JP2767319B2 - Thermal environment measurement device - Google Patents
Thermal environment measurement deviceInfo
- Publication number
- JP2767319B2 JP2767319B2 JP2301067A JP30106790A JP2767319B2 JP 2767319 B2 JP2767319 B2 JP 2767319B2 JP 2301067 A JP2301067 A JP 2301067A JP 30106790 A JP30106790 A JP 30106790A JP 2767319 B2 JP2767319 B2 JP 2767319B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- heater
- sensor
- thermal environment
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Testing Or Calibration Of Command Recording Devices (AREA)
- Air-Conditioning Room Units, And Self-Contained Units In General (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、温熱環境を測定する温熱環境測定装置に
関するものである。The present invention relates to a thermal environment measuring device for measuring a thermal environment.
〔従来の技術〕 従来より、この種の温熱環境測定装置においては、第
２図に示すような楕円状（または円柱状）のセンサ部１
の温度をある決められた一定温度Tsに保つように、セン
サ部１に対して設けられた図示せぬヒータ（以下、セン
サ部ヒータと言う）を加熱制御し、そのときのヒータ電
力Ｈに基づき気温TA,輻射温度TR,気流VAIRを総合した値
を求め、その値を温熱環境として人間の感じる体感温度
に変換するものとしていた。2. Description of the Related Art Conventionally, in a thermal environment measuring device of this type, an elliptical (or cylindrical) sensor unit 1 as shown in FIG.
The heater (not shown) provided to the sensor unit 1 (hereinafter, referred to as a sensor unit heater) is controlled so as to maintain the temperature of the sensor unit 1 at a predetermined constant temperature Ts, based on the heater power H at that time. A value obtained by integrating the temperature T A , the radiation temperature T R , and the airflow V AIR is obtained, and the obtained value is converted to a human-perceived temperature as a thermal environment.
しかしながら、このような従来の温熱環境測定装置に
おいては、センサ部１が支持部２を介して壁，床，天井
等に設置されており、センサ部ヒータの熱量の一部が支
持部２から逃げ、また壁，床，天井等の温度は一定でな
いため、ヒータ電力Ｈに変化を生じ、誤差の原因となっ
ていた。However, in such a conventional thermal environment measuring apparatus, the sensor unit 1 is installed on a wall, a floor, a ceiling, or the like via the support unit 2, and a part of the heat amount of the sensor unit heater escapes from the support unit 2. In addition, since the temperatures of the walls, floor, ceiling, and the like are not constant, a change occurs in the heater power H, causing an error.
すなわち、ヒータ電力Ｈは、気温TA,輻射温度TR,気流
VAIRのほか支持部２の温度TBにも影響を受け、次のよう
な式で表すことができる。That is, the heater power H is calculated based on the temperature T A , the radiation temperature T R ,
In addition to V AIR , it is affected by the temperature T B of the support 2 and can be expressed by the following equation.
H1＝H1（TA）＋H2（TR）＋H3（VAIR）＋H4（TB） 上記式の中でH4（TB）は望ましくない熱量である。従
来は、このH4（TB）少なくするために断熱材等を用いて
熱流を小さくしていたが、完全ではなかった。H 1 = H 1 (T A ) + H 2 (T R ) + H 3 (V AIR ) + H 4 (T B ) In the above equation, H 4 (T B ) is an undesirable heat quantity. Conventionally, to reduce the H 4 (T B ), heat flow was reduced by using a heat insulating material or the like, but it was not perfect.
本発明はこのような課題を解決するために提案された
もので、支持部に対して第２のヒータ（支持部ヒータ）
を設け、この第２のヒータを加熱制御することにより、
支持部の温度をセンサ部の温度と等しい一定温度Tsに保
つようにしたものである。The present invention has been proposed to solve such a problem, and a second heater (support portion heater) is provided for the support portion.
And by controlling the heating of the second heater,
The temperature of the support is kept at a constant temperature Ts equal to the temperature of the sensor.
したがってこの発明によれば、センサ部から支持部へ
の熱の移動が零となり、センサ部が熱的に絶縁された状
態となる。Therefore, according to the present invention, the transfer of heat from the sensor section to the support section becomes zero, and the sensor section is in a thermally insulated state.
以下、本発明に係る温熱環境測定装置を詳細に説明す
る。Hereinafter, the thermal environment measuring device according to the present invention will be described in detail.
第１図はこの温熱環境測定装置の一実施例の要部を示
すブロック回路構成図である。同図において、３はセン
サ部１（第２図参照）に対して設けられたセンサ部ヒー
タ、４はセンサ部１の温度を検出する温度センサ、５は
設定温度Tsと温度センサ４による検出温度Tpv1との差を
演算する減算回路、６は減算回路５での演算結果に基づ
きセンサ部ヒータ３への供給電力を調整するアンプ、７
はセンサ部ヒータ３への供給電力をヒータ電力Ｈとして
計測し温熱信号に変換して出力する演算器、８は支持部
２（第２図参照）に対して設けられた支持部ヒータ、９
は支持部２の温度を検出する温度センサ、10は設定温度
Tsと温度センサ９による検出温度Tpv2との差を演算する
減算回路、11は減算回路10での演算結果に基づき支持部
ヒータ８への供給電力を調整するアンプである。FIG. 1 is a block circuit configuration diagram showing a main part of one embodiment of the thermal environment measuring device. 3, reference numeral 3 denotes a sensor heater provided for the sensor unit 1 (see FIG. 2), 4 denotes a temperature sensor for detecting the temperature of the sensor unit 1, 5 denotes a set temperature Ts and a temperature detected by the temperature sensor 4. A subtraction circuit 6 for calculating a difference from T pv1 ; an amplifier 6 for adjusting the power supplied to the sensor heater 3 based on the calculation result of the subtraction circuit 5;
Is a computing unit that measures power supplied to the sensor unit heater 3 as heater power H, converts it into a thermal signal and outputs it, 8 is a support heater provided for the support 2 (see FIG. 2), 9
Is a temperature sensor for detecting the temperature of the support portion 2, and 10 is a set temperature.
A subtraction circuit 11 calculates the difference between Ts and the detected temperature T pv2 detected by the temperature sensor 9. An amplifier 11 adjusts the power supplied to the support heater 8 based on the calculation result of the subtraction circuit 10.
ここで、従来構成との関係について述べるに、従来構
成においてはセンサ部ヒータ3,温度センサ4,減算回路5,
アンプ６および演算器７を擁している。これに対して、
本実施例においては、支持部ヒータ8,温度センサ9,減算
回路10およびアンプ11を追加した構成となっている。な
お、センサ部ヒータ３への供給電力はヒータ電力Ｈとし
て計測し温熱信号を変換して出力するが、支持部ヒータ
８への供給電力は計測する必要はない。Here, the relationship with the conventional configuration will be described. In the conventional configuration, the sensor heater 3, the temperature sensor 4, the subtraction circuit 5,
It has an amplifier 6 and a computing unit 7. On the contrary,
In this embodiment, a configuration is adopted in which a support heater 8, a temperature sensor 9, a subtraction circuit 10, and an amplifier 11 are added. Note that the power supplied to the sensor heater 3 is measured as the heater power H and is converted and output as a heating signal. However, the power supplied to the support heater 8 need not be measured.
次に、本実施例の動作について説明する。 Next, the operation of the present embodiment will be described.
センサ部１の温度は次のようにして一定温度Tsに保た
れる。すなわち、センサ部１の温度が温度センサ４によ
り検出され、その検出温度Tpv1が減算回路５へ与えられ
る。減算回路５は、設定温度Tsと検出温度Tpv1との差を
とり、その差に応じた信号をアンプ６へ与える。アンプ
６は、設定温度Tsと検出温度Tpv1との差が零となるよう
に、センサ部ヒータ３への供給電力を調整する。このよ
うにして、センサ部１の温度は、設定温度Tsすなわち一
定温度Tsに保たれる。The temperature of the sensor unit 1 is maintained at a constant temperature Ts as follows. That is, the temperature of the sensor unit 1 is detected by the temperature sensor 4, and the detected temperature T pv1 is provided to the subtraction circuit 5. The subtraction circuit 5 calculates a difference between the set temperature Ts and the detected temperature Tpv1, and supplies a signal corresponding to the difference to the amplifier 6. The amplifier 6 adjusts the power supplied to the sensor section heater 3 so that the difference between the set temperature Ts and the detected temperature T pv1 becomes zero. Thus, the temperature of the sensor unit 1 is maintained at the set temperature Ts, that is, the constant temperature Ts.
一方、支持部２の温度は次のようにして一定温度Tsに
保たれる。すなわち、支持部２の温度が温度センサ９に
より検出され、その検出温度Tpv2が減算回路10へ与えら
れる。減算回路10は、設定温度Tsと検出温度Tpv2との差
をとり、その差に応じた信号をアンプ11へ与える。アン
プ11は、設定温度Tsと検出温度Tpv2との差が零となるよ
うに、支持部ヒータ８への供給電力を調整する。このよ
うにして、支持部２の温度は、設定温度Tsすなわち一定
温度Tsに保たれる。On the other hand, the temperature of the support 2 is maintained at a constant temperature Ts as follows. That is, the temperature of the support 2 is detected by the temperature sensor 9, and the detected temperature T pv2 is provided to the subtraction circuit 10. The subtraction circuit 10 calculates the difference between the set temperature Ts and the detected temperature Tpv2, and supplies a signal corresponding to the difference to the amplifier 11. The amplifier 11 adjusts the power supplied to the support heater 8 so that the difference between the set temperature Ts and the detected temperature Tpv2 becomes zero. Thus, the temperature of the support 2 is maintained at the set temperature Ts, that is, the constant temperature Ts.
すなわち、本実施例による温熱環境測定装置によれ
ば、センサ部１の温度と支持部２の温度とが、一定温度
Tsとなる。このため、センサ部１から支持部２への熱の
移動が零となり、センサ部１が熱的に絶縁された状態と
なって、演算器７へ与えられるヒータ電力ＨにおけるH4
（TB）が零となり、支持部２の局部的温度に左右される
ことなく、正しく温熱環境を測定することができるよう
になる。That is, according to the thermal environment measuring device according to the present embodiment, the temperature of the sensor unit 1 and the temperature of the support unit 2 are set to a constant temperature.
Ts. Therefore, heat transfer becomes zero in the sensor portion 1 to the support 2, in a state where the sensor unit 1 is thermally insulated, H 4 in the heater power H supplied to the arithmetic unit 7
(T B ) becomes zero, and the thermal environment can be correctly measured without being affected by the local temperature of the support portion 2.
なお、本実施例による温熱環境測定装置によれば、上
述した所期の目的が達成される他、従来自己発熱により
困難であった演算回路部とセンサとの一体化が可能とな
り、コンパクトな装置とすることができるという派生的
な効果もある。According to the thermal environment measuring apparatus according to the present embodiment, in addition to achieving the above-described intended purpose, the arithmetic circuit unit and the sensor, which were conventionally difficult due to self-heating, can be integrated, and a compact device can be obtained. There is also a secondary effect that can be.
以上説明したようにこの発明による温熱環境測定装置
によると、支持部に対して第２のヒータを設け、この第
２のヒータを加熱制御することにより、支持部の温度を
センサ部の温度と等しい一定温度Tsに保つようにしたの
で、センサ部から支持部への熱の移動が零となり、セン
サ部が熱的に絶縁された状態となって、支持部の局部的
温度に左右されることなく、正しく温熱環境を測定する
ことができるようになる。As described above, according to the thermal environment measuring apparatus of the present invention, the second heater is provided for the support, and the temperature of the support is equal to the temperature of the sensor by controlling the heating of the second heater. Since the temperature is kept at a constant temperature Ts, the transfer of heat from the sensor section to the support section becomes zero, the sensor section becomes thermally insulated, and is not affected by the local temperature of the support section. In this case, the thermal environment can be correctly measured.
また、この発明による温熱環境測定装置によれば、演
算回路部とセンサとの一体化が可能となり、コンパクト
な装置とすることができるという派生的な効果もある。Further, according to the thermal environment measuring apparatus according to the present invention, the arithmetic circuit unit and the sensor can be integrated, and there is an additional effect that the apparatus can be made compact.
第１図は本発明に係る温熱環境測定装置の一実施例の要
部を示すブロック回路構成図、第２図はこの温熱環境測
定装置および従来の温熱環境測定装置におけるセンサ部
の設置状況を示す図である。 １……センサ部、２……支持部、３……センサ部ヒー
タ、4,9……温度センサ、5,10……減算回路、6,11……
アンプ、７……演算器、８……支持部ヒータ。FIG. 1 is a block diagram showing a main part of an embodiment of a thermal environment measuring apparatus according to the present invention, and FIG. 2 shows the installation state of a sensor section in the thermal environment measuring apparatus and a conventional thermal environment measuring apparatus. FIG. 1 ... Sensor part, 2 ... Support part, 3 ... Sensor part heater, 4,9 ... Temperature sensor, 5,10 ... Subtraction circuit, 6,11 ...
Amplifier 7, arithmetic unit 8, support heater.
Claims (1)
を一定温度Tsに保つように、前記センサ部に対して設け
られた第１のヒータを加熱制御し、そのときのヒータ電
力に基づき温熱環境を測定する温熱環境測定装置におい
て、 前記支持部に対して設けられた第２のヒータと、 前記支持部の温度を前記一定温度Tsに保つように、前記
第２のヒータを加熱制御する加熱制御手段と を備えたことを特徴とする温熱環境測定装置。A heating unit controls a first heater provided for the sensor unit so as to maintain a temperature of a sensor unit provided via a support unit at a constant temperature Ts. In a thermal environment measuring apparatus for measuring a thermal environment based on a second heater, a second heater provided for the support portion, and heating control of the second heater so as to keep the temperature of the support portion at the constant temperature Ts. A thermal environment measuring device, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2301067A JP2767319B2 (en) | 1990-11-08 | 1990-11-08 | Thermal environment measurement device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2301067A JP2767319B2 (en) | 1990-11-08 | 1990-11-08 | Thermal environment measurement device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04175611A JPH04175611A (en) | 1992-06-23 |
| JP2767319B2 true JP2767319B2 (en) | 1998-06-18 |
Family
ID=17892471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2301067A Expired - Fee Related JP2767319B2 (en) | 1990-11-08 | 1990-11-08 | Thermal environment measurement device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2767319B2 (en) |
-
1990
- 1990-11-08 JP JP2301067A patent/JP2767319B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04175611A (en) | 1992-06-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |