JP2796712B2 - IC socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an IC socket for connecting an electric component such as an IC package to an external circuit.
Particularly, the present invention relates to an IC socket suitable for applying a high-frequency electric signal.

[0002]

2. Description of the Related Art In the case of an IC socket using a high-frequency electric signal, the inductance due to the length of a contact pin affects the test result of an IC package. Therefore, it is necessary to shorten the length of the contact pin. is there.
There is also a method of directly mounting an IC package on a circuit board without using contact pins.However, in general, the strength of a circuit board is low. Such a method cannot be applied to the case where the IC package must be frequently replaced because the IC package may be damaged. Therefore, the conventional I
In the inspection of the C package, etc., it has been practiced to make the contact pins have a substantially linear shape and to minimize the distance of the electric flow path between the lead of the IC package mounted on the IC socket and the external circuit. .

FIG. 4 is a sectional view showing an example of a conventional high frequency IC socket. A large number of linear contact pins 2 are implanted in the socket body 1, and the IC package 6 is mounted on the socket body 1 such that the leads 6a of the IC package are placed on the contact portions 2a of the contact pins. . Next, by closing the cover 3 pivotally attached to the socket body 1, the leads 6 a are individually connected to the contact pins 2 a by the pressing members 4 attached to the cover 3 in the same number as the contact pins 2. , Electrical connection between each lead 6a and the contact pin 2 is performed.

[0004] Pressing the contact pins 2 by separate pressing members 4 against the leads 6a one by one is performed as follows.
This is for pressing each lead 6a with an equal force.
If a single pressing member 4 attempts to press a large number of leads 6a, the pressing members 4 and the leads 6
a , the lead 6a cannot be pressed with an equal force, and the difference in pressing force between the lead 6a and the contact pin is reduced. This may affect the current flowing through the contact portion with the contact portion 2a.

At present, electrical components such as IC packages have a small space between leads 6a for high integration.
a itself tends to be thin. Then, the lead 6a and the contact pin 2 must be positioned with high precision. Generally, the dimensional tolerance of the IC package body 6b is often not strict.
Cannot be used to accurately position the lead 6a and the contact pin 2. Therefore, when it is necessary to position the lead 6a and the contact pin 2 with high accuracy, the lead 6a is positioned by providing a positioning portion for the lead in the socket body 1.
The electrical connection between the lead 6a and the contact pin 2 has been made.

[0006]

An IC as shown in FIG.
In the case of a socket, generally, the socket body 1 and the cover 3 are made by molding a synthetic resin, and the metal support shaft 7 is simply inserted into holes provided in the socket body 1 and the cover 3 made of the synthetic resin. As a result, the cover 3 is pivotally attached to the socket body 1. Therefore, cover 3
In order for the support shaft 7 to be able to rotate smoothly with respect to the socket body 1, it is necessary to provide the support shaft 7 with a certain clearance so as to pass through the holes of the socket body 1 and the cover 3. Then, the pressing member 4 attached to the cover 3 and the contact pin 2 implanted in the socket main body 1 cannot be aligned with high accuracy, and the pressing member 4 securely connects the lead 6a. In some cases, the leads 6a could not be pressed, or in some cases, some of the many leads 6a were not pressed at all, resulting in poor electrical connection between the leads 6a and the contact pins 2.

[0007] If a bearing or the like is attached to the above-mentioned hole provided in the socket body 1 and the cover 3, the cover 3 can be attached to the socket body 1 with almost no displacement. 1
However, if a bearing is used, the IC socket becomes very expensive, and the IC socket itself must be large enough to mount the bearing. there were.

An IC socket in which the socket body 1 and the cover 3 are completely separated from each other and the cover 3 is positioned with respect to the socket body 1 by a positioning member provided on the socket body 1 only when the cover 3 is closed is also known. However, even in this case, the clearance during positioning
Can not be eliminated at all, so high-precision positioning
There was a problem in doing.

SUMMARY OF THE INVENTION In view of the above problems, the present invention provides an IC for high frequency
In the socket, electrical components such as an IC package in which the leads 6a are thin and the distance between the leads 6a is very narrow are mounted, and electrical connections between the electrical components such as the IC package and an external circuit can be reliably performed. It is another object of the present invention to provide an IC socket that can easily and automatically mount and remove electric components such as an IC package.

[0010]

According to the present invention, a pressing member for pressing a lead of an electric component such as an IC package against a contact portion of a contact pin is attached to a socket body like a contact pin, and a cover is provided on the cover. , IC in the center
An opening through which electrical components such as a package can be taken in and out, and an engaging portion for engaging with the pressing member are provided, and the mounting member is vertically movably attached to the socket body. The above-mentioned problem is solved by enabling cancellation.

[0011]

The contact pin and the pressing member are attached to the socket body so that the positioning of the contact pin and the pressing member can be performed with high precision. The cover has an opening in the center through which electric components such as an IC package can be taken in and out. This allows electrical components such as an IC package to be attached to and detached from the IC socket without opening and closing the cover. In addition, the electrical components such as the IC package mounted on the IC socket have their leads pressed by the pressing member to the contact portions of the contact pins. Because it is fixed by being pressed against
Even if the hole is provided in the center of the cover, the electric components such as the IC package do not come off the IC socket.

[0012]

FIG. 1 is a partially cutaway side view showing an example of a high frequency IC socket according to the present invention, and FIG.
FIG. 3 is a partial sectional view showing a state where an IC package is mounted on the IC socket shown in FIG.

In the drawing, 1 is a socket body, 2 is a large number of contact pins which are implanted in the socket body 1 and have a straight upper portion, and 3 is elastically pressed upward against the socket body 1 by an elastic member (not shown). The cover 3 is attached to the socket body 2 so as to be movable up and down in a state where the cover 3 is opened. Reference numeral 4 denotes a pressing member which is implanted in the socket body 1 in the same number as the number of the contact pins 2.
b and can be engaged with each other.
Can elastically press the contact portion 2a of the contact pin. Reference numeral 5 denotes a convex portion for positioning a lead integrally provided on the socket main body 1, and reference numeral 6 denotes an IC package including a package main body 6b having a large number of leads 6a.

When the cover 3 is pressed downward against the elastic pressure of an elastic member (not shown), the action portion 4a of the pressing member is moved by the engaging portion 3b provided on the cover 3 to the spring provided on the pressing member 4. The portion 4c is moved outward in the socket body 1 by elastically deforming it. Then, the press contact portion 4b of the pressing member moves obliquely upward. At this time,
The IC package 6 is inserted through an opening 3a provided at the center of the cover 3, and the socket body is used so that the leads 6a of the IC package are respectively mounted on the contact portions 2a of the respective contact pins using the projections 5. 1 is mounted with the IC package 6.

Next, when the pressing down of the cover 3 is released,
The cover 3 is returned to its original position by the elastic restoring force of an elastic member (not shown), and the press contact portion 4b of the pressing member is also returned to the original position by the elastic restoring force of the spring portion 4c.
Connect the lead 6a of the C package to the contact portion 2 of the contact pin.
a, so that the lead 6a and the contact pin 2 can be electrically connected.

As can be seen from the above description, the I of the present invention
The C socket is a conventional so-called open-top type I socket.
It operates almost the same as the C socket. Therefore, the conventional IC package automatic attachment / detachment system of the open top type IC socket can be used almost as it is.

As a manufacturing method of the pressing member 4, for example, a metal plate having elasticity is punched to form a shape, and the pressing portion 4 is formed.
b may be coated with an insulating material, or may be made by punching out an insulating and elastic alloy plate or the like. Further, depending on the purpose of use of the IC socket, the pressing member 4 may not have insulating properties. Immediately
If the pressing member 4 is formed of a conductive material, the pressing member 4
Can also be used as contact pins, in which case
Has an external end extending downwardly into a portion to be implanted in the socket body 1.
Contact on the circuit board.
The contact portions 2a and 4b of the top pins 2 and 4 are used as Kelvin measurement terminals.
Can be used.

[0018]

Since the high-frequency IC socket of the present invention has the above-described structure, it is possible to mount an electric component such as an IC package having fine leads and a narrow interval between the leads, and to make each lead and the contact pin. Electrical connection can be made reliably.

[Brief description of the drawings]

FIG. 1 is a partially cutaway side view showing an example of a high-frequency IC socket according to the present invention.

FIG. 2 is a plan view of the IC socket shown in FIG.

FIG. 3 is a partial sectional view showing a state where an IC package is mounted on the IC socket shown in FIG. 1;

FIG. 4 is a sectional view showing an example of a conventional high frequency IC socket.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Socket main body 2 Contact pin 2a Contact part 3 Cover 3b Engaging part 4 Pressing member 4a Working part 4b Pressure contact part 4c Spring part 5 Convex part 6 IC package 6a Lead 6b IC package body

Claims (1)

(57) [Claims] An electrical component such as an IC package is mounted on a socket body, and a plurality of contact pins for connecting a plurality of leads of the electrical component such as the IC package and an external circuit substantially linearly are implanted in the socket body. In the high frequency IC socket provided, a plurality of pressing members for independently pressing the respective leads against the contact portions of the respective contact pins are provided with a press contact portion, a spring portion, and an action portion,
A cover, which is implanted in the socket body and further has an opening through which an IC package can be taken in and out, and an engaging portion engageable with the action portion of the pressing member, is attached to the socket body so as to be vertically movable, and the cover is attached to the socket body. By moving up and down, an elastic force of a spring portion of the pressing member presses and presses a pressing portion of the pressing member against a lead of an IC package mounted on the socket body. Characteristic IC socket.