JP2806725B2 - Substrate transfer device and substrate transfer path adjusting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer apparatus for transferring a flat substrate and a method for adjusting a substrate transfer path in the apparatus.

[0002]

2. Description of the Related Art Conventionally, as this type of substrate transfer device, there is one provided in, for example, a wire bonding device, and an example thereof is shown in FIGS. Since the apparatus is disclosed in Japanese Utility Model Laid-Open No. 3-48225 and the like, only the main part will be described.

In the wire bonding apparatus,
A plurality of lead frames L each serving as a substrate on which a plurality of IC chips (semiconductors) 101 are mounted side by side in the longitudinal direction.
The #F is arranged and accommodated in a magazine M as a substrate accommodating means, and the magazine M is loaded on the loader 102. Along with the operation of the loader 102, these lead frames L＼F are sequentially taken out of the magazine M by a frame transfer means (not shown), intermittently fed by the arrangement pitch of the IC chips 101, and
(See FIG. 19) Heater plate 10 heated by
5 is transported. Then, the heater plate 105
Above, each IC chip 101 mounted on the lead frame L # F and leads 108 formed on the lead frame (FIG.
8) are sequentially connected by bonding using conductive wires.

The lead frame L # F bonded as described above is further fed back by the above-mentioned frame transfer, and is accommodated in an empty magazine M loaded on the unloader 109.

[0005] A transport path is provided for preventing the meandering of the lead frame L＼F transported by the frame transport means and performing highly accurate transport. The transport path is provided on both sides of the lead frame L＼F. Are defined by a pair of guide rails 111 and 112 serving as guide members arranged corresponding to.

After the bonding by wire is completed, a concave portion is formed in the lead frame LF as shown in FIG. 19 for the purpose of thinning a semiconductor component as a product obtained by performing resin molding or the like. Then, the IC chip 101 is mounted as an island 113, and the island 113 is positioned with respect to a concave portion 105a provided on the heater plate 105 so that the island 113 is fitted during a bonding operation. In order to achieve this, the above-mentioned transport path is particularly important.

The lead frame L # F has various widths depending on the type of the IC chip 101 to be mounted thereon.
Numeral 12 allows the rail intervals to be adjusted so as to guide these various lead frames. More specifically, as shown in FIG. 18, a pair of frame bases 115 are fixed on a frame (not shown) of the wire bonding apparatus, and slide along rails provided on each frame base 115. Each guide rail 1 is attached to a movable slider 116.
11 and 112 are attached.

The two guide rails 111 and 11
The guide member driving means 117 for moving each of the guide rails 111 and 112 is provided by the operation of the guide member driving means 117.
F is moved close to and away from F. The guide member driving means 117 is fixed to the pulse motors 118a and 118b attached to the frame base 115, the male screw 119 connected to the output shaft of the pulse motor, and the guide rails 111 and 112. A nut 120 screwed onto the male screw 119.

Next, the guide rails 111 and 1
The loader 102 and the unloader 109 that are arranged so as to sandwich 12 are described. Since the loader 102 and the unloader 109 have the same configuration, the loader 10
Only the configuration 2 will be described in detail, and the description of the unloader 109 will be omitted.

As shown in FIG. 17, a loader 102 includes a plurality of lead frames L # arranged and accommodated in a magazine M.
F by the above-described frame transfer means (not shown) to 1
This lifting / lowering mechanism 122 includes a lifting / lowering mechanism 122 for lowering or raising the magazine M by the arrangement pitch of the lead frame L # F to take out the sheets one by one, and a lifting / lowering mechanism base 123 on which the lifting / lowering mechanism 122 is mounted. The mechanism base 123 is movable in a direction indicated by an arrow S, that is, in a direction parallel to the movable direction T of the guide rails 111 and 112, and the position is adjusted in the direction S by turning the knob 125. You.

On the elevating mechanism base 123, a pair of stocker guides 127 each having an L-shaped cross section are provided.
a and 127b are provided. One stocker guide 127a is fixed to the elevating mechanism base 123, and the other stocker guide 127b is position-adjustable in the direction indicated by the arrow U, that is, in the length direction of the magazine M.

The two stocker guides 127a, 1
On the inner surface of 27b, a total of four regulating members 1 are provided, two each.
28a to 128d are attached. These restricting members 128a to 128d are for engaging and restricting the magazine M, and the two restricting members 128a and 128b are respectively provided for the stocker guides 127a and 127b.
And the other two regulating members 128c and 128d
Can be adjusted in the direction indicated by the arrow V, that is, in the width direction of the magazine M.

Next, a description will be given of the operation of the apparatus having the above-described configuration when the transport path is adjusted so as to match the width of the lead frame L # F to be handled.

First, the pulse motors 118a and 118b (see FIG. 18) are rotationally driven based on a command signal issued from a control unit (not shown) composed of a microcomputer or the like. The guide rails 111 and 112 are moved to the movement limit position in the direction away from each other.

Next, one lead frame L # F for transport path adjustment is handled by an operator, and a reference hole (not shown) formed in the lead frame L # F projects on the heater plate 105. The projection (not shown) serving as a reference is provided. Thereby, the lead frame L
The island 113 formed on the F and on which the IC chip 101 is mounted is formed in the recess 105 a of the heater plate 105.
(See FIG. 19).

Here, as shown in FIG. 18, the lead frame L フ レ ー ム F is pressed and fixed from above by the lead frame presser 129, and the bonding means 107 (FIG. 1).
7) to operate the lead frame retainer 129.
The bonding origin 130 is set at the center position of the IC chip 101 and the island 113 through the opening 129a.

Thereafter, the pulse motors 118a, 118b
Is rotated in the reverse direction, the two guide rails 111 and 112 approach the lead frame L # F, and the gap between the both guide rails and the side end of the lead frame L # F is set to an optimum value.

Next, a magazine M accommodating a large number of the above-described lead frames L # F is loaded onto the loader 102, and the stocker guide 127b and the regulating members 128c and 1c are loaded.
The position adjustment of 28d is performed by a manual operation of an operator, and the magazine M is regulated. At this time, a gap is provided between each of the regulating members 128a to 128d and the magazine M so that the raising and lowering operation of the magazine M by the raising and lowering mechanism 122 is performed smoothly.

On the other hand, the same adjustment as that of the loader 102 is performed.
This is also performed for the unloader 109.

Thus, the adjustment of the transport path is completed.

The above-described adjustment of the transport path is performed by changing the type of the lead frame L 並 び に F (magazine M) to be transported by changing the guide rails 111 and 112 and the regulating members 128a to 128a.
This is performed to adjust the interval of 128d. In addition, when the heater plate 105 is replaced,
When a relative displacement between the island fitting concave portion 105a provided on the heater plate 105 and the island 113 occurs, the conveyance path is adjusted in the same procedure as described above. However, in this case, it is not the distance between the guide rails and the distance between the regulating members that is adjusted, but the above-described recess 1.
05a, the guide rails 111 and 112 and the respective regulating members 128a
To 128d are shifted in the same direction by the relative position shift. In order to shift each of the regulating members 128a to 128d in the same direction, the knob 125 (see FIG. 17) is used.
Is rotated by an operator to adjust the position of the lifting mechanism base 123 on which the respective regulating members are mounted.

[0022]

As described above, in the conventional substrate transport apparatus and substrate transport path adjusting method, the heater plate is changed every time the type of the lead frame L＼F is changed or the heater plate 105 is replaced. 1
In order to make the concave portion 105a of the 05 and the island 113 coincide with each other, an adjustment operation must be performed by a manual operation of the operator, which has a disadvantage that the operator is troublesome and spends much time. The present invention has been made in view of the above-described drawbacks of the related art, and has as its object to provide a substrate transfer apparatus and a substrate transfer path adjustment method that can complete adjustment of a transfer path quickly and easily. And

[0023]

According to the present invention, there is provided a substrate transport apparatus, wherein a guide member is provided corresponding to both sides of the substrate so as to guide the substrate along a predetermined path, and the guide member is freely movable toward and away from each other. Guide member driving means for moving each of them, first detection means for detecting that the guide member is engaged with the substrate and has come to a state capable of guiding the substrate,
A substrate storage unit for arranging and storing a plurality of the substrates in the guide direction of the substrate of each of the guide members is disposed, and the substrate storage unit is located at a position where the substrate can be transferred between the substrate storage unit and the guide member. A plurality of regulating members, a regulating member driving unit that moves each of the regulating members so as to be able to contact and separate from the substrate storage unit, and a second detection that detects that the regulation member regulates the substrate storage unit. Means. Further, in the substrate transfer apparatus according to the present invention, the driving force generating means of at least one of the guide member driving means and the regulating member driving means includes a signal generating means for generating a signal corresponding to an operation amount thereof, and The means is used as the detection means to detect that the signal is no longer obtained. Further, in the substrate transport path adjusting method according to the present invention, a plurality of regulating members are arranged in a guide direction of the substrate of a guide member for guiding the substrate along a predetermined path, and each of the regulating members is arranged and accommodated in a plurality of substrates Relative to the substrate accommodating means, and moving the regulating members in synchronization with each other to move the substrate accommodating means relative to the predetermined path between the substrate accommodating means and the guide member. The guide member is positioned at a position where delivery is possible, and each guide member is brought close to the substrate protruding from the substrate storage means between the guide members. Further, in the substrate transport path adjusting method according to the present invention, the center in the width direction of the substrate storage unit is made to coincide with the center of the predetermined path. Further, in the substrate transport path adjusting method according to the present invention, the guide member and the regulating member are moved in synchronization in the same direction so that the center in the width direction of the substrate storage means is predetermined with respect to the center of the predetermined path. This is to match the position deviated by the distance. Further, in the substrate transport path adjusting method according to the present invention, reference positions of the guide member and the regulating member are set. Further, in the substrate transport path adjusting method according to the present invention, the set position of the substrate storage means and the substrate with respect to the predetermined path is stored in a storage means. Further, in the substrate transport path adjusting method according to the present invention, the setting of the substrate feed in a direction along the predetermined path is performed. Further, in the substrate transport path adjusting method according to the present invention, at least three or more portions to be subjected to a predetermined operation are arranged on the substrate along the feeding direction of the substrate, and at least one portion is sandwiched therebetween. The center-to-center distance between the parts is measured, and the value obtained by dividing the center-to-center distance by a number obtained by subtracting 1 from the total number of the parts and the parts located therebetween is obtained as the average pitch between the adjacent parts. Things. In addition, an imaging device is arranged near the predetermined route according to the present invention, and an adjustment operation is performed while monitoring with the imaging device.

[0024]

Next, a description will be given of a wire bonding apparatus provided with a substrate transfer apparatus according to the present invention.

As shown in FIG. 1, in the wire bonding apparatus, a loader 2 and an unloader 3 on which a magazine M is loaded are provided on a gantry 1 thereof. Each magazine M functions as a substrate storage unit that arranges and stores a plurality of lead frames L # F as substrates, and is detachable from the loader 2 and the unloader 3. The lead frame before bonding is stored in the magazine M loaded on the loader 2, and the bonded lead frame is stored in the magazine M on the unloader 3.

A heater plate 5 is provided at a position between the loader 2 and the unloader 3. As shown in FIG. 2, the heater plate 5 is overheated by the heater block 6 and carries a lead frame L＼F supplied from a magazine M on the loader 2. As shown in FIG. 2, an IC chip (semiconductor) 8 is mounted on the lead frame L @ F, and more specifically, in the longitudinal direction of the lead frame L @ F (the direction perpendicular to the paper). They are mounted side by side at multiple pitches.

As shown in FIG. 2, a recess is formed in the lead frame L # F, and the IC chip 8 is mounted on the recess as an island 9. The structure of the island 9 on the concave is adopted for the purpose of thinning a semiconductor component as a product obtained by performing resin molding or the like after bonding is completed. Therefore, as shown in the figure, the heater plate 5 is provided with the recess 5 so that the island 9 fits during the bonding operation.
a (also shown in FIG. 1).

As shown in FIGS. 1 and 2, above the heater plate 5, a bonding means 11 is provided. The bonding means 11 connects the lead 10 (see FIG. 13) formed on the lead frame L # F positioned on the heater plate 5 and the IC chip 8 mounted on the lead frame L # F. Bonding connection is performed using a conductive wire.

As shown in FIG. 1, in front of the loader 2,
A push mechanism 13 for projecting the lead frames L フ レ ー ム F in the magazine M loaded on the loader 2 one by one in accordance with the operation of the loader 2 is provided. The push mechanism 13 includes a motor 13a, a male screw 13b rotationally driven by the motor 13a, and a nut (not shown) screwed to the male screw, and reciprocates in the direction of arrow A by rotation of the male screw 13b. And a pusher 13c which engages with the rear end of the lead frame L # F during the forward movement and pushes it out of the magazine M.

Further, a lead frame L＼F protruded from the magazine M on the loader 2 by the push mechanism 13 to the side of the heater plate 5 is brought up to the heater plate 5. A feed mechanism 14 for feeding the magazine 3 to the vicinity of the magazine M is provided.

Further, behind the heater plate 5, the lead frame L # F sent to the vicinity of the magazine M on the unloader 3 by the feed mechanism 14 is supplied to the magazine M.
There is provided a push mechanism 15 to be housed inside. The push mechanism 15 includes a pusher 15a that engages with the rear end of the lead frame L # F and pushes the pusher 15a.
a reciprocating cylinder 15b as shown by arrow B
Consisting of

The above-described push mechanisms 13 and 15 and the feed mechanism 14 are collectively referred to as frame transfer means.

The loader 2 is moved by the frame transfer means described above.
A transport path for preventing the meandering of the lead frame L＼F transported from the upper magazine M to the magazine M on the unloader 3 and performing highly accurate transport is set, and the transport path is It is defined by a pair of guide rails 17 and 18 as guide members arranged corresponding to both sides of the lead frame L # F.

The two guide rails 17 and 18 are relatively close to and separated from each other as shown by arrows C and D so that they can correspond to various lead frames having different widths. It is adjustable. Guide member driving means 21 and 22 for moving the guide rails 17 and 18 respectively are provided, and both guide rails 17 and 18 are moved by the operation of the guide member driving means 21 and 22. Close to and away from ＼F. These guide member driving means 2
Reference numerals 1 and 22 denote pulse motors 21a and 22a fixed on the gantry 1 of the apparatus, male screws 21b and 22b connected to the output shafts of the respective pulse motors and rotated, and fixed to both guide rails 17 and 18. The external threads 21b, 22b
And nuts (not shown) screwed into the respective members.

Various sensors 25 to 29 are provided on the guide rails 17 and 18 described above. These sensors are composed of, for example, reflection type optical sensors.

The sensor 25 provided near the front end of the guide rail 17 determines whether the lead frame L # F to be subjected to bonding has been projected from the magazine M on the loader 2 by the operation of the push mechanism 13, that is,
This is for detecting the presence or absence of the lead frame L # F. The sensor 26 disposed near the rear end of the guide rail 17 determines whether or not the lead frame L # F that has completed bonding has been carried out of the heater plate 5 by the push mechanism 15, that is, in the magazine M on the unloader 3. It is provided to confirm that it has been stored in. A sensor 27 provided on the guide rail 17 so as to be located on the side of the heater plate 5
Is the lead frame L on the heater plate 5.
This is for confirming the position of ＼F.

The remaining two sensors 28 and 29 are used to detect that the two guide rails 17 and 18 are engaged with the lead frame L # F and can reach the lead frame L # F. These are collectively referred to as first detecting means. More specifically, as shown in FIG. 2, the guide rails 17 and 18 are provided at right angles to each other and have two receiving surfaces 17a, 17b and 18a to be brought into contact with the lower surface and the side end of the lead frame L フ レ ー ム F, respectively. , And 18b, so that the emitted light and the reflected light from the lead frame L # F are located in a plane including the vertical receiving surfaces 17b and 18b among these receiving surfaces. Are located. Therefore, the guide rails 17 and 18 are formed with holes 17c and 18c which open at the intersections of the receiving surfaces 17a and 17b and 18a and 18b.
And 29 are inserted through the holes 17c and 18c.

In the sensor 25, the lead frame L # F to be guided by the guide rails 17 and 18 arrives at a position between the guide rails, particularly at a position where the sensors 28 and 29 can detect the lead frame. It also has the function of detecting

Next, the loader 2 and the unloader 3 arranged so as to sandwich the guide rails 17 and 18 will be described. However, since the loader 2 and the unloader 3 have a completely symmetrical configuration, only one of the loaders 2 will be described in detail to avoid complication of the drawings.

As shown in FIG. 1, the loader 2 has an elevating mechanism base 31 on which the elevating mechanism base 31 is mounted.
An elevating mechanism (not shown) is provided. The lifting mechanism is
The magazine M is lowered or raised by the arrangement pitch of the lead frames L # F in order to protrude the lead frames L # F arranged and accommodated in the magazine M one by one by the operation of the push mechanism 13. is there.

A pair of linear regulating members 33 and 34 are provided on the elevating mechanism base 31 so as to be substantially aligned in series with the guide rails 17 and 18 in the lead frame guiding direction. These two regulating members 33, 34
Are used to engage with the left and right sides of the magazine M to regulate the width in the width direction. As shown by arrows F and G, the magazine M is relatively close to and separated from each other, and the interval between the two is adjustable. It has become. Further, regulating member driving means 35 and 36 for moving the regulating members 33 and 34, respectively, are provided, and both regulating members 33 and 34 are moved with respect to the magazine M by the operation of the regulating member driving means 35 and 36. Close and spaced. These regulating member driving means 35, 36
Is a pulse motor 3 fixed on a lifting mechanism base 31.
5a, 36a, male screws 35b, 36b connected to the output shafts of the respective pulse motors and driven to rotate, and nuts fixed to both regulating members 33, 34 and screwed to the respective male screws 35b, 36b (FIG. (Not shown)).

Before and after the regulating member 33, another two
Two regulating members 38 and 39 are provided. These restricting members 38 and 39 are for engaging the front and rear ends of the magazine M and restricting them in the longitudinal direction. One restricting member 38 is fixed to the rear end of the restricting member 33. The other regulating member 39 is attached to the front end of the regulating member 33 so as to be able to approach and separate from the regulating member 38 as shown by an arrow H. And, this regulating member 39
Is provided on the regulating member 33. The regulating member driving means 41 includes a pulse motor 41a fixed to the regulating member 33, a male screw 41b connected to the output shaft of the pulse motor 41a and driven to rotate, and a regulating motor 39 fixed to the regulating member 39. Male screw 41b
And a nut (not shown) screwed into the nut.

As shown, sensors 43 and 44 are provided on the regulating members 34 and 39, respectively. These sensors 43 and 44 are respectively
4 and 38 and 39 are for detecting that the magazine M has been regulated, and these are generically referred to as second detecting means.

These sensors 43 and 44 are also composed of reflection type optical sensors similarly to the above-mentioned sensors 25 to 29, and each of the regulating members 34 is in the same state as the sensors 28 and 29 shown in FIG. And 39.

As shown in FIG. 3, each of the aforementioned sensors 25
29 and 43 and 44 are sent to a control unit (hereinafter referred to as a CPU) 47 which controls the operation of the wire bonding apparatus, and the CPU 47 sends these signals, a keyboard 48 and an imaging device 49 ( FIG.
), The pulse motors 21a, 22a, 35a, 36a, 41a, the motor 13a, the cylinder 15b, the feed mechanism 14, and the bonding means 11 are operated at the timing described later.

Next, the operation of the wire bonding apparatus having the above configuration when the type of the lead frame L # F to be handled is changed will be described with reference to FIGS. In this case, the CPU 47 (see FIG. 3) is a ROM (Read Only Memory) 5
The work procedure information input in advance to 0 is read out, and based on this, the operation control is performed according to the flowcharts shown in FIGS. Also, as described later, the RAM (Rand)
om Access Memory) 51, and stores the information. 4 and 5 show a series of flowcharts divided into two. Further, as described above, the loader 2 and the unloader 3 have the same configuration and operate in the same manner. Therefore, only the operation of one loader 2 will be described.

First, when a command signal is issued by operating the keyboard 48 (see FIG. 3) or the like, the CP
U47, as shown in FIG.
2a, 35a and 36a are respectively rotated in the reverse direction to move the two regulating members 33 and 34 and the two guide rails 17 and 18 in directions away from each other, and to position them at their respective reference positions (shown as step S1 in FIG. 4). ing).

In this state, a magazine M accommodating a lead frame to be newly handled is loaded between the two regulating members 33 and 34.

Subsequently, the pulse motor 36a for driving one of the regulating members 34 is rotated forward, and as shown in FIG. 6, the regulating member 34 is moved toward the other regulating member 33. When the magazine M pressed toward the regulating member 33 by the regulating member 34 is detected by the sensor 43, the magazine M is stopped based on a detection signal issued from the sensor 43 (steps S2 to S4). As a result, the magazine M is sandwiched from both sides by the regulating members 33 and 34.

Thereafter, the pulse motors 35a and 36a
Are slightly rotated in reverse (step S5). Accordingly, an optimum gap (not shown) is provided between the two regulating members 33 and 34 and the side surface of the magazine M.

Next, the pulse motor 41a is rotated forward and the regulating member 39 is moved to the other regulating member 3 as shown in FIG.
8 and is stopped based on a detection signal emitted from the sensor 44 at the time when the magazine M pressed toward the regulating member 38 by the regulating member 39 is detected by the sensor 44 (steps S6 to S6). S8).

Then, the pulse motor 41a is slightly rotated reversely (step S9). Thereby, an optimum gap (not shown) is provided between the two regulating members 38 and 39 and the end face of the magazine M. Thus, Magazine M
Is movable in a vertical direction (a direction perpendicular to the paper surface) in a state surrounded by the respective regulating members 33, 34, 38, and 39, so that the magazine M can be raised and lowered by a lifting mechanism (not shown).

Next, one pulse motor 35a is rotated forward and the other pulse motor 36a is rotated reversely (step S10). As shown in FIG. 8, both regulating members 33 and 34 have the same resolution and the same resolution in the same direction. The magazine M is synchronously moved at the same speed, and stopped when the center in the width direction of the magazine M coincides with the center 53 of the predetermined path to guide the lead frame L # F (steps S11 and S11).
12). In this case, the center 53 of the predetermined path refers to the center of the concave portion 5a formed in the heater plate 5.

As described above, both regulating members 3 are arranged so that the center of the magazine M in the width direction coincides with the center 53 of the predetermined path.
When moving the control members 3 and 34 in the same direction,
Assuming that the amount of movement from the reference position to the stop position of only one of the regulating members 34 performed as a preceding step is WＷ2, the amount of movement of 3, 34 is set.

When the positioning operation of the magazine M is completed as described above, or concurrently with the positioning operation of the magazine M, the pulse motors 21a and 22a for driving the guide rails 17 and 18 are both rotated by a predetermined rotation amount. Then, the wafer is brought from the state shown in FIG. 1 to the state shown in FIGS. 6 to 8, that is, the state close to the center 53 (step S13). In this state, the receiving surfaces 17b, 18b of the guide rails 17, 18 have
The interval between the two (see FIG. 2) is set to be somewhat larger than the width of the lead frame L # F housed in the magazine M (described later). However, these receiving surfaces 17b, 18
The receiving surfaces 17a and 18a for supporting the ends of the lead frame L # F perpendicular to b are in a state capable of supporting the lead frame L # F.

Subsequently, the push mechanism 13 is operated,
As shown in FIG. 9, an arbitrary lead frame L # F housed in the lowermost to the uppermost stage in the magazine M is protruded out of the magazine M, and the leading end thereof is a receiving surface 17a of both the guide rails 17 and 18. , 18a and detected by the sensor 25 (steps S14 and S1).
5). As is apparent from FIG. 10, in this state, the receiving surfaces 17a, 1
8a and both sides of the lead frame L @ F
Has occurred.

Based on the detection signal output from the sensor 25, the pulse motors 21a and 22a are both rotated forward (step S16), and the two guide rails 17, 18 are connected to the lead frame L が F as shown in FIG. And the lead frame L フ レ ー ム F is moved toward the sensors 28 and 2
9 is stopped based on the detection signals emitted from the two sensors 28 and 29 at the time when it is detected by step 9 (step S1).
7, S18). Thereby, the lead frame L フ レ ー ム F
Are receiving surfaces 17b, 18b of both guide rails 17, 18.
Is sandwiched from both sides.

Thereafter, the pulse motors 21a and 21a
Both 2a are slightly reversed (step S19).
Thereby, as shown in FIG.
An optimum gap δ is provided between the vertical receiving surfaces 17b, 18b provided on the first and the second and the both ends of the lead frame L # F, and the lead frame L # F can be transported. As shown in FIG. 12, for example, the sensor 28 is installed so that the optical axis 28a of the irradiation light is located at the above-mentioned position δ from the receiving surface 17b of the guide rail 17, whereby the lead frame L フ レ ー ム F If the side end is detected, the returning operation of the guide rail for providing the gap δ becomes unnecessary. The same applies to the sensor 29 provided on the other guide rail 18, and the same applies to other sensors 43 and 44 provided on the regulating members 34 and 39 for detecting the magazine M. is there.

By the above series of operations, the center of the lead frame L # F to be newly handled and the center of the magazine M accommodating the lead frame L # F become the center 53 of the predetermined path for guiding the lead frame L # F, that is, the heater. The plate 5 is aligned with the center of the concave portion 5a. When the center of the island 9 of the lead frame L # F coincides with the center of the lead frame L # F in the width direction, as shown in FIGS. Coincides with the center 53 of the path.

As shown in FIGS. 13 and 14, the side ends of the lead frame L $ F and the inner wall surface of the magazine M are connected to each other so that the lead frame L # F can be protruded and stored in the magazine M smoothly. Between them, a gap having a maximum of e ₁ is generated. Therefore, as shown in the figure, when the lead frame L # F is housed in one side in the magazine M, even if the center of the magazine M in the width direction coincides with the center 53 of the predetermined path as described above, The center 54 of the island 9 provided on the lead frame L # F (FIG. 13)
And shown in FIG. 15) with respect to the center 53 of the predetermined path.
Shifted by _1/2, it will not have a match. In this case, in order to correct the deviation, the operation described below is performed subsequent to the above operation.

The above description is based on the premise that each lead frame L # F does not have the above-described displacement in the magazine M. As described above, when each lead frame L フ レ ー ム F is shifted to one side in the magazine M, the lead frame L＼F is placed on the inner wall surface of the magazine M.
Since the side ends of the lead frame L are in contact with each other, there is a concern that the projecting and storing operation of the lead frame L @ F may not be smooth. Will be Although this correction operation is not shown in the flowcharts of FIGS. 4 and 5, specifically, the pulse motors 35a and 36a are slightly rotated in synchronization with each other, and the two regulating members 33 and 34 are moved in the same direction. Then, the magazine M is moved in the direction in which the deviation is corrected.

Now, in order to correct the aforementioned deviation e _1/2 between the center 54 of the island 9 and the center 53 of the predetermined path, the pulse motors 21a and 35a are rotated forward while the other pulse motors 22a and 36a are rotated. Is rotated in the reverse direction, so that each of the regulating members 33 and 34 and both of the guide rails 17 and 18 are synchronously moved in the same direction at the same resolution and at the same speed, so that the center of the magazine M in the width direction is The deviation e _{1 from} the center 53 of the predetermined path
/ 2, that is, when the center 54 of the island 9 coincides with the center 53 of the predetermined path (steps S20 to S22).

Incidentally, as shown in FIG.
Center 54 may lead frame L\F formed offset by e ₂ with respect to the width direction center 55 of the lead frame, such case also be operated similarly to the correction operation of the shift described above, the The center 54 of the island 9 is made to coincide with the center 53 of the predetermined route.

It should be noted that the center 53 of the island 9 coincides with the center 53 of the predetermined path, that is, the center of the concave portion 5 a of the heater plate 5.
(See FIGS. 2 and 3).
47 (shown in FIG. 3),
This is performed by the operator himself watching a microscope (not shown) arranged above the heater plate 5 and a monitor television (not shown) connected to the imaging device 49.

Thus, the lead frame L to be handled
Adjustment of the transport path according to ＼F is completed.

When the CPU 47 (see FIG. 3) sets the positions of the magazine M and the lead frame L # F as described above, the set positions, specifically, the respective regulating members 33, 3
4 and 39 and the set positions of the guide rails 17 and 18 are input to the RAM 51 and stored. Then, when the same type of lead frame L # F is handled again, the stored information is taken out and the position is set immediately.

When the adjustment in the frame width direction is completed as described above, the setting of the feed of the lead frame L # F in the direction along the predetermined path is performed according to the following procedure.

First, the feed mechanism 14 (see FIG. 1) is operated to feed the lead frame L # F by a minute distance.
In this state, the CPU 47 or the operator performs the operation while checking the image obtained by the imaging device 49 in the same manner as in the above-described adjustment in the frame width direction. It should be noted that a reference cross line (cross line) is simultaneously displayed in the obtained image.

First, the sent lead frame L #
It is confirmed that the tip of F has reached the intersection of the crosshairs, and this coordinate position is stored in the RAM 51 as a first reference.

Next, from the leading end of the lead frame L # F,
It is confirmed that the center of the island 9 has reached the intersection of the crosshairs, and this coordinate position is used as a second reference in the RAM 51.
To memorize.

Then, it is confirmed that the center of the second island 9 from the tip has reached the intersection of the crosshairs, and the lead frame L＼F feed amount from the second reference to this point is calculated and obtained. To be stored in the RAM 51. The calculated feed amount corresponds to the pitch between adjacent islands 9. The feed amount is obtained by monitoring the operation amount of the feed mechanism 14 using an encoder (not shown) or the like. In addition to the above, the feed amount from the first island 9 to the second island 9 is calculated and immediately obtained as a pitch. The average pitch may be obtained by dividing the feed amount from the first island to the Nth island, that is, the value obtained by dividing the center-to-center distance between the two islands by N-1.

After the above, the lead frame L # F is fed until the rear end reaches the intersection of the crosshairs, and the total feed amount from the first reference to this point is stored in the RAM 51. This total feed amount is the total length of the lead frame L＼F.

The set values stored in the RAM 51 as described above are read out from the stored information and reproduced as needed.

In this embodiment, each regulating member 3
The reference positions for the operation of the guide rails 3 and 34 and the two guide rails 17 and 18 are set at or near the movement limit position in the direction in which the regulating members 33 and 34 and the two guide rails 17 and 18 are separated from each other. In addition, if there is a lead frame that has been transported before an arbitrary position, for example, a lead frame to be newly handled, a new lead frame is set with a position matching the previous lead frame and the magazine containing the lead frame as a reference position. It is also possible to obtain a position matching the frame and the magazine by arithmetic processing based on the original reference position.

Further, without setting the reference position as described above, it is also possible to adjust the transport path while tracking the position of the guide rail or the like based on the image or the like obtained by the imaging device 49.

In the present embodiment, one of the regulating members 33 and 34 is moved in the same direction so that the center of the magazine M in the width direction coincides with the center 53 of the predetermined path. Is fixed and only the other regulating member 34 is moved. On the contrary, the regulating member 33 may be fixed and the regulating member 33 may be moved, or both regulating members 33 and 34 may be operated together. May be.

Further, in this embodiment, the sensor 2 for detecting that the guide rails 17 and 18 are engaged with the lead frame L # F and can guide the lead frame L # F.
8 and 29, and sensors 43 and 4 for detecting that the respective regulating members 33, 34, 38 and 39 have regulated the magazine M.
Although the sensor 4 is provided, if this detection is performed using the imaging device 49 or the like, the sensors are unnecessary.

Further, the guide member driving means 21 and 22 and the regulating member driving means 3 for moving the guide rails 17 and 18 and the regulating members 33, 34 and 39, respectively.
The pulse motors 21a, 2a, 2
If 2a, 35a, 36a and 41a are provided with an encoder as a signal generating means for generating a pulse signal corresponding to the respective operation amount, that is, the rotation angle,
The above sensors 28, 29, 43, and 44 can be eliminated.

That is, if the guide rails 17 and 18 and the regulating members 33, 34, 38 and 39 are engaged with the lead frame L＼F and the magazine M, respectively, and they are clamped, they can move further. Therefore, a pulse signal from the encoder cannot be obtained. In this state, the pulse motor is stopped as detection. At this time, it is preferable that the pulse motor is reversely rotated by the number of pulses after the pulse motor is stopped, in consideration of the fact that each pulse motor rotates several pulses extra due to its inertia.

Further, in this embodiment, when a certain kind of lead frame is handled, the heater plate 5 needs to be replaced, so that the recess 5a of the heater plate itself causes the lead frame L＼F In the case where a deviation has occurred from the island 9, it is only necessary to move the regulating members 33, 34 and the guide rails 17, 18 in the same direction to perform the operation of matching the island 9 with the concave portion 5 a, The adjustment is very quick and easy.

In this embodiment, the adjustment of the transport path of the lead frame in the wire bonding apparatus is described. However, it is to be noted that the present invention can be applied to other apparatuses, substrates, and substrate storage means. Nor.

[0082]

As described above, according to the present invention,
Adjustment of the transport path can be performed automatically, quickly, and easily, which has the effect of reducing the burden on the operator.

[Brief description of the drawings]

FIG. 1 is a plan view of a main part of a wire bonding apparatus including a substrate transfer device according to an embodiment of the present invention.

FIG. 2 is a view on arrow PP of FIG. 1;

FIG. 3 is a block diagram showing an operation control system of the device shown in FIG. 1;

FIG. 4 is a flowchart showing the operation of the apparatus shown in FIG.

FIG. 5 is a flowchart showing the operation of the apparatus shown in FIG.

FIG. 6 is an operation explanatory diagram of the apparatus shown in FIGS. 1 and 2;

FIG. 7 is an operation explanatory diagram of the device shown in FIGS. 1 and 2;

FIG. 8 is an operation explanatory diagram of the device shown in FIGS. 1 and 2;

FIG. 9 is an operation explanatory diagram of the device shown in FIGS. 1 and 2;

FIG. 10 is an enlarged view of a portion Q in FIG. 9;

FIG. 11 is an explanatory diagram of the operation of the apparatus shown in FIGS. 1 and 2;

FIG. 12 is a longitudinal sectional view showing a modified example of a part of the device shown in FIGS. 1 and 2;

FIG. 13 is an explanatory diagram of the operation of the apparatus shown in FIGS. 1 and 2;

FIG. 14 is a diagram illustrating the operation of the device shown in FIGS. 1 and 2;

FIG. 15 is an operation explanatory diagram of the device shown in FIGS. 1 and 2;

FIG. 16 is a plan view of another example of a lead frame to be handled in the device shown in FIGS. 1 and 2;

FIG. 17 is a plan view of a main part of a wire bonding apparatus including a conventional substrate transfer device.

FIG. 18 is a plan view of a portion of the device shown in FIG.

FIG. 19 is a view taken in the direction of arrows LL in FIG. 18;

[Description of sign]

DESCRIPTION OF SYMBOLS 1 Stand 2 Loader 3 Unloader 5 Heater plate 5a Depression 8 IC chip 9 Island 11 Bonding means 13,15 Push mechanism 14 Feed mechanism 17,18 Guide rail (guide member) 21,22 Guide member drive means 25,26,27,28 , 29, 43, 44 Sensors 33, 34, 38, 39 Restriction members 35, 36, 41 Restriction member driving means 47 CPU 49 Imaging device

Claims (10)

(57) [Claims] 1. A pre-order guided along the substrate in a predetermined path
Serial and both sides are arranged to correspond and toward and away from each other freely guiding member substrate, a guide member drive means for moving said guide member each, the guide member can guide the substrate engaged with said substrate double a first detecting means for detecting that that the status, the substrate in the guiding direction of the substrate of the guide member each
Arrange the substrate storage means to store several substrates and store the substrate
Transfer of the substrate between means and the guide member is possible
Restricting members for restricting the substrate storing means in various positions
When the regulating member driving means for the regulating member, respectively move <br/> freely the substrate housing means separable, and a second detecting means for detecting that said regulating member is regulated to the substrate housing means A substrate transfer device, comprising: At least the driving force generating means one has according to claim 2, wherein said guide member drive means and the regulating member driving means comprises a signal generating means for generating a signal corresponding to the operation amount,
Claim 1, characterized that you detecting that the signal of the signal generating means as said detecting means is no longer obtained
The substrate transfer device according to any one of the preceding claims. 3. A guide section for guiding a substrate along a predetermined route.
A plurality of regulating members are arranged in the direction in which the substrate
A board storage for accommodating a plurality of the above-mentioned boards in each of the regulating members.
Relatively close to the storage means, and each of the regulating members
Synchronously move the substrate storage means to the predetermined path
On the other hand, between the substrate storage means and the guide member,
It is positioned at a position where the board can be delivered and
The substrate protruding between the guide members from the means
A base characterized in that the guide members are brought close to each other.
Plate transport path adjustment method. 4. The method according to claim 3 , wherein the center of the substrate storage means in the width direction coincides with the center of the predetermined path. 5. A match in a position offset by a predetermined distance center relative to the center of the predetermined path in the width direction of the guide member respectively, and the substrate housing means by moving the regulating member each in synchronism in the same direction Claims characterized by
3. The method for adjusting a substrate transfer path according to 3 . 6. The method of claim 3 through claim, characterized in Rukoto such by setting the reference position of the guide member and the regulating member
5. The method of adjusting a substrate transfer path according to any one of the items 5 . 7. Any one substrate transport path adjustment method according one of claims 3 to 6, characterized in that to store the set position of the substrate housing means and said substrate relative to said predetermined path in the storage means. 8. A substrate transport path adjustment method as claimed in any one of claims 3 to 7, characterized in that the setting of feed of the substrate in a direction along the predetermined path. 9. juxtaposed at least three or more with the site to be subjected to predetermined work along the feed direction of the substrate on the substrate, the distance between the centers of sites each other located across at least one said site The average pitch between adjacent parts is obtained by measuring and dividing the center-to-center distance by the number obtained by subtracting one from the total number of parts located between the parts and between them. 9. The method for adjusting a substrate transfer path according to item 8 . 10. Place the imaging device in the vicinity of the predetermined path, the substrate conveying path as claimed in any one of claims 3 to 9, characterized in that performing the adjustment operation while monitoring with a imaging device Adjustment method.