JP2706712B2 - Dust-filled solder wire, its manufacturing method and its feeder - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a characteristic shape of a solder wire containing tin (hereinafter referred to as solder containing tin), a manufacturing method for forming the same, and an apparatus for the manufacturing method.

[0002]

2. Description of the Related Art The characteristic shape of solder containing dust is disclosed in Japanese Utility Model Laid-Open Publication No. Sho 63-47086, Japanese Utility Model Laid-Open Publication No. Sho 54-38134, etc.
No. 59-62886. Their characteristic shape is that the tinned solder is continuous or interrupted in parallel with the axial direction of the tinned solder to form a V-shaped groove reaching the tarnish layer at a cross section perpendicular to the axial direction. Further, a V-shaped groove is formed before and after in the axial direction.
Japanese Utility Model Application Laid-Open No. 54-38134 mentioned above attempts to reduce the width of the elongated groove reaching the tan layer, but it is also a V-shaped groove.

[0003] Since the above-mentioned conventional groove is formed by cutting a V-shaped blade up to the central layer in the solder containing the tin in parallel with the axis, the solder layer is pushed and spread to both sides in parallel with the axis. , And the diameter of the solder containing the dust is unbalanced and large. As a result, the solder containing the dust is sent unevenly in the guide pipe for sending to the soldering device, and is worn by contact with the wall. Furthermore, since the solder containing the resin is wound in a spiral shape when initially wound on a reel, when the V-shaped groove is cut while being rewound, the V-shaped groove is arranged in a spiral shape, and the V-shaped groove at the soldering point is formed. There is a disadvantage that the position of the groove is not fixed.

Further, the conventional V-shaped groove is provided continuously or intermittently long along the axis of the solder containing the dust, and the dust layer is exposed on the entire bottom surface of the groove. When the tip of this solder containing solder is heated at the time of soldering, the melting point of the solder is 183 ° C in standard quality, and the boiling point of the solder is 60 ° C to 10 ° C.
Since the temperature is 0 ° C., the varnish layer whose exposed surface is widened at the bottom of the long groove is directly heated and liquefied. Solder is scattered by the vapor pressure generated from the varnish, and it is inevitable that the solder is scattered on the electronic component bonding surface. Was.

Further, since the V-shaped groove forming blade has a shape for forming the same groove in the solder containing the dirt, the action of feeding the solder containing the dirt is small, and other means for feeding and adjusting the feed are required. Needed.

[0006]

SUMMARY OF THE INVENTION The present invention is intended to solve the problem of soldering tinned solder.
It is a groove that can prevent the scattering of the solder, and is a groove that suppresses an increase in the diameter of the solder containing the dust, and attempts to form a groove that improves the feeding of the solder containing the dust.

[0007]

In order to solve the above-mentioned problems of the present invention, the shape of the blade of the rotary disc that is cut into the solder containing the tan is made not to have the conventional V-shape in the cross section in the rotation direction but to make both sides perpendicular. The front edge in the direction of rotation shall be a vertical edge on the diameter extension of the turntable, and the following bottom edge shall be formed as an inclined edge rising upward. To intermittently form a groove.

[0008]

The blade of the rotary disc forms a groove in the solder with a vertical wall on both sides in the rotation direction and on both sides as shown in FIGS. 3 and 4, so that the groove width of the solder containing the dust is V-shaped. Does not expand like that. Therefore, the deviation of the diameter of the solder containing the dust is reduced. In addition, since the cutting is performed at the vertical edge, the feeding of the solder containing the dust becomes strong. In addition, the lower edge of the vertical edge of the blade is pulled up as soon as it reaches the layer, so that the layer is less exposed. On the other hand, in the section of the prior art,
Inside the groove as invented in Japanese Utility Model Publication No. 54-38134
If the bottom surface is wide open to the tarnish layer and the exposed surface of the tarnish layer is wide ,
Solder layer with lower melting point than solder due to heating of solder
Temporarily sharply vapor pressure than tar is heated occurs, Ha
In the present invention, the exposure of the dust layer is small,
When heated, heat is transferred from the solder to the tar layer
Yarn liquefied by the vapor pressure generated from the ani by small scale
The steam pressure is released by pushing up the nip into the pit pool,
Atmospheric pressure does not rise , so no explosion occurs and solder
Dispersion can be suppressed .

[0009]

When EXAMPLES illustrating an embodiment of the present invention, the apparatus a as shown in FIG. 1 is JikuSo rotatably guide pulley 1 downward, rotary table 3 the guide with an edge 2 around thereabove The pulley 1 is rotatably mounted on a shaft so as to be able to move up and down and rotate at the same speed with the same power. On one side of the guide pulley 1, a pipe 4 for feeding the solder b with the dirt between the guide pulley 1 and the rotating plate 3, and on the other side, the grooved formed solder b is guided to the soldering point. Pipe 5 is provided. The shape of the blade 2 of the turntable 3 is rectangular in the cross section in the rotation direction, so that both sides are vertical walls, and the leading edge in the rotation direction is a vertical edge which is a vertical line a on the diameter extension of the turntable 3, The bottom edge continuing from the lower end of the vertical line a is formed as an oblique edge that becomes an oblique line B rising upward. Assuming that the diameter of the solder containing the tin is 0.5 mm, the thickness of the blade 2 is 0.1
mm and the depth reaches the dent layer 6 at the center of the tin-containing solder b.

[0010] Solder b containing dust wound on a reel not shown
Is inserted between the guide pulley 1 and the rotating plate 3 which rotate while adjusting the vertical distance through the pipe 4 on one side of the device a, the blade 2 is pushed in, and the tip of the blade reaches the stain layer 6. Preferably, three blades 2 at the front, rear, and center are cut into the solder b containing the dents. When the blade 2 cuts in, the ridge of the blade 2 which is the vertical line a is in the same direction as the axis of the solder b containing dents. Since the solder b containing tin can be divided into a solid and a fluid of the solder and the tin layer, the density difference is large, and the melting point of the solder and the boiling point of the tin are as described above. When the vapor pressure is applied, the mist accumulates in the mist pool 7 on the trace of the blade 2 so that the solder does not burst and scatter.

[0011] The blade 2 also pushes the tinned solder b through the solder layer 8 by rotation, so that the tinned solder b can be sent to the soldering point while being rewound from the reel.

[0012]

According to the present invention, there is an effect that the scattering of the solder during the soldering is suppressed, the diameter of the solder containing the dust is prevented from expanding, and the feeding of the solder containing the dust is made good and strong.

[Brief description of the drawings]

FIG. 1 is a schematic view of an apparatus for forming a tinned solder wire of the present invention.

FIG. 2 is a side view of a blade used in the present invention.

FIG. 3 is a vertical cross-sectional view of the solder wire with a tin of the present invention.

FIG. 4 is a plan view of the solder wire with a tin of the present invention.

[Explanation of symbols]

 a Apparatus 1 Guide pulley 2 Blade 3 Turntable b Solder with dirt Vertical line B Oblique line 6 Dirt layer 7 Dirt pool 8 Solder layer

Claims (3)

(57) [Claims] 1. An elongated groove having a vertical wall formed on an inner surface thereof, wherein a groove provided along an axis of the solder wire containing the resin is formed.
And the inner bottom surface is how
The front part corresponding to the direction is the solder layer containing the solder wire at the center.
A grooved wire that reaches the upper end of the solder wire, and a rear portion of the grooved portion is formed as an oblique bottom surface rising upward, and the groove having the above-mentioned shape is used as a pool for repelling when used. 2. A shape of a blade of a rotating disk cut into solder containing solder is rectangular in a cross section in the rotating direction, a leading edge in the rotating direction is a vertical edge on a diameter extension of the rotating disk, and a bottom edge following a lower end of the edge. Wherein the vertical edge is formed as a depth reaching the dent layer, and the blade is intermittently cut into the dent-containing solder layer to provide a groove for the dent pool. Recipe. 3. A rotary plate for feeding a solder wire containing a resin,
The cross-section is rectangular, the leading edge in the direction of rotation is the vertical edge on the diameter extension of the turntable, the bottom edge following the lower end of the rotary edge is the rising edge, and the vertical edge has a blade with a depth reaching the tarnish layer. A feeding device for a solder wire containing a tin, wherein the feed is strengthened by a vertical edge of a blade when the solder wire containing a tin is sandwiched between the rotating disk and the guide roller.