JP2703436B2 - Component mounting position data creation device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting position data generating apparatus for generating component mounting position data indicating a position on a printed circuit board on which a chip component to be suctioned by a suction nozzle is to be mounted.

[0002]

2. Description of the Related Art A technique relating to this kind of component mounting apparatus is disclosed in Japanese Patent Application Laid-Open No. 60-161700. According to this conventional technique, components are mounted on a printed circuit board in the order of mounting according to a program having X data and Y data indicating a mounting position on the printed circuit board (2).

[0003] The mounting position data also includes data of the θ rotation direction, and these data have been created from data obtained from a drawing of a pattern or the like.

[0004]

However, according to the prior art, if the printed circuit board is not completed as shown in the pattern diagram and the pattern is displaced in the X and Y directions and the .theta. Even if components are mounted in the same manner, there is a disadvantage that the lead terminals of the components are displaced from the pattern and a defective board is formed.

[0005] For this reason, mounting position data has been created by actually mounting components on a printed circuit board and measuring the deviation from the pattern. However, creating such a method is extremely time-consuming. There were drawbacks.

Accordingly, an object of the present invention is to create mounting position data suitable for an actual printed circuit board without any trouble.

[0007]

SUMMARY OF THE INVENTION Therefore, the present invention provides a component mounting position data creating apparatus for creating component mounting position data indicating a position on a printed circuit board where a chip component to which a suction nozzle has been sucked is to be mounted. Imaging means for imaging the component mounting surface, drawing means for drawing a figure representing the component to be mounted, and display means for superimposing the figure drawn by the drawing means and the image picked up by the imaging means on a screen. Moving means for moving the figure drawn by the drawing means and the captured image so as to relatively move in the XY direction and the θ rotation direction on the screen; and moving the figure on the printed circuit board by the movement of the moving means. XY directions and θ
Storage means for storing, as the component mounting position data, the positions moved in the XY directions and the θ rotation direction by the moving means when they are matched with a predetermined position in the rotation direction.

[0008]

The image of the printed circuit board picked up by the image pickup means and the figure drawn by the drawing means are relatively moved in the XY direction and the .theta. When the figure is matched with the positions in the XY direction and the θ rotation direction, the storage means stores the XY
The position moved in the direction and the θ rotation direction is stored as component mounting position data.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

In FIGS. 2, 3 and 4, (1) represents X
XY by rotation of the axis motor (2) and the Y axis motor (3)
An XY table that moves in the direction, on which a printed circuit board (5) on which chip-shaped electronic components (hereinafter, referred to as chip components or components) (4) are mounted is placed.

[0011] (6) is a supply table, chip components (4)
A large number of component supply devices (7) for supplying the components are provided. Reference numeral (8) denotes a supply stand drive motor, which rotates the ball screw (9) to fit the ball screw (9) through a nut (not shown) fixed to the supply stand (6). 6) is guided and moved by the linear guide (10).

(11) is a turntable which rotates intermittently. A suction nozzle (1) is provided on the outer edge of the turntable (11).
The mounting heads (13) having four (2) are arranged at equal intervals in accordance with the intermittent pitch.

The stop position of the mounting head (13) at which the suction nozzle (12) sucks and picks up the component (4) from the supply device (7) is a suction station. An outside suction nozzle (12) sucks the component (4).

The position where the mounting head (13) stops next is the recognition station, where the component recognition camera (14) recognizes the displacement of the component (4) to be sucked by the suction nozzle (12). Is done.

The next mounting head (1) of the recognition station
The stop position of 3) is the angle correction station, and the suction nozzle (12) is rotated in the θ direction by the nozzle rotation roller (15) based on the recognition result by the recognition camera (14), and the rotation angle of the component (4) Is corrected.

The next stop position of the angle correction station is:
A mounting station, on which a component (4) to be suctioned by a suction nozzle (12) of the station is mounted on the substrate (5).

(18) is a base, and the XY table (1) moves XY with respect to the base (18). (19) is a board recognition camera, and the base (18) )
The printed board (5) fixed to the support plate (20) fixed to the XY table (1) is imaged.

As shown in FIG. 4, a positioning mark (22) is displayed on the printed board (5), and the mark (22) is picked up by a recognition camera (19) and the board (5) is picked up.
Is recognized on the XY table (1).
Reference numeral (23) denotes a supply conveyor that conveys the printed circuit board (5) and supplies it to the XY table (1).

Next, the control circuit of this embodiment will be described with reference to FIG.

In FIG. 1, (25) is a CPU,
Various data stored in the RAM (26) and the operation unit (2
7) In accordance with a program stored in the ROM (28), various operations related to the mounting operation of the chip component (4) on the printed circuit board (5) of the component mounting device are controlled based on signals from 7) and the like.

For example, the X-axis motor (2) and the Y-axis motor (3) are driven by the drive circuit (2) under the control of the CPU (25).
9) is driven. A graphic RAM (31) stores a graphic figure.
It is connected to the CPU (25) via 2). (3
An A / D conversion circuit 3) converts an analog signal of an image captured by the board recognition camera (19) into a digital signal, and converts the converted digital signal into a video RAM (34).
Is stored. Based on the image stored in the RAM (34), the recognition processing circuit (35) performs recognition processing such as position recognition of the substrate (5).

The recognition processing circuit (35) is connected to a CPU (25) via an interface (32).
The recognized data is transferred to the CPU (25).

A horizontal / vertical synchronizing signal is simultaneously supplied from the interface (32) to the graphic RAM (31), the board recognition camera (19) and the video RAM (34) via a horizontal / vertical synchronizing signal line (37). Have been. CPU (2) from graphic RAM (31)
The image signal created and stored in 5) is output to the display logic (38) in synchronization with the horizontal / vertical synchronization signal, and the camera (19) in synchronization with the signal from the A / D conversion circuit (33). Are output to the logic (38), and both images are combined and output by the OR circuit in the logic (38). The composite output, which is a digital signal, is converted into an analog signal by a D / A conversion circuit (39), and is stored in a graphic RAM (31) on a monitor (41) as an image captured by a camera (19). The image on which the graphic figure is superimposed is displayed.

Image data for displaying one screen of the monitor (61) is stored in the graphic RAM (31). If a different graphic figure is to be displayed, the CPU (25) rewrites the RAM (31). Will be. If you want to rotate and display a graphic figure, you have to rewrite it. To rotate a graphic figure, the position (X,
If Y) is represented by X = lcosθ, Y = lsinθ, the position (XR, YR) rotated by Δθ is XR = lc
By calculating os (θ + Δθ) and YR = lsin (θ + Δθ), new graphic graphic data is calculated based on the original graphic graphic data, and can be executed by changing the data in the graphic RAM (31).

A monitor (43) for displaying an operation screen and various data is connected to the interface (32) via a display circuit (44).

Next, the operation section (27) will be described.

In FIG. 1, reference numeral 47 denotes a numeric keypad for keying in a numeral, and reference numerals 48 to 51 denote a cursor (52) (see FIG. 7) in a direction indicated by an arrow on a screen of a monitor 43. The cursor key is used to move the X-axis motor (2) and the Y-axis motor (3) or to monitor (4) in the NC data alignment mode described later.
It is also used to change the rotation angle of the graphic figure displayed in 1). In the NC data matching mode, the motors (2) and (3) or the graphic figures move only while the cursor keys (48) to (51) are being pressed, and do not move when they are not pressed. (53) is a SET key for setting a mode and the like.

(55) is a teaching key for setting the component mounting apparatus to the teaching mode, (56) is an automatic key for setting the same to the automatic operation mode, and (57) is for setting the same to the manual operation mode. Manual key. (58) is a start key, (59) is an operation key, and (60) is a stop key.

The RAM (26) has step numbers indicating the order of mounting the components (4) as shown in FIG. 5, and mounting position data indicating mounting positions at X, Y and θ angles on the printed circuit board (5). And an NC consisting of a part ID indicating the type of the part
Data is stored for each board type, and data such as an X size indicating a component size in the X direction and a Y size indicating a component size in the Y direction are stored as part data for each component ID as shown in FIG. .

The RAM (26) has an X-direction position memory (62) for storing the X-direction position and the Y-direction position on the printed circuit board (5) at the center of the screen imaged by the camera (19), respectively. A position memory (63) is provided, and the current position moved by the rotation of the motors (2) and (3) is always stored.

The RAM (26) has a monitor (4)
A .theta.-direction position memory (64) for storing a turning angle position in the .theta. Turning direction with respect to the printed circuit board (5) of the graphic figure displayed in 1) is provided. The rotation angle position for the case where the mounting position of the θ angle of the NC data of the graphic figure is “0 degree” is stored.

The NC data matching mode is a mode in which an actual board (5) is checked by using a camera (14) to correct the mounting position for each step number stored in the NC data and corrected. is there.

The operation of the above configuration will be described below.

First, when the operator presses the teaching key (55), a mode selection screen as shown in FIG. 7 is displayed on the monitor (43). When the cursor (52) on this screen is appropriately pressed by one of the cursor keys (48) and (49), and the SET key (53) is pressed in accordance with the "4 NC data alignment", the component mounting apparatus The NC data matching mode is set, and the monitor (43) displays a board type selection screen as shown in FIG. Cursor (5
In the same manner as described above, 2) is set according to “PCB1” of “1”, which is the substrate type for which the NC data is to be checked and corrected.
When the ET key (53) is pressed, the NC data registration for PCB1 is performed.

Next, the worker puts the board (5) of the board type "PCB1" on which the component (4) is not mounted and on which no adhesive or cream solder is applied, into the supply conveyor (23).
The operation key (59) is depressed while placed on the top. Then
The substrate (5) is supplied to the XY table (1) by the conveyor (23), and is positioned and fixed at a predetermined position on the table (1) by a positioning device (not shown).

Then, by the rotation of the X-axis motor (2) and the Y-axis motor (3), the positioning mark (22) of the substrate (5) moves below the camera (19), and the mark (22) ) Is performed, and the recognition processing circuit (35) recognizes the position of the mark (22) based on the captured image data stored in the video RAM (34) via the A / D conversion circuit (33). Another mark (2) on the substrate (5)
The position of 2) is similarly recognized, and the printed circuit board (5)
The origin position in the XY direction and the θ rotation direction of the CPU (25)
To be grasped.

Thereafter, the CPU (25) reads the step "001" of the NC data stored in the RAM (26), and a screen as shown in FIG. 9 is displayed on the monitor (43).
The X-axis motor (2) and the Y-axis motor (3) so that the coordinate position of (X1, Y1) in step "001" is at the center of the screen.
Is rotated, and the XY table (1) is moved.

At this time, the CPU (25) reads out the part data of the part ID from the part ID "R3216" of the step number "001" of the NC data, and, based on the X size and Y size data, reads the graphic RAM.
In (31), the data of the graphic figure of the component outline of this size is written in accordance with the dimensions of the board (5) with the center of the screen as the center. The graphic graphic data is output from the RAM (31) in synchronization with the horizontal / vertical synchronous signal output from the horizontal / vertical synchronous signal line (37), and the image of the graphic graphic is captured by the camera (19). The image is superimposed on the image of the printed circuit board (5) and displayed on the monitor (41) as shown in FIG.

Here, the image shown by the dotted line is a graphic figure image, and the image shown by the solid line is an image of a pattern to which the lead wires are soldered. The positional relationship when the actual component (4) is mounted on the board (5) is shown. In FIG. 10, the graphic figure is indicated by a dotted line, but may be displayed as a solid line on an actual screen, or may be a white line or a black line depending on the background. Also, what is actually displayed on the screen in the figure is two rectangles, a rectangle which is a dotted graphic figure and a solid line which shows a pattern, and a cross mark or the like is not displayed.
The same applies to FIGS. 11, 13 and 14 below.

According to FIG. 10, the graphic figure is shifted from the pattern image, and the pattern to which the component (4) in this step "001" is to be mounted is not located at the position corresponding to the coordinate position of (X1, Y1). Recognize.

Then, the operator operates the cursor key (49)
(51) is pressed, the X-axis motor (2) and the Y-axis motor (3) are rotated to move the XY table (1), so that the pattern image matches the graphic figure as shown in FIG. The pressing of the keys (49) and (51) is stopped to stop the XY table (1).

During this movement, the position of the printed circuit board (5) at the center of the screen is updated and stored in the X-direction position memory (62) and the Y-direction position memory (63) as needed.
In the state of 1, “X1 + ΔX” is stored in the memory (62), and “Y1 + ΔY” is stored in the memory (63).

In this state, when the operator presses the operation key (59), the CPU (25) changes the X data of the step "001" of the NC data in the RAM (26) to "X1 + ΔX".
And the Y data is rewritten to “Y1 + ΔY”.

Thereafter, the CPU (25) proceeds to step "00".
The NC data of "2" is read and the position on the printed circuit board (5) indicated by the X and Y mounting position data is moved to the center of the screen of the monitor (41) by moving the XY table (1). The part ID “C453” is displayed on the screen of the monitor (41).
Since the part data of “2” is shown in FIG. 12, the RAM is based on the X size and the Y size, and based on the fact that the mounting position data of the θ angle in step “002” is “θ2”. The graphic data of the component outline is written in (31), and the image shown in FIG. 13 is displayed.

This graphic graphic is a graphic graphic whose longitudinal direction is rotated counterclockwise around the center of the screen at an angle "θ2" with respect to the X axis of the screen, and the part (4) is rotated at an angle "θ2". It is the external shape when it is. Then, “θ2” is stored in the θ-direction position memory (64).

Next, the operator determines that the graphic figure is shifted from the pattern image by an angle,
Press the cursor key (48) while holding down the ET key (53). Then, the graphic figure rotates counterclockwise in FIG. 13 around the center of the screen. Thus, the graphic figure is rotated to the position shown in FIG. 14, and the pressing of the SET key (53) and the cursor key (48) is stopped. If it is turned too much, the SET key (53) and the cursor key (49) may be pushed and turned clockwise to stop at the position shown in FIG.

This rotation is performed by the graphic RAM (31).
May be rewritten to, for example, data rotated once at appropriate time intervals in units of one degree.

The .theta.-direction position memory (64) stores ".theta.2", which is the mounting position data of the .theta. Angle, and the contents are stored every time the RAM (31) is modified while the figure is rotated. , The rotation angle of the longitudinal direction with respect to the X axis is updated.

Then, at the position shown in FIG. 14, the operation key (59)
Is pressed and the content of the memory (64) is “θ2 + Δθ”, the CPU (25) changes the mounting position data of the θ angle of the NC data step “002” in the RAM (26) to “θ2 + Δθ”. . At this time, the X and Y mounting position data are not changed.

Next, the CPU (25) reads the step "003" of the NC data, and similarly performs the checking and correcting operation of the mounting position data. Step "001"
In the step 002, only the θ angle is changed. However, if all of the XY and θ angles are shifted, the cursor keys (48) to (51) and the SET key are set as described above. By pressing (53) to move the XY table (1) and rotate the graphic figure, the pattern and the figure may be matched.

Next, the operator presses the automatic key (73) to set the component mounting apparatus in the automatic operation mode, and presses the start key (75).
The automatic operation of the component mounting apparatus is performed by pressing.

First, the printed circuit board (5) is carried in from an upstream device (not shown), and is positioned and fixed at a predetermined position on the XY table (1) in the same manner as described above, and the positioning mark (22) is set in the same manner as described above. It is recognized by the recognition camera (19). Thus, even if the position of the pattern including the mark (22) changes with respect to the outer shape of the substrate (5), if the positional relationship between the mark (22) and the pattern is the same, the NC data corrected as described above will Can be used. In addition, if the board (5) on which the component is to be mounted expands and contracts at a uniform expansion and contraction rate with respect to the board (5) whose NC data has been corrected, the expansion and contraction rates are recognized based on recognition of the two-point mark (22). Is calculated, the NC data is corrected, and the component (4) can be mounted.

Next, the head (13) is positioned at the suction station, and the component (4) is suctioned by the suction nozzle (12). Next, when the head (13) reaches the recognition station, the nozzle (12) by the camera (14).
The position of the component (4) to be sucked is recognized.

Next, the head (13) moves to the angle correction station, and the nozzle (12) is rotated by the rotation of the nozzle rotation roller (15) based on the recognition result at the recognition station.
Is rotated to correct the angle of the component (4).

Next, when the head (13) reaches the mounting station, the XY table (1) rotates the X-axis motor (2) and the Y-axis motor (3) to correct the position of the recognition result at the recognition station. Is moved in the XY directions by an amount corresponding to the addition of the chip component (4), and the chip component (4) is mounted at a predetermined position in the XY directions and the θ rotation direction indicated by the NC data on the printed circuit board (5) on the table (1). .

Thereafter, the same operation is performed for each head (13).

When the mounting of the component (4) on one printed board (5) is completed, the board (5) is discharged to a downstream device (not shown), and the next board (5) is placed on the XY table (1). The positioning mark (22) is recognized and the component (4) is mounted.

Thereafter, the components (4) are mounted on the printed circuit board (5) one after another in the same manner.

In the present embodiment, the graphic displayed on the monitor (41) is superimposed on the image of the printed circuit board (5). In the case where the part protrudes outside the mold, the size of the part of the mold may be stored as the part size of the part data of the part. In this case, an outline drawing of the mold may be displayed. Further, a graphic indicating the position of the lead wire of the component (4) may be used, or an outline drawing of a pattern to which the lead wire of the component (4) is soldered may be used as a graphic graphic.

Further, in the present embodiment, when the installation position data of the original NC data is different from the aligned position, the NC data is changed to the aligned position.
The NC data itself may not be changed, and may be stored in the RAM (26) as correction data for each mounting position data in each step of the NC data.

Further, in this embodiment, the movement of the graphic figure in the screen in the XY directions with respect to the image on the printed circuit board (5) is performed by moving the XY table (1), and the movement in the θ rotation direction is the rotation of the graphic figure itself. Was done by
Regarding the movement in the XY directions, the camera (19) may be configured to be movable in the XY directions,
The AM (31) may be moved while being rewritten, or the XY table (1) may be rotated in the θ direction by placing the XY table (1) on a table that rotates in the θ direction. Or the camera (19) may be configured to be rotatable in the θ direction.

Further, the present invention is applicable to a case where the same pattern is present at the same position in each lot even when the printed circuit board (5) does not expand and contract uniformly and changes in expansion and contraction for each part of the substrate (5). Then, if the NC data is corrected for one of the lots as in this embodiment, the NC data can be used for the substrate (5) in the same lot.

Further, if the positional relationship between the outer shape of the positioned substrate and the pattern does not change and the expansion and contraction of the substrate can be ignored,
There is no need to recognize the positioning mark (22).

Further, in the present embodiment, the NC data that has already been created is confirmed and corrected, but it may be used to create the NC data from the beginning while assigning step numbers.

[0065]

As described above, according to the present invention, in the screen of the display means, the figure drawn by the drawing means coincides only with the predetermined position in the XY directions and the .theta. Since the component mounting position data in the XY direction and the θ rotation direction are stored, the component mounting position data can be easily created.

[Brief description of the drawings]

FIG. 1 is a control block diagram of the present invention.

FIG. 2 is a plan view of a component mounting apparatus to which the present invention is applied.

FIG. 3 is an overall perspective view of the same device.

FIG. 4 is a perspective view of a main part of the device.

FIG. 5 is a diagram showing NC data.

FIG. 6 is a diagram showing part data.

FIG. 7 is a diagram showing a screen for mode selection.

FIG. 8 is a diagram showing a screen for selecting a substrate type.

FIG. 9 is a diagram of a screen indicating that the eye is being matched.

FIG. 10 is a diagram showing a screen of a monitor for alignment.

FIG. 11 is a diagram showing a screen of a monitor for alignment.

FIG. 12 is a diagram showing a screen indicating that a match is being made;

FIG. 13 is a diagram showing a screen of a monitor for alignment.

FIG. 14 is a diagram showing a screen of a monitor for alignment.

[Explanation of symbols]

(1) XY table (moving means) (4) Chip-shaped electronic component (chip component) (5) Printed circuit board (12) Suction nozzle (19) Board recognition camera (imaging means) (25) CPU (drawing means) (moving) Means) (26) RAM (storage means) (31) Graphic RAM (drawing means) (moving means) (41) Monitor (display means)

Claims (1)

(57) [Claims] An image pickup means for picking up an image of a component mounting surface of a printed circuit board in a component mounting position data generating apparatus for generating component mounting position data indicating a position on a printed circuit board where a chip component picked up by a suction nozzle is to be mounted. Drawing means for drawing a figure representing a component to be mounted, display means for superimposing a figure drawn by the drawing means and an image taken by the imaging means on a screen, and a figure drawn by the drawing means. A moving means for moving the captured image so as to relatively move in the XY direction and the θ rotation direction on the screen; and moving the figure by the movement of the moving means in the XY direction and the θ rotation direction on the printed circuit board. Storage means for storing, as the component mounting position data, the position moved by the moving means in the XY direction and the θ rotation direction when the position is matched. Device for creating component mounting position data.