JP2784668B2 - Method of forming partition wall in hollow fiber membrane module - Google Patents

Method of forming partition wall in hollow fiber membrane module

Info

Publication number
JP2784668B2
JP2784668B2 JP19324189A JP19324189A JP2784668B2 JP 2784668 B2 JP2784668 B2 JP 2784668B2 JP 19324189 A JP19324189 A JP 19324189A JP 19324189 A JP19324189 A JP 19324189A JP 2784668 B2 JP2784668 B2 JP 2784668B2
Authority
JP
Japan
Prior art keywords
cover
hollow fiber
fiber membrane
partition wall
partition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP19324189A
Other languages
Japanese (ja)
Other versions
JPH0356127A (en
Inventor
篤 北川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP19324189A priority Critical patent/JP2784668B2/en
Publication of JPH0356127A publication Critical patent/JPH0356127A/en
Application granted granted Critical
Publication of JP2784668B2 publication Critical patent/JP2784668B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Separation Using Semi-Permeable Membranes (AREA)

Description

【発明の詳細な説明】 <産業上の利用分野> 本発明は中空糸膜モジュールの端部に樹脂隔壁を成形
する方法に関するものである。
The present invention relates to a method for forming a resin partition at an end of a hollow fiber membrane module.

<従来の技術> 原液中からの固形分の分離、原液中からの特定の液体
の分離、液体中からの気体の分離あるいは、混合気体中
からの特定の気体の分離に、透過膜(MF、UFあるいはRO
等)を使用することが公知であり、特に、単位容積当り
の膜面積を大きくとり得る中空糸膜が注目されている。
中空糸膜を用いたモジュールには、種々の形式のものが
提案されているが、通常の中空糸膜モジュールにおいて
は、中空糸膜束を筒状カバー内に収納し、カバー両端の
少くとも一端に高耐圧性の樹脂隔壁、例えば、エポキシ
樹脂隔壁を注型することが不可欠である。
<Prior art> Separation of solids from a stock solution, separation of a specific liquid from a stock solution, separation of a gas from a liquid, or separation of a specific gas from a mixed gas, using a permeable membrane (MF, UF or RO
) Is known, and hollow fiber membranes, which can take a large membrane area per unit volume, have attracted attention.
Various types of modules using hollow fiber membranes have been proposed.In a general hollow fiber membrane module, a hollow fiber membrane bundle is housed in a cylindrical cover, and at least one end of both ends of the cover is provided. It is indispensable to cast a high pressure-resistant resin partition wall, for example, an epoxy resin partition wall.

ところで、モジュールにおいては、熱水通水後、直に
冷水を流さなければならないことが往々にしてあるが
(例えば、熱水消毒後での冷冷水冷却)、上記の中空糸
膜モジュールにおいては、カバーと往型関壁との間で剥
離が生じ易く、かかる剥離下では、透過側と原水側との
間のリーク発生が避けられない。かかる剥離の原因とし
ては、従来、注型時に注型樹脂の発熱等に起因してひ
ずみが注型樹脂内部に残っている、カバーと注型樹脂
の熱膨張係数が異なる等のために、上記の急激な温度変
化のもとで過大な応力が発生する結果であると考えられ
ており、その対策として、iカバーと中空糸膜束との間
の隔壁部分に年輪状に可撓性樹脂部分を設けて応力を吸
収すること(特開昭61−141904、同61−15309)、ii注
型に多段注型法を使用すること、iiiカバーと注型樹脂
との熱膨張係数を同等にすることが知られている。
By the way, in a module, it is often necessary to flow cold water immediately after hot water flow (for example, cold and cold water cooling after hot water disinfection), but in the above hollow fiber membrane module, Peeling is likely to occur between the cover and the outward wall, and under such peeling, the occurrence of a leak between the transmission side and the raw water side is inevitable. As a cause of such peeling, conventionally, the distortion remains due to heat generation of the casting resin during casting, etc., due to a difference in thermal expansion coefficient between the cover and the casting resin, etc. This is considered to be the result of excessive stress being generated under a rapid temperature change. As a countermeasure, a flexible resin portion in the shape of an annual ring is provided on the partition wall between the i-cover and the hollow fiber membrane bundle. To absorb stress (Japanese Patent Laid-Open Nos. 61-141904 and 61-15309), to use the multi-stage casting method for ii casting, and to make the thermal expansion coefficient of the cover and casting resin equal. It is known.

<解決しようとする課題> しかしながら、本発明者の経験によれば、熱的条件が
苛酷になれば、これらの手段を用いてもカバー端部と樹
脂隔壁との間の剥離を防止し難く、前記した以外に
も原因があると推認され、かかる原因を探求したとこ
ろ、プラスチック製カバー端部が実質上熱収縮性である
ことも重大な一原因(第3の原因)であることを知っ
た。
<Problem to be solved> However, according to the experience of the present inventor, if the thermal condition becomes severe, it is difficult to prevent separation between the cover end portion and the resin partition even by using these means, It was presumed that there were causes other than the above, and when the cause was searched for, it was found that the heat-shrinkability of the plastic cover end was also a serious cause (third cause). .

すなわち、カバー端部に熱収縮性があり(カバー端部
に未結晶部分がある場合の他、カバー端部を構成するヘ
ツダー部材の周方向厚みが不均一のために、ヘッダーの
熱膨張がいびつになってあたかも熱収縮性を呈するよう
に振舞う場合もある)、カバー端部と隔壁との熱膨張係
数が等しくても、加熱されるとカバーに収縮力が発生
し、この収縮力が基づく歪が原因となって、カバー端部
と隔壁との間に剥離力が発生するに至るのである。
That is, the thermal expansion of the header is distorted due to the heat shrinkability of the cover end (unless there is an amorphous portion at the cover end, and the uneven thickness of the header member constituting the cover end in the circumferential direction). In some cases, the cover may behave as if it exhibits heat shrinkage), but even if the cover edge and the partition have the same coefficient of thermal expansion, a shrinkage force is generated in the cover when heated, and the strain based on this shrinkage force As a result, a peeling force is generated between the end of the cover and the partition.

このように本発明者においては、プラスチック製カバ
ーと樹脂隔壁との剥離の原因として少くとも上記した三
つの事由があることを知った。
As described above, the present inventor has found that there are at least the three reasons described above as causes of the separation between the plastic cover and the resin partition.

而して、その剥離の完全な防止には、各原因の各解決
手段の総和が理想的であるが、前記した隔壁に年輪状に
可撓性樹脂部分を設ける構成においては、一般に可撓性
樹脂が高温下で溶出性を呈し、透過水の水質低下を招来
するので、不適当である。特に半導体製造用の超純水、
注射用水の製造には適用できない。
Thus, in order to completely prevent the peeling, the total sum of the respective solving means for each cause is ideal. However, in the above-described configuration in which the flexible resin portion is provided in the shape of an annual ring on the partition wall, the flexibility is generally high. The resin is unsuitable because it exhibits an elution property at a high temperature and lowers the quality of permeated water. Ultrapure water especially for semiconductor manufacturing,
Not applicable for the production of water for injection.

本発明の目的は、上記第三の原因をも勘案し、かつ、
可撓性樹脂による応力吸収作用に依存することなく、苛
酷な温度変化時でもケースと樹脂隔壁との間の封止性を
保持し得る中空糸膜モジュールにおける隔壁成形方法を
提供することにある。
The object of the present invention is to take into account the third cause, and
It is an object of the present invention to provide a partition wall forming method for a hollow fiber membrane module that can maintain the sealing property between a case and a resin partition even under a severe temperature change without depending on a stress absorbing action of a flexible resin.

<課題を解決するための手段> 本発明に係る中空糸膜モジュールにおける隔壁成形方
法は、筒状のプラスチックカバー端部を加熱し、該加熱
下でそのカバー端部の内周に硬化性樹脂のコーテング層
を成形し、このカバー内に中空糸膜束を収納し、而るの
ち、上記のカバー端部内に硬化性樹脂隔壁を注型するこ
とを特徴とする方法である。
<Means for Solving the Problems> In the method for forming a partition wall in the hollow fiber membrane module according to the present invention, the end of the cylindrical plastic cover is heated, and under the heating, the curable resin is coated on the inner periphery of the end of the cover. The method is characterized by forming a coating layer, storing the hollow fiber membrane bundle in the cover, and then casting a curable resin partition in the end of the cover.

<実施例の説明> 以下、図面により本発明の実施例を説明する。<Description of Example> Hereinafter, an example of the present invention will be described with reference to the drawings.

図面は本発明によって作成した中空糸膜モジュールの
隔壁部を示している。図において、1はプラスチック製
の筒状カバーであり、プラスチックをパイプ状に押出し
成形し、これを定尺切断したものを用いている。カバー
端部はカバー本体と別部材のヘツダーで構成し、ヘツダ
ーをカバー本体に接合することもできる。2はカバー端
部の内周面に設けた硬化性樹脂(以下、硬化性樹脂Aと
いとう)のコーティング層である。3はカバー内に収納
した中空糸膜束である。4はカバー端部内に注型した硬
化性樹脂(以下、硬化性樹脂Bという)の隔壁である。
The drawing shows a partition part of a hollow fiber membrane module prepared according to the present invention. In the figure, reference numeral 1 denotes a plastic cylindrical cover, which is formed by extruding plastic into a pipe shape and cutting the same into fixed lengths. The cover end may be formed of a separate member and a header, and the header may be joined to the cover body. Reference numeral 2 denotes a curable resin (hereinafter referred to as curable resin A) coating layer provided on the inner peripheral surface of the cover end. 3 is a hollow fiber membrane bundle housed in the cover. Reference numeral 4 denotes a partition wall of a curable resin (hereinafter, referred to as a curable resin B) cast into an end of the cover.

上記の硬化性樹脂A並びにBには、モジュールの使用
温度に耐え得るもの、例えば、耐熱型のエポキシ樹脂、
ウレタン樹脂等を使用できる。硬化性樹脂AとBは同一
または異種の何れであってもよい。
The above-mentioned curable resins A and B include those capable of withstanding the operating temperature of the module, for example, a heat-resistant epoxy resin,
Urethane resin or the like can be used. The curable resins A and B may be the same or different.

本発明によって隔壁を成形するには、カバー端部を加
熱する(カバー全体を加熱してもよい)。この加熱温度
は中空糸膜モジュールの最高使用温度(95℃前後)とす
ることが好ましいが、それよりも若干、低度であっても
よい(60℃以上)。次いで、カバー端部の内周に硬化性
樹脂Aをコーテングし、再び、上記の温度にまで加熱し
て樹脂Aの硬化並びにアフターキュアを行う。硬化性樹
脂Aのコーテング厚さは、厚くするほどよいが中空糸膜
束の収納上、制限がある。ただし、2mm以上の厚みは必
要である。
To form a partition according to the present invention, the edge of the cover is heated (the entire cover may be heated). The heating temperature is preferably set to the maximum operating temperature of the hollow fiber membrane module (around 95 ° C.), but may be slightly lower (60 ° C. or higher). Next, the curable resin A is coated on the inner periphery of the cover end, and is heated again to the above temperature to cure and after cure the resin A. The coating thickness of the curable resin A is preferably as thick as possible, but there is a limit in storing the hollow fiber membrane bundle. However, a thickness of 2 mm or more is required.

硬化性樹脂Aのコーテング層を設けたのちは、カバー
内に中空糸膜束を収納し、カバー端部内に硬化性樹脂B
を注型して隔壁を成形する。この注型には遠心法を用い
ることが望ましい。隔壁の内面は、カバー内の原液空間
に原液流に対するデットスペースを生じさせないよう、
傾斜の凹曲面とすることが望ましい。
After the coating layer of the curable resin A is provided, the hollow fiber membrane bundle is stored in the cover, and the curable resin B is provided in the end of the cover.
To form a partition wall. It is desirable to use a centrifugal method for this casting. The inner surface of the partition wall does not create a dead space for the undiluted solution flow in the undiluted solution space in the cover,
It is desirable to have an inclined concave curved surface.

上記のように、本発明に係る隔壁成形方法において
は、カバー端部をモジュールの使用温度に近い温度で加
熱処理したうえで、樹脂隔壁を注型しているから、モジ
ュールを苛酷な熱的条件下で使用しても、カバーと隔壁
との間に作用する剥離力をよく抑制でき、その間の剥離
を防止できる。
As described above, in the partition wall forming method according to the present invention, since the cover end portion is heated at a temperature close to the operating temperature of the module and then the resin partition wall is cast, the module is subjected to severe thermal conditions. Even when used below, the peeling force acting between the cover and the partition can be well suppressed, and peeling therebetween can be prevented.

すなわち、カバー内径または隔壁外径をR、カバーの
厚みをt、カバー並びに隔壁の熱膨張係数を共にα、カ
バーのヤング率をE1、隔壁のヤング率をE2、カバー端部
の熱収縮率をβ、使用時温度上昇をTとすれば、カバー
端部に作用するフープストレスfは となり、カバー端部がkfの率で伸び、元の温度への冷却
時にカバー端部と隔壁との間に次式で示す剥離力Pが作
用するに至る。
That is, the inner diameter of the cover or the outer diameter of the partition is R, the thickness of the cover is t, the thermal expansion coefficients of the cover and the partition are both α, the Young's modulus of the cover is E 1 , the Young's modulus of the partition is E 2 , and the thermal contraction of the end of the cover is performed. If the rate is β and the temperature rise during use is T, the hoop stress f acting on the cover edge is The end of the cover extends at a rate of kf, and a peeling force P expressed by the following equation is exerted between the end of the cover and the partition wall at the time of cooling to the original temperature.

而るに、本発明においては、カバー端部を予熱処理し
てカバー端部の熱収縮率βを実質上零としてあるから、
上記剥離力Pをほぼ零になし得る。
Thus, in the present invention, since the cover end is preheat-treated, the heat shrinkage β of the cover end is set to substantially zero,
The peeling force P can be made substantially zero.

更に、本発明においては、樹脂隔壁を硬化性樹脂Aの
部分と硬化性樹脂Bの部分とに分けて成形し、実質上2
段注型を用いているから、樹脂硬化に伴うひずみ充分に
小さくできる。
Further, in the present invention, the resin partition walls are divided into a part of the curable resin A and a part of the curable resin B, and are molded.
Since the step casting is used, the strain associated with the resin curing can be sufficiently reduced.

<発明の効果> このように、本発明によれば、上記剥離力Pの排除並
びに2段注型法によって、モジュールの苛酷の温度使用
条件下でもカバー端部と隔壁間の剥離を防止し得、信頼
性に優れた中空糸膜モジュールを提供できる。このこと
は、次の実施例と比較例との対比からも明らかである。
<Effects of the Invention> As described above, according to the present invention, the peeling between the cover end and the partition wall can be prevented even under the severe temperature use condition of the module by eliminating the peeling force P and the two-step casting method. A highly reliable hollow fiber membrane module can be provided. This is clear from the comparison between the following examples and comparative examples.

実施例1 ポリスルホン製カバーを予め100℃に加熱しておき、
該カバーの端部内周面に耐熱性エポキシ樹脂組成物(油
化シエル株式会社製品エピコート828と三和化学株式会
社製品DA−100との混合物)を厚さ5mmでコーテングし、
再び100℃に加熱してコーテング層を硬化させた。而る
のち、外径1mmの中空糸膜を3000本カバー内に収納し、
次いで、同上の耐熱性エポキシ樹脂組成物によって隔壁
を注型した。
Example 1 A polysulfone cover was previously heated to 100 ° C.
A heat-resistant epoxy resin composition (a mixture of Yuka Ciel Co., Ltd. product Epicoat 828 and Sanwa Chemical Co., Ltd. product DA-100) was coated on the inner peripheral surface of the end at a thickness of 5 mm,
The coating layer was heated again to 100 ° C. to cure the coating layer. After that, 3000 hollow fiber membranes with an outer diameter of 1 mm are stored in the cover,
Next, partition walls were cast using the same heat-resistant epoxy resin composition as above.

実施例2 カバーの予熱温度並びにコーテング層の加熱温度を60
℃とした以外、実施例1と同じとした。
Example 2 The preheating temperature of the cover and the heating temperature of the coating layer were set to 60
The same as Example 1 except for the temperature.

比較例 カバーを予熱せず、コーテング層を常温硬化とした以
外、実施例1と同じとした。
Comparative Example Same as Example 1 except that the cover was not preheated and the coating layer was cured at room temperature.

実施例並びに比較例品のそれぞれについて、熱水の通
水、常温水の通水を繰り返す冷熱サイクル試験を行った
ところ、比較例品においては、3サイクル目でカバーと
隔壁との間が剥離したが、実施例品1においては、50サ
イクル目でも剥離せず、実施例2においては、36サイク
ル目まで異常がなかった。
For each of the Example and Comparative Example products, when a cooling / heating cycle test in which hot water flow and normal temperature water flow were repeated was performed, in the Comparative Example product, the space between the cover and the partition wall peeled off at the third cycle. However, in Example product 1, no peeling occurred even at the 50th cycle, and in Example 2, there was no abnormality up to the 36th cycle.

【図面の簡単な説明】[Brief description of the drawings]

図面は本発明により形成される中空糸膜モジュールの隔
壁部を示す説明図である。 1……カバー 2……硬化性樹脂のコーテング層 3……中空糸膜束、4……硬化性樹脂の隔壁
The drawing is an explanatory view showing a partition wall portion of the hollow fiber membrane module formed according to the present invention. DESCRIPTION OF SYMBOLS 1 ... Cover 2 ... Coating layer of curable resin 3 ... Bunch of hollow fiber membranes 4 ... Partition wall of curable resin

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】筒状のプラスチックカバー端部を加熱し、
該加熱下でそのカバー端部の内周に硬化性樹脂のコーテ
ング層を成形し、このカバー内に中空糸膜束を収納し、
而るのち、上記のカバー端部内に硬化性樹脂隔壁を注型
することを特徴とする中空糸膜モジュールにおける隔壁
成形方法。
1. An end of a cylindrical plastic cover is heated,
Under the heating, a coating layer of a curable resin is formed on the inner periphery of the cover end, and the hollow fiber membrane bundle is stored in the cover,
Thereafter, a method of forming a partition in a hollow fiber membrane module, comprising casting a curable resin partition into the end of the cover.
JP19324189A 1989-07-25 1989-07-25 Method of forming partition wall in hollow fiber membrane module Expired - Fee Related JP2784668B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19324189A JP2784668B2 (en) 1989-07-25 1989-07-25 Method of forming partition wall in hollow fiber membrane module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19324189A JP2784668B2 (en) 1989-07-25 1989-07-25 Method of forming partition wall in hollow fiber membrane module

Publications (2)

Publication Number Publication Date
JPH0356127A JPH0356127A (en) 1991-03-11
JP2784668B2 true JP2784668B2 (en) 1998-08-06

Family

ID=16304681

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19324189A Expired - Fee Related JP2784668B2 (en) 1989-07-25 1989-07-25 Method of forming partition wall in hollow fiber membrane module

Country Status (1)

Country Link
JP (1) JP2784668B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3314762B2 (en) * 1999-08-19 2002-08-12 日本電気株式会社 Electron beam exposure mask, electron beam exposure method using the same, electron beam exposure apparatus, and device manufacturing method
KR20020065207A (en) * 2001-02-06 2002-08-13 장진호 Coating to prevent breakage of hollow fiber membrane

Also Published As

Publication number Publication date
JPH0356127A (en) 1991-03-11

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