JP2794905B2 - Microwave band IC package - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microwave band IC package for encapsulating a semiconductor integrated circuit operating in a high frequency band of several tens of MHz or more, particularly in a millimeter wave band of 30 GHz or more. It is.

[Conventional technology]

FIG. 4 (a) is a perspective view showing an example of a conventional microwave band IC package (beam lead type), and FIG. 4 (b) is a perspective view showing another conventional example (microstrip type). In these figures, 1 is a package body, 2 is an input / output microstrip line for chip connection, 3 is an input / output beam lead for external circuit connection, and 4 is an input / output microstrip line for external circuit connection.

FIG. 5 (a) shows the microwave band IC package (beam lead type) shown in FIG.
F) It is a perspective view which shows the state which is evaluating the characteristic.
FIG. 5 (b) shows the microwave band IC of FIG. 4 (b).
FIG. 6 is a perspective view showing a state in which high-frequency (RF) characteristics of a package for use (microstrip type) are evaluated using a jig. 5 is an evaluation jig, 6 is a beam lead holder, 7 is an IC chip, and 8 is a bonding wire.

[Problems to be solved by the invention]

In a beam lead type package as shown in FIG. 4 (a), as shown in FIG. 5 (a), since a simple metal plate is used as the beam lead 3, the characteristic impedance changes as the distance from the package end surface increases. There is a problem that reflection and loss increase.

Further, in a microstrip type package as shown in FIG. 4 (b), as shown in FIG. 5 (b), it is necessary to connect to an external circuit using a bonding wire 8 at the time of measurement, so that workability is improved. Further, there is a problem that reflection and loss increase due to the parasitic inductance of the bonding wire 8.

In order to connect to a module or a measuring jig outside the package body 1, the length is several millimeters, and if the characteristic impedance becomes inaccurate due to the long length, the adverse effect is greatly affected. Also, use at high frequencies has been difficult.

The present invention has been made to solve such a problem, and an object of the present invention is to provide a microwave band IC package that has low loss and low reflection up to high frequencies and is easy to evaluate.

[Means for solving the problem]

A package for a microwave band IC according to the present invention is a lead-like dielectric film made of a flexible thin-film tape for forming a coplanar line having a signal line and a ground line for connecting an RF signal between the package and an external circuit. And the lead-like dielectric film is extended into the package and integrally formed as a part of the package.

[Action]

In the present invention, a lead-like dielectric film made of a flexible thin film tape forming a coplanar line is extended into the package and integrated as a part of the package to connect to an external circuit. The characteristic impedance is constant up to the point away from the package, and a package with low loss and low reflection can be obtained.

〔Example〕

 Hereinafter, the present invention will be described.

FIG. 1 is a perspective view showing an embodiment of a microwave band IC package according to the present invention. In this figure, FIG.
The same reference numerals as those in FIG. 5 denote the same parts, 9 is a lead-like dielectric film made of a flexible thin tape such as polyimide, 10 is a signal line, 11 is a ground line, and the lead-like dielectric film is Reference numeral 9 denotes a coplanar line having a ground line 11 on both sides of a signal line 10 and extends to the inside of the package 1 to be integrally formed as a part of the package body.

 Next, the operation will be described with reference to FIG.

FIG. 2 is a perspective view showing a state where the high frequency characteristics of the microwave band IC package of FIG. 1 are being measured. Since the lead-like dielectric film 9 has a certain degree of elasticity, it is easy to adhere the signal line (not shown) provided on the back surface of the lead holder 6 to the signal line 10 provided on the lead-like dielectric film 9. And has good workability. Also, since the parasitic inductance is very small, reflection and loss at the package end face are very small.

In the above embodiment, the signal line 10 and the ground line 11 are provided on the surface of the dielectric film 9, but as shown in FIG. 3, they are formed on the back surface of the dielectric film 9 to form a coplanar line. This has the same effect as the above embodiment.

〔The invention's effect〕

As described above, the present invention uses a lead-like dielectric film made of a flexible thin-film tape forming a coplanar line for connection of an RF signal between a package and an external circuit. Is extended inside the package and is integrally formed as a part of the package, so that the characteristic impedance is constant up to the position away from the end face of the package, and a package with low loss, low reflection and easy evaluation can be obtained.
A high-precision pattern can be produced, and since the connection with the evaluation jig is made at one point, the connection is easy and the high-frequency characteristics are greatly improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of a microwave band IC package according to the present invention, FIG. 2 is a perspective view showing a state in which high frequency characteristics of the package are being measured, and FIG. FIG. 4 (a) is a perspective view showing an embodiment, FIG. 4 (a) is a perspective view showing an example of a conventional microwave band IC package (beam lead type), and FIG. 4 (b) is another conventional example (micro strip type). 5 (a) is a perspective view showing a state in which the evaluation of the beam lead type package of FIG. 4 (a) is being performed, and FIG. 5 (b) is a view showing FIG. 4 (b). FIG. 4 is a perspective view showing a state in which the microstrip type package is being evaluated. In the figure, 1 is a package body, 2 is an input / output microstrip line for chip connection, 9 is a lead-like dielectric film, 10 is a signal line, and 11 is a ground line. The same reference numerals in each drawing indicate the same or corresponding parts.

Continuation of front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 23/00-23/10

Claims (1)

(57) [Claims] A lead-like dielectric film made of a flexible thin film tape forming a coplanar line having a signal line and a ground line is used for connection of an RF signal between a package and an external circuit. A microwave band, wherein a body film is extended inside the package and integrally formed as a part of the package.
IC package.