JP2801738B2 - Semiconductor device and outer lead bonding method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial application field) The present invention relates to, for example, a semiconductor device formed by bonding an outer lead of a TAB component to an inner lead of a lead frame, and the semiconductor device. Outer lead bonding method.

(Prior Art) For example, as shown in FIG. 5, a plastic QFP (Qua
d Flat Package) 1 Internal connection (IC chip 2)
And the inner leads 3 of the lead frame are connected by wire bonding using gold wires 3a or the like. However, in the case where the internal connection is performed by wire bonding as described above, the limit is to manufacture a plastic QFP having 200 leads, and it is difficult to manufacture a plastic QFP having more leads.

Therefore, recently, as shown in FIG. 6, TAB (Tape) is used for the internal connection of the plastic QFP4 having a lead count exceeding 200 pins.
Attention has been focused on methods of applying Automated Bonding technology. By applying the TAB technology in this way, for example, it is possible to perform internal connection of a 300-pin class plastic QFP.

That is, a plastic QFP (hereinafter, referred to as QFP) 4 as a semiconductor device in which the above-described TAB technology is applied to the internal connection is used as an IC chip 2
A TAB component 6 comprising an outer lead 5 projecting outside the IC chip 2 is sealed in a plastic package 7. The QFPs 4 are connected together at one end of the outer leads 5 to predetermined positions of the IC chip 2 via bumps (protruding electrodes) or the like.

Further, the QFP 4 has a belt-like support ring 8 extending in the direction in which the outer leads 5 are arranged as shown in FIG. In the QFP 4, the support ring 8 is partially located on the outer leads 5, that is, in the middle of the outer leads 5 in the longitudinal direction, and the outer leads 5 are integrally held by the support ring 8.

The QFP 4 is outer lead-bonded, and the other end of the outer lead 5 is formed on the lead frame and then separated from the lead frame and the base end of the inner lead 3. It is connected to the. The QFP 4 arranges the base end of the inner leads 3... And the support ring 8 substantially horizontally, and separates the base end of the inner leads 3.

Furthermore, the outer lead bonding of the TAB component 6
Although not shown, a TAB component 6 is held and aligned with the lead frame, and a rod-shaped vertically movable bonding tool is used which heats the outer leads 5... Is being done.

(Problems to be solved by the invention) By the way, in QFP4 as described above, inner leads 3 ...
Are set to small values of, for example, about 150 μm, and the mechanical strength of the inner leads 3 is weak. For this reason, in the outer lead bonding step, the inner leads 3... May be bent in the arrangement direction and contact adjacent inner leads by being pressed by the bonding tool.

In the outer lead bonding step, the outer leads 5 ...
The bonding portion between the inner lead 3 and the inner lead 3 may adhere to the bonding tool. When the bonding tool rises after the thermocompression bonding and releases the TAB component 6, the TAB component 6 is lifted by the bonding tool. was there.

An object of the present invention is to provide a semiconductor device having a good yield by preventing the inner lead from being bent and coming into contact with an adjacent inner lead during the outer lead bonding.

After connecting the outer lead and inner lead,
Outer lead bonding with excellent reliability of connection between the outer lead of the TAB component and the inner lead of the lead frame by reliably releasing the B component and preventing the TAB component from being lifted while adhering to the bonding tool It is to provide a method.

[Structure of the Invention] (Means and Actions for Solving the Problems) In order to achieve the above object, the present invention provides a TAB in which an IC chip is internally lead-bonded at one end and a lead used as an outer lead is formed at the other end. In a semiconductor device having parts and integrally holding the outer lead by a support body made of an insulating material and connecting the outer lead to an inner lead formed on a lead frame, the semiconductor device includes the inner lead and the outer lead. The inner lead and the outer lead are connected with the support body interposed therebetween.

Further, a lead is formed in which an IC chip is inner-lead bonded to one end and a lead used as an outer lead is formed on the other end, and the outer lead of a TAB product in which the outer lead is integrally held by a support body made of an insulating material is a lead frame. In the outer lead bonding method for connecting to the inner lead formed in the above, the positioning step of aligning the outer lead of the TAB component and the inner lead of the lead frame while holding the TAB component by a vertically movable suction nozzle; A mounting step of lowering the suction nozzle to mount the outer lead of the TAB component on the inner lead and contacting the support body with the inner lead, and lowering a vertically movable bonding tool to lower the TAB component by the suction nozzle. Holding the above bonding tool A connection step of pressing the outer lead against the inner lead by pressing the outer lead with the inner lead, and a bonding tool raising step of independently raising the bonding tool while holding the TAB component by the suction nozzle. did.

By doing so, the present invention can prevent the inner lead from being bent and coming into contact with an adjacent inner lead during the outer lead bonding, and can improve the yield of the semiconductor device.

After connecting the outer lead and inner lead, TAB
The reliability of the connection between the outer lead of the TAB component and the inner lead of the lead frame can be improved by reliably releasing the component and preventing the TAB component from being lifted by the bonding tool.

(Embodiment) Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
Description will be made based on (d). In addition, the same numbers as those described in the section of the related art are assigned the same numbers,
The description is omitted.

6 in each figure is formed by inner lead bonding using TAB (Tape Automated Bonding) technology, and is a plastic QFP (Quad Flat Packag) as a semiconductor device.
e) TAB parts built into a plastic package. The TAB component 6 is obtained by mounting the IC chip 2 on a tape carrier made of, for example, a synthetic resin and then punching the IC chip 2 from the tape carrier. And TAB parts 6
Has a large number of outer leads 5, whose one ends are connected to the IC chip 2 via bumps (protruding electrodes), protruding radially.

As shown in FIGS. 2 and 3, the TAB component 6 is formed using a part of the tape carrier, extends in the direction in which the outer leads 5 are arranged, and straddles the outer leads 5. It has a belt-shaped support ring 8 (support body) made of. The TAB component 6 has the support ring 8 positioned at a middle portion in the longitudinal direction of the outer leads 5 and fixed to the outer leads 5 from the side where the IC chip 2 is located. The TAB component 6 integrally holds the outer leads 5 by the support ring 8.

Further, in each figure, reference numerals 3... Denote inner leads to which the TAB component 6 is subjected to outer lead bonding. The inner leads 3 are formed integrally with a lead frame 9 as shown in FIG. 1, and have front ends (not shown) projecting from the plastic package in four directions. The inner leads 3 are arranged substantially horizontally with the IC chip 2 as shown in FIG. 2, and enter under the outer leads of the TAB component 6.

Furthermore, the inner leads 3 have extension portions 10 at the base end thereof, and the extension portions 10 reach the lower side of the support ring 8 of the TAB component 6. The inner leads 3 are provided with support rings 8 on their base end surfaces 11.
The extension portions 10 are brought into surface contact with the support ring 8 at a pressure sufficient to prevent slippage between the support ring 8 and the support ring 8.

The inner leads 3 sandwich the support ring 8 between the extension 10 and the outer leads 5. The support ring 8 extends in the direction in which the extension 10 is arranged. It is held together.

Further, the inner leads 3 are formed such that the support ring 8 is interposed between the extension 10 and the outer lead 5, and the tip of the outer lead 5 is bent so as to cover the support ring 8. Is thermocompression-bonded to the upper surface of the proximal end.

That is, such TAB parts 6 and inner leads 3 ...
In the plastic QFP having the above, the inner leads 3 are held by the support ring 8 of the TAB component 6,
It is possible to prevent the inner leads 3 from being displaced in the arrangement direction due to the pressing force during the outer lead bonding. Therefore, the inner leads 3 can be prevented from contacting adjacent inner leads, and the plastic QFP
Yield and reliability can be improved.

In addition, the above-described TAB component 6 and inner leads 3 are:
Outer lead bonding is performed as shown in FIGS. 4 (a) to 4 (d).

That is, as shown in FIG. 4 (a), the bonding tool 12 is disposed substantially along the axis of the vertically movable bonding tool 12, moves in a horizontal direction integrally with the bonding tool 12, and is independent of the bonding tool 12. The TAB component 6 is sucked by the suction nozzle 13 that can be moved up and down, and the IC chip 2 is held with the IC chip 2 facing downward. Then, the suction nozzle 13 is horizontally moved together with the bonding tool 12, and the TAB component 6 is conveyed to be opposed to the lead frame 9 placed on the bonding stage 14 from above.

After the outer leads 5 of the TAB component 6 are aligned with the inner leads 3 of the lead frame 9, the fourth lead
As shown in FIG. 2B, the suction nozzle 13 is lowered independently of the bonding tool 12, and the support ring 8 of the TAB component 6 is brought into contact with the extension 10 of the inner lead 3.

Further, while holding the TAB component 6 by the suction nozzle 13, the bonding tool 12 is lowered, and as shown in FIG. 4 (c), the front end surface of the heated bonding tool 12 is moved from the support ring 8 of the outer leads 5. Also press against the outside part. Then, the tip of the outer leads 5 is pressed by the bonding tool 11, and the outer leads 5 are pressed.
Are bent stepwise so as to cover the support ring 8, are brought into contact with the inner leads, and are thermocompression-bonded to the inner leads 3..

After connecting the outer leads 5 to the inner leads 3 by thermocompression bonding, first, while holding the TAB component 6 on the lead frame 9 by the suction nozzle 13, the bonding tool 12 is raised, and the bonding tool 12 is moved. It is separated from the bonding parts 15. Then, after releasing the TAB component 6 from the bonding tool 12, the suction nozzle 13 is raised and separated from the TAB component 6, and the outer lead bonding is completed as shown in FIG. 4 (d).

That is, in such an outer lead bonding method, the bonding tool 12 is raised while the TAB component 6 is held on the lead frame 9 by the suction nozzle 123. Therefore, the outer leads 5 are replaced with the inner leads 3.
When the bonding portion 15 is attached to the bonding tool 12 when thermocompression bonding is performed on the TAB component 6 and the bonding tool 1
2 can be surely separated.

Therefore, the TAB component 6 can be reliably released from the bonding tool 12 after thermocompression bonding, and the TAB component 6 is not lifted by the rising bonding tool 12. The reliability of the connection between the outer leads 5 of the TAB component 6 and the inner leads 3 of the lead frame 9 can be improved.

Further, the support ring 8 of the TAB part is brought into contact with the inner leads 3... And the outer leads 5 and the inner leads 3.
And the inner leads 3 can be held and positioned by using the support ring 8 and also serving as the inner ring. Therefore, the bonding tool
When pressurized by 12, the inner leads 3 can be prevented from being bent and coming into contact with adjacent inner leads. Further, the yield and reliability of the plastic QFP can be improved.

[Effect of the Invention] As described above, the present invention has a TAB component in which a plurality of outer leads are protruded outward by inner lead bonding, and the outer leads are integrally and partially held by a support ring made of an insulating material. In addition, in a semiconductor device in which the outer lead is crimped and connected to the inner lead formed on the lead frame, the inner lead is provided with an extension extending to the center side of the TAB component, and a support is provided between the extension and the outer lead. With the ring interposed, the inner lead was held using a support ring.

In addition, in the outer lead bonding method of connecting multiple outer leads of a TAB component to multiple inner leads formed on a lead frame, the TAB component is held by a suction nozzle that can move up and down, and this TAB component is aligned with the inner lead. A first step of lowering the suction nozzle, placing the TAB component on the inner lead, and partially contacting the support ring integrally holding the outer lead with the inner lead; The third step of lowering the free bonding tool and pressing the outer lead by the bonding tool while pressing the outer lead to the inner lead while holding the TAB component by the suction nozzle, and after connecting the outer lead to the inner lead, Raises the bonding tool independently while holding the TAB component with the suction nozzle And and a fourth step of separating the bonding tool from the outer leads.

Therefore, the present invention can prevent the inner lead from being bent and coming into contact with an adjacent inner lead at the time of outer lead bonding, and can improve the yield of the semiconductor device.

After connecting the outer lead and inner lead,
There is an effect that the reliability of the connection between the outer lead of the TAB component and the inner lead of the lead frame can be improved by reliably releasing the B component, preventing the TAB component from being lifted by the bonding tool, and the like.

[Brief description of the drawings]

1 to 4 (a) to (d) show the main parts of one embodiment of the present invention, and FIG. 1 is a perspective view schematically showing a state in which a TAB component is outer lead bonded to a lead frame. FIG. 2, FIG. 2 is a side view showing the outer lead bonded TAB component, FIG. 3 is an enlarged plan view showing the bonding portion, and FIGS. 4 (a) to 4 (d) are outer lead bonding methods. FIG. 5 to FIG. 8 show a conventional example, FIG. 5 is a side sectional view showing a type of plastic QFP employing wire bonding for internal connection, and FIG. FIG. 7 is a side sectional view showing the same plastic QFP of the type employing the TAB technology, FIG. 7 is a side view showing a TAB component subjected to outer lead bonding, and FIG. 8 is an enlarged plan view showing a bonding portion. 3 ... Inner lead, 4 ... Plastic QFP (semiconductor device), 5 ... Outer lead, 6 ... TAB parts, 8 ...
Support ring, 9 Leadframe, 10 Extension, 12 Bonding tool, 13 Suction nozzle.

Claims (2)

(57) [Claims] 1. A TAB component having an IC chip on one end side and a lead used as an outer lead on the other end side, and the outer lead is integrally held by a support body made of an insulating material. A semiconductor device having the outer lead connected to an inner lead formed on a lead frame, wherein the inner lead and the outer lead are connected with the support body interposed between the inner lead and the outer lead. Semiconductor device. 2. An outer lead of a TAB product in which an IC chip is internally lead-bonded at one end and a lead used as an outer lead is formed at the other end, and the outer lead is integrally held by a support made of an insulating material. In an outer lead bonding method for connecting to an inner lead formed on a lead frame, a positioning step of positioning the outer lead of the TAB component and the inner lead of the lead frame while holding the TAB component by a suction nozzle that can be moved up and down. And a mounting step of lowering the suction nozzle, mounting the outer lead of the TAB component on the inner lead, and contacting the support body with the inner lead, and lowering a vertically movable bonding tool to lower the suction nozzle. While holding the TAB parts, A connecting step of pressing the outer lead by pressing the outer lead to the inner lead and connecting the inner lead to the inner lead, and a bonding tool raising step of independently raising the bonding tool while holding the TAB component by the suction nozzle. An outer lead bonding apparatus characterized in that: