JP2768704B2 - Semiconductor device manufacturing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial application field) The present invention relates to a semiconductor device manufacturing apparatus, and is particularly suitable for a control system of the manufacturing apparatus.

(Prior art) In recent semiconductor device assembling processes, an automation process using a computer is generally used. In addition to batch processing, single-wafer processing has become a hot topic. Due to the development of manufacturing conditions, the size of a single crystal for a semiconductor that can be manufactured tends to become larger.

Furthermore, under the severe economic environment, it is necessary to use a large-sized single crystal for semiconductors to cope with cost reduction by a mass production system and to cope with production of a small number of various kinds. Against this background, a device that integrates a plurality of manufacturing devices required for manufacturing semiconductor devices has been developed and put into practical use. Although employed, the flow of processing steps is constant within this device.

(Problems to be Solved by the Invention) In such a manufacturing method, (1) even if the combination of the predetermined processes is similar, the device is completely different from another device depending on the timing of the device, the situation, the user (User) circumstances, and the like. turn into.

(2) In addition, the improvement of the apparatus does not easily progress in accordance with the progress of the processing technology, and even if it is possible, conditions such as cost, delivery date, technology, and space are frequently added, and it is difficult to realize.

(3) In addition, improvements cannot be made in line with changes in the production line.
As in the case of (2), there are many additional conditions and it is difficult to realize.

The present invention has been made under such circumstances. In particular, the flow of the manufacturing process can be arbitrarily selected (the flow can be switched to the minimum flow required for the product), and the combination of the processing steps can be arbitrarily selected. It is an object of the present invention to provide a semiconductor device manufacturing apparatus that can be used (devices are formed by arbitrarily combining processing steps that have been previously modularized).

[Configuration of the invention]

(Means for Solving the Problems) A semiconductor device manufacturing apparatus according to the present invention controls a mechanism unit that performs a different single process installed in a manufacturing apparatus necessary for each semiconductor device manufacturing process, and controls each mechanism unit. A plurality of module mechanisms having a control unit for performing the processing, an integrated processing apparatus electrically connected to each of these module mechanisms and performing management control, and a communication network connecting the integrated processing apparatus and each of the module mechanisms. The integrated processing device and the respective module mechanisms are transmitted and received via the communication network to enable processing of each of the module mechanisms, and control a manufacturing apparatus required for each manufacturing process of the semiconductor device. It is characterized by the following.

(Function) In the present invention, a resist coater (Resist Coater), a developer (Developer),
Soft Baker, Hard Bak
er), an ATR (Automatic Transfer), a wafer spin (Wafer Spin), and other mechanical mechanisms are each provided with an interface. In addition, each of the mechanical mechanisms having the interface, that is, the control unit, is a system that can be electrically connected to the integrated processing device by a communication network to perform centralized control. Then, it is called a module mechanism.

That is, a semiconductor manufacturing apparatus is configured by a plurality of module mechanisms, and each is controlled by a control unit attached thereto.
Data such as necessary recipes (information necessary for a semiconductor manufacturing process using a computer and having substantially the same meaning as a normal menu) is instructed from the integrated processing device. The information is exchanged between the integrated processing device and the plurality of module mechanisms by a status signal through a communication network.

Embodiment An embodiment of the present invention will be described with reference to FIGS. As shown in the overall configuration diagram of FIG. 1, the integrated processing device 1 (IMCS) includes a plurality of module devices 2, 3
.. (IIOC) are connected by the communication network system 6, and polling and response of data are exchanged to integrally manage the entire apparatus.

A conceptual diagram of the entire system will be described with reference to FIG.
Here, elevator units # 1, 2, 12, and 13 (the S / R in the figure is an abbreviation of an elevator), which constitute a mechanism unit of each module mechanism, #
6, Resist Coater, # 10 Developer, # 4 Soft Baker
# 8 Hard Baker, # 10ATR (Automatic
Transfer) Two spins 7, 8 are arranged. Dotted lines in the figure indicate specific devices, and solid lines indicate a state in which a semiconductor substrate to be processed (hereinafter, referred to as a wafer) is removed therefrom.

The dotted line written next to this clean hand is
The control means a transporting vehicle for transporting a wafer to be processed. The control is performed by a clean hand as an interface and CMIFs # 3 and # 11, and of course, is connected to each module mechanism.

Spins 7 and 8 are devices that perform the operation of aligning multiple wafers. The interfaces are CTM and # 5, respectively.
And # 9CTMIF.

Further, it goes without saying that each module mechanism and interface are electrically connected to the integrated processing device 1 (IMCS) and the PCS (Power Controller).

The communication network system for transmitting information transmits a control command (instruction) from the primary station 5 as apparent from FIG. FIG. 3 is a diagram showing an outline of the mechanism of the integrated processing apparatus 1, including a CPU, a RAM, a disk controller, a plasma display and a graphic controller, a printer and a PIO.
And a built-in LAN. In some cases, a CPU is provided with a system console, and an operation keyboard is also connected via an interface.

On the other hand, as shown in FIG. 5, the module mechanisms 2, 3,... Transmit a control command transmitted from a primary station 5 held in a communication network system having second to n-th stations (slave channels). Input to the interface and output according to the sequence. In short, the communication network system includes the integrated processing device 1 and the modules 2 and 3
… Control data, recipe data, status data,
Provides end data and other data transmission.

The functions of the integrated processing apparatus 1 are shown in FIG. 4 for each block, and each function can be individually displayed, and a so-called operator interface is provided.

That is, as shown in the figure, the action key has six types of key modes. The test mode has seven types, the standard entry 4 belonging to the entry mode has four types of control modes.

FIG. 6 is a diagram showing communication timing of the communication network system. As shown in the figure, the case where data to be sent to the secondary station has occurred in the primary station is displayed. In the secondary station response to the primary station polling, data to be transmitted occurs after the third polling and response. After the transmission is completed, the fourth and subsequent polling and response are performed.

 Next, specific processing will be described.

FIG. 7 shows the flow of processing via the module mechanism, where the symbols are S / R: elevator, C: coater, SB:
Soft bake, ATR: Aligner transfer, D: Developer, HB: Hard bake, CTM: Center transfer,
→: Transfer direction by clean hand, →: Transfer direction by dedicated model.

Example 1 is elevator → CTM → coater → CTM → soft bake → elevator. Example 2 is elevator → CTM → developer → CTM → hard bake → elevator. Example 3 is elevator → CTM → coater → CTM → soft bake → ATR → Hard bake → 1.CTM → Developer → CTM → 2.CTM → Hard bake → 3. Elevator As described above, various routes are generated by the semiconductor device manufacturing process.

Further, FIGS. 8 and 9 show the communication status of various data (commands, processes, etc.) between the integrated processing unit IMCS and the module mechanism IIOC using the communication network system.

In the standard, the procedure for transmitting the recipe is shown, and the order of operating the mechanism units of the module mechanisms 2 is also clarified.

10 to 13 clarify communication data timing for processing between a plurality of module mechanisms 2 connected by the communication network system.

In contrast, FIGS. 14 to 17 show communication timings for processing between a plurality of module mechanisms connected by dedicated communication.

 Table 1 shows the data division.

The operation of the above system will be described. First, as an initial setting, the module mechanisms 2... Connected to the integrated processing apparatus 1 are automatically searched. That is, the command "B0" shown in Table 1 is sent to all slave channels (stations), the response command "B1" of the slave channel that has responded to the command is checked, and the subsequent text (attached to the communication network system). Module mechanism described in
Depending on the No., slave channel and module mechanism 2 ...
Read the sequence.

Next, the arrangement of the module mechanisms 2 automatically monitored is displayed on the plasma display device (refer to FIG. 3). In this case, the arrangement is made in anticipation of the processing flow from the module mechanisms 2.

Then, after confirming the display contents by the operator, the arrangement of the module mechanisms 2 is registered as shown in FIG. Here, the displayed arrangement is corrected by a key. However, the addition of the module mechanism is a necessary condition that the arrangement is connected to the slave channel.

To start the process, it is necessary to key in the recipe number after the above-mentioned initial setting is completed, and to register the data corresponding to the recipe number in the entry mode of the integrated processing apparatus 1 in advance.

Then, after setting a semiconductor element to be processed, that is, a work in a predetermined module mechanism 2..., The system is started. After the start is started, a command is issued to the integrated processing apparatus 1 and the module mechanisms 2 in accordance with the movement of the work, and the status communication shown in FIG. 8 and the status communication between the module mechanisms 2 (FIGS. 8 and 9) are performed. While proceeding.

The movement of the work required for this processing uses the communication timing for the communication network system in FIGS. 10 to 13 and the communication timing clarified in FIGS. 14 to 17.

〔The invention's effect〕

In this way, by handling a single processing step and organically combining the module mechanism with the control unit and the mechanism unit, a series of processing equipment can be planned and a manufacturing equipment that can respond to changes is completed. Was done. As a result, it is possible to cope with the flow of the changed processing steps, which has been conventionally regarded as a problem, by the unit of the module mechanism, and there is an advantage that the life of the apparatus is extended.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing the entire system according to the present invention, FIG. 2 is a conceptual diagram of the system configuration, and FIG.
FIG. 4 is a hardware block diagram of the integrated processing apparatus.
5 is a functional block diagram of the integrated processing apparatus, FIG. 5 is a hardware block diagram of a module mechanism, FIG. 6 is a communication timing diagram of a communication network system, and FIG. , FIG. 8 and FIG. 9 show commands and commands between the integrated processing device and the module mechanism.
FIG. 10 to FIG. 13 are diagrams showing the flow of data, FIG.
The figure is a timing communication timing diagram between each module mechanism using dedicated communication. 1: Integrated processing unit, 2 ... module mechanism, 6: Communication network system.

Claims (1)

(57) [Claims] A plurality of module mechanisms each including a mechanism unit for performing a single different process installed in a manufacturing apparatus required for each semiconductor device manufacturing process and a control unit for controlling each of the mechanism units; An integrated processing device that is electrically connected to each module mechanism and performs management control, and includes a communication network that connects the integrated processing device and each module mechanism, and the integrated processing device via the communication network. A semiconductor device manufacturing apparatus, wherein processing of each of these module mechanisms is enabled by transmitting and receiving signals between the respective module mechanisms, and a manufacturing apparatus required for each manufacturing process of the semiconductor element is controlled.