JP2702330B2 - Semiconductor device manufacturing equipment - Google Patents
Semiconductor device manufacturing equipmentInfo
- Publication number
- JP2702330B2 JP2702330B2 JP24225691A JP24225691A JP2702330B2 JP 2702330 B2 JP2702330 B2 JP 2702330B2 JP 24225691 A JP24225691 A JP 24225691A JP 24225691 A JP24225691 A JP 24225691A JP 2702330 B2 JP2702330 B2 JP 2702330B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- tape
- ultraviolet
- individual semiconductor
- suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
Landscapes
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は半導体装置の製造装置に
かかり、とくに個片の半導体素子を配列した貼り付けテ
ープから半導体素子を突き上がることによってはがす、
突き上げ方式の装置でダイボンダー内に用いる製造装置
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing apparatus, and more particularly, to a semiconductor device which is peeled off by sticking up a semiconductor element from an adhesive tape on which individual semiconductor elements are arranged.
The present invention relates to a manufacturing apparatus used in a die bonder as a thrust-type apparatus.
【０００２】[0002]
【従来の技術】従来のかかる装置は図３に示す様に、個
片半導体素子１を吸着する吸着針２と、個片半導体素子
１を突き上げる突き上げ針１２と、個片半導体素子１を
配列している貼り付けテープ１３と、テープ吸着孔５が
付いた突き上げステージ６とを有している。この貼り付
けテープ１３はエンビ系の母剤表面にポリオレフィン系
の粘着剤を形成しこれにより半導体素子を接着してい
る。2. Description of the Related Art As shown in FIG. 3, a conventional apparatus comprises an attraction needle 2 for adsorbing an individual semiconductor element 1, a push-up needle 12 for pushing up the individual semiconductor element 1, and an arrangement of the individual semiconductor elements 1. And a push-up stage 6 provided with a tape suction hole 5. The adhesive tape 13 forms a polyolefin-based adhesive on the surface of an embi-based base material, thereby bonding the semiconductor elements.
【０００３】次に動作について説明する。貼り付けテー
プ１３を突き上げステージ６で突き上げ、突き上げステ
ージ６に有するテープ吸着孔５にて吸引固定し、突き上
げ針１２で個片半導体素子１を突き上げる。それと同時
に吸着ホルダー３に固定された吸着針２が降下し、先に
突き上げられた個片半導体素子の表面に接着吸着して搬
送される。Next, the operation will be described. The adhesive tape 13 is pushed up by the push-up stage 6, suction-fixed by the tape suction hole 5 of the push-up stage 6, and the individual semiconductor element 1 is pushed up by the push-up needle 12. At the same time, the suction needle 2 fixed to the suction holder 3 descends, and is adhered and adsorbed to the surface of the individual semiconductor element which has been pushed up before being conveyed.
【０００４】[0004]
【発明が解決しようとする課題】この従来の装置では個
片半導体素子が吸着針で吸着するまでに個片半導体素子
がはがれたり、配列みだれを起こさない様に個片半導体
素子配列用貼り付けテープと個片半導体素子との接着強
度を保つ必要があるため、突き上げ針での突き上げ量及
び吸着針での吸着力の管理に難しいものがあった。In this conventional apparatus, an adhesive tape for arranging individual semiconductor elements so that the individual semiconductor elements are not peeled off or the array is not broken before the individual semiconductor elements are attracted by the attraction needle. Therefore, it is difficult to control the amount of push-up with the push-up needle and the attraction force with the suction needle because it is necessary to maintain the adhesive strength between the device and the individual semiconductor element.
【０００５】また、金属製又はセラミックス製等の硬度
の高い突き上げ針で個別半導体素子の裏面を突き上げる
ため、個片半導体素子に傷，ワレ等のダメージを与える
恐れがあると言う問題点があった。Further, since the back surface of the individual semiconductor element is pushed up by a metal or ceramic push-up needle having high hardness, there is a problem that individual semiconductor elements may be damaged or cracked. .
【０００６】[0006]
【課題を解決するための手段】本発明の特徴は、個片半
導体素子が表面に貼り付けられ紫外線照射によって該半
導体素子との接着強度が減少するテープに紫外線を照射
する紫外線照射部と、前記テープの前記半導体素子が貼
り付けられた表面とは反対側の裏面より高圧空気により
該半導体素子およびテープを突き上げる突き上げ空気部
とを備えた半導体装置の製造装置である。According to the present invention, there is provided an ultraviolet irradiating section for irradiating an ultraviolet ray to a tape on which an individual semiconductor element is adhered to a surface and whose adhesive strength with the semiconductor element is reduced by the irradiation of the ultraviolet ray; An apparatus for manufacturing a semiconductor device, comprising: a push-up air portion which pushes up the semiconductor element and the tape by high-pressure air from the back surface of the tape opposite to the surface to which the semiconductor element is attached.
【０００７】この紫外線照射部は前記テープの裏面側に
備えられ該テープにその裏面側より紫外線を照射するこ
とが好ましい。この紫外線照射部に紫外線照射量を制御
する絞り環を備えることができる。[0007] The ultraviolet irradiating section is preferably provided on the back side of the tape, and irradiates the tape with ultraviolet rays from the back side. The ultraviolet irradiation unit can be provided with a stop ring for controlling the amount of ultraviolet irradiation.
【０００８】通常は、テープの表面側に吸着および搬送
手段を備えこれにより突き上げられた半導体素子を吸着
し搬送する。Usually, suction and transport means are provided on the front side of the tape to suck and transport the semiconductor element pushed up by the suction and transport means.
【０００９】[0009]
【実施例】次に本発明について図面を参照して説明す
る。図１は本発明の一実施例の縦断面図である。紫外線
照射により個片半導体素子１と個片半導体素子１との接
着強度を減少させることが出来る紫外線対応の貼り付け
テープ４にグラスファイバー製のリング状紫外線照射部
７から個片半導体素子１ケ毎の裏面方向から紫外線を照
射し、接着強度を減少させる。この貼り付けテープはエ
ンビ系の母材表面にアクリル系の粘着剤を形成し、これ
により半導体素子を接着する。紫外線の照射によりこの
アクリル系の粘着剤は固化してゆき、粘着力、接着力が
弱まってゆく。次に高圧空気発生部８で発生した高圧空
気がリング状紫外線照射部７の中央の空気針用微細孔１
０を通ることにより空気針となり個片半導体素子１を突
き上げる。吸着ホルダー３に固定されている吸着針２が
個片半導体素子１の表面まで降下し、個片半導体素子１
を吸着針２と空気針ではさみこんだ状態にする。次に貼
り付けテープ４を支持している突き上げステージ６を降
下させ、個片半導体素子１と貼り付けテープ４をはが
し、その後吸着針２は個片半導体素子１を吸着した状態
で搬送する。この時空気排気部９の排気弁を開き排気す
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is a longitudinal sectional view of one embodiment of the present invention. The bonding strength between the individual semiconductor element 1 and the individual semiconductor element 1 can be reduced by irradiating the ultraviolet light onto the ultraviolet-sensitive adhesive tape 4 from the glass fiber ring-shaped ultraviolet irradiator 7 to each individual semiconductor element. UV light is irradiated from the back side of the substrate to reduce the adhesive strength. This adhesive tape forms an acrylic pressure-sensitive adhesive on the surface of an embi-type base material, thereby bonding the semiconductor element. The irradiation of ultraviolet rays causes the acrylic pressure-sensitive adhesive to solidify, thereby weakening the adhesive strength and the adhesive strength. Next, the high-pressure air generated by the high-pressure air generating section 8 is supplied to the air needle fine hole 1 at the center of the ring-shaped ultraviolet irradiation section 7.
By passing through 0, it becomes an air needle and pushes up the individual semiconductor element 1. The suction needle 2 fixed to the suction holder 3 descends to the surface of the individual semiconductor element 1 and the individual semiconductor element 1
Is sandwiched between the suction needle 2 and the air needle. Next, the push-up stage 6 supporting the adhesive tape 4 is lowered, and the individual semiconductor element 1 and the adhesive tape 4 are peeled off. Then, the suction needle 2 conveys the individual semiconductor element 1 while adsorbing the individual semiconductor element 1. At this time, the exhaust valve of the air exhaust unit 9 is opened to exhaust air.
【００１０】図２は本発明の他の実施例で個別半導体素
子の大きさが異なっても、同一装置を使用できる様紫外
線照射面積を調整することができるように可動性の紫外
線照射面積調整用絞り環１１の付いたリング状紫外線照
射部の縦断面図である。FIG. 2 shows another embodiment of the present invention, in which a movable ultraviolet irradiation area is adjusted so that an ultraviolet irradiation area can be adjusted so that the same apparatus can be used even if the size of an individual semiconductor element is different. FIG. 4 is a longitudinal sectional view of a ring-shaped ultraviolet irradiation section provided with an aperture ring 11.
【００１１】[0011]
【発明の効果】以上説明したように本発明は個片半導体
配列用の貼り付けテープに紫外線の照射により個片半導
体素子との接着強度を減少させることが出来る紫外線対
応の貼り付けテープを使用しているため従来の様に貼り
付けの際の接着強度の大小及び、突き上げ量、吸着針の
吸着力等とのバランスをコントロールする必要がなく、
常に強い接着強度側に管理すればよい。そのため個片半
導体素子のはがれ、配列みだれが発生しにくく、又、突
き上げ時の管理も容易になる。又、突き上げ針が金属
製，セラミック製等の固体状の針でなく高圧空気による
空気針であるため個片半導体素子の裏に傷，ワレ等のダ
メージを与える問題が少なくなるという効果を有する。As described above, the present invention uses an ultraviolet-ray-compatible adhesive tape which can reduce the adhesive strength between the individual semiconductor elements by irradiating ultraviolet rays to the individual semiconductor array adhesive tape. Therefore, there is no need to control the balance between the magnitude of the bonding strength at the time of pasting, the amount of push-up, the suction force of the suction needle, etc. as in the past,
What is necessary is just to always manage on the strong adhesive strength side. For this reason, peeling of the individual semiconductor elements and array breakage are unlikely to occur, and management during pushing up becomes easy. Further, since the push-up needle is not a solid needle made of metal, ceramic or the like but an air needle using high-pressure air, there is an effect that the problem of damaging the back of the individual semiconductor element, such as scratches and cracks, is reduced.
【図１】本発明の一実施例を示す縦断面図である。FIG. 1 is a longitudinal sectional view showing one embodiment of the present invention.
【図２】本発明の他の実施例を示す縦断面図である。FIG. 2 is a longitudinal sectional view showing another embodiment of the present invention.
【図３】従来技術による突き上げ方式の装置を示す縦断
面図である。FIG. 3 is a longitudinal sectional view showing a conventional push-up type device.
１ 個片半導体素子 ２ 吸着針 ３ 吸着針ホルダー ４ 紫外線対応貼り付けテープ ５ 貼り付けテープ吸着孔 ６ 突き上げステージ ７ リング状紫外線照射部 ８ 高圧空気発生部 ９ 空気排気部 １０ 空気針用微細孔 １１ 紫外線照射面積調整用絞り環 １２ 突き上げ針 REFERENCE SIGNS LIST 1 piece semiconductor element 2 suction needle 3 suction needle holder 4 UV-sensitive adhesive tape 5 adhesive tape suction hole 6 push-up stage 7 ring-shaped UV irradiation section 8 high-pressure air generation section 9 air exhaust section 10 fine hole for air needle 11 UV Aperture ring for irradiation area adjustment 12 Push-up needle
Claims (4)
外線照射によって該半導体素子との接着強度が減少する
テープに紫外線を照射する紫外線照射部と、前記テープ
の前記半導体素子が貼り付けられた表面とは反対側の裏
面より高圧空気により該半導体素子およびテープを突き
上げる突き上げ空気部とを備えたことを特徴とする半導
体装置の製造装置。1. An ultraviolet irradiator for irradiating an ultraviolet ray to a tape on which an individual semiconductor element is stuck on the surface and whose adhesive strength with the semiconductor element is reduced by the irradiation of the ultraviolet ray, and the semiconductor element of the tape is stuck. An apparatus for manufacturing a semiconductor device, comprising: a push-up air portion that pushes up the semiconductor element and the tape by high-pressure air from a back surface opposite to the front surface.
に備えられ該テープにその裏面側より紫外線を照射する
ようにした請求項１の製造装置。2. The apparatus according to claim 1, wherein said ultraviolet irradiation section is provided on a back side of said tape, and irradiates said tape with ultraviolet rays from said back side.
絞り環を備えている請求項１又は請求項２の製造装置。3. The manufacturing apparatus according to claim 1, wherein the ultraviolet irradiation unit includes an aperture ring for controlling the amount of ultraviolet light.
段を備えこれにより突き上げられた半導体素子を吸着し
搬送するようにした請求項１、請求項２又は請求項３の
製造装置。4. The manufacturing apparatus according to claim 1, further comprising suction and transport means on the front side of the tape, wherein the semiconductor element protruded by the suction and transport means is sucked and transported.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24225691A JP2702330B2 (en) | 1991-09-24 | 1991-09-24 | Semiconductor device manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24225691A JP2702330B2 (en) | 1991-09-24 | 1991-09-24 | Semiconductor device manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0582566A JPH0582566A (en) | 1993-04-02 |
| JP2702330B2 true JP2702330B2 (en) | 1998-01-21 |
Family
ID=17086565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24225691A Expired - Fee Related JP2702330B2 (en) | 1991-09-24 | 1991-09-24 | Semiconductor device manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2702330B2 (en) |
-
1991
- 1991-09-24 JP JP24225691A patent/JP2702330B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0582566A (en) | 1993-04-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19970819 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |