JP2722557B2 - Manufacturing method of printed wiring board - Google Patents
Manufacturing method of printed wiring boardInfo
- Publication number
- JP2722557B2 JP2722557B2 JP63289476A JP28947688A JP2722557B2 JP 2722557 B2 JP2722557 B2 JP 2722557B2 JP 63289476 A JP63289476 A JP 63289476A JP 28947688 A JP28947688 A JP 28947688A JP 2722557 B2 JP2722557 B2 JP 2722557B2
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive resin
- wiring board
- printed wiring
- resin layer
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、印刷配線板の製造方法に関し、特に感光性
樹脂を使用したソルダーレジストの形成方法に関する。Description: TECHNICAL FIELD The present invention relates to a method for manufacturing a printed wiring board, and more particularly to a method for forming a solder resist using a photosensitive resin.
〔従来の技術〕 従来、印刷配線基板への感光性樹脂を使用したソルダ
ーレジストの形成は、第２図に示すように、配線パター
ンを形成した印刷配線基板１上に、例えばスクリーン印
刷等の手段を用いて感光性樹脂層２を被着形成し（第２
図（Ａ））、しかる後にフォトマスク３を介して紫外線
により露光し（第２図（Ｂ））、感光性樹脂層２の所望
部分のみを光重合させ、光重合していない部分を現像除
去する（第２図（Ｃ））ことにより形成していた。[Prior Art] Conventionally, formation of a solder resist using a photosensitive resin on a printed wiring board is performed by, for example, screen printing or the like on a printed wiring board 1 on which a wiring pattern is formed as shown in FIG. To form a photosensitive resin layer 2 by using
(FIG. 2 (A)), and thereafter, it is exposed to ultraviolet rays through the photomask 3 (FIG. 2 (B)), and only the desired portion of the photosensitive resin layer 2 is photopolymerized, and the non-photopolymerized portion is removed by development. (FIG. 2C).
しかしながら、従来の印刷配線基板へのソルダーレジ
ストの形成方法では、露光−未露光の境界部においてエ
ッジの立ち上がりが甘くなり（アンダーカット量が大き
くなり）、高密度のソルダーレジスト被膜の形成が困難
であるという欠点を有していた。However, in the conventional method of forming a solder resist on a printed wiring board, the rise of the edge is weak at the exposed-unexposed boundary (the amount of undercut is increased), and it is difficult to form a high-density solder resist film. There was a disadvantage that there is.
〔課題を解決するための手段〕 本発明はソルダーレジストの形成工程を含む印刷配線
板の製造方法において、配線パターンの形成された印刷
配線基板上に感光性樹脂層を被着形成させる工程と、こ
の感光性樹脂層を第１のフォトマスクを用いて密着露光
し光重合させる工程と、第１のフォトマスク上のパター
ンの輪郭線をパターンとした第２のフォトマスクを用い
て密着露光し、光重合させる工程と、感光性樹脂層の光
重合していない部分を現像除去する工程とを有すること
を特徴としている。[Means for Solving the Problems] The present invention relates to a method for manufacturing a printed wiring board including a step of forming a solder resist, wherein a step of forming a photosensitive resin layer on a printed wiring board on which a wiring pattern is formed, A step of subjecting the photosensitive resin layer to close contact exposure using a first photomask and photopolymerizing, and a close contact exposure using a second photomask having a contour of a pattern on the first photomask as a pattern; The method is characterized by including a step of photopolymerizing and a step of developing and removing a non-photopolymerized portion of the photosensitive resin layer.
次に本発明について図面を参照して説明する。第１図
（Ａ）〜（Ｄ）は本発明の第１の実施例の工程を示す断
面図である。まず、配線パターンを形成した印刷配線基
板１上に、スクリーン印刷により感光性樹脂層２を被着
形成した。ここで感光性樹脂層２としては大陽インキ
（株）製PSR−1000（商標）を使用し、スクリーン印刷
は、100メッシュのテトロンスクリーンにより硬度60の
スキージを用いて行なった。スクリーン印刷の後、90
℃,20分間の乾燥を行ない調粘用溶剤の除去を行なった
（第１図（Ａ））。次に第１のフォトマスク４を感光性
樹脂層２に密着し、紫外線照射を行なった（第１図
（Ｂ））。さらに第１のフォトマスク４上に形成された
パターンの輪郭線をパターンとした第２のフォトマスク
５を感光性樹脂層２に密着し、紫外線照射を行なった
（第１図（Ｃ））。しかるのち、感光性樹脂層２の光重
合されていない部分を現像除去し、所望のソルダーレジ
スト６を得た。ここで、現像液としては、旭化成工業
（株）製エターナIR（商標）を使用した（第１図
（Ｄ））。Next, the present invention will be described with reference to the drawings. FIGS. 1A to 1D are cross-sectional views showing the steps of the first embodiment of the present invention. First, the photosensitive resin layer 2 was formed on the printed wiring board 1 on which the wiring pattern was formed by screen printing. Here, PSR-1000 (trade name) manufactured by Taiyo Ink Co., Ltd. was used as the photosensitive resin layer 2, and screen printing was performed using a 100 mesh Tetron screen using a squeegee having a hardness of 60. After screen printing, 90
The mixture was dried at a temperature of 20 ° C. for 20 minutes to remove the viscosity adjusting solvent (FIG. 1 (A)). Next, the first photomask 4 was brought into close contact with the photosensitive resin layer 2 and irradiated with ultraviolet rays (FIG. 1 (B)). Further, a second photomask 5 having a pattern formed by the contour of the pattern formed on the first photomask 4 was brought into close contact with the photosensitive resin layer 2 and irradiated with ultraviolet rays (FIG. 1C). Thereafter, a portion of the photosensitive resin layer 2 where photopolymerization was not performed was removed by development to obtain a desired solder resist 6. Here, Eterna IR (trademark) manufactured by Asahi Kasei Kogyo Co., Ltd. was used as the developer (FIG. 1 (D)).
第１表は、本発明の第１の実施例１により形成したソ
ルダーレジストの形状を比較したものである。従来例で
は200mJ/cm2の紫外線照射では、100μ幅パターンの形成
は不可能であった。300mJ/cm2の照射により100μ幅パタ
ーンの形成は可能になったが、30μのアンダーカットを
生じている。一方、第１の実施例では、いずれの照射露
光量でも100μ幅パターンの形成は可能となり、 次に本発明の第２の実施例について説明する。第１の
実施例と同様に配線パターンを形成した印刷配線基板１
を用意し、デュポン（Du・pont）社製VACREL（商標）−
930ドライフィルムを100℃,2Kg/cm2の条件下でホットロ
ールラミネートし感光性樹脂層２を被着形成した（第１
図（Ａ））。次に第１のフォトマスク４を感光性樹脂層
２に密着し、紫外線照射を行なった（第１図（Ｂ））。
さらに第１のフォトマスク４上に形成されたパターンの
輪郭線をパターンとした第２のフォトマスク５を感光性
樹脂層２に密着し、紫外線照射を行なった（第１図
（Ｃ））。しかるのち、感光性樹脂層２の光重合されて
いない部分を現像除去し所望のソルダーレジスト６を得
た。ここで現像液としては旭化成工業（株）製エターナ
NV（商標）を使用した（第１図（Ｄ））。Table 1 compares the shapes of the solder resists formed according to the first embodiment of the present invention. In the conventional example, it was impossible to form a 100 μ width pattern by irradiating with 200 mJ / cm 2 ultraviolet rays. Irradiation at 300 mJ / cm 2 made it possible to form a pattern with a width of 100 μm, but caused an undercut of 30 μm. On the other hand, in the first embodiment, it is possible to form a pattern having a width of 100 μ at any exposure dose. Next, a second embodiment of the present invention will be described. Printed wiring board 1 on which a wiring pattern is formed as in the first embodiment
Prepared by DuPont's VACREL (trademark)-
A 930 dry film was hot roll-laminated under the conditions of 100 ° C. and 2 kg / cm 2 to form a photosensitive resin layer 2 (No. 1).
Figure (A)). Next, the first photomask 4 was brought into close contact with the photosensitive resin layer 2 and irradiated with ultraviolet rays (FIG. 1 (B)).
Further, a second photomask 5 having a pattern formed by the contour of the pattern formed on the first photomask 4 was brought into close contact with the photosensitive resin layer 2 and irradiated with ultraviolet rays (FIG. 1C). Thereafter, a portion of the photosensitive resin layer 2 where photopolymerization was not performed was removed by development to obtain a desired solder resist 6. Here, as a developing solution, Eterna manufactured by Asahi Kasei Corporation
NV ™ was used (FIG. 1 (D)).
第２表は、本発明の第２の実施例により形成したソル
ダーレジストの形状を比較したものである。従来例で
は、いずれの照射露光量でも100μ幅パターンの形成は
できたが、40μの大きなアンダーカットを生じた。これ
に対して第２の実施例では、アンダーカット量が10〜０
μと大幅に改善された。Table 2 compares the shapes of the solder resists formed according to the second embodiment of the present invention. In the conventional example, a pattern having a width of 100 μm could be formed at any irradiation exposure amount, but a large undercut of 40 μm occurred. On the other hand, in the second embodiment, the undercut amount is 10 to 0.
μ was greatly improved.
〔発明の効果〕 以上説明したように、本発明によれば、感光性樹脂層
の露光−未露光境界部分において生じる半重合部分をエ
ッジ部分のみ二重に露光することによって重合を完全に
しアンダーカット量を減少せしめ高密度のソルダーレジ
ストの形成が可能になった。 [Effects of the Invention] As described above, according to the present invention, by partially exposing only the edge portion of the semi-polymerized portion generated at the exposed-unexposed boundary portion of the photosensitive resin layer, the polymerization is completed and the undercut is performed. The amount can be reduced and a high-density solder resist can be formed.
第１図（Ａ）〜（Ｄ）は、本発明の第１および第２の実
施例を工程順に示す縦断面図、第２図（Ａ）〜（Ｃ）
は、従来例を工程順に示す縦断面図である。 １……印刷配線基板、２……感光性樹脂層、３……フォ
トマスク、４……第１のフォトマスク、５……第２のフ
ォトマスク、６……ソルダーレジスト。1 (A) to 1 (D) are longitudinal sectional views showing the first and second embodiments of the present invention in the order of steps, and FIGS. 2 (A) to 2 (C).
1 is a longitudinal sectional view showing a conventional example in the order of steps. DESCRIPTION OF SYMBOLS 1 ... Printed wiring board, 2 ... Photosensitive resin layer, 3 ... Photomask, 4 ... First photomask, 5 ... Second photomask, 6 ... Solder resist.
Claims (1)
印刷配線板の製造方法において、配線パターンの形成さ
れた印刷配線基板上に感光性樹脂層を被着形成させる工
程と、前記感光性樹脂層を第１のフォトマスクを用いて
密着露光し光重合させる工程と、第１のフォトマスク上
のパターンの輪郭線をパターンとした第２のフォトマス
クを用いて密着露光し光重合させる工程と、前記感光性
樹脂層の光重合していない部分を現像除去する工程とを
有することを特徴とする印刷配線板の製造方法。1. A method of manufacturing a printed wiring board including a step of forming a photosensitive solder resist, wherein a step of forming a photosensitive resin layer on a printed wiring board on which a wiring pattern is formed is provided. A step of photo-polymerizing by contact exposure using a first photomask; and a step of photo-polymerizing by contact exposure using a second photomask having a contour line of a pattern on the first photo mask as a pattern. Developing and removing the non-photopolymerized portion of the photosensitive resin layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63289476A JP2722557B2 (en) | 1988-11-15 | 1988-11-15 | Manufacturing method of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63289476A JP2722557B2 (en) | 1988-11-15 | 1988-11-15 | Manufacturing method of printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02134638A JPH02134638A (en) | 1990-05-23 |
| JP2722557B2 true JP2722557B2 (en) | 1998-03-04 |
Family
ID=17743767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63289476A Expired - Fee Related JP2722557B2 (en) | 1988-11-15 | 1988-11-15 | Manufacturing method of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2722557B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5743208B2 (en) * | 2011-06-27 | 2015-07-01 | 日立化成株式会社 | Circuit board manufacturing method |
-
1988
- 1988-11-15 JP JP63289476A patent/JP2722557B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02134638A (en) | 1990-05-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |