JP2710513B2 - How to fix the board - Google Patents

How to fix the board

Info

Publication number
JP2710513B2
JP2710513B2 JP4648692A JP4648692A JP2710513B2 JP 2710513 B2 JP2710513 B2 JP 2710513B2 JP 4648692 A JP4648692 A JP 4648692A JP 4648692 A JP4648692 A JP 4648692A JP 2710513 B2 JP2710513 B2 JP 2710513B2
Authority
JP
Japan
Prior art keywords
pedestal
substrate
board
housing
screw
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP4648692A
Other languages
Japanese (ja)
Other versions
JPH05251579A (en
Inventor
光明 林
Original Assignee
東北日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東北日本電気株式会社 filed Critical 東北日本電気株式会社
Priority to JP4648692A priority Critical patent/JP2710513B2/en
Publication of JPH05251579A publication Critical patent/JPH05251579A/en
Application granted granted Critical
Publication of JP2710513B2 publication Critical patent/JP2710513B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、ぜい性材料の基板を筺
体部品に固定する基板の固定方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for fixing a substrate made of a brittle material to a housing part.

【0002】[0002]

【従来の技術】従来、この種の基板の固定方法は、筺体
上部部品に基板を接着剤で固定し、かつリード端子を貫
通させる端子台を筺体下部部品に接着材で固定したの
ち、基板のリード端子を端子台に貫通させて筺体上部部
品と筺体下部部品とを結合させていた。
2. Description of the Related Art Conventionally, this type of board fixing method is to fix a board to an upper part of a housing with an adhesive, and fix a terminal block through which lead terminals are to be penetrated to a lower part of the housing with an adhesive, and then mount the board. The lead terminal is passed through the terminal block to connect the upper part of the housing and the lower part of the housing.

【0003】図3を参照し、これについて説明する。図
3は従来の基板を固定した筺体部品の要部の一例を示す
断面図である。
This will be described with reference to FIG. FIG. 3 is a cross-sectional view showing an example of a main part of a housing component to which a conventional board is fixed.

【0004】図示するように、基板10は筺体上部部品
50に緩衝体51を介して両面粘着テープ52により固
定され、一方端子台60は筺体下部部品70に接着剤7
1で固定される。
As shown in the figure, the substrate 10 is fixed to the upper part 50 of the housing via a buffer 51 with a double-sided adhesive tape 52, while the terminal block 60 is attached to the lower part 70 of the housing with an adhesive 7
Fixed at 1.

【0005】接着剤により両者が固定したのち、基板1
0のリード端子11が端子台60および筺体株部品70
それぞれの端子貫穴を貫通し、次いで筺体上部部品50
と筺体下部部品70とが結合される。
After the two are fixed by the adhesive, the substrate 1
0 lead terminal 11 is a terminal block 60 and a housing stock component 70
Penetrate through each terminal through-hole and then the housing upper part 50
And the housing lower part 70 are combined.

【0006】接着固定は、構成部品の搭載位置などを確
認したのち、注意力を持って結合するという技能を要
し、かつ時間も必要とする。
[0006] Adhesive fixing requires the skill of carefully connecting components after confirming the mounting position of the components and the like, and also requires time.

【0007】[0007]

【発明が解決しようとする課題】この従来の基板の固定
方法は、基板および端子台をそれぞれ筺体部品に接着材
で固定するので、正確な位置決めが困難であり、かつ接
着材の硬化まで次の組立工程を待つ必要があり、時間的
損失も回避できない。
In this conventional method of fixing a substrate, since the substrate and the terminal block are each fixed to a housing part with an adhesive, accurate positioning is difficult, and the next step is until the adhesive is cured. It is necessary to wait for the assembly process, and time loss cannot be avoided.

【0008】また、基板の交換に際してはセラミックの
ようにぜい性材質の基板が両面粘着テープで固定され、
また部分的な緩衝体のこともあり、外的衝撃を吸収しき
れず、組立後においても基板が破損し易いという問題点
があった。
Further, when replacing the substrate, a substrate made of a brittle material such as ceramic is fixed with a double-sided adhesive tape,
In addition, there is a problem that a partial buffer may not be able to absorb an external impact and the substrate may be easily damaged even after assembly.

【0009】本発明の目的は、端子台相当位置に成形樹
脂材による台座を緩衝体として使用すると共に、この台
座と一体成形されたワッシャで基板のねじ止め用の穴を
保護することにより、上記問題点を解消する基板の固定
方法を提供することにある。
An object of the present invention is to use a pedestal made of a molded resin material at a position corresponding to a terminal block as a buffer, and to protect a screw hole of a substrate with a washer integrally formed with the pedestal, thereby achieving the above-mentioned object. An object of the present invention is to provide a method of fixing a substrate, which solves the problem.

【0010】[0010]

【課題を解決するための手段】本発明による基板の固定
方法は、ぜい性材料の基板を筺体部品に固定する基板の
固定方法において、前記基板の回路実装面を避けた形状
の絶縁体による成形樹脂材の台座を前記筺体部品上に重
ね合わせて、前記台座がもつ複数の位置決めテーパーを
前記筺体部品の突起部に嵌合一致させると共に、前記台
座の上方から前記基板を、この基板のリード端子を前記
台座および前記筺体部品それぞれの端子貫通穴に貫通さ
せて重ね合わせ、次いで、前記突起部および前記基板の
それぞれがもつねじ貫通穴、並びに前記位置決めテーパ
ーに続くねじ穴をボルトで下方から貫通させ、さらに前
記台座と一体成形されるワッシャに前記ボルトを貫通さ
せたのちこのボルト先端からナットを掛け、前記ワッシ
ャを介して前記基板、前記台座および前記筺体部品を締
付け固定することである。
According to the present invention, there is provided a method of fixing a substrate, comprising: fixing a substrate made of a brittle material to a housing component by using an insulator having a shape avoiding a circuit mounting surface of the substrate. A pedestal of a molded resin material is superimposed on the housing component, and a plurality of positioning tapers of the pedestal are fitted and matched with the protrusions of the housing component, and the substrate is read from above the pedestal to the lead of the substrate. The terminals are passed through the terminal through holes of the pedestal and the housing component, respectively, and overlapped. Then, the screw through holes of the protrusions and the substrate, and the screw holes following the positioning taper are passed through from below with bolts. After passing the bolt through a washer integrally formed with the pedestal, a nut is hung from the tip of the bolt, and the base is passed through the washer. Is to fastened the seat and the housing part.

【0011】[0011]

【実施例】次に、本発明について図面を参照して説明す
る。図1は本発明の一実施例を示す組立斜視図、また図
2は図1の組立後の要部の一例を示す断面図である。
Next, the present invention will be described with reference to the drawings. FIG. 1 is an assembled perspective view showing one embodiment of the present invention, and FIG. 2 is a cross-sectional view showing an example of a main part after assembly in FIG.

【0012】図示するように、ぜい性材料のセラミック
の基板10は、所定数のリード端子11および基板10
を固定するボルト42を貫通する複数のねじ貫通穴12
を有する。
As shown, a ceramic substrate 10 made of a brittle material includes a predetermined number of lead terminals 11 and a substrate 10.
Screw through holes 12 passing through bolts 42 for fixing
Having.

【0013】成形樹脂材の台座20はリード端子11と
間隔が合う所定間隔位置に端子貫通穴21、基板10の
ねじ貫通穴12と嵌合する径をもつワッシャ凸部22、
台座20と一体成形されボルト42を止めるナット41
を固定するワッシャ23、ボルト42を貫通するねじ穴
24、および位置決め用にねじ穴24の入口部分に設け
た位置決めテーパー25を有する。
A pedestal 20 made of a molding resin is provided with terminal through holes 21 at predetermined intervals where the lead terminals 11 are spaced from each other, and a washer projection 22 having a diameter to be fitted into the screw through holes 12 of the substrate 10.
Nut 41 integrally formed with base 20 to hold bolt 42
And a screw hole 24 passing through the bolt 42, and a positioning taper 25 provided at the entrance of the screw hole 24 for positioning.

【0014】下部の筺体部品30は、台座20の端子貫
通穴21を貫通するリード端子11を下方の外部に引き
出す端子貫通穴31、台座20の位置決めテーパー25
と嵌合する突起部32、およびこの突起部32からねじ
穴24およびねじ貫通穴12を貫通するボルト42用の
ねじ貫通穴33を有する。
The lower housing part 30 has a terminal through hole 31 for drawing out the lead terminal 11 penetrating the terminal through hole 21 of the pedestal 20 to the outside below, and a positioning taper 25 of the pedestal 20.
And a screw through hole 33 for a bolt 42 that passes through the screw hole 24 and the screw through hole 12 from the protrusion 32.

【0015】次に、図面を参照して組立手順について説
明する。
Next, an assembling procedure will be described with reference to the drawings.

【0016】まず、台座20は筺体部品30に重ねて乗
せられ、位置決めテーパー25が突起部32に嵌合して
位置決めされる。この台座20の上に、リード端子11
を端子貫通穴21,31を貫通させつつ基板10を乗せ
ることにより、リード端子11か筺体部品30の下方か
ら露出する。
First, the pedestal 20 is placed on the housing component 30 so as to be positioned thereon, and the positioning taper 25 is fitted to the projection 32 to be positioned. On this pedestal 20, the lead terminals 11
Is mounted on the board 10 while penetrating through the terminal through holes 21 and 31, so that the lead terminal 11 or the housing component 30 is exposed from below.

【0017】次いで、ワッシャ23のワッシャ凸部22
が上方から基板10のねじ貫通穴12の位置に合わせ嵌
め込まれ、ねじ穴24とワッシャ23とがねじ貫通穴1
2をはさむと共に、ワッシャ23の上部にナット41を
配置し、筺体部品30の下方からねじ貫通穴33、ねじ
穴24およびねじ貫通穴12を貫通したボルト42が、
ワッシャ23からナット41に達し、ナット41により
締付け、固定される。
Next, the washer projection 22 of the washer 23
Is screwed from above into the position of the screw through hole 12 of the substrate 10, and the screw hole 24 and the washer 23 are screwed into the screw through hole 1.
2, a nut 41 is disposed above the washer 23, and a bolt 42 that has passed through the screw through-hole 33, the screw hole 24, and the screw through-hole 12 from below the housing part 30,
It reaches the nut 41 from the washer 23, and is tightened and fixed by the nut 41.

【0018】従って、基板10が台座20を介して筺体
部品30にボルト42およびナット41により結合固定
される。
Accordingly, the substrate 10 is fixedly connected to the housing component 30 via the pedestal 20 by the bolts 42 and the nuts 41.

【0019】前記説明は最も正常と思われる手順の一例
であり、手順に前後があっても、また方向に逆があって
も同一効果を得ることは可能であり、上記説明が本発明
を限定するものではない。
The above description is an example of the procedure which seems to be the most normal. The same effect can be obtained even if the procedure is performed before or after, or the direction is reversed. It does not do.

【0020】[0020]

【発明の効果】以上説明したように本発明はぜい性材料
である基板を、緩衝体を兼ねた台座を介してボルトおよ
びナットで筺体部品にねじ止めし、かつ基板のねじ貫通
穴が台座と一体成形されたワッシャと嵌合する構成とな
っているので、基板およびこの基板のねじ貫通穴が台座
およびこの台座によるワッシャで保護される一方、同一
台座がリード端子の台座も兼ね、かつ簡便なねじ止めで
セラミック基板を保持することにより、部品点数の低減
及び台座のワッシャによるナットの回わり止めの役割り
も効果的で、組立時間の低減を可能にし、組立技能に左
右されずに製品特性の維持を達成することができるとい
う効果がある。
As described above, according to the present invention, a substrate made of a brittle material is screwed to a housing part with bolts and nuts via a pedestal also serving as a buffer, and a screw through hole of the substrate has a pedestal. And the screw through hole of this board is protected by the pedestal and the washer by this pedestal, while the same pedestal also serves as the pedestal of the lead terminal, and is easy to use. By holding the ceramic substrate with simple screwing, the number of parts can be reduced, and the rotation of the nut by the washer on the pedestal can be effectively stopped.Assembling time can be reduced, and the product is not affected by assembly skills. There is an effect that the maintenance of characteristics can be achieved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例を示す組立斜視図である。FIG. 1 is an assembled perspective view showing one embodiment of the present invention.

【図2】図1の組立後の要部の一例を示す断面図であ
る。
FIG. 2 is a sectional view showing an example of a main part after assembly in FIG. 1;

【図3】従来の構成部材組立後の要部の一例を示す断面
図である。
FIG. 3 is a cross-sectional view showing an example of a main part after a conventional component member is assembled.

【符号の説明】[Explanation of symbols]

10 基板 11 リード端子 12,33 ねじ貫通穴 20 台座 21,31 端子貫通穴 22 ワッシャ凸部 23 ワッシャ 24 ねじ穴 25 位置決めテーパー 30 筺体部品 32 突起部 41 ナット 42 ボルト DESCRIPTION OF SYMBOLS 10 Substrate 11 Lead terminal 12, 33 Screw through hole 20 Pedestal 21, 31 Terminal through hole 22 Washer convex part 23 Washer 24 Screw hole 25 Positioning taper 30 Housing part 32 Projecting part 41 Nut 42 Bolt

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 ぜい性材料の基板を筺体部品に固定する
基板の固定方法において、 前記基板の回路実装面を避けた形状の絶縁体による成形
樹脂材の台座を前記筺体部品上に重ね合わせて、前記台
座がもつ複数の位置決めテーパーを前記筺体部品の突起
部に嵌合一致させると共に、 前記台座の上方から前記基板を、この基板のリード端子
を前記台座および前記筺体部品それぞれの端子貫通穴に
貫通させて重ね合わせ、 次いで、前記突起部および前記基板のそれぞれがもつね
じ貫通穴、並びに前記位置決めテーパーに続くねじ穴を
ボルトで下方から貫通させ、 さらに前記台座と一体成形されるワッシャに前記ボルト
を貫通させたのちこのボルト先端からナットを掛け、前
記ワッシャを介して前記基板、前記台座および前記筺体
部品を締付け固定することを特徴とする基板の固定方
法。
1. A method of fixing a board made of a brittle material to a casing part, wherein a pedestal of a molding resin material made of an insulator having a shape avoiding a circuit mounting surface of the board is superimposed on the casing part. The plurality of positioning tapers of the pedestal are fitted and matched with the projections of the housing component, and the board is inserted from above the pedestal, and the lead terminals of the board are connected to terminal through holes of the pedestal and the housing component, respectively. Then, a screw through hole of each of the protrusion and the substrate, and a screw hole following the positioning taper are penetrated from below with a bolt, and further, the washer is integrally formed with the pedestal. After penetrating the bolt, a nut is hung from the tip of the bolt, and the board, the pedestal, and the housing part are tightened and fixed via the washer. Fixing method of the substrate, wherein Rukoto.
JP4648692A 1992-03-04 1992-03-04 How to fix the board Expired - Lifetime JP2710513B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4648692A JP2710513B2 (en) 1992-03-04 1992-03-04 How to fix the board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4648692A JP2710513B2 (en) 1992-03-04 1992-03-04 How to fix the board

Publications (2)

Publication Number Publication Date
JPH05251579A JPH05251579A (en) 1993-09-28
JP2710513B2 true JP2710513B2 (en) 1998-02-10

Family

ID=12748539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4648692A Expired - Lifetime JP2710513B2 (en) 1992-03-04 1992-03-04 How to fix the board

Country Status (1)

Country Link
JP (1) JP2710513B2 (en)

Also Published As

Publication number Publication date
JPH05251579A (en) 1993-09-28

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Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 19970930