JP2748931B2 - Superconducting ceramic paste - Google Patents
Superconducting ceramic pasteInfo
- Publication number
- JP2748931B2 JP2748931B2 JP62112550A JP11255087A JP2748931B2 JP 2748931 B2 JP2748931 B2 JP 2748931B2 JP 62112550 A JP62112550 A JP 62112550A JP 11255087 A JP11255087 A JP 11255087A JP 2748931 B2 JP2748931 B2 JP 2748931B2
- Authority
- JP
- Japan
- Prior art keywords
- paste
- superconducting ceramic
- superconducting
- powder
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 title claims description 36
- 239000000843 powder Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052684 Cerium Inorganic materials 0.000 claims description 2
- 229910052691 Erbium Inorganic materials 0.000 claims description 2
- 229910052693 Europium Inorganic materials 0.000 claims description 2
- 229910052688 Gadolinium Inorganic materials 0.000 claims description 2
- 229910052689 Holmium Inorganic materials 0.000 claims description 2
- 229910052765 Lutetium Inorganic materials 0.000 claims description 2
- 229910052779 Neodymium Inorganic materials 0.000 claims description 2
- 229910052777 Praseodymium Inorganic materials 0.000 claims description 2
- 229910052772 Samarium Inorganic materials 0.000 claims description 2
- 229910052771 Terbium Inorganic materials 0.000 claims description 2
- 229910052775 Thulium Inorganic materials 0.000 claims description 2
- 229910052769 Ytterbium Inorganic materials 0.000 claims description 2
- 229910052788 barium Inorganic materials 0.000 claims description 2
- 229910052791 calcium Inorganic materials 0.000 claims description 2
- 229910052746 lanthanum Inorganic materials 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 229910052706 scandium Inorganic materials 0.000 claims description 2
- 229910052712 strontium Inorganic materials 0.000 claims description 2
- 229910052727 yttrium Inorganic materials 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 11
- 239000010949 copper Substances 0.000 description 10
- 239000012298 atmosphere Substances 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 7
- 229910052760 oxygen Inorganic materials 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000004014 plasticizer Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 229910002480 Cu-O Inorganic materials 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 2
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000002612 dispersion medium Substances 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229940116411 terpineol Drugs 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/45—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on copper oxide or solid solutions thereof with other oxides
- C04B35/4504—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on copper oxide or solid solutions thereof with other oxides containing rare earth oxides
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/45—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on copper oxide or solid solutions thereof with other oxides
- C04B35/4512—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on copper oxide or solid solutions thereof with other oxides containing thallium oxide
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/45—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on copper oxide or solid solutions thereof with other oxides
- C04B35/4521—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on copper oxide or solid solutions thereof with other oxides containing bismuth oxide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
- H01L21/76891—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances by using superconducting materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49888—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing superconducting material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0296—Processes for depositing or forming copper oxide superconductor layers
- H10N60/0352—Processes for depositing or forming copper oxide superconductor layers from a suspension or slurry, e.g. screen printing or doctor blade casting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は超伝導セラミックペーストに係り、特にＹ−
Ba−Cu−Ｏ系、La−Sr−Cu−Ｏ系、あるいはSc−Ba−Cu
−Ｏ系等の高温Tc超伝導セラミックスにおいて金属Cuを
混合してペーストの性能を向上させた超伝導セラミック
ペーストに関するものである。
ハイブリッドICや多層回路基板に用いる伝送線路は主
に金属の導体材料をバインダ、溶剤、可塑剤等からなる
ビヒクルと均一に混合されペースト状としたものを約10
00℃前後で熱処理され形成される。このように導体ペー
ストは伝送線路となるので電気抵抗が低いことが要求さ
れている。
〔従来の技術〕
従来上記導体ペーストの導体材料として電気抵抗が低
いAu（固有抵抗2.3μΩ・cm）、Cu（固有抵抗1.7μΩ・
cm）あるいはマイグレーションを抑制したAg-Pd、等が
用いられていた。
〔発明が解決しようとする課題〕
しかしながら、上記の導体材料でもなお電気抵抗が高
いので、より電気抵抗の低い導体の使用が望まれてい
た。
そこで、本発明は超伝導材料を半導体装置や回路基板
に適用することによって、電気抵抗の低い導体材料を提
供しようとするものである。
〔課題を解決するための手段〕
本発明は、この目的を達成するために、高温超伝導セ
ラミックス粉末を用いた超伝導セラミックペーストに金
属銅粉末を添加したことを特徴とする超伝導セラミック
ペーストを提供するものである。
すなわち、本発明では回路基板の伝送線路（配線）等
の導体材料として超伝導セラミックスを用いることを可
能にするための高温Tc超伝導セラミック形成用ペースト
を提供する。
高温Tc超伝導セラミックとは、最近開発された液体窒
素温度（77K）以上の温度で超伝導現象を示すことがで
きる主として複合酸化物系セラミックスのことであり、
下記式で表わされるものがある。
｛(MIIIO)a(MIII 2O3)1-a｝b(CuO)c(O)d
ここで、MII:Ba,Sr,Ca,Mgのうちの少なくとも１種、
MIII:Y,Sc,La,Ce,Pr,Nd,Sm,Eu,Gd,Tb,Ho,Er,
Tm,Yb,Luのうちの少なくとも１種、
0.5≦ａ≦0.9,
１≦ｂ≦2,
１≦ｃ≦2,
−１＜ｄ＜２。
このような高温Tc超伝導セラミックペーストは、高温
超伝導セラミックス粉末と、その超伝導セラミック粉末
を分散させ、ペーストとしての適当な取扱い性を付与す
るための分散媒とからなる。
高温超伝導セラミックス粉末は、成分金属の酸化物、
炭酸塩、硝酸塩、水酸化物又は、金属単体からなる出発
混合粉末を酸素含有雰囲気中800〜1000℃程度で焼成
し、必要に応じて酸素雰囲気中でアニールして高温超伝
導セラミックスのバルクを得、これを粉砕して作製する
ことができる。超伝導セラミックス粉末はペースト中好
ましくは60〜90wt％、より好ましくは80wt％の量で用い
られる。
分散媒はバインダ、可塑剤、溶剤（高沸点溶剤）等に
よって構成される。バインダとしてはエチルセルロー
ス、ポリビニルブチラール、アクリル樹脂等からなり、
ペースト中に好ましくは0.5〜5wt％、より好ましくは1w
t％の量で用いられる。可塑剤はジブチルフタレートな
どからなり、好ましくは４〜20wt％、より好ましくは9w
t％の量で用いられる。高沸点溶剤はテルピネオールな
どからなり、好ましくは５〜20wt％、より好ましくは10
wt％の量で用いる。その他の添加剤（界面活性剤、チタ
ン又はシランカップリング剤、など）を必要に応じて添
加してもよいことはもちろんである。
本発明の超伝導セラミックペーストの最大の特徴は、
ペースト中に超伝導セラミック粉末に加えて金属銅を添
加することである。金属銅の添加量は超伝導セラミック
100重量部に対して２〜15、好ましくは５〜10重量部と
する。添加量が少ないと効果がなく、多すぎると焼成後
の超伝導セラミックスの特性を低下させるおそれがある
からである。金属銅は延性に優れているためにペースト
の印刷適性を顕著に改良し、得られる超伝導パターンを
鮮明にする効果を有する。
本発明の高温超伝導セラミックペーストはスクリーン
印刷法などの公知の方法で基板又はグリーンシート上に
適用後、酸素含有雰囲気中で800〜1000℃で焼成し、必
要に応じて酸素雰囲気中でアニールすることによって超
伝導セラミックとなる。
〔作用〕
本発明によれば従来の導体ペーストにおける導体部を
超伝導セラミックスとしているので電気抵抗を低下させ
た導体ペーストが得られ、かつペースト中に金属銅を用
いたことによってペーストの印刷適正、パターン形成性
が改良される。金属銅は焼成後に酸化され、焼成超伝導
セラミックス中に残るが、その量は微量なので超伝導性
には影響しない。
〔実施例〕
以下に本発明の実施例を説明する。
まず酸化バリウム（BaO）粉末42.5g、酸化イットリウ
ム（Y2O3）粉末20.8g及び酸化銅（CuO）粉末36.7gを混
合、圧粉し、予め酸素含有雰囲気中で800〜1000℃の温
度で熱処理して超伝導セラミックスを作製し、これを圧
粉して超伝導セラミックス粉末とした。
この超伝導セラミックス粉末に金属銅粉末7g、メチル
エチルケトン100gを添加、調合し、この材料をボールミ
ルで50時間混合した。そこからこの混合物にバインダと
してエチルセルロース0.9g、高沸点溶剤としてテルピネ
オール2.5g、可塑剤としてジブチルフタレート2.6gを添
加し、第一次混練としてらいかい機中で10時間混合し
た。次に三本ロールミルによりこのペースト状のものを
45回通しペーストとした。この時の粘時は2000Pであっ
た。
そこから、このペーストを高純度アルミナ基板（99.7
％ Al2O3、残部MgO及びCr2O3：特公昭55-11483号公報
参照）上に300メッシュのスクリーンを用いて配線パタ
ーンを印刷した。
これを大気中（酸素雰囲気又は酸素と不活性ガスの混
合ガス雰囲気中でもよい）で900℃、６時間焼成した。
得られた配線パターンの電気抵抗を調べたところ、第
１図に示す如く、77Kにおいて超伝導現象を示すことが
確認された。
比較のために、上記と同様にして、但し、ペースト中
に金属銅粉末を含まないペーストを用いて配線パターン
を作製した。この配線パターンも77Kで超伝導を示した
が、パターンには明らかな乱れ（変形）があり、金属銅
を含むペーストの効果が認められた。
〔発明の効果〕
以上説明したように本発明によれば回路基板の配線材
を液体窒素温度以上で電気抵抗零とすることが可能とな
る。また超伝導セラミック組成物中に銅が分散している
のでペーストの印刷特性が改良され、きれいな超伝導セ
ラミックスパターンが得られ、またそのパターンが幅が
小さくても断線の可能性を防止することができる。Description: TECHNICAL FIELD The present invention relates to a superconducting ceramic paste, and in particular, relates to a superconductive ceramic paste.
Ba-Cu-O system, La-Sr-Cu-O system, or Sc-Ba-Cu
The present invention relates to a superconducting ceramic paste obtained by mixing metal Cu in a high-temperature Tc superconducting ceramic such as -O system and improving the performance of the paste. Transmission lines used for hybrid ICs and multilayer circuit boards are mainly made of pastes in which a metallic conductor material is uniformly mixed with a vehicle consisting of a binder, solvent, plasticizer, etc. to form a paste.
It is formed by heat treatment at about 00 ° C. As described above, since the conductor paste becomes a transmission line, it is required that the electric resistance be low. [Prior art] Conventionally, as conductor materials of the above-mentioned conductor paste, Au (specific resistance 2.3 μΩ · cm), Cu (specific resistance 1.7 μΩ ·
cm) or Ag-Pd that suppresses migration. [Problems to be Solved by the Invention] However, even with the above-mentioned conductor materials, the electric resistance is still high, and therefore, it has been desired to use a conductor having a lower electric resistance. Therefore, the present invention is to provide a conductor material having low electric resistance by applying a superconducting material to a semiconductor device or a circuit board. [Means for Solving the Problems] The present invention provides a superconducting ceramic paste characterized in that metallic copper powder is added to a superconducting ceramic paste using high-temperature superconducting ceramic powder in order to achieve this object. To provide. That is, the present invention provides a paste for forming a high-temperature Tc superconducting ceramic for enabling the use of superconducting ceramics as a conductor material for a transmission line (wiring) of a circuit board. High-temperature Tc superconducting ceramics are mainly composite oxide ceramics that can exhibit superconductivity at temperatures higher than the liquid nitrogen temperature (77K) recently developed.
There is one represented by the following formula. ｛(M III O) a (M III 2 O 3 ) 1-a ｝ b (CuO) c (O) d where M II : at least one of Ba, Sr, Ca, Mg, M III : Y, Sc, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Ho, Er,
At least one of Tm, Yb and Lu, 0.5 ≦ a ≦ 0.9, 1 ≦ b ≦ 2, 1 ≦ c ≦ 2, −1 <d <2. Such a high-temperature Tc superconducting ceramic paste is composed of a high-temperature superconducting ceramic powder and a dispersion medium for dispersing the superconducting ceramic powder and imparting appropriate handleability as a paste. High-temperature superconducting ceramic powder is composed of oxides of component metals,
The starting mixed powder consisting of carbonate, nitrate, hydroxide or simple metal is fired in an oxygen-containing atmosphere at about 800 to 1000 ° C., and if necessary, annealed in an oxygen atmosphere to obtain a bulk of high-temperature superconducting ceramics. , And can be manufactured by grinding. The superconducting ceramic powder is used in the paste preferably in an amount of 60 to 90 wt%, more preferably 80 wt%. The dispersion medium is composed of a binder, a plasticizer, a solvent (high boiling point solvent) and the like. The binder is made of ethyl cellulose, polyvinyl butyral, acrylic resin, etc.
Preferably 0.5 to 5 wt%, more preferably 1 w
Used in amounts of t%. The plasticizer is composed of dibutyl phthalate or the like, preferably 4 to 20% by weight, more preferably 9% by weight.
Used in amounts of t%. The high-boiling solvent comprises terpineol or the like, preferably 5 to 20% by weight, more preferably 10 to 20% by weight.
Used in wt% amounts. Of course, other additives (surfactant, titanium or silane coupling agent, etc.) may be added as needed. The biggest feature of the superconducting ceramic paste of the present invention is that
This is to add metallic copper to the paste in addition to the superconducting ceramic powder. The amount of metallic copper added is superconducting ceramic
The amount is 2 to 15, preferably 5 to 10 parts by weight based on 100 parts by weight. If the amount is too small, there is no effect, and if it is too large, the properties of the superconductive ceramic after firing may be deteriorated. Metallic copper has excellent ductility, so that the printability of the paste is remarkably improved, and the resulting superconductive pattern is sharpened. The high-temperature superconducting ceramic paste of the present invention is applied on a substrate or a green sheet by a known method such as a screen printing method, and then fired at 800 to 1000 ° C. in an oxygen-containing atmosphere, and annealed in an oxygen atmosphere as necessary. This results in a superconducting ceramic. [Operation] According to the present invention, the conductor portion in the conventional conductor paste is made of superconducting ceramics, so that a conductor paste having reduced electric resistance is obtained, and the use of metallic copper in the paste allows the paste to be printed properly. The pattern formability is improved. Metallic copper is oxidized after firing and remains in the fired superconducting ceramics, but its amount is very small and does not affect superconductivity. Examples Examples of the present invention will be described below. First, 42.5 g of barium oxide (BaO) powder, 20.8 g of yttrium oxide (Y 2 O 3 ) powder and 36.7 g of copper oxide (CuO) powder are mixed and compacted, and are preliminarily heated at a temperature of 800 to 1000 ° C. in an oxygen-containing atmosphere. Heat treatment was performed to produce a superconducting ceramic, which was compacted to obtain a superconducting ceramic powder. 7 g of metal copper powder and 100 g of methyl ethyl ketone were added to this superconducting ceramic powder, mixed, and mixed with a ball mill for 50 hours. From this mixture, 0.9 g of ethyl cellulose as a binder, 2.5 g of terpineol as a high boiling point solvent, and 2.6 g of dibutyl phthalate as a plasticizer were added to the mixture, and the mixture was mixed in a grinder for 10 hours as a primary kneading. Next, this paste-like thing is
The paste was passed through 45 times. The viscosity time at this time was 2000P. From there, this paste was applied to a high-purity alumina substrate (99.7
% Al 2 O 3 , balance MgO and Cr 2 O 3 : see Japanese Patent Publication No. 55-11483) using a 300-mesh screen to print a wiring pattern. This was fired at 900 ° C. for 6 hours in the air (even in an oxygen atmosphere or a mixed gas atmosphere of oxygen and an inert gas). When the electric resistance of the obtained wiring pattern was examined, it was confirmed that a superconducting phenomenon was exhibited at 77K as shown in FIG. For comparison, a wiring pattern was prepared in the same manner as above, except that a paste containing no metallic copper powder was used. This wiring pattern also exhibited superconductivity at 77K, but the pattern had a clear disorder (deformation), and the effect of the paste containing metallic copper was recognized. [Effects of the Invention] As described above, according to the present invention, it is possible to make the electrical resistance of the wiring member of the circuit board zero at liquid nitrogen temperature or higher. In addition, since the copper is dispersed in the superconducting ceramic composition, the printing characteristics of the paste are improved, a clean superconducting ceramic pattern is obtained, and even if the pattern is small in width, the possibility of disconnection can be prevented. it can.
【図面の簡単な説明】
第１図は本発明に係る一実施例の超伝導セラミックス配
線の電気抵抗温度依存性を示す図である。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram showing temperature dependence of electric resistance of a superconducting ceramic wiring according to one embodiment of the present invention.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 横山 博三 川崎市中原区上小田中1015番地 富士通 株式会社内 (72)発明者 亀原 伸男 川崎市中原区上小田中1015番地 富士通 株式会社内 (72)発明者 丹羽 紘一 川崎市中原区上小田中1015番地 富士通 株式会社内 (56)参考文献 特開 昭63−250014（ＪＰ，Ａ) 特開 昭63−233071（ＪＰ，Ａ) ────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Hirozo Yokoyama Fujitsu, 1015 Ueodanaka, Nakahara-ku, Kawasaki-shi Inside the corporation (72) Inventor Nobuo Kamehara Fujitsu, 1015 Ueodanaka, Nakahara-ku, Kawasaki-shi Inside the corporation (72) Inventor Koichi Niwa Fujitsu, 1015 Ueodanaka, Nakahara-ku, Kawasaki-shi Inside the corporation (56) References JP-A-63-250014 (JP, A) JP-A-63-233071 (JP, A)
Claims (1)
ックペーストに金属銅粉末を添加したことを特徴とする
超伝導セラミックペースト。 ２．前記超伝導セラミックスが下記式で表わされる特許
請求の範囲第１項記載の超伝導セラミックペースト。 ｛(MIIIO)a(MIII 2O3)1-a｝b(CuO)c(O)d ここで、MII:Ba,Sr,Ca,Mgのうちの少なくとも１種、 MIII:Y,Sc,La,Ce,Pr,Nd,Sm,Eu,Gd,Tb,Ho,Er,Tm,Yb,Luの
うちの少なくとも１種、 0.5≦ａ≦0.9, １≦ｂ≦2, １≦ｃ≦2, −１＜ｄ＜２。(57) [Claims] A superconducting ceramic paste characterized in that metallic copper powder is added to a superconducting ceramic paste using high-temperature superconducting ceramic powder. 2. 2. The superconducting ceramic paste according to claim 1, wherein said superconducting ceramic is represented by the following formula. ｛(M III O) a (M III 2 O 3 ) 1-a ｝ b (CuO) c (O) d where M II : at least one of Ba, Sr, Ca, Mg, M III : At least one of Y, Sc, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Ho, Er, Tm, Yb, Lu, 0.5 ≦ a ≦ 0.9, 1 ≦ b ≦ 2, 1 ≦ c ≦ 2, −1 <d <2.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62112550A JP2748931B2 (en) | 1987-05-11 | 1987-05-11 | Superconducting ceramic paste |
| DE3853316T DE3853316T2 (en) | 1987-05-08 | 1988-05-06 | Superconducting circuit card and process for its manufacture. |
| EP88304129A EP0290271B1 (en) | 1987-05-08 | 1988-05-06 | Superconducting circuit board and process of manufacturing it |
| CN88102627A CN1040937C (en) | 1987-05-08 | 1988-05-07 | Superconducting circuit board and paste adopted therefor |
| CN91101166A CN1059349A (en) | 1987-05-08 | 1991-02-23 | A kind of coating that is used to form superconducting ceramic film |
| US08/064,668 US5286713A (en) | 1987-05-08 | 1993-05-21 | Method for manufacturing an oxide superconducting circuit board by printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62112550A JP2748931B2 (en) | 1987-05-11 | 1987-05-11 | Superconducting ceramic paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63277512A JPS63277512A (en) | 1988-11-15 |
| JP2748931B2 true JP2748931B2 (en) | 1998-05-13 |
Family
ID=14589465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62112550A Expired - Lifetime JP2748931B2 (en) | 1987-05-08 | 1987-05-11 | Superconducting ceramic paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2748931B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6450324A (en) * | 1987-08-20 | 1989-02-27 | Sanyo Electric Co | Manufacture of oxide superconductive film |
| JPH02206504A (en) * | 1989-02-03 | 1990-08-16 | Koujiyundo Kagaku Kenkyusho:Kk | Work piece of superconductive material |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2606698B2 (en) * | 1987-03-23 | 1997-05-07 | 株式会社 半導体エネルギー研究所 | Manufacturing method of superconducting ceramics |
| JPS63250014A (en) * | 1987-04-03 | 1988-10-17 | Hitachi Maxell Ltd | Composite material |
-
1987
- 1987-05-11 JP JP62112550A patent/JP2748931B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63277512A (en) | 1988-11-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH03141502A (en) | Copper paste composite | |
| JP2567491B2 (en) | High thermal conductivity colored aluminum nitride sintered body and method for producing the same | |
| JP3662955B2 (en) | Circuit board and circuit board manufacturing method | |
| JPH01192781A (en) | Thick film copper conductor composition | |
| JP2748931B2 (en) | Superconducting ceramic paste | |
| JPS63277549A (en) | Superconductive ceramic paste composition | |
| JPH06206772A (en) | Aluminum nitride sintered compact and ceramic circuit substrate | |
| JP2748932B2 (en) | Superconducting ceramic paste | |
| EP1434750B1 (en) | Thick film conductor compositions for use on aluminum nitride substrates | |
| JPH0740633B2 (en) | Insulating layer composition | |
| JP2965222B2 (en) | Conductor paste | |
| JP2589433B2 (en) | Plateable thick film copper conductor paste composition | |
| JPH0945130A (en) | Conductor paste composite | |
| JPS63271994A (en) | Ceramic wiring substrate | |
| JP2685806B2 (en) | Multilayer wiring circuit board | |
| JP2583901B2 (en) | Superconducting electrical circuit | |
| JP2764087B2 (en) | Ceramic superconductor paste and method of manufacturing ceramic superconductor wiring circuit board using the paste | |
| JP2918642B2 (en) | Conductive paste | |
| JPH0888453A (en) | Ceramic circuit board and its manufacture | |
| CN115424761A (en) | Tungsten slurry for HTCC substrate and preparation method thereof | |
| JPH0573358B2 (en) | ||
| JPH0497594A (en) | Hybrid integrated circuit board | |
| JP2839350B2 (en) | Glaze resistance material and method of manufacturing the same | |
| CA1240213A (en) | Metal oxide-coated copper powder | |
| JPS62237605A (en) | Thick film paste |