JP2804507B2 - Manufacturing method of linear light source - Google Patents
Manufacturing method of linear light sourceInfo
- Publication number
- JP2804507B2 JP2804507B2 JP10078889A JP10078889A JP2804507B2 JP 2804507 B2 JP2804507 B2 JP 2804507B2 JP 10078889 A JP10078889 A JP 10078889A JP 10078889 A JP10078889 A JP 10078889A JP 2804507 B2 JP2804507 B2 JP 2804507B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- resin
- emitting diodes
- light source
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Discharging, Photosensitive Material Shape In Electrophotography (AREA)
- Exposure Or Original Feeding In Electrophotography (AREA)
- Light Sources And Details Of Projection-Printing Devices (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Description
【発明の詳細な説明】 （イ） 産業上の利用分野 本発明は発光ダイオードを用いた線状光源に関する。The present invention relates to a linear light source using a light emitting diode.
（ロ） 従来の技術 近年、原稿の照明や電子写真のイレース光源としてキ
セノン管や蛍光灯にかわり、発光ダイオードを用いた線
状光源が用いられる様になってきた。これは長尺の基板
上に発光ダイオードを一乃至数列に整列させ、その発光
ダイオードの周辺を包囲する様に枠体を配置し、発光ダ
イオードの上方には防塵カバーもしくは円柱状等の棒状
レンズを設けている。この線な線状光源は発光ダイオー
ドの整列ピッチや駆動電流の調整で所望の照度分布が得
やすく、また小型に出来るという長所がある。(B) Conventional technology In recent years, a linear light source using a light emitting diode has been used instead of a xenon tube or a fluorescent lamp as an illumination light source for an original or an erase light source for electrophotography. In this method, light-emitting diodes are arranged in one or several rows on a long substrate, a frame is arranged so as to surround the periphery of the light-emitting diodes, and a dust-proof cover or a rod-shaped lens such as a column is disposed above the light-emitting diodes. Provided. This linear linear light source has advantages in that a desired illuminance distribution can be easily obtained by adjusting the arrangement pitch of the light emitting diodes and the driving current, and the size can be reduced.
（ハ） 発明が解決しようとする課題 一般に発光ダイオードを用いる時はワイヤボンド線で
配線を施こし、特性の安定化および光取出効率向上のた
め透光性の樹脂を塗布している。線状光源の場合には、
特開昭58−222578号公報の如く発光ダイオードの列と直
交する一方向にワイヤボンドするか、特開昭62−237774
号公報の如く発光ダイオードの列と平行な一方向にワイ
ヤボンドを行っている。そして樹脂は、多く塗布すると
実開昭63−22760号公報の如くレンズ状となり集光性が
得られるものの、樹脂量の制御が困難で、その量及び硬
化後の形状により光学特性が著しく変化し、所望の照度
分布となり難い。そこで樹脂量を少なくしていたが、第
２図に破線（イ）（ロ）で示す様にわずかではあるが照
度変化が生じていた。そこでこれを検討した所、線状光
源は原稿等の全巾にわたる程の長尺ゆえ樹脂塗布におい
て樹脂補充が必要となり、その時に発光ダイオードとワ
イヤボンド線との間に大きな樹脂溜りができたり逆に樹
脂の塗布量が少なくて発光ダイオードの一部が露出する
ためであることが判った。(C) Problems to be Solved by the Invention In general, when a light emitting diode is used, wiring is provided with a wire bond line, and a light transmitting resin is applied to stabilize characteristics and improve light extraction efficiency. In the case of a linear light source,
As disclosed in JP-A-58-222578, wire bonding is performed in one direction orthogonal to a row of light-emitting diodes, or JP-A-62-237774.
As shown in the publication, wire bonding is performed in one direction parallel to the rows of light emitting diodes. When the resin is applied in a large amount, it becomes a lens shape as shown in Japanese Utility Model Application Laid-Open No. 63-22760 and light-collecting properties can be obtained. It is difficult to obtain a desired illuminance distribution. Therefore, although the amount of resin was reduced, the illuminance was slightly changed as shown by broken lines (a) and (b) in FIG. Therefore, when we examined this, the linear light source was so long as to cover the entire width of the original, etc., so it was necessary to replenish the resin in the resin application. It was found that the application amount of the resin was small and a part of the light emitting diode was exposed.
（ニ） 課題を解決するための手段 本発明は上述の点を考慮してなされたもので、樹脂溜
りが発光ダイオードとワイヤボンド線との間にて生じや
すいことに着目し、ワイヤボンド線の方向を少なくとも
２種類としたものである。また本発明はワイヤボンド方
向を発光ダイオードの列の略中央で逆向きにし、１端か
ら中央に向って樹脂塗布するものである。(D) Means for Solving the Problems The present invention has been made in consideration of the above points, and has been focused on the fact that a resin puddle is likely to be formed between a light emitting diode and a wire bond wire. There are at least two types of directions. Further, in the present invention, the wire bonding direction is reversed at substantially the center of the row of light emitting diodes, and the resin is applied from one end toward the center.
（ホ） 作用 これにより、ワイヤボンド線の方向が変化する部分で
樹脂補充を行い、または発光ダイオードの列の端部で樹
脂量を調節して補充なしに塗布することが出来、均一な
樹脂塗布が行え、照度分布を整えることができる。(E) Function By this, the resin can be replenished at the portion where the direction of the wire bond line changes, or the resin can be applied at the end of the row of the light emitting diode without replenishing by adjusting the amount of the resin. And illuminance distribution can be adjusted.
（ヘ） 実施例 第１図は本発明実施例の線状光源の断面図である。
（１）は基板で、ガラスエポキシ樹脂、紙フェノール樹
脂、アルミニウム等を基板として少なくとも表面に導電
パターン（図示せず）を有したプリント基板等からな
る。（２）（２）…は基板（１）上に１列（又は数列）
に整列された発光ダイオード、一辺0.2〜0.4mmの略さい
ころ状をなしたGaP、GaAsP等からなり、0.2〜10mmの所
定の間隔で配置されており、基板（１）の導電パターン
にワイヤボンド線（３）（３）…で配線を施こされてい
る。このワイヤボン線（３）（３）…は基板（１）の中
心位置（もしくは発光ダイオード（２）（２）…の列の
中心）を向くように、第１ボンドを発光ダイオード
（２）（２）…上に、第２ボンドを図の右側（左寄発光
ダイオード）又は左側（右寄発光ダイオード）の基板導
電パターン上にそれぞれワイヤボンドされ、これによっ
て方向が互いに逆で発光ダイオードの列に平行となって
いる。そしてこれらの発光ダイオード（２）（２）…と
ワイヤボンド線（３）（３）…は無色透明なシリコン等
からなる透光性の樹脂（４）（４）…で覆われている。
この樹脂（４）（４）…は、第１図に示されているよう
に、発光ダイオード（２）（２）の間に位置する樹脂の
高さが、ワイヤボンド線（３）（３）…の頂点よりも低
位置になるように少量塗布して形成されている。（５）
は発光ダイオード（２）（２）…を包囲するよう基板
（１）上に溶着ピン（６）（６）…等で固着された枠体
で、必要に応じて発光ダイオード（２）（２）…毎に仕
切反射部（７）（７）を設けてある。（８）は発光ダイ
オード（２）（２）…の上方に配置された棒状レンズ
で、その長手方向は発光ダイオード（２）（２）…の列
と一致しており、枠体（５）に固定されている。(F) Embodiment FIG. 1 is a sectional view of a linear light source according to an embodiment of the present invention.
The substrate (1) is a printed circuit board having a conductive pattern (not shown) on at least the surface thereof using glass epoxy resin, paper phenol resin, aluminum or the like as a substrate. (2) (2) ... is one row (or several rows) on the substrate (1).
The light emitting diodes are made of GaP, GaAsP, etc. in the shape of a die having a side of 0.2 to 0.4 mm, and are arranged at predetermined intervals of 0.2 to 10 mm. (3) Wiring is applied in (3) ... The first bonds are attached to the light emitting diodes (2) (2) so that the wire bonding wires (3) (3)... Face the center position of the substrate (1) (or the center of the row of the light emitting diodes (2) (2). )... Above, the second bond is wire-bonded on the substrate conductive pattern on the right side (left-side light emitting diode) or on the left side (right-side light emitting diode) of the figure, whereby the directions are opposite to each other and parallel to the row of light emitting diodes. It has become. The light emitting diodes (2) (2) and the wire bond lines (3) (3) are covered with a transparent resin (4) (4) made of colorless and transparent silicon or the like.
As shown in FIG. 1, the height of the resin located between the light emitting diodes (2) and (2) is increased by the wire bond wires (3) and (3). Are formed by applying a small amount so as to be lower than the top of. (5)
Is a frame fixed by welding pins (6), (6), etc. on the substrate (1) so as to surround the light emitting diodes (2), (2). .. Are provided with partition reflecting portions (7) and (7). (8) is a rod-shaped lens arranged above the light emitting diodes (2), (2)..., And its longitudinal direction coincides with the row of the light emitting diodes (2), (2). Fixed.
以上の様な構成において、発光ダイオード（２）
（２）…を基板（１）に載置しワイヤボンドしたあと、
樹脂を刷毛塗りするときは基板端部で刷毛に含んだ樹脂
量を調整した後、第１ボンド側から第２ボンド側に向っ
て順次樹脂塗布して中央で塗布を終了する際にすれば、
A3版用の線状光源まではいずれも均一な樹脂量が塗布で
きる。これは各々の発光ダイオード塗布において、塗り
はじめの時発光ダイオードにより樹脂が薄膜化し、その
膜で発光ダイオードとワイヤボンド線からなる突起全体
を覆い、この時全樹脂量が規定され、その後樹脂の粘性
によって溜まりやすい部分に樹脂が集まるので、形も整
うからである。In the above configuration, the light emitting diode (2)
(2) After placing on the substrate (1) and wire bonding,
When applying the resin by brush, after adjusting the amount of resin contained in the brush at the end of the substrate, the resin is sequentially applied from the first bond side to the second bond side, and when the application is completed at the center,
A uniform amount of resin can be applied to the linear light source for the A3 plate. This is because, in each light-emitting diode coating, the resin is thinned by the light-emitting diode at the beginning of coating, and the film covers the entire protrusion consisting of the light-emitting diode and the wire bond wire. This is because the resin collects in the portion where it easily accumulates, so that the shape is adjusted.
もた、刷毛やディスペンサにおいて樹脂の補充を必要
とする場合、ワイヤボンド方向をかえることで塗布又は
滴下、拡散の方向を異ならせる事なるので、樹脂量の少
ないもの同志又は多いもの同志が近接することとなり照
度分布の突然の変化は生じない。If the brush or dispenser requires replenishment of the resin, the direction of application or dripping by changing the wire bond direction will be different, so that the one with a small amount of resin or the one with a large amount of resin come close to each other That is, no sudden change in the illuminance distribution occurs.
（ト） 発明の効果 以上の如くにより近接する発光ダイオードに対する樹
脂量が略等しくなるので、例えば第２図の曲線（ハ）の
様な照度分布を要求された場合にも破線（イ）（ロ）の
如き照度変化は生じない。(G) Effect of the Invention As described above, the resin amounts for the light emitting diodes closer to each other become substantially equal, and therefore, even when an illuminance distribution like a curve (c) in FIG. 2 is required, for example, a broken line (a) (b) No change in illuminance as in the case of (1).
第１図は本発明実施例の線状光源の断面図、第２図は照
度分布図である。 （１）……基板、（２）……発光ダイオード、（３）…
…ワイヤボンド線、（４）……樹脂。FIG. 1 is a sectional view of a linear light source according to an embodiment of the present invention, and FIG. 2 is an illuminance distribution diagram. (1) ... substrate, (2) ... light-emitting diode, (3) ...
... wire bond wire, (4) ... resin.
Claims (1)
する工程と、発光ダイオードと基板との配線を発光ダイ
オードの列の略中央部で方向が逆転するようにワイヤボ
ンドにより行う工程と、透光性の樹脂を列の端部から中
央に向け発光ダイオードとワイヤボンド線とを覆うよう
に塗布する工程とを具備した事を特徴とする線状光源の
製造方法。A step of aligning and mounting a plurality of light emitting diodes on a substrate; and a step of performing wire bonding so that the wiring between the light emitting diodes and the substrate is reversed at a substantially central portion of a row of the light emitting diodes. Applying a translucent resin so as to cover the light emitting diode and the wire bond line from the end of the row toward the center of the row.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10078889A JP2804507B2 (en) | 1989-04-20 | 1989-04-20 | Manufacturing method of linear light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10078889A JP2804507B2 (en) | 1989-04-20 | 1989-04-20 | Manufacturing method of linear light source |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10047556A Division JPH114022A (en) | 1998-02-27 | 1998-02-27 | Linear light source |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02278885A JPH02278885A (en) | 1990-11-15 |
| JP2804507B2 true JP2804507B2 (en) | 1998-09-30 |
Family
ID=14283185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10078889A Expired - Lifetime JP2804507B2 (en) | 1989-04-20 | 1989-04-20 | Manufacturing method of linear light source |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2804507B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57173361U (en) * | 1981-04-27 | 1982-11-01 | ||
| JPH0639461Y2 (en) * | 1987-02-19 | 1994-10-12 | 三洋電機株式会社 | Linear light source |
-
1989
- 1989-04-20 JP JP10078889A patent/JP2804507B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02278885A (en) | 1990-11-15 |
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