JP2807672B2 - Plasma display device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display device, and more particularly, to a plasma display panel (hereinafter, sometimes referred to as a PDP) in a case thereof.
Called. The present invention relates to a heat dissipation structure of a chassis member supporting a substrate.

[0002]

2. Description of the Related Art In recent years, PDPs are being put to practical use as thin, lightweight display devices with a large screen. This PD
In P, in a PDP substrate having a front glass substrate and a rear glass substrate bonded together, a discharge gas is sealed in a minute gap between the two glass substrates, and ultraviolet light generated by discharge in the discharge gas is applied to the rear glass substrate. Irradiate the phosphor to emit light. Therefore, the temperature of the PDP substrate becomes considerably high by repeatedly performing the discharge over the entire surface.

A PDP usually has a chassis member. The chassis member supports the PDP substrate on the front surface and a plurality of circuit boards for driving and controlling the light emission display of the PDP substrate on the rear surface. However, the driving voltage for causing the discharge is high. Therefore, a considerable amount of heat is generated from the circuit board. Therefore, in the plasma display device, how to cool against heat generated from the PDP substrate and the circuit substrate has been a major problem.

[0004] To address this problem, PDPs have been
A plurality of small exhaust fans are provided inside the upper part of the case that accommodates boards and chassis members, etc., and the heated air in the case is exhausted to the outside through the ventilation holes by these fans, so that the outside air at room temperature can be removed. A structure was adopted in which suction was performed and forced cooling was performed.

[0005]

However, in the forced cooling structure as described above, in addition to the problem of noise and failure of the exhaust fan, there is also a problem that dust is sucked into the case together with the outside air and the inside becomes dirty. Was.

Further, in the case of the plasma display device, there are a large number of 30 to 40 film-like wirings for electrically connecting the electrodes at the edge of the PDP substrate and the circuit board. Each film-shaped wiring has a width of about 50 to 100 mm, and is arranged adjacent to each other with a slight gap. Therefore, each film-like wiring that has a large curved shape in the free space exists so as to block the air flow path in the case, and as a result, the flow of the heated air in the case is obstructed. There was a problem that the cooling efficiency in the case was reduced.

[0007]

In order to solve the above-mentioned problems, the plasma display device of the present invention includes a chassis member having a front surface on which a plasma display panel substrate is supported in a case, and a rear surface of the chassis member. In addition to the heat dissipating fins, the heat dissipating fins located in the upper region of the chassis member are formed so as to have higher heat dissipating efficiency than the heat dissipating fins located in other regions.

In the plasma display device of the present invention,
The surface area of the heat dissipating fin located in the upper region of the chassis member may be larger than the surface area of the heat dissipating fin located in the other region, or the projecting height of the heat dissipating fin located in the upper region of the chassis member The height may be higher than the height of the heat dissipating fin located in another area.

Further, a circuit board for driving the plasma display panel substrate to emit light may be supported on the rear surface of the chassis member, and the heat radiation fins may be formed over substantially the entire rear surface of the chassis member. In this case, the circuit board may be arranged around the heat-dissipating fins having the increased heat-dissipating efficiency, or the circuit board may be arranged around the heat-dissipating fins located in the upper region of the chassis member. .

[0010] A heat dissipation auxiliary member may be attached to the heat dissipation fin.

Further, the air in the case, which has been heated by the heat radiation from the plasma display panel substrate, the circuit board and the chassis member, is discharged to the outside from the ventilation hole at the upper part of the case by natural convection without using an exhaust fan. In addition, a non-forced cooling structure that keeps the temperature in the case at or below the allowable temperature by taking in room temperature air from the ventilation hole at the bottom of the case may be adopted.

Further, a heat conductive sheet may be interposed between the plasma display panel substrate and the chassis member.

Further, in a case having a ventilation hole,
A chassis member having a heat dissipating fin formed on a rear surface thereof, a plasma display panel substrate supported on a front surface of the chassis member, a plurality of panel driving circuit substrates supported on a rear surface of the chassis member, and an edge of the chassis member A plurality of film-shaped wirings extending beyond the portion and electrically connecting the electrodes at the edge of the plasma display panel substrate and the circuit board, and holding these film-shaped wirings with a wiring pressing member to shape the wirings. By doing so, the space occupied by the film-shaped wiring in the case may be reduced as compared with the case where the curved shape of the film-shaped wiring is not restricted.

[0014]

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. As shown in FIG. 1, a plasma display device 10 according to a first embodiment of the present invention is housed in a front case portion 14 and a back case portion 16 which are combined into a case 12 to form a case 12. And an internal unit 26. A plurality of ventilation holes 18 and 20 are formed in the upper and lower portions of the front case portion 14 in the width direction (the direction of arrow a, the same applies hereinafter), and the front surface has a light transmitting portion 22 made of glass or the like. doing. Also, a plurality of ventilation holes 18, 2,
0 (only the upper ventilation hole 18 is shown) is formed in the width direction.

The internal unit 26 includes the chassis member 2
8, a PDP substrate 32 supported on the front surface of the chassis member 28 by an L-shaped angle plate 30, a heat conductive sheet 34 made of silicon or the like interposed between the chassis member 28 and the PDP substrate 32, Member 28
And a plurality of circuit boards 36 supported on the rear surface. The heat conductive sheet 34 is for efficiently conducting the heat of the PDP substrate 32 to the chassis member 28. The circuit board 36 controls the light emission driving of the PDP board 32 and its control.

The PDP substrate 32 has a front plate and a back plate, and although not shown in the drawing, the front plate is longer in the long side direction and shorter in the short side direction than the back plate. Therefore, the front plate and the back plate each have a portion that does not overlap each other, and a terminal connected to an electrode in the PDP substrate is formed in the non-overlapping portion (not shown). A plurality of film-like wirings (not shown) having a male connector at the end are crimped to the terminals, and the male connector is a female connector (not shown) provided at the edge of each circuit board 36.
To each circuit board 36 and P
The DP substrate 32 is electrically connected.

The chassis member 28 is made of aluminum die cast or the like. As shown in FIG. 2, a plurality of heat dissipating fins 42 are integrally formed on the rear surface 40 of the chassis member 28 over substantially the entire area. The heat radiation fins 42 protrude in a rectangular shape from the rear surface 40 and extend in the vertical direction, and are formed at equal intervals in parallel. Also,
Each heat radiation fin 42 has a width of about 3 mm and an interval of about 3 mm.
Experiments have confirmed that the heat radiation efficiency is good when formed at a pitch of about 6 mm as mm, but of course the dimensions are not limited to these. Further, the shape of the heat radiating fins 42 is not limited to the above, and for example, the heat radiating fins 42 may be divided into a plurality of vertical fins.

In this embodiment, the heat dissipating fins 42 are formed almost all over the rear surface of the chassis member 28.
As long as a cooling effect that can avoid damage to the P substrate 32 can be obtained, the radiating fins 42 need not necessarily be formed in almost the entire area, and may be formed only in a part of the area.

The radiating fins 42 in the upper central region excluding both ends in the width direction of the chassis member 28 have a higher projecting height from the rear surface of the chassis member 28 than the radiating fins 42 in the other regions, so that the radiation efficiency is improved. It is formed to be large.
That is, the heat radiation efficiency is increased by making the surface area of the heat radiation fins 42 located in the upper region of the chassis member 28 larger than the surface area of the heat radiation fins 42 located in the other region, more specifically, the lower region. It has been enlarged. This is because the temperature of the chassis member 28 rises due to the heat transmitted from the PDP substrate 32 via the heat conductive sheet 34, but the temperature distribution is not uniform, and the upper region tends to be hotter. Correspondingly, the heat radiation efficiency in that region is increased.

Each of the circuit boards 36 is arranged around the projecting area 44 of the radiating fin 42 projecting further than the other areas (see FIG. 1). With this arrangement, the projecting region 44 of the heat radiation fin 42 is
6, the effect of increasing the heat radiation efficiency is not reduced. Each circuit board 36 is supported on a boss (not shown) projecting from the rear surface of the chassis member 28, and a gap is provided so as not to directly contact the tip of the radiating fin 42 and the rear surface 40 of the chassis member 28. (See FIG. 3).

On the other hand, a plurality of bosses 48 having female screw holes therein are integrally formed on the periphery of the front surface 46 of the chassis member 28 so as to protrude integrally with the chassis member 28. If the boss portion 48 is integrally formed with the chassis member 28 in advance in this manner, the number of steps and cost can be reduced as compared with a case where the boss is later attached by welding, caulking, or the like.

The angle plates 30 are provided so as to correspond to the four sides of the PDP substrate 32, respectively, and as shown in FIG.
Are screwed to the respective boss portions 48. The angle plate 30 is composed of two plate portions 30 forming substantially right angles.
The plate portion 30a is pressed against the peripheral portion of the front surface of the PDP substrate 32 via a buffer member 52 made of a foam material. As a result, the PDP substrate 32 is placed on the front surface 46 of the chassis member 28 via the heat conductive sheet 34.
It is supported by.

The other plate portion 30b of the angle plate 30 extends along the four end surfaces 54 of the chassis member 28. The plate portion 30b and the chassis member 2
8, a number of film-like wirings (not shown) for electrically connecting the circuit board 36 and the PDP board 32 exist. Therefore, the operator holds the edge of the assembled internal unit 26 by holding the edge of the back unit 16.
When fixing the film-like wiring, the plate portion 30b serves to protect the film-like wiring, thereby preventing the film-like wiring from being damaged.

In the plasma display device 10 having the above-described configuration, when the PDP substrate 32 is caused to emit light, the heat generated by the internal discharge causes the PDP substrate 32 to emit light.
Temperature rises. The heat generated in the PDP substrate 32 is transmitted to the chassis member 28 via the heat conductive sheet 34,
Heat is efficiently dissipated from the integrally formed heat dissipating fins 42. The air whose temperature has been raised by the heat radiation is released to the outside through the ventilation holes 18 in the upper part of the case 12, and the air at room temperature flows in from the ventilation holes 20 in the lower part of the case 12. The PDP board 32 and each circuit board 36 are cooled by the natural convection of the air, and the temperature inside the case 12 is reduced to room temperature (maximum assumed temperature 40
It was confirmed by experiments that the temperature could be maintained at or below the allowable temperature of (° C) +40] ° C.

As described above, the heat dissipating fins 42 are integrally formed on the chassis member 28 supporting the PDP substrate 32 and are also used as heat dissipating plates having high heat dissipating efficiency, so that the air in the case 12 is naturally convected. A non-forced cooling structure that cools the inside of the case has become possible. This allows
Since the exhaust fan for forcibly discharging the air in the case 12 to the outside and forcibly cooling the inside of the case is not required,
Problems such as noise and failure of the exhaust fan and dust suction due to forced exhaust can be solved and cost can be reduced.

Although the plasma display device 10 of the present embodiment has a non-forced cooling structure in which an exhaust fan is completely eliminated, an exhaust fan is provided as an auxiliary component and the case 12 is combined with the natural convection of the air. May be promoted. Also in this case, the number of exhaust fans can be reduced as compared with the related art, so that the above-described problem such as noise can be reduced.

Further, as shown in FIG.
A heat-dissipating auxiliary member 54 is additionally provided on the second projecting region 44,
The heat radiation efficiency in this region may be further increased.
The heat radiation assisting member 54 is formed by fixing a metal plate assembled in a lattice shape inside a metal plate bent in a U-shape, and includes a plurality of space regions 56 extending in the same vertical direction as the heat radiation fins 42 therein. In. The cross-sectional shape of the space region 56 is not limited to a square, and various shapes can be considered. It was confirmed by experiments that the temperature of the chassis member 28 was further reduced by about 10 ° C. when such a heat dissipation auxiliary member 54 was provided. Therefore, in the case of a plasma display device using a PDP substrate of a DC system that generates a larger amount of heat than an AC system, it is particularly preferable to provide the above-described heat dissipation auxiliary member 54.

However, in FIG. 4, the heat dissipation auxiliary member 54 is provided on the projecting region 44 of the heat dissipation fin 42,
The projecting heights of the heat dissipating fins 42 may be all equal without providing the projecting region 44, and the heat dissipating auxiliary member 54 may be provided thereon to enhance the heat dissipating effect in the upper region of the chassis member 28.

Next, a plasma display device 60 according to a second embodiment will be described with reference to FIGS. FIG. 5 is an exploded perspective view of the plasma display device 60, and FIG.
Is a longitudinal sectional view of the device in an assembled state. In addition,
In the drawings referred to below, the same components as those of the plasma display device 10 of the first embodiment described above are denoted by the same reference numerals.

The plasma display device 60 has substantially the same configuration as that of the plasma display device 10 of the first embodiment, and is combined with the front case portion 14 and the back case portion 1 to form the case 12.
6 and an internal unit 26 housed in the case 12. At the top and bottom of the front case part 14,
A plurality of ventilation holes 18 and 20 are formed in the width direction, respectively, and have a light transmitting portion 22 made of glass or the like on the front surface thereof. Also, a plurality of ventilation holes 18 and 20 (upper ventilation hole 1
8 is formed over the width direction.

The front case portion 14 is formed of, for example, an iron plate. On the other hand, the back case portion 16 has four corner portions 16a formed of, for example, an iron plate, and the other portions formed of, for example, aluminum. This is to reduce the weight of the product and improve the workability of the bending process.
Also. The light transmitting part 22 of the front case part 14 is, for example, silver-evaporated. As described above, the case 12 is made of metal, and the light-transmitting portion 22 is also subjected to metal vapor deposition, so that the internal unit 26 has a shielding effect against electromagnetic wave interference.

The internal unit 26 includes a chassis member 28
A PDP board 32 adhesively supported by a double-sided tape 29 on the front surface of the chassis member;
A heat conductive sheet 34 made of silicon or the like interposed between the substrate 32 and a plurality of circuit boards 36 supported on the rear surface of the chassis member 28. Heat conduction sheet 34 is PD
This is for efficiently transmitting the heat generated in the P board to the chassis member 28. The circuit board 36 controls the light emission of the PDP board 32 and controls the light emission of the PDP board 32. It is electrically connected to the extracted electrode.

On the rear surface of the chassis member 28, a radiating fin 42 extending in the vertical and horizontal directions and a circuit board 3
A plurality of bosses 29 for attaching the boss 6 and bosses 31 arranged at four corners of the boss portion 31 for fixing the chassis member 28 to the back case 16 are protruded. The heat dissipating fins 42 and the boss portions 29 and 31 are formed integrally with the chassis member 28 by die casting or casting.

When the internal unit 26 is fixed to the back case 16, a resin insulating spacer 62 is interposed between the boss 31 of the chassis member 28 and the back case 16 as shown in FIG. A screw 66 is screwed to the boss 31 from the outside of the case section 16 with a screw 66 via an insulating washer 64 made of resin. Also, the front case part 14
Is attached to the back case section 16 with screws 68, but is in a non-contact state with the internal unit 26. Therefore, the internal unit 26 and the case 12 are completely insulated, and the shielding effect against electromagnetic wave interference is further improved.

Next, a plasma display device 70 according to a third embodiment will be described with reference to FIGS.
Since the configuration is almost the same as that of the second embodiment, different portions will be mainly described.

First, in the conventional plasma display device, as shown in FIG.
2 are provided, and the fan 72
2 to forcibly exhaust the air inside
The internal unit 26 including the DP substrate 32 has been cooled.
However, the film wiring 74 extending beyond the edge of the chassis member 28 and electrically connecting the electrode at the edge of the PDP substrate 32 and the circuit board 36 is greatly curved in free space, and It existed so as to block the flow path of the air flowing toward it. For this reason, the flow of air inside the case 12 was hindered, and the cooling efficiency was reduced.

Therefore, as shown in FIG. 8, in the plasma display device 70 of this embodiment, the film-like wiring 7
By pressing and shaping 4 with a wiring pressing member 76, the space occupied by the film-shaped wiring 74 in the case 12 is reduced, and an air circulation path is secured. Thus, the heat that has been transmitted from the PDP board 32 inside the case 12 is radiated from the radiating fins 42 of the chassis member 28, so that the temperature-raised air is smoothly exhausted, and a decrease in cooling efficiency can be prevented.

The wiring pressing member 76 is formed by resin integral molding and has a shape shown in FIG. FIG. 9 shows the wiring holding member 76 by a triangular method. A rectangular through hole 78 is formed in the center of the wiring holding member 76. As shown in FIGS. 10 and 11, the film-like wiring 74 whose tip is connected to the connector 37 of the circuit board 36 is inserted into the through-hole 78 of the wiring holding member 76 in a loop shape, so that the film-like wiring 74 swells. Is pressed and shaped. As a result, the space occupied by the film-shaped wiring 74 in the case 12 is reduced as compared with the case where the curved shape of the film-shaped wiring 74 is not regulated at all, as shown in FIG.

Further, the wiring holding member may be formed in a shape shown by a trigonometric method in FIG. The wiring pressing member 80 is also a resin-integrated molded product. On both sides, a gripping arm 82 for gripping the connector of the circuit board 36 from both sides and a lower protruding portion 84 protruding in the width direction are formed below the gripping arm 82. Arm 82 and lower projection 84
And a slit 86 is opened between them. This slit 8
6, the edge of the circuit board 36 is inserted into the wire holding member 8 so that each end of the grip arm 82 engages with the connector 37.
0, the film-like wiring 74 extending from the edge of the PDP board 32 is pushed into between the circuit board 36 and the chassis member 28 by the lower projecting portion 84, and the film-like wiring 74 is A small loop is formed and connected to the connector 37. As a result, the length Hb of the film wiring 74 from the connector 37 to the tip of the loop becomes about one third of the length Ha when the wiring pressing member 76 shown in FIG. Larger distribution channel can be secured.

The material of the wiring holding member is not limited to resin, but may be metal, for example. Further, the shape of the wiring holding member is not limited to those shown in FIGS. 10 and 12, and may have a function of shaping the shape of the film-like wiring 74 to reduce the space occupied in the case 12. Alternatively, the surplus portion of the film-shaped wiring 74 may be pressed and shaped by a rubber band, an adhesive tape, or the like. further,
Although the plasma display device 70 of the present embodiment has been described as having the forced exhaust fan 72, a non-forced cooling structure that does not use a fan as in the first embodiment is different from the first embodiment in that an air circulation path in the case is secured. The use of the wiring holding member is also effective in the plasma display device described above.

[0041]

As is apparent from the above description, according to the plasma display device of the present invention, the heat transmitted from the PDP substrate to the chassis member can be efficiently radiated by the radiating fins. In particular, by forming the heat dissipating fins in the upper region of the chassis member so that the heat radiation efficiency is higher than in the other regions, the cooling effect in the upper region of the chassis member that tends to be higher in temperature than the other regions. Can be increased. The air heated by the heat radiation from the chassis member rises and is discharged to the outside of the case, and the room temperature air flows into the case. As a result, the PDP board and the circuit board are cooled, and the temperature in the case can be maintained at the allowable temperature or lower.

As described above, the chassis member supporting the PDP substrate is also used as a heat radiating plate having high heat radiation efficiency, and a non-forced cooling structure for cooling the inside of the case by natural convection of air eliminates the need for an exhaust fan. Problems such as fan noise, breakdown, and dust suction accompanying forced exhaust can be solved, and costs can be reduced. Further, even when the exhaust fan is used as an auxiliary device, the number of installation fans can be reduced as compared with the conventional case, so that the noise and the like can be reduced and the cost can be reduced.

In a plasma display device in which the space occupied by the film-shaped wiring in the case is reduced by shaping with a wiring holding member, air heated by heat radiation from the PDP substrate, the chassis member, and the circuit substrate passes through the case. A flow path flowing toward the pores can be secured, and a decrease in cooling efficiency in the case can be prevented.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a plasma display device according to a first embodiment.

FIG. 2 is a perspective view of a chassis member.

FIG. 3 is a cross-sectional view in the width direction of the assembled internal unit.

FIG. 4 is a perspective view showing a state in which a heat dissipation auxiliary member is attached to a projecting region of a heat dissipation fin of a chassis member.

FIG. 5 is an exploded perspective view of a plasma display device according to a second embodiment.

FIG. 6 is a longitudinal sectional view of the plasma display device of the second embodiment in an assembled state.

FIG. 7 is a longitudinal sectional view of a conventional plasma display device.

FIG. 8 is a longitudinal sectional view of a plasma display device according to a third embodiment.

FIG. 9 is a triangular view of the wiring holding member by triangulation.

FIG. 10 is a perspective view showing a state in which a film-shaped wiring is shaped using a wiring holding member.

FIG. 11 is a side view showing a state in which the film-shaped wiring is shaped using the wiring pressing member.

FIG. 12 is a triangular view of another wiring holding member by triangulation.

FIG. 13 is a side view showing a state where the film-shaped wiring is shaped using another wiring pressing member.

[Explanation of symbols]

10: Plasma display device, 12: Case, 1
8, 20: vent hole, 28: chassis member, 32: plasma display panel substrate, 34: heat conductive sheet, 36
... Circuit board, 42: Heat dissipating fins, 54: Heat dissipating auxiliary member, 70: Plasma display device, 74: Film wiring, 76, 80: Wiring holding member.

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁶ , DB name) G09F 9/00 304 G09F 9/00 348

Claims (9)

(57) [Claims] 1. A case, comprising a chassis member supporting a plasma display panel substrate on a front surface thereof, a heat radiation fin on a rear surface of the chassis member, and a heat radiation fin located in a region above the chassis member. A plasma display device formed so that heat radiation efficiency is higher than heat radiation fins located in other regions. 2. The plasma display device according to claim 1, wherein the surface area of the heat dissipating fin located in the upper region of the chassis member is larger than the surface area of the heat dissipating fin located in the other region. . 3. The radiating fin located in the upper area of the chassis member has a height higher than that of the radiating fin located in the other area. The plasma display device according to the above. 4. A circuit board for driving the plasma display panel substrate to emit light on a rear surface of the chassis member, and the heat dissipating fins are provided on substantially the entire rear surface of the chassis member. Claim 1
4. The plasma display device according to any one of items 1 to 3. 5. The plasma display device according to claim 4, wherein said circuit board is arranged around heat radiation fins located in an upper area of said chassis member. 6. The plasma display device according to claim 1, wherein a heat dissipation auxiliary member is provided on the heat dissipation fin. 7. The plasma display panel substrate,
The air in the case, which has been heated by the heat radiation from the circuit board and the chassis member, is discharged to the outside from the ventilation hole at the upper portion of the case by natural convection without using an exhaust fan, and the room temperature air is discharged from the ventilation hole at the lower portion of the case. 7. The plasma display device according to claim 4, wherein a non-forced cooling structure for maintaining the temperature in the case at a temperature equal to or lower than an allowable temperature is adopted. 8. The plasma display device according to claim 1, wherein a heat conductive sheet is interposed between the plasma display panel substrate and the chassis member. 9. A chassis member having radiating fins on a rear surface in a case having a ventilation hole, a plasma display panel substrate supported on a front surface of the chassis member,
A plurality of panel driving circuit boards supported on the rear surface of the chassis member, and extending beyond the edge of the chassis member to electrically connect the electrodes on the edge of the plasma display panel substrate and the circuit board. With a plurality of film-shaped wirings to be connected, by holding these film-shaped wirings with a wiring pressing member and shaping them, the film-shaped wirings in the case compared to the case where the curved shape of the film-shaped wirings are not regulated A plasma display device characterized in that it occupies a small space.