JP2752930B2 - Dicing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a dicing apparatus for dividing a large number of integrated circuits formed on a semiconductor substrate wafer into individual chips.

[0002]

2. Description of the Related Art FIG. 3 is a perspective view of a dicing apparatus showing an example of the prior art. Conventionally, a dicing apparatus of this type has been disclosed as a conventional technique in Japanese Patent Application Laid-Open No. H4-240749. This dicing apparatus, as shown in FIG.
A table 8 capable of holding and rotating the wafer 13 stuck on the adhesive sheet in X, Y and rotation directions; a Z moving body 10 for moving a blade 12 for cutting the wafer 13 in the Z-axis direction to cut the wafer 13; A cleaning liquid supply unit 11 for dropping the cleaning liquid into the cleaning liquid supply pipe 11 and a removal plate 9 having a built-in cleaning liquid supply pipe and having a discharge port 9a for the cleaning liquid and extending from the Z moving body 10 are provided.

Next, the operation of the dicing apparatus will be described. First, the wafer 13 is mounted on the mounting surface of the table 8 together with the adhesive sheet. Next, the Z moving body 10 is moved downward to make a cut. Then, the table 8 is moved in the X direction, and the wafer 13 is cut in one direction while supplying the cleaning liquid. After cutting in one direction, the wafer is fed by a predetermined pitch relatively in the Y direction orthogonal to the cutting direction, and the table 8 is moved in the direction opposite to the previous direction to cut the wafer 13. This is repeated to cut the wafer 13 in one direction. Next, Table 8
Is rotated 90 degrees, and the same cutting operation as described above is repeated to divide the chips into individual chips.

On the other hand, during this cutting operation,
The removal plate 9 attached to the Z-moving body 10 receives a dirty cleaning liquid including an adhesive sheet and chips from the wafer, and the removal plate 9
Dilutes and flushes the dirty cleaning liquid with the cleaning liquid from the discharge port 9a.

[0005]

However, in the above-mentioned conventional dicing apparatus, the removing plate having a discharge port for discharging the cleaning liquid is provided on one side of the blade, so that the table is moved from the blade toward the removing plate. When moving in the direction of, the part immediately after cutting the wafer approaches the removal plate,
Although the chips in the cut portion are effectively removed before adhering to the wafer, when the table moves in the blade direction from the removal plate, the portion immediately after the wafer is cut away from the removal plate, and the removal plate for removing the chips is removed. It does not work effectively and it is difficult to remove chips.

Further, even if the cleaning liquid received by the removing plate is received, there is a problem that the dirty cleaning liquid adheres to the wall surface of the removing plate and drops again on the surface of the cut wafer to cause contamination. The attachment of chips or the like to the wafer adversely affects the performance of the semiconductor device. In particular, it affects optical performance. As a result, the yield is significantly reduced.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a dicing apparatus which can cut and divide a wafer without attaching chips or the like.

[0008]

SUMMARY OF THE INVENTION The present invention is characterized in that a table on which a wafer is placed and which can reciprocate and rotate in one direction and a rotating blade for cutting the wafer are moved downward to cut the wafer. In a dicing apparatus comprising: a Z moving body to be provided; and a first cleaning liquid supply unit for dropping a cleaning liquid onto the cut wafer, a predetermined range of the blade and the cut wafer extending from the Z moving body. A box-shaped cleaning liquid scattering prevention cover covering an area, and an inner wall disposed parallel to a side wall of the cleaning liquid scattering prevention cover parallel to the rotation surface of the blade, and a side end thereof is defined by a predetermined distance from the wafer surface. A dicing apparatus comprising: a chip removing plate extending downward with an interval; and a second cleaning liquid supply unit having a plurality of cleaning liquid discharge ports arranged side by side along the outer wall of the chip removing plate. It is.

It is preferable that an adjusting mechanism for adjusting a distance between the side end of the chip removing plate and the wafer surface is provided. Further, it is desirable to provide a plate-shaped porous member attached to the inner wall of the chip removing plate.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

FIGS. 1A and 1B are a partially cutaway perspective view and a sectional view of a dicing apparatus showing an embodiment of the present invention. As shown in FIG. 1, this dicing apparatus includes a box-shaped cleaning liquid scattering prevention cover 1 that extends from a Z moving body 10 and covers a blade 13 and a predetermined area 13a of a cut wafer 13; An inner wall 2a is disposed outside the side wall 1a of the scattering prevention cover 1 parallel to the rotation surface of the blade 12 so as to be parallel to the rotation surface of the blade 12, and the side end 2b is lowered downward so as to have a predetermined distance d with the surface of the wafer 13. A second chip having a chip removing plate 2 extending and a plurality of cleaning liquid discharge ports 5 arranged along the outer wall 2c of the chip removing plate 2.
Is provided. Otherwise, it is the same as the conventional example.

Next, the chip removing operation of the dicing apparatus will be described. First, as described in the conventional example, the table 8 and the blade 12 relatively move back each time the table 8 is fed by a predetermined pitch in a direction orthogonal to the cutting direction along the mounting surface of the table 8. When the wafer 13 is cut into a predetermined width by the blade 12 using the blade 12, the cleaning liquid 14 a dropped from the cleaning liquid supply unit 11, including dirt and chips and scattered during dicing, is received by the side wall 1 a of the cover 1. The cleaning liquid 14b adhering to the side wall 1a of the cover 1 is dripped by its own weight into the cleaning liquid 14c on the cut wafer 13.

Next, as shown by the arrow, table 8
Every time the pitch is moved, the cleaning liquid 14c containing chips and dirt is separated by the chip removing plate 2, and at the same time, the cleaning liquid 14d is ejected from the discharge port 5 of the cleaning liquid supply unit 4 and is pushed out of the wafer 13 surface. Then, the cutting of the wafer 13 in one direction is completed, the table 8 reaches the right side with respect to the paper surface, and the blade 1
2 is removed from the table, the Z moving body 10 is raised, the blade 12 is raised above the surface of the wafer 13, and the table 8 is moved to the left side with respect to the paper surface while supplying the cleaning liquid 8d from the cleaning liquid supply unit 4 to move the wafer 13 surface. Wash again.

The chips of the wafer 13 and the chips of the adhesive sheet contained in the cleaning liquid 14c have a relatively small specific gravity and float on the surface of the liquid layer of the cleaning liquid 14c. Therefore, it is preferable that the distance d between the side end portion 2b of the chip removing plate 2 and the surface of the wafer 13 be equal to the thickness of the liquid layer. In addition, since the thickness of the liquid layer changes depending on the surface tension of the cleaning liquid and the surface state of the wafer 13, for example, the bracket of the cover 1 is adjusted so that the distance between the side end 2 b of the chip removing plate 2 and the surface of the wafer 13 can be adjusted. It is desirable to provide an adjusting mechanism 6 with a set screw for attaching the chip 3 and the chip removing plate 2.

FIG. 2 is a sectional view of a dicing apparatus showing another embodiment of the present invention. This dicing device
As shown in FIG. 2, a polynomial plate 7 having a predetermined length is attached to the inner wall 2a of the chip removing plate 2 and is provided above the side end 2b. Otherwise, the configuration is the same as the dicing apparatus of the above-described embodiment.

By providing the polynomial plate 7, the cleaning liquid 14c rises due to the movement of the table 8, and the dirt contained in the cleaning liquid 14c is collected in the depressions on the surface of the porous plate 7. In addition, a sponge or a pumice is applied to the polynomial plate.

[0017]

As described above, according to the present invention, the cover for receiving the cleaning liquid dropped from the vicinity of the blade and scattered by dicing, and the surface layer of the cleaning liquid which falls outside of the cover and drops from the cover and accumulates on the wafer surface are formed on the table. By providing a chip removing plate to be stroked with the movement and a cleaning liquid supply unit having a cleaning liquid discharge port for pushing out the cleaning liquid discharged from the chip removing plate to the outside as the table is moved, the surface of the wafer is provided. There is no floating chips, and as a result, there is an effect that the chips can be cut and divided without adhering to the wafer surface.

[Brief description of the drawings]

FIG. 1 is a partially cutaway perspective view and a sectional view of a dicing apparatus showing an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a dicing apparatus showing another embodiment of the present invention.

FIG. 3 is a perspective view of a dicing apparatus showing an example of the related art.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Cover 1a Side wall 2 Chip removal plate 2a Inner wall 2b Side end 3 Bracket 4,11 Cleaning liquid supply part 5 Discharge port 6 Adjusting mechanism 7 Porous plate 8 Table 9 Removal plate 10 Z moving body 12 Blade 13 Wafer 14a, 14b, 14c , 14d cleaning liquid

Claims (3)

(57) [Claims] 1. A table on which a wafer can be placed and reciprocally moved and rotated in one direction, a Z-moving body for moving a rotating blade for cutting the wafer downward to make a cut in the wafer, First drop of cleaning liquid on wafer
A dicing apparatus comprising: a cleaning liquid scattering prevention cover having a box shape extending from the Z movable body and covering an area of a predetermined range of the blade and the cut wafer; A chip removing plate in which an inner wall is disposed in parallel outside the side wall parallel to the rotation surface of the blade and a side end extends downward so as to have a predetermined distance from the wafer surface; and a chip removing plate. A second having a plurality of cleaning liquid discharge ports arranged side by side along the outer wall;
And a cleaning liquid supply unit. 2. The dicing apparatus according to claim 1, further comprising an adjusting mechanism for adjusting a distance between the side end of the chip removing plate and the wafer surface. 3. The dicing apparatus according to claim 1, further comprising a plate-shaped porous member attached to an inner wall of the chip removing plate.