front view looking toward the X ₁ direction. In FIG. 1, an amplifier substrate 10 is a substrate surface 1 of a multilayer substrate body 11.
Four taper bushes 12 and three output pins 13 are fixed to 1a by brazing, and a plurality of resistors 14 and one capacitor 15 are fixed by soldering. Arrangement positions of the four tapered bushing 12, the position of the protruding portion 7a of the cover 7, i.e. four from the outer peripheral side end portion of the groove portion 6d is bent at a right angle extending in the X ₂ direction of the lead wire 3 And the same position. Further, the substrate body 1
1 is a concave portion 6 having straight ends 11b and 11c formed in upper and lower portions.
f is the same as the shape of the straight end 11
The amplifier board 10 is positioned in the recess 6f by b and 11c. That is, the concave portion 6f is
It functions as an amplifier board positioning part for positioning.

Since the amplifier board 10 is mounted in a direction orthogonal to the axial direction of the housing 5 as shown in FIG. 1, the combustion pressure sensor 1 with a built-in amplifier is smaller in the axial direction than the conventional configuration. Is planned. The size of the amplifier substrate 10 is smaller than that of the conventional one by using the ceramic multilayer substrate as described above.

FIG. 5 shows the lead wire 3 and the tapered bush 1 described above.
FIG. 3 is a diagram illustrating a connection with the output pin 13 and a connection between an output pin 13 and an output lead wire 21 described later. As shown in the figure, an insertion hole 11d for the lead wire 3 having a diameter slightly larger than that of the lead wire 3 is formed in the portion of the substrate body 11 where the tapered bush 12 is provided. Taper bush 1
Reference numeral 2 includes a tapered portion 12a and a cylindrical portion 12b, and the bottom surface of the tapered portion 12a finished perpendicular to the axial direction is brazed to the substrate surface 11a of the substrate main body 11. The inner diameter of the cylindrical portion 12b is regulated to be substantially the same as the outer diameter of the lead wire 3 with a slight gap so that the lead wire 3 can be inserted smoothly.

The lead wire 3 is inserted into the insertion hole 11d of the substrate body 11.
And the tapered bush 12 is inserted toward the X ₂ direction, while being slightly protruding ends of the lead wire 3 from the end portion of the cylindrical portion 12b, lead by irradiating a laser to the end of the lead wire 3 3 is welded (laser-bonded) to the end of the cylindrical portion 12b.

According to the configuration of the tapered bush 12,
The contact area between the tapered portion 12a and the substrate main body 11 can be widened, and the bonding strength between the substrate main body 11 and the tapered bush 12 can be increased. The lead wire 3 which is narrowed down by the tapered portion 12a and is irradiated with a laser beam
In this case, the positional accuracy of the end portion, that is, the joining positional accuracy is improved, and the outer diameter of the lead wire 3 and the inner diameter of the cylindrical portion 12b are substantially the same, and the degree of adhesion between the lead wire 3 and the cylindrical portion 12b is good. In addition, the joining property of the lead wire 3 and the taper bush 12 by laser joining can be improved. Taper part 1
Since the lead wire 3 is easily guided to the cylindrical portion 12b having a small diameter by 2a, the above effect can be obtained by a simple operation of inserting the lead wire 3. According to the effects (1) to (4), the bonding property between the lead wire 3 and the amplifier substrate 10 can be improved by a simple bonding operation.

The brazing of the taper bush 12 and the output pins 13 to the substrate body 11 is generally performed at 700 to 1000 ° C.
Therefore, the bonding strength is sufficient for the ambient temperature of about 150 ° C. in this part, and the taper bush 12 and the output pin 13 are not removed from the substrate body 11 due to the heat in this part.

In FIGS. 1 and 5, the output pin 13 is an amplifier.
A terminal for outputting an output signal of the substrate 10 to the outside.
Between the capacitor penetrating portion 13a and the connection pin portion 13b.
Become. 22 is a 4-2 alloy (iron, nickel alloy)
And X of the housing 5 _TwoOpening 5 at direction end
e and shielded together with the housing 5
It is a plate that constitutes the structure. This plate 22
The end of the large diameter portion 5b of the housing 5 is
It is arranged with a slight gap between it and the large diameter portion 5b
The caulking portion 5d is caulked inward and fixed to the housing 5.
ing. Therefore, the capacitor penetrating portion 13 of the output pin 13
In the portion where "a" penetrates the plate 22, noise is removed.
Is provided with an annular feedthrough capacitor 23.
The feedthrough capacitor 23, the plate 22, and the feedthrough capacitor
The capacitor 23 and the output pin 13 are electrically connected by soldering.
It is connected to the.

The output lead wire 21 is connected to the vertical extension 3
Similarly to the above, the tapered bush 12 has a vertically extending portion 21a for stress relaxation, which extends perpendicularly to the axial direction by two right-angle bent portions. Are provided respectively. The three output lead wires 21 corresponding to the three output pins 13 are arranged and supported by the support member 25 shown in FIG. 1 such that the position of the tapered bush 24 matches the position of the output pin 13. I have. This taper bush 24
The connection pin portion 13b of the output pin 13 is relatively inserted through the connection pin portion 13b similarly to the connection of the lead wire 3.
The tip of b is irradiated with a laser, and the connection pin 13 b is laser-joined to the tapered bush 24. The output lead wires 21 are connected to three connector terminals 26 constituting one of the connectors in the support member 25, respectively.

In FIG. 1, reference numeral 30 denotes a connector portion of the combustion pressure sensor 1 with a built-in amplifier. The taper bush 24 is joined to a predetermined output pin 13 to set the connector terminal 26 at a predetermined position. 1 is formed in a predetermined shape.

Next, a method of assembling the combustion pressure sensor 1 with a built-in amplifier according to the present embodiment will be described. 6 to 10 are diagrams for explaining a method of assembling the combustion pressure sensor 1 with a built-in amplifier. FIGS. 7 to 9 show the spacer 6 and the cover 7 in FIG.
In the drawing, a cross-section along the line VII-VII is shown.

[0023] First, insert the X ₁ direction side end portion of the lead wire 3 extending in a linear element assembly 4 in the extending hole 5f provided in the small diameter portion 5a of the housing 5. Then, by press-fitting toward the portion where the semiconductor element 2 of the element assembly 4 is provided in the X ₂ direction to the tip portion of the small-diameter portion 5a, the element assembly 4, as shown in FIG. 6
Is fixed to the housing 5.

[0024] The next spacer 6 small-diameter section 6a is X ₁ direction,
And the direction the large-diameter portion 6b is X ₂ direction, the opening 5e provided on the X ₂ direction side end portion of the housing 5, in four leads 3 (FIG insertion hole 6c of the small-diameter portion 6a, Only two are shown). Then, move the spacer 6 in the X ₁ direction, by fitting the small diameter portion 6a in the extending hole 5f, mounting the spacer 6 to a predetermined position shown in FIG.

Next, as shown in FIG. 8, at the connecting portion between the insertion hole 6c of the spacer 6 and the groove 6d, X ₂
The lead wires 3 extending in the direction side are bent in the extending direction (outer peripheral direction) of the groove 6d, and each of the four lead wires 3 is expanded.

Next, the cover 7 is moved in the direction of X
_The directions are _two directions, and the directions are fitted into the recesses 6e of the spacer 6. Then, the fitted cover 7 and push it towards the cover 7, which is a predetermined direction from the opening portion 5e in the X ₁ direction in the recess 6e. Here, cover 7 is X ₁
In the process of pushing in the direction, the protruding portion 7a of the cover 7 comes into contact with the lead wire 3 preliminarily expanded by the process described with reference to FIG. When the advancing movement of the X ₁ direction of the cover 7, with bending of the lead wire 3 at the connecting part of the insertion hole 6c and the groove 6d is further bent in a direction toward a right angle, the outer periphery of the groove 6d The lead wire 3 is sandwiched between the end of the groove 6d and the protrusion 7a. Then, at the stage where the fitting of the cover 7 into the concave portion 6e is completed, as shown in FIG. 9, the lead wire 3 is bent at a right angle at the outer peripheral end of the connecting portion and the groove 6d, respectively. The vertical extending portion 3a is formed between the bent portions.

Further, in the step of fitted into the concave portion 6e of the cover 7 is completed, the groove 6d 4 lead wires 3 arranged respectively in extending been bent at a right angle at the outer side end portion in the X ₂ direction Is the tapered bush 12 on the amplifier board 10.
The arrangement is the same as the arrangement. That is, the pitch A between the two lead wires 3 shown in FIG.
The position of the end of the groove 6d and the position of the protruding portion 7a are determined in advance so as to be equal to the pitch between the tapered bushes 12 through which the taper bush 12 is inserted. Therefore, the groove 6d connects the lead wire 3 to the amplifier.
Lead for positioning so as to lead to a position penetrating substrate 10
Functions as a line positioning unit. Further, the dimension B in the axial direction of the lead wire 3 is a length dimension that is optimal when the lead wire 3 is laser-bonded to the tapered bush 12 in the next step. That is, the length of the lead wire 3 at the stage of the element assembly 4 alone is determined so that the lead wire 3 has an optimum length B when the lead wire 3 is formed as shown in FIG.

Thus, as shown in FIG.
9 and press the cover 7 into the predetermined position from the opening 5e as described above with reference to FIG.
Can be formed in accordance with the next step.

Next, the amplifier board 10 is connected to the taper bush 12.
There is a direction which becomes X ₂ direction, also the direction that fitted in the recess 6f of the spacer 6. Then, allowed to move the amplifier board 10 having a predetermined orientation from the opening portion 5e in the X ₁ direction. In the course of movement to the X ₁ direction, inserting the lead wire 3 into a predetermined insertion hole 11d and the tapered bush 12 of the amplifier board 10. At the stage when the fitting of the amplifier board 10 into the recess 6f is completed, as shown in FIG.
0 is mounted in a direction orthogonal to the axial direction, and the tip of the lead wire 3 penetrating the amplifier board 10 protrudes from the end of the tapered bush 12. Then, the distal end of the lead wire 3 was the projected (in the figure, indicated by an arrow C) the laser toward the X ₁ direction from the X ₂ direction side through the opening 5e of the lead wires 3 of the portion protruding by irradiating Taper bush 12
, Ie, laser welding.

As described above, the lead wire 3 from the piezoelectric element 2 is inserted through the amplifier substrate 10 so that the piezoelectric element 2 of the amplifier substrate 10
Is connected to the amplifier substrate 10 on the opposite side, that is, the opening 5e side, so that the connection work between the amplifier substrate 10 and the lead wire 3 is performed from the opening 5e side after the amplifier substrate 10 is mounted on the housing 5. This facilitates the work of attaching the amplifier board 10 to the housing 5 and the work of connecting the leads 3 to the amplifier board 10.

Further, by using a laser junction which is particularly advantageous for a connection operation in a narrow portion, the connection operation between the lead wire 3 and the amplifier substrate 10 is simplified, and the reliability of the electrical connection is improved. .

[0032] Then the plate 22 in moved in the X ₁ direction from Similarly openings 5e to a predetermined position, and attaching the caulking portion 5d in the housing 5 and the plate 22 by caulking. Then, the feedthrough capacitor 23 and the output pin 13 are soldered. This soldering operation is also performed from the opening 5e.

Next, of the pre-assembled assembly of the output lead wire 21, the tapered bush 24, the support member 25, and the connector terminal 26, the tapered bush 24 is connected to the connection pin of the output pin 13 as shown in FIG. inserted into section 13b, performs laser bonding of the laser bonding and the X ₂ is irradiated with a laser from the direction the output pin 13 at the tip portion of the same connecting pin part 13b and the output lead 21 of the lead wire 3.

Finally, after the connector terminal 26 of the assembly is set at a predetermined position, the connector portion 30 is formed into a predetermined shape shown in FIG. 1 by insert molding.

As described above, according to the method of assembling the combustion pressure sensor 1 with a built-in amplifier according to the present embodiment, the element assembly 4
All the assembled parts after the mounting can be mounted in order from the opening 5e of the housing 5, and the lead wires 3 from the semiconductor element 2 are inserted through the amplifier
The laser bonding to the amplifier substrate 10 is performed on the side of the opening 5e. The connection of the output lead wire 21 to the amplifier substrate 10 is also performed by laser bonding from the opening 5e. As described above, the combustion pressure sensor 1 with a built-in amplifier according to the present embodiment allows one-way assembly from left to right in FIG. 1, and furthermore, works for connecting the lead wire 3 and the output lead wire 21 to the amplifier board 10. Is simplified by laser joining from the opening 5e side, so that the assembling workability of the sensor 1 is remarkably improved as compared with the related art. A recess 6f for positioning the amplifier board 10;
Lead wire 3 is led to a position penetrating amplifier substrate 10
The positioning groove 6 d and the spacer 6 are both provided on the spacer 6.
Spacer 6 is provided between housing 5 and amplifier board 10.
As a result, the spacer 6 places the amplifier substrate 10
The positioning and the positioning of the lead wire 3 can be performed together.
Wear. Therefore, the lead wire 3 and the amplifier base are
Relative movement can be prevented from occurring with the plate 10 and
Before the connection of the lead wire 3 and the amplifier board 10,
Assembling because the positioning accuracy of 10 is maintained high
Workability can be improved. Also, lead 3
After the connection of the amplifier substrate 10, the lead wire 3 and the
Stress can be prevented from being generated at the connection portion with the
The durability can be improved.

In the combustion pressure sensor 1 with a built-in amplifier according to the present embodiment, the insertion hole 11d is provided in the amplifier substrate 10, and the lead wire 3 from the semiconductor element 2 is connected on the opposite side of the amplifier substrate 10 from the piezoelectric element 2. The configuration of the amplifier substrate 10
Can be arranged orthogonally to the axial direction of the combustion pressure sensor 1 with a built-in amplifier, and the size of the substrate itself is reduced by using a ceramic multilayer substrate. The compact combustion pressure sensor 1 is downsized compared to the prior art.

Further, the amplifier board 10 for the leads 3 and 22
Since the laser connection was used instead of the solder connection for the connection to the semiconductor device, the reliability of the electrical connection under high temperature and vibration was improved.

[0038]

As described above, according to the present invention, the operation of connecting the lead wires to the amplifier board is performed from the opening provided for mounting the amplifier board after the amplifier board is mounted on the housing. Accordingly, the work of attaching the amplifier board to the housing and the work of connecting the lead wires to the amplifier board become easy, and the workability of assembling the combustion pressure sensor with a built-in amplifier can be improved as compared with the related art. Also,
Since the amplifier board is provided in a direction orthogonal to the axial direction of the housing, the combustion pressure sensor with a built-in amplifier can be downsized in the axial direction. In addition, the same member
Positioning of the amplifier substrate with spacers and lead wires
Positioning is performed together.
Between the lead wire and the amplifier board.
Before connecting the lead wire and the amplifier board.
Assembly work because the positioning accuracy of the
Performance, and lead wires and amplifier board
After the connection, connect the lead wire to the amplifier board.
Stress can be prevented and durability can be improved.
Can be.

[Brief description of the drawings]

FIG. 1 is a sectional view showing the configuration of an embodiment of a combustion pressure sensor with a built-in amplifier according to the present invention.

FIG. 2 is a configuration diagram of a spacer shown in FIG.

FIG. 3 is a configuration diagram of a cover shown in FIG. 1;

[4] In FIG. 1 the amplifier board is a front view looking toward the X ₁ direction.

FIG. 5 is a view for explaining a connection between a lead wire from a semiconductor element and a tapered bush, and a connection between an output pin and an output lead wire.

6 is a diagram illustrating a method of assembling the combustion pressure sensor with a built-in amplifier shown in FIG.

7 is a diagram illustrating a method of assembling the combustion pressure sensor with a built-in amplifier shown in FIG.

8 is a diagram illustrating a method of assembling the combustion pressure sensor with a built-in amplifier shown in FIG.

9 is a diagram illustrating a method of assembling the combustion pressure sensor with a built-in amplifier shown in FIG.

10 is a diagram illustrating a method of assembling the combustion pressure sensor with a built-in amplifier shown in FIG.

[Description of Signs] 1 Combustion pressure sensor with built-in amplifier 2 Semiconductor element 3 Lead wire 3a, 21a Vertically extending portion 4 Element assembly 5 Housing 5e Opening 6 Spacer 6c, 11d Insertion hole 6d Groove 6g Projection 7 Cover 10 Amplifier substrate 11 Board body 12, 24 Taper bush 13 Output pin 21 Output lead wire 22 Plate 23 Feed-through capacitor 25 Support member 26 Connector terminal 30 Connector part

Claims (1)

(57) [Claims] 1. A pressure detecting section for detecting a combustion pressure is provided at one end of a cylindrical housing, and a lead wire from the pressure detecting section is disposed in the housing along an axial direction of the housing. together, it is configured to the lead wire is provided in the housing an amplifier board for processing the pressure signals by mounting the opening portion provided in the other end portion of said housing from said pressure detection unit is connected cage, and provided to the amplifier board whose substrate surface becomes the direction perpendicular to the axial direction of the housing, the lead wire is opposite to the pressure sensing portion of the amplifier board through the amplifier board the amplifier board in the substrate surface on the side
Built-in amplifier combustion pressure sensor configured to be connected
And disposed between the housing and the amplifier board.
The positioning of the amplifier substrate
And the rib so as to be guided to a position penetrating the amplifier board.
Formed together with the lead wire positioning part that positions the lead wire
A combustion pressure sensor with a built-in amplifier, comprising a spacer formed .