JP2784050B2 - Production method of metal powder - Google Patents
Production method of metal powderInfo
- Publication number
- JP2784050B2 JP2784050B2 JP1179721A JP17972189A JP2784050B2 JP 2784050 B2 JP2784050 B2 JP 2784050B2 JP 1179721 A JP1179721 A JP 1179721A JP 17972189 A JP17972189 A JP 17972189A JP 2784050 B2 JP2784050 B2 JP 2784050B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- powder
- metal powder
- coating layer
- base layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000843 powder Substances 0.000 title claims description 60
- 239000002184 metal Substances 0.000 title claims description 59
- 229910052751 metal Inorganic materials 0.000 title claims description 59
- 238000004519 manufacturing process Methods 0.000 title description 16
- 239000010410 layer Substances 0.000 claims description 40
- 239000011247 coating layer Substances 0.000 claims description 28
- 238000001816 cooling Methods 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 11
- 238000002844 melting Methods 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 9
- 150000002739 metals Chemical class 0.000 claims description 4
- 238000007747 plating Methods 0.000 description 16
- 238000000034 method Methods 0.000 description 15
- 239000002923 metal particle Substances 0.000 description 8
- 238000005498 polishing Methods 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Powder Metallurgy (AREA)
Description
【発明の詳細な説明】 (産業上の利用分野) 本発明は、複数層から成り、半導体装置のバンプ形成
等に用いられる金属粉体の製造方法に関するものであ
る。Description: TECHNICAL FIELD The present invention relates to a method for producing a metal powder having a plurality of layers and used for forming bumps of a semiconductor device.
(従来の技術) 半導体装置のバンプ形成等に際し、印刷技術が使用さ
れることがある。この印刷技術は、所定パターンのスク
リーンを通して、例えばクリームハンダ等の導電性イン
クを塗布することにより、バンプ等を形成するものであ
る。導電性インクは、導電物質としての金属粉体を、例
えばフラックス中に混入してペースト状にしたものであ
る。(Prior Art) A printing technique is sometimes used for forming bumps of a semiconductor device. In this printing technique, a bump or the like is formed by applying a conductive ink such as cream solder through a screen having a predetermined pattern. The conductive ink is obtained by mixing a metal powder as a conductive substance into, for example, a flux to form a paste.
従来、この種の金属粉体としては、球状に加工された
金属微粒子に他の金属層をめっき等によって形成した2
層構造のものが広く用いられている。以下、その製造方
法について説明する。Conventionally, as this kind of metal powder, another metal layer is formed by plating or the like on spherical metal fine particles.
Those having a layer structure are widely used. Hereinafter, the manufacturing method will be described.
先ず、金属粉体の核となるべき金属の線材を一定の寸
法で輪切りにした後、これらをバレル研磨等の方法によ
り球状に加工し、所定粒径の金属粒子核を形成する。金
属粒子核の素材としては、比較的柔らかく切断及び研磨
作業が容易であり、めっきの付着性も良い銅(Cu)材等
が一般的に用いられている。First, a metal wire to be a nucleus of a metal powder is sliced into a predetermined size, and then processed into a spherical shape by a method such as barrel polishing to form a metal particle nucleus having a predetermined particle size. As a material of the metal particle nucleus, a copper (Cu) material, which is relatively soft and easy to cut and polish, and has good adhesion to plating, is generally used.
次に、金属粒子核の表面に電気めっき又は熱電解めっ
き等の方法により、外該金属層を形成する。外該金属層
の素材としては、錫(Sn)、鉛(Pb)、インジウム(I
n)及びはんだ等が用いられる。これらの金属は、比較
的低融点金属であり、電気めっきや無電解めっき等に適
したものである。Next, the outer metal layer is formed on the surface of the metal particle nucleus by a method such as electroplating or thermoelectrolytic plating. Materials for the outer metal layer include tin (Sn), lead (Pb), indium (I
n) and solder are used. These metals are relatively low melting metals and are suitable for electroplating, electroless plating, and the like.
このようにして、金属粒子核の表面に外核金属層が形
成されて成る2層構造の金属粉体が製造される。個々の
金属粉体の外径は、例えば10〜20μm程度であり、これ
らが多数集められて成る金属粉体として実用に供され
る。Thus, a metal powder having a two-layer structure in which the outer core metal layer is formed on the surface of the metal particle nucleus is manufactured. The outer diameter of each metal powder is, for example, about 10 to 20 μm, and it is put into practical use as a metal powder formed by collecting a large number of these.
(発明が解決しようとする課題) しかしながら、上記構成の金属粉体の製造方法は、微
細な金属粒子に対し、煩雑な研磨やめっき工程によって
構成されており、生産効率の向上を図ることは極めて困
難であった。(Problems to be Solved by the Invention) However, the method for producing a metal powder having the above-described configuration is configured by complicated polishing and plating steps for fine metal particles, and it is extremely difficult to improve production efficiency. It was difficult.
即ち、研磨やめっき工程は元来比較的長時間を要する
作業である上に、金属粒子に対する研磨工程においては
研磨材や研磨量等の管理、及びめっき工程においてはめ
っき時間やめっき層の厚さの管理等の煩雑かつ精細な管
理が必要となる。In other words, the polishing or plating process originally requires a relatively long time. In addition, in the polishing process for metal particles, the polishing material and the amount of polishing are controlled, and in the plating process, the plating time and the thickness of the plating layer are controlled. It requires complicated and detailed management such as management.
これらの管理を怠れば、金属粒子核の粒径やめっき層
の膜圧に大きなばらつきを生じ、歩留りが著しく低下し
てしまう。If these controls are neglected, large variations occur in the particle size of the metal particle nuclei and the film pressure of the plating layer, and the yield is significantly reduced.
本発明は、前記従来技術がもっていた課題として、煩
雑な研磨やめっき工程を必要とするため、生産効率の向
上を図れない点について解決した金属粉体の製造方法を
提供するものである。An object of the present invention is to provide a method for producing a metal powder, which solves the problem of the conventional technique that a complicated polishing and plating process are required, so that the production efficiency cannot be improved.
(課題を解決するための手段) 本発明は前記課題を解決するために、金属粉体の製造
方法を、第1の金属から成る膜状の基体層を形成する工
程と、前記基体層の少なくとも一方の面に前記第1の金
属より低融点の第2の金属から成る被覆層を形成する工
程と、前記被覆層が形成された前記基体層を所定寸法に
分割し、前記第1及び第2の金属が層状を成す粉体片を
形成する工程と、前記粉体片を熱処理により溶融した後
冷却し、前記第1の金属の周囲を前記第2の金属が被覆
して成るほぼ球状の金属粉体を形成する工程とで、構成
したものである。(Means for Solving the Problems) In order to solve the above problems, the present invention provides a method for producing a metal powder, comprising: forming a film-like base layer made of a first metal; Forming a coating layer made of a second metal having a lower melting point than the first metal on one surface, and dividing the base layer on which the coating layer is formed into a predetermined size; A step of forming a powder piece in which the metal forms a layered form; a step of melting the powder piece by heat treatment and cooling; and forming a substantially spherical metal formed by coating the periphery of the first metal with the second metal. And a step of forming a powder.
(作 用) 本発明によれば、以上のように金属粉体の製造方法を
構成したので、膜状の単体層上に被覆層を形成する工程
は、簡単かつ効率的に均一な膜厚の2層構造を形成せし
める働きをする、また、前記膜状の2層構造を分割して
粉体片を形成する工程は、容易な手段で寸法精度に優れ
た粉体片を形成せしめるように働く。(Operation) According to the present invention, since the method for producing a metal powder is configured as described above, the step of forming a coating layer on a film-shaped single layer can be performed easily and efficiently with a uniform film thickness. The step of forming a two-layer structure and dividing the film-like two-layer structure to form a powder piece works to form a powder piece with excellent dimensional accuracy by an easy means. .
さらに、前記粉体片に熱処理及び冷却を施して球状化
する工程は、粉体片を容易かつ短時間で球状化させると
共に、その体積を変えることなく球状化せしめる働きを
する。これにより、前2工程で達成された均一な膜厚及
び優れた寸法精度に基づき、高精度な外径寸法及び金属
組成比の金属粉体が容易に得られる。Further, the step of subjecting the powder piece to spheroidization by heat treatment and cooling serves to easily and quickly make the powder piece spheroidal and to make the powder piece spheroidal without changing its volume. Thereby, based on the uniform film thickness and excellent dimensional accuracy achieved in the previous two steps, highly accurate metal powder having an outer diameter and a metal composition ratio can be easily obtained.
従って、前記課題を解決することができる。 Therefore, the above problem can be solved.
(実施例) 第1図(a)〜(d)は、本発明の実施例を示す金属
粉体の製造工程図である。以下、図の順番に従ってその
製造方法を説明する。(Example) FIGS. 1 (a) to 1 (d) are production process diagrams of metal powder showing an example of the present invention. Hereinafter, the manufacturing method will be described in the order of the drawings.
(1) 第1図(a)の工程 先ず、第1の金属例えば銅材を用いて膜状の基体層1
を形成する。基体層1の厚さは例えば1〜3μm程度と
し、長尺に形成してロール状に巻いておいてもよい。(1) Step of FIG. 1A First, a film-like base layer 1 made of a first metal such as copper is used.
To form The thickness of the base layer 1 is, for example, about 1 to 3 μm, and may be formed in a long shape and wound in a roll shape.
(2) 第1図(b)の工程 基体層1の表面に、第1の金属より低融点を有する第
2の金属を用いて被覆層2を形成する。第2の金属とし
ては、例えば錫、鉛、インジウム及び半田等を用い、圧
着、接着又はめっき等の方法により、例えば厚さ5〜10
μm程度の被覆層2を形成する。長尺の基体層1に対し
てめっきを施すときは、ロールめっきの方法を用いると
よい。被覆層2の形成後、被覆層2もしくは裏面側の基
体層1上に所定寸法の切断線3を設定する。切断線3は
実際に描かず、想定するものであってもよい。(2) Step of FIG. 1 (b) A coating layer 2 is formed on the surface of the base layer 1 using a second metal having a lower melting point than the first metal. As the second metal, for example, tin, lead, indium, solder, or the like is used, and the thickness is 5 to 10 by a method such as pressure bonding, adhesion, or plating.
A coating layer 2 of about μm is formed. When plating the long base layer 1, a method of roll plating may be used. After the formation of the coating layer 2, a cutting line 3 having a predetermined dimension is set on the coating layer 2 or the base layer 1 on the back surface side. The cutting line 3 is not actually drawn but may be assumed.
(3) 第1図(c)の工程 基体層1及び被覆層2をプレス等の方法により、切断
線3に従って切断し、微細な粉体片4に分割する。これ
により、図示の如く例えば直方体状の多数の粉体片4が
作られる。個々の粉体片4の大きさは、例えば1辺が5
〜10μm程度の極めて微細なものであり、これらが多数
集まって粉末状を成している。(3) Step of FIG. 1 (c) The base layer 1 and the coating layer 2 are cut along a cutting line 3 by a method such as pressing to divide into fine powder pieces 4. Thereby, as shown in the figure, for example, a large number of powder pieces 4 having a rectangular parallelepiped shape are produced. The size of each powder piece 4 is, for example, 5 on one side.
It is extremely fine, about 10 μm, and many of them are in a powder form.
(4) 第1図(d)の工程 粉体片4の形成後、これらを図示しない処理炉に投入
し、球状化処理を施す。処理炉は例えば円筒状を成し、
その上部に加熱部を有し、下部に冷却部を有するもので
ある。処理炉の内部には、ヘリウム(He)等の不活性ガ
ス又は窒素ガス(N2)等を充填し、不活性ガス雰囲気を
形成しておく。(4) Step of FIG. 1D After the powder pieces 4 are formed, they are put into a processing furnace (not shown) and subjected to spheroidizing treatment. The processing furnace has, for example, a cylindrical shape,
It has a heating section at the top and a cooling section at the bottom. The inside of the processing furnace is filled with an inert gas such as helium (He) or a nitrogen gas (N 2 ) to form an inert gas atmosphere.
この処理炉に投入された粉体片4は、加熱部により基
体層1及び被覆層2の融点以上に加熱される。例えば基
体層1が銅のとき、加熱温度は1083℃以上とする。この
加熱により、先ず被覆層2が溶融し、基体層1の周囲を
覆う。次いで基体層1が溶融して表面張力によりほぼ球
状化し、その周囲全面を被覆層2が被覆する。The powder pieces 4 placed in the processing furnace are heated by the heating unit to a temperature equal to or higher than the melting points of the base layer 1 and the coating layer 2. For example, when the base layer 1 is made of copper, the heating temperature is set to 1083 ° C. or higher. By this heating, the coating layer 2 is first melted and covers the periphery of the base layer 1. Next, the base layer 1 is melted and made substantially spherical by surface tension, and the entire surrounding area is covered with the coating layer 2.
前記加熱と共に、粉体片4は処理炉内を落下するが、
落下過程において溶融した粉体片4は冷却される。この
冷却過程において、先ず融点のより高い基体層1が冷却
されて凝固する。さらに落下するに従って冷却が進行
し、基体層1周囲の被覆層2が凝固する。With the heating, the powder pieces 4 fall in the processing furnace.
In the falling process, the molten powder pieces 4 are cooled. In this cooling process, first, the base layer 1 having a higher melting point is cooled and solidified. The cooling progresses as it falls further, and the coating layer 2 around the base layer 1 solidifies.
ここに処理炉は、粉体片4の落下完了時点において、
被覆層2の軟化点以下の温度となるような冷却過程を設
定するか、もしくは例えば水冷等の冷却器を設け、水等
によって強制冷却する。これにより、最終的に第1図
(d)に示すようなほぼ球状の2層構造から成る金属粉
体5が得られる。Here, the processing furnace, when the fall of the powder pieces 4 is completed,
A cooling process is set such that the temperature is equal to or lower than the softening point of the coating layer 2, or a cooler such as water cooling is provided and forced cooling is performed with water or the like. Thus, a metal powder 5 having a substantially spherical two-layer structure as shown in FIG. 1 (d) is finally obtained.
このようにして所望の金属粉体5が得られるが、金属
粉体5の外径寸法等は、容易かつ高精度に設定すること
ができる。即ち、金属粉体5の外径寸法は、第1図
(b)の状態における基体層1と被覆層2の合計膜厚及
び切断線3の間隔寸法によって容易に決定される。ま
た、金属粉体5を構成する2種の金属の組成比も、第1
図(b)の基体層1と被覆層2の膜厚比によって、容易
かつ正確に決定することができる。Although the desired metal powder 5 is obtained in this manner, the outer diameter and the like of the metal powder 5 can be easily and accurately set. That is, the outer diameter of the metal powder 5 is easily determined by the total thickness of the base layer 1 and the coating layer 2 and the interval between the cutting lines 3 in the state shown in FIG. In addition, the composition ratio of the two types of metals constituting the metal powder 5 is also the first ratio.
The thickness can be easily and accurately determined by the thickness ratio between the base layer 1 and the coating layer 2 in FIG.
以上の実施例においては、膜状の基体層1上に被覆層
2を形成し、これらを分割した後に熱処理によって球状
化する金属粉体の製造方法としたので、従来のように金
属粒子に対する煩雑な研磨やめっき作業が不要となる。
従って、極めて容易な工程により、効率良く金属粉体5
を製造することができる。しかも、所定の外径及び組成
比を有する金属粉体5を簡単な手段で高精度に得られる
という利点もある。In the above embodiment, since the coating layer 2 is formed on the film-like base layer 1, and the coating layer 2 is divided and then spheroidized by a heat treatment, the method for producing the metal powder is complicated. No special polishing or plating work is required.
Therefore, the metal powder 5 can be efficiently formed by an extremely simple process.
Can be manufactured. In addition, there is an advantage that the metal powder 5 having a predetermined outer diameter and a predetermined composition ratio can be obtained with high accuracy by simple means.
第2図(a),(b)は本発明の他の実施例を示す粉
体片の斜視図であり、同図(a)は3層構造及び同図
(b)は円筒形状の粉体片を示すものである。2 (a) and 2 (b) are perspective views of a powder piece showing another embodiment of the present invention. FIG. 2 (a) shows a three-layer structure and FIG. 2 (b) shows a cylindrical powder. It shows a piece.
第2図(a)において、この実施例は基体層1の両面
に被覆層2を形成した例を粉体片6で示すものである。
このような3層構造は、特にめっきにより被覆層2を形
成する場合に適している。また、粉体片6を処理炉によ
って球状化する際に、被覆層2による基体層1の被覆を
円滑に行なわしめるという利点もある。In FIG. 2 (a), this embodiment shows an example in which coating layers 2 are formed on both surfaces of a base layer 1 by powder pieces 6.
Such a three-layer structure is particularly suitable for forming the coating layer 2 by plating. Further, when the powder pieces 6 are spheroidized by a processing furnace, there is an advantage that the coating of the base layer 1 with the coating layer 2 can be performed smoothly.
第2図(b)は、円筒形状に加工した粉体片7の例を
示すものであるが、このような形状は、粉体片7をプレ
ス打抜き等によって形成する場合に適している。このよ
うな円筒形状としても、第1図(d)と同様の金属粉体
を得ることができる。FIG. 2 (b) shows an example of the powder piece 7 processed into a cylindrical shape. Such a shape is suitable when the powder piece 7 is formed by press punching or the like. Even with such a cylindrical shape, the same metal powder as in FIG. 1 (d) can be obtained.
なお、本発明は図示の実施例に限定されず、種々の変
形が可能であり、例えば次のような変形例が挙げられ
る。The present invention is not limited to the illustrated embodiment, and various modifications are possible, for example, the following modifications.
(i) 第1図(a)〜(d)及び第2図(a),
(b)では、膜状の基体層1の上に被覆層2を形成する
ものとしたが、さらに被覆層2の上にこれより低融点金
属から成る他の被覆層を形成してもよい。こうすること
により、複数の被覆層から成る金属粉体を得ることがで
きる。(I) FIGS. 1 (a) to (d) and 2 (a),
In (b), the coating layer 2 is formed on the film-like base layer 1, but another coating layer made of a metal having a lower melting point may be further formed on the coating layer 2. By doing so, a metal powder composed of a plurality of coating layers can be obtained.
(ii) 球状化に際し、処理炉内部には必ずしも不活性
ガスを充填しなくてもよい。要は、金属粉体が酸化され
ないように心掛ければよい。(Ii) When spheroidizing, the inside of the processing furnace does not necessarily need to be filled with an inert gas. In short, it is sufficient to keep the metal powder from being oxidized.
(iii) 球状化に用いる処理炉の形式は例示のものに
限定されない。例えば加熱部や冷却部には種々の方式の
採用が考えられ、特に冷却部を設けずに自然冷却とする
ことも可能である。(Iii) The type of processing furnace used for spheroidization is not limited to the example. For example, it is possible to adopt various methods for the heating unit and the cooling unit, and it is possible to perform natural cooling without providing a cooling unit.
(発明の効果) 以上詳細に説明したように、本発明によれば、膜状の
基体層1上に被覆層2を形成し、これらを微細な粉体片
に分割した後、熱処理により球状化する方法としたの
で、従来の金属粒子に対する煩雑な研磨及びめっき工程
を必要とする方法に比べ、容易かつ短時間の製造工程で
金属粉体を製造できるようになる。(Effects of the Invention) As described in detail above, according to the present invention, a coating layer 2 is formed on a film-like base layer 1, and these are divided into fine powder pieces, and then spheroidized by heat treatment. Therefore, the metal powder can be manufactured in an easy and short manufacturing process as compared with the conventional method which requires complicated polishing and plating steps for metal particles.
また、金属粉体の外径寸法や組成比等に対する高精度
化が簡単な手段でなされ、歩留りの向上を図ることもで
きる。In addition, it is possible to improve the accuracy with respect to the outer diameter dimension, the composition ratio, and the like of the metal powder by simple means, and it is possible to improve the yield.
従って、金属粉体の製造に係わる生産効率、経済性及
び高品質化の大幅な向上が期待できる。Therefore, it is expected that the production efficiency, economy and quality of the production of the metal powder can be greatly improved.
第1図(a)〜(d)は本発明の実施例を示す金属粉体
の製造工程図、第2図(a),(b)は本発明の他の実
施例を示し、同図(a)は3層構造の粉体片及び同図
(b)は円筒形状の粉体片の斜視図である。 1……基体層、2……被覆層、3……切断線、4,6,7…
…粉体片、5……金属粉体。FIGS. 1 (a) to 1 (d) show a manufacturing process diagram of a metal powder showing an embodiment of the present invention, and FIGS. 2 (a) and 2 (b) show another embodiment of the present invention. (a) is a perspective view of a powder piece having a three-layer structure, and (b) is a perspective view of a cylindrical powder piece. 1 ... substrate layer, 2 ... coating layer, 3 ... cutting line, 4, 6, 7 ...
... powder pieces, 5 ... metal powder.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6,DB名) B22F 9/06 B22F 9/04 B22F 1/00 B23K 35/40 340──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. 6 , DB name) B22F 9/06 B22F 9/04 B22F 1/00 B23K 35/40 340
Claims (1)
る工程と、 前記基体層の少なくとも一方の面に前記第1の金属より
低融点の第2の金属から成る被覆層を形成する工程と、 前記被覆層が形成された前記基体層を所定寸法に分割
し、前記第1及び第2の金属が層状を成す粉体片を形成
する工程と、 前記粉体片を熱処理により溶融した後冷却し、前記第1
の金属の周囲を前記第2の金属が被覆して成るほぼ球状
の金属粉体を形成する工程とを、 順に施すことを特徴とする金属粉体の製造方法。1. A step of forming a film-like base layer made of a first metal, and forming a coating layer made of a second metal having a lower melting point than the first metal on at least one surface of the base layer. And a step of dividing the base layer on which the coating layer is formed into a predetermined size to form a layered powder piece of the first and second metals, and melting the powder piece by heat treatment. After cooling, the first
Forming a substantially spherical metal powder by covering the periphery of the metal with the second metal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1179721A JP2784050B2 (en) | 1989-07-12 | 1989-07-12 | Production method of metal powder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1179721A JP2784050B2 (en) | 1989-07-12 | 1989-07-12 | Production method of metal powder |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0344408A JPH0344408A (en) | 1991-02-26 |
JP2784050B2 true JP2784050B2 (en) | 1998-08-06 |
Family
ID=16070714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1179721A Expired - Lifetime JP2784050B2 (en) | 1989-07-12 | 1989-07-12 | Production method of metal powder |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2784050B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5754582B2 (en) * | 2011-02-28 | 2015-07-29 | 三菱マテリアル株式会社 | Precoat solder paste |
-
1989
- 1989-07-12 JP JP1179721A patent/JP2784050B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0344408A (en) | 1991-02-26 |
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