JP2739300B2 - Liquid crystal drive - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a YAG laser marker,
The present invention relates to a liquid crystal driving device used for a liquid crystal display or the like, which performs a display or the like by liquid crystal by entering and transmitting predetermined light from a back surface of a liquid crystal panel.

[0002]

2. Description of the Related Art Conventionally, a laser marker for printing on the surface of a work using a YAG laser has been known. As such a laser marker, a liquid crystal panel in which a polymer composite liquid crystal is sandwiched by a glass substrate is used. Here, since the liquid crystal panel itself cannot drive the liquid crystal, a driving circuit for that purpose is required. Further, it is necessary to position and fix the liquid crystal panel at a predetermined position.

Therefore, as shown in FIG. 2, a liquid crystal panel 3 is fixedly arranged on a printed wiring board 1, and an IC chip for driving liquid crystal and printed wiring are formed on the printed wiring board 1. Liquid crystal panel module 1 composed mainly of liquid crystal panel 3
00 is used as one assembly part of the laser marker.

[0004] The YAG laser beam Lb is incident from the back of the liquid crystal panel module 100 and passes through the opening 1 a of the printed wiring board 1 in the liquid crystal display section (a so-called mask section) 7 of the liquid crystal panel 3 so that the IC chip is formed. As a result, light is transmitted only through the dot (pixel) portion driven, and characters and the like corresponding to the shape of the driven dot portion are printed on the work surface.

As a configuration of this type of liquid crystal panel module, there is one disclosed in Japanese Utility Model Laid-Open Publication No. 1-62583. The technology disclosed in this publication is to electrically connect an electrode group on a liquid crystal panel and an electrode group on a printed wiring board by a conductive rubber connector, and to cover an area of the printed wiring board surface surrounded by the electrode group. An IC chip is provided around the outer substrate.

It is not surprising that the IC chip is provided on a liquid crystal panel. However, since the technology for providing the IC chip on the liquid crystal panel as a glass substrate has not been established, the liquid crystal panel and the Has to dispose an IC chip on a separate printed circuit board.

[0007]

Incidentally, in the case of a so-called high resolution type liquid crystal or a low duty driving type liquid crystal, since the number of dots in a mask portion becomes large, the number of electrodes becomes extremely large, and the number of electrodes becomes extremely large. Therefore, the number of IC chips and the number of printed wirings to be provided in the semiconductor device become extremely large. This is even more so in particular in recent years where high-density displays compatible with HDTV have been demanded.

However, since the printed wiring board 1 has the opening 1a for incidence of the YAG laser beam, the space for mounting an IC chip and providing printed wiring is limited. On the other hand, it is conceivable to increase the size of the printed wiring board 1 to secure mounting of a large number of IC chips and to enable a large number of wirings. However, in recent years, there has been a demand for downsizing of the apparatus, and there is a situation that a design contrary thereto cannot be adopted.

Here, suppose that the technology described in the above-mentioned publication temporarily covers the periphery of the printed wiring board in a limited space.
Even if the required number of IC chips can be mounted, the number of electrodes and the number of wirings are large, so that during the assembly, adjacent signal lines among the signal lines drawn from the electrodes interfere with each other. Probability becomes extremely high. For this reason, an unexpected situation such as a short circuit or an operation failure is caused, and the reliability of the device is greatly impaired. In addition, the difficulty in assembly increases the number of steps and significantly increases the manufacturing cost.

The present invention has been made in view of such circumstances, and in a liquid crystal driving device in which a large number of IC chips and the like are required to be arranged, if a large number of IC chips and the like can be arranged in a limited space. It is another object of the present invention to provide a liquid crystal driving device that can reduce the size, improve the reliability and reduce the cost of the device by eliminating problems such as short circuit due to the high density of signal lines.

[0011]

Therefore, according to the present invention, there is provided a substrate having an opening through which light is incident at a central portion, and one surface of the substrate so that the opening and the liquid crystal are located at the same position. A liquid crystal panel disposed, disposed around the substrate,
A plurality of IC chips for driving the liquid crystal, a panel-side electrode group provided between the liquid crystal panel and the substrate and provided on the liquid crystal panel and a substrate-side electrode group provided on the substrate are electrically connected. A liquid crystal driving device having a connector connected to the liquid crystal panel and driving each pixel of liquid crystal in the liquid crystal panel by connecting the substrate-side electrode group and the plurality of IC chips with electric signal lines. On the inner surface of the substrate surface surrounded by the substrate-side electrode group, the I
Disposing a C chip and disposing the IC chip in a portion outside an inner portion surrounded by the substrate-side electrode group;
An electric signal line from the substrate-side electrode group, the inner portion,
The outer portion can be drawn out in both directions, and two adjacent signal lines among the electric signal lines drawn out from the substrate-side electrode group can be used.
Regarding the two signal lines, one is drawn out in the direction of the inner part, and the other is drawn out in the direction of the outer part, and the electric signal lines drawn out from the substrate-side electrode group in the direction of the outer part are: The electric signal line and the electric signal line drawn out to the inner portion adjacent to the electric signal line are provided in the inner portion by inserting the hole provided in the substrate into the inner portion. Done I
While being connected to the C chip, an electric signal line drawn out from the substrate-side electrode group in the direction of the inner part is drawn out to the outer part by inserting a hole provided in the substrate, and the electric signal line is connected to the electric signal line. The electric signal line drawn out to the outer part adjacent to the electric signal line is connected to an IC chip provided in the outer part.

[0012]

[0013]

That is, according to the present invention, as shown in FIG. 2, a space 1b (substrate portion surrounded by a broken line) when the liquid crystal panel 3 is overlaid on the printed wiring board 1, that is, a mask in the liquid crystal panel 3 in FIG. It is noted that a space corresponding to a portion excluding the part 7 and the electrode group 8 is a dead space. As the number of wirings drawn from the mask unit 7 increases, the degree of interference between adjacent signal lines increases, and it is necessary to increase the interval between the electrodes in the electrode group 8. For this reason, it is necessary to increase the longitudinal direction of the electrode group 8, and to increase the space where the signal lines 9 are radially arranged. Therefore, it is possible to provide the IC chip and the wiring connected thereto in this large space.
As described above, the IC chip and the electric signal lines connected to the IC chip are arranged around the substrate, that is, outside the electrode group on the substrate as well as inside the electrode group on the substrate. For this reason, it becomes possible to arrange a large number of IC chips and electric signal lines in a limited space on the substrate without interference of the signal lines.

Further, in the present invention, the routing of the signal lines led out from the electrode group on the substrate is configured as follows. (A) The substrate-side electrode group 5 can be drawn out in both directions inside and outside the substrate 1. (B) Two adjacent signal lines of the substrate-side electrode group 5 are led out to the inside and outside of the substrate 1. (C) A signal line drawn out from the substrate-side electrode group 5 is drawn in through a through hole provided in the substrate 1, and this signal line and a signal drawn out inward adjacent to the signal line. Connecting wires to the inner IC chip. Similarly,
A signal line drawn inward from the substrate-side electrode group 5 is drawn out through a hole for insertion provided in the substrate 1, and this signal line and a signal line drawn out adjacent thereto are drawn out, Connect to the outside IC chip. According to such a configuration, a large number of IC chips and electric signal lines can be arranged in a limited space on the substrate without interference of the signal lines.

[0015]

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a liquid crystal driving device according to the present invention will be described below with reference to the drawings. FIG. 2 shows the configuration of a liquid crystal panel module which is an embodiment of the present invention.
As shown in FIG.
It is an assembly part constituting a laser marker for printing on the work surface by using a laser, and includes a liquid crystal panel 3 sandwiching a polymer composite liquid crystal by a glass epoxy substrate, and a drive circuit for driving the liquid crystal of the liquid crystal panel 3. A printed wiring board 1 for positioning and fixing the liquid crystal panel 3 in a predetermined position, and a plurality of conductive rubbers 2 interposed between the liquid crystal panel 3 and the printed wiring board 1 and electrically connecting them. And a holder 4 for fixing the liquid crystal panel 3 to the front surface 1c of the printed wiring board 1.

The printed wiring board 1 has an opening 1a through which a YAG laser beam Lb is incident from the back surface 1c, and the liquid crystal panel 3 is connected to the front (front) surface 1c of the substrate 1.
A plurality of IC chips 6a (hereinafter, referred to as an outer IC chip 6a) will be described below in a manner to be described later outside a space 1b (a substrate portion surrounded by a broken line) occupied when fixed and arranged.
a) is disposed.

Around the space 1b, a plurality of electrodes 5 (hereinafter, referred to as the electrodes) are provided so as to face the end faces of the conductive rubber 2 and are electrically connected to respective ends of the plurality of signal lines in the conductive rubber 2. , A substrate-side electrode group 5). The interval between adjacent electrodes of the electrode group 5 is, for example, 0.25 mm, which is high density, but is configured so that the signal lines of the conductive rubber 2 do not interfere with each other.

Further, a plurality of IC chips 6b (hereinafter, referred to as inner IC chips 6b) are arranged on the back surface 1d of the printed wiring board 1 inside the substrate side electrode group 5 in a manner described later. Has been established. The outside I
Each of the C chip 6a and the inner IC chip 6b is an IC in which a circuit for driving each dot of the mask section 7 of the liquid crystal panel 3 is built. Outer and inner IC chips 6a, 6b
Are electrically connected to the substrate-side electrode group 5 via signal lines provided with printed wiring on the substrate 1 in a manner described later.

On the other hand, as shown in FIG. 4, the liquid crystal panel 3 includes a mask portion 7 which is a liquid crystal dot (pixel) portion, a plurality of signal lines 9 radially drawn from each dot of the mask portion 7, and a panel. 3 and a plurality of electrodes 8 (hereinafter, referred to as panel-side electrode group 8) that electrically connect the ends of the signal lines 9 to each other.

A panel-side electrode group 8 faces an end face of the conductive rubber 2 opposite to an end face facing the surface 1c of the substrate 1, and each electrode of the panel-side electrode group 8 and the board-side electrode group 5 Are electrically connected by respective signal lines in the conductive rubber 2. Therefore, the IC chip 6a on the substrate 1
A required electric signal is supplied from 6b to each liquid crystal dot on the liquid crystal panel 3, and the liquid crystal is driven. Note that the conductive rubber 2 is merely an example, and any connector that can electrically connect the two electrode groups 5 and 8 may be used, and the electrical connection state is arbitrary. Here, the inner IC chip 6b
Could be arranged for the following reasons.

That is, the space 1b in the substrate 1
Corresponds to a space in the liquid crystal panel 3 excluding the mask portion 7 and the electrode group 8. On the other hand, as the number of signal lines 9 drawn from the mask section 7 increases, the degree of interference between adjacent signal lines increases. Therefore, it is necessary to increase the interval between the electrodes in the electrode group 8. For this reason, it is necessary to enlarge the longitudinal direction of the electrode group 8, and the signal line 9
It is necessary to increase the space where the... Are arranged radially. Therefore, it is possible to provide the IC chip and the wiring connected thereto in this large space.

FIG. 3 is a perspective view showing a state in which the liquid crystal panel 3 is fixed to the substrate 1 by the holder 4, and FIG. 5 is a sectional view showing a state in which the liquid crystal panel 3 is similarly fixed.

As shown in these figures, the outer periphery of the holder 4 is fixed to the printed wiring board 1 by screws 10 and nuts 13 via spacers 12. Therefore, the liquid crystal panel 3 interposed between the holder 4 and the substrate 1 is fixed to the substrate 1 together with the conductive rubbers 2. During such fixing, the opening 1a of the substrate 1, the mask 7 of the liquid crystal panel 3, and the opening 4a of the holder 4 are positioned so as to be at the same position. This is because these are the portions 11 where the YAG laser light Lb enters and passes (see FIG. 5). The opening 1a
May be at least the same size as the mask portion 7 and may be slightly larger than this. The same applies to the holder opening 4a.

Thus, the YAG laser beam Lb is incident from the back of the liquid crystal panel module 100, and passes through the opening 1a of the printed circuit board 1 to the mask portion 7 of the liquid crystal panel 3.
Light is transmitted only through the dot portion driven by the IC chip, and characters or the like corresponding to the shape of the driven dot portion are printed on the work surface.

FIG. 1 is an enlarged view showing a predetermined corner 1e of the surface 1c of the printed wiring board 1. As shown in FIG.

As shown in the drawing, the outer IC chips 6a-1, 6a, 6a-1
a-2, 6a-3, 6a-4... are provided. Here, the areas 14-1, 14-2, 14-3, 14-4,... Surrounded by the two-dot chain line for each IC chip indicate the area where the printed wiring is provided for each IC chip. is there.

On the other hand, a plurality of inner IC chips 6b-1 are similarly arranged along side 1f, but only one is shown in the figure for convenience of explanation. A region 15-1 surrounded by a two-dot chain line corresponds to the inner IC chip 6b-1.
This is the area where printed wiring is provided.

It should be noted that the outer IC is similarly provided along the left side 1g.
The chip 6a and the inner IC chip 6b are respectively arranged continuously, but are not shown in the drawing. In the drawing, a dashed line indicates an outline of the liquid crystal panel 3. In the drawing, those indicated by broken lines indicate those disposed on the back surface 1d of the substrate 1. That is, it is understood that the inner IC chip 6b-1 is provided on the back surface 1d of the substrate 1.

From the substrate side electrode group 5, the outer IC chip 6
a-1, 6a-2, 6a-3, inner IC chip 6b-
1, the signal lines L1 to be connected to these IC chips are sequentially drawn from the left in the order of the outer IC chips 6a-4. It should be noted that the arrangement of the outer side and the inner side alternately in this manner is merely an example, and the outer side and the inner side may be arranged alternately depending on the layout of the printed wiring, and the ratio is arbitrary. . Further, it is also possible to carry out the arrangement at an irregular rate instead of the regular rate. The point is that the printed wiring and the IC chip may be arranged with a margin.

Now, paying attention to the left region indicated by the arrow B, a total of five IC chips and the corresponding printed wiring are provided in this region as described above. However, if the IC chips are arranged only outside the substrate-side electrode group 5 and the necessary printed wiring is provided to them as in the conventional case, the four outer IC chips 6a
-1 to 6a-4 and four printed wiring sections 14-1 to 14-1
In the area occupied by 14-4, the inner IC chip 6b-1 and the printed wiring section 15-1 must be further arranged. In this case, it is obvious that there is not enough physical space, and even if the signal lines can be arranged, the adjacent signal lines will be closer to each other, which will cause a problem such as a short circuit.

In this respect, according to this embodiment, the space where the signal lines 9 of the liquid crystal panel 3 are provided is large, and it is noted that this space has become a dead space. IC chip 6b-1 and printed wiring 1 in space 1b on substrate 1 corresponding to
5-1 is arranged, so limited space B
Thus, it is understood that more IC chips and printed wiring can be provided, and that wiring can be performed with a margin without inconvenience such as short circuit. Thus, it is possible to cope with a liquid crystal driving device in which the number of wires is inevitably increased, such as a high resolution liquid crystal and a low duty driving type liquid crystal, without violating a demand for miniaturization.

In the embodiment, in addition to the above, wiring is performed as described below so that the intervals between the signal lines are not narrowed, and the inconvenience such as a short circuit is more effectively avoided.

Focusing on the outer IC chip 6a-1, the signal lines L1, L2, L3,
L4 are drawn out and connected to each terminal of the chip 6a-1. Adjacent signal lines are arranged on the front surface 1c and the back surface 1d of the substrate 1, respectively. That is, the signal line L1 is on the front surface 1c, and the signal line L2 is on the back surface 1d.
The signal line L3 is printed on the front surface 1c, and the signal line L4 is printed on the rear surface 1d. Thereby, each surface 1
c, the signal lines are distributed to 1d, the number of signal lines to be disposed on one side is reduced by half, and a margin is created in the interval between the adjacent signal lines L1 and L3 (front surface 1c) and L2 and L4 (back surface 1d). Can be arranged without fear of interference. Therefore, the area of the printed wiring portion 14-1 can be substantially reduced, and downsizing is achieved.

In addition, among the signal lines led out from the substrate-side electrode group 5, the signal lines L1 and LL3 on the front side are on the side 1f side,
The signal lines L2 and L4 on the back side are opposite to the light transmitting portion 11
To the signal lines L1,
L2... Are drawn to opposite sides.
Thus, even with the electrode group 5 having a high density of 0.25 mm pitch, interference between adjacent signal lines at the time of drawing out signal lines is removed, and problems such as short circuit are prevented.

Further, the rear signal lines L2, L4,... Drawn to the light transmitting portion 11 side are guided to the rear side 1d of the substrate 1 through through holes H1, H2,. However, the positions of the adjacent ones of the through holes H1, H2,... Are different from the electrode group 5. That is, the through holes H1 are arranged so that the distance is small, and the through holes H2 are large, the distance is alternately different. Thereby, interference between the signal lines L2, L4,... On the back side is removed, and problems such as short circuits are prevented.

The signal lines L2, L4,... On the rear side pass through the through holes h1, h2,... Provided near the IC chip 6a-1 through the rear surface 1d of the substrate 1. Then, it is disposed on the front surface 1c of the substrate 1 again and connected to the terminals of the IC chip 6a-1.

The other outer IC chips 6a-2 to 6a-4 are also provided with printed wiring in a similar manner, thereby contributing to downsizing and eliminating interference between signal lines to more effectively reduce inconveniences such as short circuits. To prevent it.

On the other hand, since the printed wiring section 15-1 corresponding to the inner IC chip 6b-1 has a relatively large space, the signal lines L11 and L12 to be connected to the IC chip 6b-1 are basically provided. L13, L14, L15... Are arranged on the front surface 1c of the substrate 1. However, since there is a risk of interference in the portion drawn out from the electrode group 5, the adjacent electrodes are arranged so that the signal lines are alternately drawn on the side 1f side of the electrode group 5 and the light transmitting portion 11 side of the electrode group 5. , To prevent interference.

Further, the signal lines L12, L14,... Drawn to the same side 1f are inserted through the through holes H11, H12,..., And are inserted through the through holes I1, I2. And appears again on the surface 1c. During this time, the signal lines L11, LL12, L13, L1
4, L15... Alternately pass through the front and back of the substrate 1 to prevent interference.

The adjacent through holes H11, H12
Are different from each other to prevent interference.

Each signal line L11, L12, L13, L1
4, L15... Reach the vicinity of the inner IC chip 6b-1, and the through holes h11, h12, h13, h14, h
15 and pass through the back surface 1d and are connected to the terminals of the IC chip 6b-1.

The inner IC chips 6b-1...
Although it is arranged on the back surface 1d, it is also possible to arrange it on the front surface 1c. The outer IC chips 6a-1 are arranged on the front surface 1c of the substrate 1.
It is also possible to arrange this on the back surface 1d. In short, I
As a place for disposing the C chip, it is possible to dispose the C chip at an arbitrary position on the front or the back as long as it is advantageous in securing space and preventing interference of signal lines.

As described above, according to this embodiment,
In a liquid crystal driving device that requires a large number of IC chips to be provided, such as a so-called high-resolution liquid crystal or a low-duty drive type liquid crystal, a large number of IC chips can be provided in a limited space. In addition to the above, problems such as a short circuit due to the high density of the signal lines are eliminated.

[0045]

As described above, according to the present invention, the IC is provided not only outside the substrate side electrode group but also inside the substrate side electrode group.
Since the chips and the electric signal lines connected to the IC chips are arranged, a large number of IC chips and electric signal lines can be arranged in a limited space on the substrate without interference of the signal lines. Become. Therefore, the size of the device can be reduced, and the reliability such as short circuit can be prevented. Further, since a complicated operation for arranging the signal lines at a high density is not performed, the cost can be reduced by reducing the number of steps.

In addition, adjacent signal lines among the electric signal lines led out from the substrate side electrode group are arranged on the front surface and the back surface of the substrate, respectively, so that the signal lines do not interfere with each other. In addition, defects such as short circuit and the like can be more effectively achieved, and the reliability and cost of the device can be improved.

[Brief description of the drawings]

FIG. 1 is a view showing in detail a corner portion of a printed wiring board in an embodiment of a liquid crystal driving device according to the present invention.

FIG. 2 is used as part of a laser marker;
FIG. 2 is a perspective view illustrating a configuration of a liquid crystal panel module as an example device.

FIG. 3 is a perspective view showing an appearance of the liquid crystal panel module shown in FIG. 2;

FIG. 4 is a plan view showing the configuration of the liquid crystal panel shown in FIG.

FIG. 5 is a sectional view showing a section of the liquid crystal panel module shown in FIG. 3;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Conductive rubber 3 Liquid crystal panel 5 Substrate side electrode 6a Outside IC chip 6b Inside IC chip

Claims (2)

(57) [Claims] A liquid crystal panel disposed on one side of the substrate such that the opening and the liquid crystal are positioned at the same position; and A plurality of IC chips disposed around the liquid crystal panel and driving the liquid crystal, and interposed between the liquid crystal panel and the substrate;
A connector for electrically connecting a panel-side electrode group provided on the liquid crystal panel to a substrate-side electrode group provided on the substrate; and transmitting an electric signal between the substrate-side electrode group and the plurality of IC chips. In a liquid crystal driving device configured to drive each pixel of liquid crystal in the liquid crystal panel by connecting with a line, the IC chip is disposed on an inner portion of the surface of the substrate surrounded by the substrate side electrode group. At the same time, the IC chip is disposed in a portion outside an inner portion surrounded by the substrate-side electrode group, and an electric signal line from the substrate-side electrode group is connected to the inner portion,
It is possible to draw out in both directions of the outer portion, and among the electric signal lines drawn out from the substrate-side electrode group,
Regarding two adjacent signal lines, one is drawn in the direction of the inner part and the other is drawn in the direction of the outer part, and the electric signal drawn in the direction of the outer part from the substrate-side electrode group By drawing a wire through the hole provided in the substrate, the wire is pulled out to the inside portion,
The electric signal line drawn out to the inner portion adjacent to the electric signal line is connected to an IC chip provided in the inner portion, and the electric signal line is drawn out in the direction of the inner portion from the substrate-side electrode group. By passing an electric signal line through the hole provided in the substrate, the electric signal line is drawn out to the outer portion, and the electric signal line
A liquid crystal driving device, wherein an electric signal line led out to the outer portion adjacent to the electric signal line is connected to an IC chip provided in the outer portion. 2. The electric signal line insertion hole is provided in the vicinity of the substrate-side electrode group, and adjacent holes among the holes are provided at positions different from each other by a different distance from the substrate-side electrode group. The liquid crystal driving device according to claim 1, wherein