JP2811278B2 - Power semiconductor module - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power semiconductor module in which one or more power semiconductor chips are mounted on a metal substrate and sealed with a resin.

[0002]

2. Description of the Related Art Conventionally, as a power semiconductor module,
For example, Japanese Utility Model Publication No. Sho 62-9740 is known. That is, a thermally conductive insulating plate having a copper circuit on one surface is bonded on a metal substrate, and a power semiconductor chip is mounted on the copper circuit of the insulating plate. The electrode on the semiconductor chip is connected to a copper circuit or a lead conductor by an aluminum wire, and the lead conductor is fixed on the copper circuit, and the part not fixed is bent and stands upright with respect to the substrate. A synthetic resin frame surrounding the periphery is bonded onto the metal substrate, and a resin for protecting the semiconductor chip and the aluminum wires is injected.

The power semiconductor module formed as described above is as shown in FIG. That is,
A plurality of lead conductors 2 are drawn out from the power semiconductor module main body 1 in which a semiconductor chip is sealed by injecting a resin into a metal substrate and a frame. An insertion port 13a through which the plurality of lead conductors 2 can pass, and this insertion port 1
A cover 13 provided with a nut 13b embedded near 3a is put on the main body 1. Thereafter, the lead conductor 2 is bent, a screw (not shown) is inserted into a hole 2a provided in the conductor 2, and fixed to a nut 13b to form a terminal for connection to an external conductor of the power semiconductor module.

[0004]

In such a conventional power semiconductor module, when the number of the lead conductors 2 increases, the lead conductors 2 are inserted into the insertion holes 13a of the lid 13.
It became difficult to insert it into the device, resulting in poor workability. Also, the position of the lead conductor may change,
When the number of the lead conductors increases or decreases, the lids are redesigned, and a mold for the lid body to be applied to each is required, which causes a problem that the module becomes expensive.

[0005]

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has a power semiconductor chip mounted on a metal substrate, and a plurality of drawers connected to the power semiconductor chip. has a conductor, a body Ru was sealed with a resin a power semiconductor chip, Germany inserted into each conductive lead
And it is constituted by a lid body of standing the number multiple.

[0006]

According to the present invention, a plurality of independent lids are formed by being inserted into each of the lead conductors, placed on the main body, placed on the main body, and then the lead conductors are bent to form terminals for connection with external conductors.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to FIGS. Reference numeral 1 denotes a power semiconductor module main body in which a resin is injected into a metal substrate and a frame to seal an internal semiconductor chip, as in FIG. 2 is the body 1
Are a plurality of extraction conductors extracted from the plurality of extraction conductors. Reference numeral 3 denotes a lid having an insertion port 3a that can pass through one lead conductor, and a nut 3b embedded near the insertion port 3a.

[0008] Then insert each lid 3 to each lead-out conductor 2
Te was placed in the body 1, bending the after loading drawer conductor 2, by inserting screws (not shown) into a hole provided in the conductor 2, is fixed to the nut 3b, and the connection terminals of the module external conductor Form.

As a result, each of the independent lids can be reliably inserted into the lead conductor, and the workability is improved.

In the embodiment shown in FIG. 1, the lead conductor 2 is drawn out from the vicinity of the same wall surface of the frame body. However, as shown in FIG. The direction of each lid 3 may be changed and each lid 3 may be inserted into the lead conductor 2.

When the number of lead conductors 2 increases or decreases as shown in FIG. 3, the number of lids 3 may be adjusted according to the number of lead conductors.

Incidentally, depending on the type of the semiconductor module,
When the size of the lead conductor is changed, an independent lid corresponding to the size may be held. Further, in the above embodiment, the frame is adhered to the metal substrate, the resin is injected into the frame, and the semiconductor chip is sealed with the metal substrate. The present invention can also be applied to a device in which a semiconductor chip is sealed by injecting a resin between molds, and thereafter, a semiconductor module is formed except for a mold.

[0013]

As described above, according to the semiconductor module of the present invention, the lid having the insertion hole through which the lead-out conductor can be penetrated and the nut is formed as independent structures.
It can respond regardless of the position and number of the lead conductors,
The semiconductor module can be manufactured at low cost while expanding the application of the design. Further, since the lids can be individually inserted into the lead conductors, workability is improved.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of an embodiment of a power semiconductor module according to the present invention.

FIG. 2 is an exploded perspective view of another embodiment of the power semiconductor module of the present invention.

FIG. 3 is an exploded perspective view of another embodiment of the power semiconductor module of the present invention.

FIG. 4 is an exploded perspective view of a conventional power semiconductor module.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Main body 2 Lead conductor 3 Lid 3a Insertion opening 3b Nut

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁶ , DB name) H01L 25/00-25/18 H01L 23/28-23/31 H01L 23/48-23/498

Claims (1)

(57) [Claims] 1. A mounting a power semiconductor chip to a metal substrate, a plurality of lead and <br/> conductor connected to the semiconductor chip for the power, the semiconductor chip for the power, sealed with resin Main body and independent
A power semiconductor module, which is composed of a lid body of several.