JP2776126B2 - Chip solid electrolytic capacitor with fuse and method of manufacturing the same - Google Patents

Chip solid electrolytic capacitor with fuse and method of manufacturing the same

Info

Publication number
JP2776126B2
JP2776126B2 JP7973992A JP7973992A JP2776126B2 JP 2776126 B2 JP2776126 B2 JP 2776126B2 JP 7973992 A JP7973992 A JP 7973992A JP 7973992 A JP7973992 A JP 7973992A JP 2776126 B2 JP2776126 B2 JP 2776126B2
Authority
JP
Japan
Prior art keywords
fuse
solid electrolytic
electrolytic capacitor
cathode terminal
capacitor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP7973992A
Other languages
Japanese (ja)
Other versions
JPH05315204A (en
Inventor
敏幸 三谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP7973992A priority Critical patent/JP2776126B2/en
Publication of JPH05315204A publication Critical patent/JPH05315204A/en
Application granted granted Critical
Publication of JP2776126B2 publication Critical patent/JP2776126B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は固体電解コンデンサに関
し、特にヒューズ付きチップ固体電解コンデンサ及びそ
の製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid electrolytic capacitor, and more particularly, to a chip solid electrolytic capacitor with a fuse and a method of manufacturing the same.

【0002】[0002]

【従来の技術】一般に固体電解コンデンサは種々の電子
回路に使用されており、故障率が小さいことが利点とさ
れている。しかし、一旦故障が発生した場合には、短絡
となることが多い。そして、このような場合に大きな短
絡電流が流れると、コンデンサ素子が発熱して焼損して
しまうことがある。
2. Description of the Related Art In general, solid electrolytic capacitors are used in various electronic circuits, and it is considered that a small failure rate is an advantage. However, once a failure occurs, a short circuit often occurs. If a large short-circuit current flows in such a case, the capacitor element may generate heat and burn out.

【0003】この過大な短絡電流による故障の際に発生
するコンデンサ素子の焼損を防止するとともに、周辺回
路構成素子を保護するたには、コンデンサを短絡から開
放する必要がある。従来この目的のため、一般的にはヒ
ューズを、内蔵した固体電解コンデンサが用いられてい
る。このような固体電解コンデンサをヒューズ付き固体
電解コンデンサと称する。図5は従来のヒューズ付きチ
ップ固体電解コンデンサの構造を示す一部断面斜視図で
ある。また、図6は図5に示す従来のヒューズ付きチッ
プ固体電解コンデンサの断面図及び組み立て前の陰極端
子の平面図である。コンデンサ素子1は陽極リード2と
陰極層3とからなり、陽極リード2には陽極端子4が接
続されている。ヒューズ7は陰極端子5の内部接続部5
aと外部引き出し部5bに接続され、ヒューズ7を保護
するための保護樹脂11により覆われている。陰極層3
はヒューズを内蔵した陰極端子5の内部接続部5aとは
んだ12によって接着されている。そして、これらが外
装樹脂10によって絶縁外装されている。
In order to prevent the capacitor element from being burned out at the time of failure due to the excessive short-circuit current and to protect the peripheral circuit components, it is necessary to release the capacitor from the short circuit. Conventionally, a solid electrolytic capacitor having a built-in fuse has been used for this purpose. Such a solid electrolytic capacitor is called a solid electrolytic capacitor with a fuse. FIG. 5 is a partial sectional perspective view showing the structure of a conventional chip solid electrolytic capacitor with a fuse. FIG. 6 is a sectional view of the conventional chip solid electrolytic capacitor with a fuse shown in FIG. 5 and a plan view of a cathode terminal before assembly. The capacitor element 1 includes an anode lead 2 and a cathode layer 3, and an anode terminal 4 is connected to the anode lead 2. The fuse 7 is connected to the internal connection 5 of the cathode terminal 5.
a and the external lead portion 5b, and is covered with a protective resin 11 for protecting the fuse 7. Cathode layer 3
Are bonded by solder 12 to the internal connection portion 5a of the cathode terminal 5 containing a fuse. These are insulated by an exterior resin 10.

【0004】[0004]

【発明が解決しようとする課題】上述した従来のヒュー
ズ付きチップ固体電解コンデンサは陰極層3とヒューズ
7を内蔵した陰極端子5の内部接続部5aをはんだで接
続するので以下の欠点を持っている。陰極端子5はヒュ
ーズ7を内蔵しており、製造工程中の取り扱いによるヒ
ューズ断線を防ぐためにヒューズ部分を保護樹脂11に
より絶縁被覆する必要があり、このため陰極層3と内部
接続部5aとの間に、保護樹脂11の厚さ分の段差が生
じ、はんだを溶融させて陰極層3と内部接続部5aを接
続させる際に内部接続部5aの弾性復元により、はんだ
が未硬化の内に接続が断たれてしまい、陰極接続の信頼
性が確保できないという問題点があった。
The above-mentioned conventional chip solid electrolytic capacitor with a fuse has the following drawbacks because the internal connection portion 5a of the cathode layer 3 and the cathode terminal 5 containing the fuse 7 are connected by soldering. . The cathode terminal 5 has a built-in fuse 7, and it is necessary to insulate the fuse portion with a protective resin 11 in order to prevent the disconnection of the fuse due to handling during the manufacturing process. For this reason, between the cathode layer 3 and the internal connection portion 5a Then, a step corresponding to the thickness of the protective resin 11 is generated, and when the solder is melted to connect the cathode layer 3 and the internal connection portion 5a, the connection is restored while the solder is uncured due to the elastic restoration of the internal connection portion 5a. There was a problem that the connection was cut off and the reliability of the cathode connection could not be ensured.

【0005】本発明の目的は、陰極端子とコンデンサ素
子とをはんだにより接続する際に、はんだが未硬化のう
ちに陰極端子の内部接続部が弾性復元により接続が断た
れてしまうことを防止でき、不良率の低減・接続の信頼
性を向上させたヒューズ付きチップ固体電解コンデンサ
を提供することにある。
An object of the present invention is to prevent the internal connection of the cathode terminal from being disconnected due to elastic restoration while the solder is not cured when the cathode terminal and the capacitor element are connected by solder. Another object of the present invention is to provide a chip solid electrolytic capacitor with a fuse, which has a reduced defective rate and improved connection reliability.

【0006】[0006]

【課題を解決するための手段】本発明のヒューズ付きチ
ップ固体電解コンデンサ素子は、固体電解コンデンサ素
子から導出された陽極リードに接続された陽極端子と、
前記固体電解コンデンサ素子の陰極層に接続されたヒュ
ーズ付き陰極端子と、前記陽極端子及び前記陰極端子の
所定部分を除き全体を覆う外装樹脂とを含み、前記陰極
端子が内部接続部と外部引き出し部とこれら双方を接続
するヒューズを保護被覆する樹脂からなるヒューズ付き
チップ固体電解コンデンサにおいて、前記陰極端子の内
部接続部が、長方形の素子接続部と、長方形の対角上に
位置したヒューズ接続部および突出部により構成されて
いることを特徴として構成され、またその製造方法は、
陰極端子をコンデンサ素子に接続する工程が、コンデン
サ素子上にはんだ層を形成した後、陰極端子をコンデン
サ素子上の所定の位置に合わせ、陰極端子のヒューズ接
続部の突出部をコンデンサ素子に接触させるまで押え、
ヒューズ接続部を加熱することを特徴として構成され
る。
According to the present invention, there is provided a chip solid electrolytic capacitor element with a fuse, comprising: an anode terminal connected to an anode lead derived from the solid electrolytic capacitor element;
A cathode terminal with a fuse connected to the cathode layer of the solid electrolytic capacitor element, and an exterior resin covering the whole except for a predetermined portion of the anode terminal and the cathode terminal, wherein the cathode terminal has an internal connection portion and an external lead portion. In a solid electrolytic capacitor with a fuse made of a resin for protecting and covering a fuse connecting both of them, the internal connection portion of the cathode terminal has a rectangular element connection portion, a fuse connection portion located on a diagonal of the rectangle, and It is characterized by being constituted by the protruding portion, and the manufacturing method thereof,
The step of connecting the cathode terminal to the capacitor element includes, after forming a solder layer on the capacitor element, aligning the cathode terminal with a predetermined position on the capacitor element, and bringing the protrusion of the fuse connection portion of the cathode terminal into contact with the capacitor element. Hold down until
It is characterized by heating the fuse connection.

【0007】[0007]

【実施例】次に本発明について図面を参照して説明す
る。図1は本発明の一実施例の内部構造を示す一部断面
斜視図、図2は図1に示す第1の実施例の陰極端子の組
み立て前の平面図及び陰極接続工程を示す横断面図であ
る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is a perspective view, partly in section, showing the internal structure of one embodiment of the present invention. FIG. 2 is a plan view of the cathode terminal of the first embodiment shown in FIG. It is.

【0008】タンタル、アルミニウム等の弁作用を有す
る金属粉末に陽極リード2の一部を埋設した状態でプレ
ス成形して陽極体を形成し、この陽極体を真空焼結した
後、陽極酸化しその陽極酸化膜上に公知の手段により、
二酸化マンガン層、カーボン層、めっき層、はんだ層を
順次形成し、固体電解コンデンサ素子1とする。次に、
ヒューズ7を陰極端子5の内部接続部5aと外部引き出
し端子5bに溶着法により接続した後、例えばモールド
成形により保護樹脂11で覆う。
An anode body is formed by press molding with a part of the anode lead 2 buried in a metal powder having a valve action such as tantalum or aluminum, and the anode body is vacuum-sintered and then anodized. By a known means on the anodic oxide film,
A manganese dioxide layer, a carbon layer, a plating layer, and a solder layer are sequentially formed to obtain a solid electrolytic capacitor element 1. next,
After the fuse 7 is connected to the internal connection portion 5a of the cathode terminal 5 and the external lead terminal 5b by a welding method, the fuse 7 is covered with the protective resin 11 by, for example, molding.

【0009】次に、固体電解コンデンサ素子1から導出
された陽極リード2を陽極端子に抵抗溶接し、また、固
体電解コンデンサ素子1の外周に形成されている陰極層
3を高温はんだ12によって、陰極端子5の内部接続部
5aに接続する。
Next, the anode lead 2 led out of the solid electrolytic capacitor element 1 is resistance-welded to the anode terminal, and the cathode layer 3 formed on the outer periphery of the solid electrolytic capacitor element 1 is cathode-heated with high-temperature solder 12. Connected to the internal connection part 5a of the terminal 5.

【0010】次に、これらを外装樹脂10によって絶縁
外装し本発明のヒューズ付きチップ固体電解コンデンサ
を得る。
Next, these are insulated and sheathed with a sheath resin 10 to obtain a chip solid electrolytic capacitor with a fuse of the present invention.

【0011】次に、陰極端子5の製造方法、陰極端子5
と固体電解コンデンサ素子1との接続方法について詳細
に説明する。
Next, a method of manufacturing the cathode terminal 5 will be described.
A method for connecting the capacitor and the solid electrolytic capacitor element 1 will be described in detail.

【0012】図2は本実施例に用いた陰極端子5の組み
立て前の形状を示したものである。内部接続部5aと外
部引き出し端子5bとが一体に形成され、フレーム14
により支持されている。本実施例では、先ず、内部接続
部5aと外部引き出し端子5bとの間にヒューズ7を溶
着する。次に、内部接続部5aと外部引き出し端子5b
とを、所定部分を露出させてモールド成形法にて、保護
樹脂11により被覆する。この際、内部接続部5a端面
と保護樹脂11の間には0.1mm程度のすき間を設け
る。その後、内部接続部5aの露出部を、A−A1 線、
B−B1 線、C−C1 線および、D−D1 線で切断し
て、ヒューズ機能を有する陰極端子5を得る。
FIG. 2 shows the shape of the cathode terminal 5 used in this embodiment before assembly. The internal connection portion 5a and the external lead-out terminal 5b are integrally formed, and the frame 14
Supported by In this embodiment, first, the fuse 7 is welded between the internal connection portion 5a and the external lead-out terminal 5b. Next, the internal connection part 5a and the external lead-out terminal 5b
Are covered with a protective resin 11 by a molding method with a predetermined portion exposed. At this time, a gap of about 0.1 mm is provided between the end face of the internal connection portion 5a and the protective resin 11. Thereafter, the exposed portions of the internal connection portion 5a, A-A 1 line,
B-B 1 line, C-C 1 line and, by cutting with D-D 1 line, obtaining a cathode terminal 5 having the fuse function.

【0013】ここで、A−A1 線は内部接続部端面より
0.5mmのところで切断し突出部5cを得る。次に、
接続用高温はんだクリームをコンデンサ素子1の表面に
塗布し一旦溶融硬化させ、はんだ層13を形成した。次
に固体電解コンデンサ素子1の所定の位置に内部接続部
5aを合わせた後、内部接続部5aの突出部5cを押え
用爪13で固体電解コンデンサ素子1に押し当てる。そ
の状態を維持したまま加熱用こて15を内部接続部5a
に押し当て、高温はんだ層13はんだを溶融させる。次
に、高温はんだ層12が硬化後、押え用爪13を外し、
固体電解コンデンサ素子1と陰極端子5の接続を完了し
た。
[0013] Here, A-A 1 line gets a protruding portion 5c is cut at the 0.5mm than the internal connecting end face. next,
A high-temperature solder cream for connection was applied to the surface of the capacitor element 1 and was once melt-hardened to form a solder layer 13. Next, after the internal connecting portion 5a is aligned with a predetermined position of the solid electrolytic capacitor element 1, the protruding portion 5c of the internal connecting portion 5a is pressed against the solid electrolytic capacitor element 1 by the pressing claw 13. While maintaining this state, the heating iron 15 is connected to the internal connection portion 5a.
To melt the high-temperature solder layer 13 solder. Next, after the high-temperature solder layer 12 is cured, the holding claws 13 are removed,
The connection between the solid electrolytic capacitor element 1 and the cathode terminal 5 was completed.

【0014】次に、この組み立て完了品を陽極端子4と
陰極端子5の所定部分を露出させてトランスファーモー
ルド工法により、外装樹脂10で絶縁外装する。
Next, a predetermined portion of the anode terminal 4 and the cathode terminal 5 is exposed on the assembled product, and is insulated with an exterior resin 10 by a transfer molding method.

【0015】その後、フレーム14を図2(b)に示す
E−E1 線で切断し、更に、陽極端子4および、陰極端
子5を外装樹脂10の外壁に沿って折り曲げて本発明の
第1の実施例のヒューズ付きチップ固体電解コンデンサ
を完成した。
Thereafter, the frame 14 is cut along the line EE 1 shown in FIG. 2B, and the anode terminal 4 and the cathode terminal 5 are bent along the outer wall of the exterior resin 10 to form the first terminal of the present invention. The chip solid electrolytic capacitor with a fuse according to the example was completed.

【0016】図3は本発明の他の実施例の一部断面斜視
図、図4(a)は陰極端子の形状を示しており、本実施
例では突出部5cを外部引き出し方向と逆方向に設けて
いる。本実施例の陰極端子形状を用いることにより、図
4(b)に示す如く突出部を押える押え爪13および、
押える工程をフレーム単位で行なえるため、装置およ
び、工程を簡略化できるという利点がある。フレーム形
状以外の材料、製造工程は第1の実施例と同様である。
FIG. 3 is a perspective view, partially in cross section, of another embodiment of the present invention, and FIG. 4A shows the shape of a cathode terminal. Provided. By using the shape of the cathode terminal of the present embodiment, as shown in FIG.
Since the pressing step can be performed in frame units, there is an advantage that the apparatus and the steps can be simplified. The material other than the frame shape and the manufacturing process are the same as in the first embodiment.

【0017】[0017]

【発明の効果】以上説明したように本発明は、ヒューズ
付き陰極端子の内部接続部に突出部を設け、接続工程に
おいて突出部を利用して陰極端子の内部接続部を固体電
解コンデンサ素子に確実に接触させ、接続用はんだ溶
解、硬化まで接触状態を維持させることを容易に行なう
事ができる。その結果、従来、溶融はんだが未硬化のう
ちにフレームの弾性復元により一旦接続した陰極端子と
固体電解コンデンサ素子の接続が失われてしまうという
不良が約0.5%発生していたが、本発明によれば同様
の不良を撲滅することができ、不良率の低減、当該不良
除去のための検査工程の削減および接続の信頼性を向上
させることができた。
As described above, according to the present invention, a projection is provided at the internal connection of the cathode terminal with a fuse, and the internal connection of the cathode terminal is securely connected to the solid electrolytic capacitor element by utilizing the projection in the connection step. , And the contact state can be easily maintained until the connection solder is melted and cured. As a result, about 0.5% of the defects that the connection between the cathode terminal once connected and the solid electrolytic capacitor element was lost due to the elastic recovery of the frame while the molten solder was uncured occurred. According to the present invention, similar defects can be eliminated, the defect rate can be reduced, the number of inspection steps for removing the defects can be reduced, and the connection reliability can be improved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例のヒューズ付き固体電解コン
デンサの一部断面斜視図である。
FIG. 1 is a partial cross-sectional perspective view of a solid electrolytic capacitor with a fuse according to an embodiment of the present invention.

【図2】図1に示す本発明第1の実施例の組み立て前の
陰極端子の平面図及び陰極接続工程の横断面図である。
FIG. 2 is a plan view of a cathode terminal before assembly and a cross-sectional view of a cathode connection step of the first embodiment of the present invention shown in FIG. 1;

【図3】本発明の他の実施例のヒューズ付き固体電解コ
ンデンサの一部断面斜視図である。
FIG. 3 is a partial sectional perspective view of a solid electrolytic capacitor with a fuse according to another embodiment of the present invention.

【図4】図3に示す本発明第2の実施例の組み立て前の
陰極端子の平面図及び陰極接続工程の横断面図である。
FIG. 4 is a plan view of a cathode terminal before assembly and a cross-sectional view of a cathode connection step of the second embodiment of the present invention shown in FIG. 3;

【図5】従来のヒューズ付き固体電解コンデンサの一部
断面斜視図である。
FIG. 5 is a partial sectional perspective view of a conventional solid electrolytic capacitor with a fuse.

【図6】図5に示すヒューズ付き固体電解コンデンサの
断面図及び組み立て前の陰極端子の平面図である。
6 is a sectional view of the solid electrolytic capacitor with a fuse shown in FIG. 5 and a plan view of a cathode terminal before assembly.

【符号の説明】[Explanation of symbols]

1 コンデンサ素子 2 陽極リード 3 陰極層 4 陽極端子 5a 内部接続部 5b 外部引き出し部 5c 突出部 7 ヒューズ 10 外装樹脂 11 保護樹脂 12 高温はんだ 13 押え用爪 14 フレーム 15 加熱用こて DESCRIPTION OF SYMBOLS 1 Capacitor element 2 Anode lead 3 Cathode layer 4 Anode terminal 5a Internal connection part 5b External lead-out part 5c Projection part 7 Fuse 10 Outer resin 11 Protective resin 12 High-temperature solder 13 Holding claw 14 Frame 15 Heating iron

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 固体電解コンデンサ素子と、前記固体電
解コンデンサ素子から導出された陽極リードに接続され
た陽極端子と、前記固体電解コンデンサ素子の陰極層に
接続されたヒューズ付き陰極端子と、前記陽極端子及び
前記陰極端子の所定部分を除き全体を覆う外装樹脂とを
含み、前記陰極端子が内部接続部と外部引き出し部とこ
れら双方を接続するヒューズを保護被覆する樹脂からな
るヒューズ付きチップ固体電解コンデンサにおいて、前
記陰極端子の内部接続部が、長方形の素子接続部と、長
方形の対角上に位置したヒューズ接続部および突出部に
より構成されていることを特徴とするヒューズ付きチッ
プ固体電解コンデンサ。
1. A solid electrolytic capacitor element, an anode terminal connected to an anode lead derived from the solid electrolytic capacitor element, a cathode terminal with a fuse connected to a cathode layer of the solid electrolytic capacitor element, and the anode A chip solid electrolytic capacitor with a fuse, comprising a terminal and an exterior resin covering the whole except for a predetermined portion of the cathode terminal, wherein the cathode terminal is made of a resin for protecting and covering an internal connection portion, an external lead portion, and a fuse connecting both of them. 2. The chip solid electrolytic capacitor with a fuse according to claim 1, wherein the internal connection portion of the cathode terminal comprises a rectangular element connection portion, a fuse connection portion and a protrusion located on a diagonal of the rectangle.
【請求項2】 内部接続部が、長方形の素子接続部と、
長方形の対角上に位置したヒューズ接続部および突出部
により構成された陰極端子を固体電解コンデンサ素子に
接続する工程が、コンデンサ素子上にはんだ層を形成す
る工程と、陰極端子をコンデンサ素子上の所定の位置に
合わせた後、陰極端子の内部接続部の突出部をコンデン
サ素子に接触させるまで押える工程と、内部接続部を加
熱する工程からなることを特徴とするヒューズ付きチッ
プ固体電解コンデンサの製造方法。
2. The method according to claim 1, wherein the internal connection part is a rectangular element connection part,
The step of connecting the cathode terminal formed by the fuse connection part and the protrusion located on the diagonal of the rectangle to the solid electrolytic capacitor element includes the steps of: forming a solder layer on the capacitor element; and connecting the cathode terminal on the capacitor element. Manufacturing a chip solid electrolytic capacitor with a fuse, comprising: a step of pressing a projection of an internal connection portion of a cathode terminal until it contacts a capacitor element after being adjusted to a predetermined position; and a step of heating the internal connection portion. Method.
JP7973992A 1992-04-01 1992-04-01 Chip solid electrolytic capacitor with fuse and method of manufacturing the same Expired - Lifetime JP2776126B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7973992A JP2776126B2 (en) 1992-04-01 1992-04-01 Chip solid electrolytic capacitor with fuse and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7973992A JP2776126B2 (en) 1992-04-01 1992-04-01 Chip solid electrolytic capacitor with fuse and method of manufacturing the same

Publications (2)

Publication Number Publication Date
JPH05315204A JPH05315204A (en) 1993-11-26
JP2776126B2 true JP2776126B2 (en) 1998-07-16

Family

ID=13698594

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7973992A Expired - Lifetime JP2776126B2 (en) 1992-04-01 1992-04-01 Chip solid electrolytic capacitor with fuse and method of manufacturing the same

Country Status (1)

Country Link
JP (1) JP2776126B2 (en)

Also Published As

Publication number Publication date
JPH05315204A (en) 1993-11-26

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