JP2698741B2 - Chemical valve with temperature adjustment circuit - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chemical liquid valve for controlling a flow of a chemical liquid used in a semiconductor manufacturing apparatus and the like.
More specifically, the present invention relates to a chemical liquid valve with a temperature adjusting circuit capable of supplying a chemical liquid at a constant temperature.

[0002]

2. Description of the Related Art Conventionally, in a semiconductor manufacturing process or the like, a chemical valve has been used to control the transport of corrosive chemicals and the like. In this case, in order to prevent corrosion due to the chemical solution, the body of the chemical solution valve with which the chemical solution contacts is made of SUS. Here, the chemical solution is used in a lithography process or the like in a semiconductor manufacturing process and chemically reacts with a substance on a wafer, so that the temperature needs to be kept constant. In recent years, with the increase in the degree of integration of semiconductors, the temperature adjustment of a chemical solution has higher accuracy than before, for example, ± 0.1 with respect to a set temperature of 30 degrees.
Degree is required.

[0003] The temperature of the chemical is controlled in the chemical pipe section before and after the chemical valve, but in order to prevent the temperature of the chemical stopped at the chemical valve from dropping, the temperature of the chemical in the chemical valve must be maintained. Was a problem.

For this reason, as shown in FIG. 5, a hollow metal block 3 is closely attached to the periphery of the body 1 of the chemical liquid valve, and the temperature regulating water W is supplied to the hollow portion 6 of the block by the hot water pipe 4. Therefore, the entire body of the chemical liquid valve is warmed to keep the temperature of the chemical liquid F constant. Here, the chemical solution F is
The liquid flows into an input port formed in the body 1 of the chemical liquid valve by the chemical liquid inflow pipe 5, and flows out of an output port formed in the body 1 of the chemical liquid valve by the chemical liquid output pipe 7.

Since the iron constituting the block 3 and the heat conductivity of the SUS constituting the body 1 of the chemical valve are high, the heat of the temperature control water W in the hollow portion 6 quickly heats the body 1 and keeps the chemical F constant. Can be kept warm to temperature.

[0006]

However, in recent years,
Due to the diversification of types of corrosive chemicals and the demand for higher precision in the lithography process, etc. due to the higher integration of semiconductors, the adhesion occurs during body cutting when SUS is used for the body of the chemical valve. Contamination of chemicals by dust and particles has become a problem. For this reason, a body integrally formed of a corrosion-resistant resin, for example, PFA has been used.

[0007] Even when a resin is used for the body 1 of the chemical valve, the chemical 3 is heated by the temperature control water W flowing through the hollow portion 6 by closely contacting the block 3 with the outside of the body 1 as in the conventional case. I was However, since the thermal conductivity of the resin is extremely low as compared with SUS, the chemical solution is added by ± 0.1.
It was difficult to control the temperature with a degree of accuracy. In particular, immediately after the chemical solution valve shuts off the flow of the chemical solution for a long time, the temperature of the chemical solution is greatly reduced, which adversely affects the semiconductor manufacturing process and reduces the yield of semiconductor products.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and can reduce the temperature change of a chemical solution flowing inside even when a corrosion-resistant resin is used for the body of a chemical solution valve. The purpose is to supply a simple chemical valve.

[0009]

In order to achieve this object, a chemical liquid valve with a temperature control circuit according to the present invention comprises an input port into which a fluid flows, an output port from which a fluid flows, and an output port from the input port. A fluid passage that communicates with the fluid passage, and a valve body that is opened and closed by a diaphragm on the fluid passage that is driven by the pressure of the working gas, and that switches a communication between the input port and the output port. And a body forming the output port and the fluid passage is formed of resin, and the body has a temperature adjustment circuit in which a fluid for temperature adjustment flows near the fluid passage.

[0010]

A fluid such as a chemical liquid flowing from an input port formed in the body of the chemical liquid valve with a temperature adjusting circuit according to the present invention having the above-described structure flows out of an output port through a fluid passage. In addition, a fluid passage communicating the input port with the output port, and a valve element that is opened and closed by a diaphragm on the fluid passage driven by the pressure of the working gas switches the communication between the input port and the output port. The temperature control circuit of the body, in which the input port, the output port, and the fluid passage are integrally formed of resin, is supplied with temperature-regulated water to keep the fluid flowing through the input port, the fluid passage, and the output port at a constant temperature. I have.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A chemical liquid valve with a temperature adjusting circuit according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing a configuration of a chemical liquid valve 11 with a temperature adjusting circuit according to an embodiment of the present invention.

The chemical liquid valve 11 comprises an upper half valve body driving section 40 and a lower half body, ie, a valve body 41. At the center of the valve body drive section 40, a piston rod 32 for fixing and holding the valve body 20 is provided slidably up and down. The return spring 26 is provided on the upper surface of the piston rod 32.
Are attached so as to urge the piston rod 32 downward. The space in which the return spring 26 is attached is closed to form a cylinder upper chamber 36. The cylinder upper chamber 36 is provided with an upper port 25 for compressed air.

A lower cylinder chamber 35 is formed below the cylinder. The cylinder lower chamber 35 is provided with a lower port 34 for compressed air. A diaphragm 21 is attached around the valve body 20 to prevent the chemical solution F from leaking. The valve element 20 is in contact with the valve seat 22 when the piston rod 32 is on the lower side.

Next, the anti-dripping valve 12 provided on the right side of the chemical liquid valve 11 with a temperature adjusting circuit will be described.
The liquid dripping prevention valve 12 sucks a small amount of the chemical solution to prevent the chemical solution F from dripping onto the wafer in the semiconductor manufacturing process when the chemical solution valve 11 shuts off the flow of the chemical solution F, so that the chemical solution F slightly flows from the tip of the supply nozzle. It is a valve that performs the function of being retracted. The body of the anti-dripping valve 12 is integrated with the body of the chemical liquid valve 11 to form a valve body 41.

The anti-dripping valve 12 is provided with a piston rod 37 for fixing and holding the valve element 23 slidably up and down. The return spring 28 is attached to the lower surface of the piston rod 37 so as to urge the piston rod 37 upward. The space in which the return spring 28 is attached is closed to form a cylinder lower chamber 39. The cylinder lower chamber 39 is provided with a lower port 38 for compressed air.

An upper cylinder chamber 33 is formed above the cylinder. The cylinder upper chamber 33 is provided with an upper port 30 for compressed air. A diaphragm 24 is attached around the valve body 23 to prevent the chemical solution F from leaking.

Next, the valve body 4 which is the body of the chemical liquid valve 11
1 will be described. In the present embodiment, a valve body 41 which is a body of the chemical liquid valve 11 is formed integrally with a body of the anti-dripping valve 12. The valve body 41 has an input port 1
8, a fluid passage 29 and an output port 19 are formed, and a valve seat 22 for communicating both ports is provided.

Next, the temperature adjusting circuit 17 for keeping the temperature of the chemical solution F flowing in the valve body 41 constant will be described. Temperature control blocks 13 and 14 for forming the temperature control circuit 17 are provided below the valve body 41. The valve body 41 is manufactured by integral molding of a resin, and the temperature adjustment circuit 17 through which the temperature regulating water W flows near the input port 18, the fluid passage 29, and the output port 19 through which the chemical solution flows.
a, 17b and 17c are formed. In addition, FIG.
As shown in the A sectional view and the BB sectional view of FIG.
2, the temperature adjustment circuits 17d, 17e, 17f,
17 g are formed.

A temperature control water input port 15 and a temperature control water output port 16 communicate with the temperature control circuit 17. These temperature adjusting circuits 17 are for heating the chemical solution F by flowing the temperature-regulated water W inside, and also reduce the amount of resin used when the valve body 41 is molded with resin, thereby reducing the cost. Plays.

Next, the temperature adjustment circuit 17 having the above configuration
The operation of will be described. From the temperature control water input port 15, temperature control water is supplied in order to quickly and quickly reach a temperature at which the chemical solution F is slightly offset from 30 degrees. The temperature adjusting circuit 17 is located near the input port 18, the fluid passage 29, and the output port 19, which are the passages of the chemical solution F, and the temperature regulating water warms the chemical solution F via the resin wall of the valve body 41.

The temperature of the chemical F is measured by a thermometer (not shown), and the temperature of the chemical F is maintained at 30 ° C. by adjusting the temperature of the temperature regulating water by a feedback circuit. According to the temperature adjustment circuit 17 of the present embodiment, the temperature adjustment circuit 17 includes the input port 18 which is a passage for the chemical solution F,
Since it is located in the vicinity of the fluid passage 29 and the output port 19, the temperature of the chemical solution F can be quickly controlled.
The temperature of the chemical solution F can be accurately adjusted.

Referring to FIG. 4, the effect of the temperature adjusting circuit of this embodiment will be described with experimental values. The experimental values are obtained by measuring how the temperature of the chemical solution F decreases over time under various conditions in a state in which the chemical solution F of 30 degrees is left inside the valve body 41 of the chemical solution valve. is there. The reason why such an experiment was performed is that the temperature drop of the chemical solution F is a significant problem in the semiconductor process because the supply of the chemical solution F has been stopped for a long time.

A shows the result of the chemical liquid valve with the temperature control circuit using the PFA resin body of this embodiment. B shows the result when the temperature adjustment circuit shown in FIG. 5 is used using the SUS body as described in the prior art. Also, SU
C shows the result when the temperature adjustment circuit was not used with the S body. D shows the results when the temperature adjustment circuit was not used using the PFA resin body.

As shown by the experimental results, according to the chemical liquid valve with the temperature adjusting circuit of the present embodiment, even if the use of the chemical liquid F is stopped for 5 minutes or more, the temperature of the chemical liquid F is always kept at 30 degrees plus or minus 0. It can be maintained within a range of once. Further, in the chemical liquid valve of the present embodiment, since an integrally molded product of resin is used for the valve body 41, compared with a SUS machined body,
The generation of impurities and particles is small, the semiconductor process is not adversely affected, and the yield of semiconductor products can be increased.

Next, the operation of the chemical liquid valve having the above configuration will be described. FIG. 1 shows a cylinder upper chamber 36 of the chemical liquid valve 11.
3 shows a state in which compressed air is flowing. The piston rod 32 is urged downward by applying a downward urging force by the return spring 26, and the valve body 20 is in contact with the valve seat 22. Thus, the input port 18 and the output port 19 are not in communication.

On the other hand, when supplying the chemical solution F to the semiconductor manufacturing process, the air to the cylinder upper chamber 36 is shut off, and the compressed air flows to the cylinder lower chamber 35. Since the force by which the compressed air pushes the piston rod 32 upward is stronger than the spring force of the return spring 26, the piston rod 32 moves upward. As a result, the valve element 20 is separated from the valve seat 22, and the input port 18 and the output port 19 communicate with each other.

Next, when shutting off the supply of the chemical solution F to the semiconductor manufacturing process, the air to the lower cylinder chamber 35 is shut off, and the compressed air flows into the upper cylinder chamber 36. Then, the piston rod 32 moves downward. As a result, the valve body 20 comes into contact with the valve seat 22, and the input port 18 and the output port 19 are shut off.

When the chemical solution F is shut off, the chemical solution F often remains in the form of droplets at the tip of the nozzle that supplies the chemical solution F to the semiconductor manufacturing process. If this is left as it is, there is a risk that droplets of the chemical solution F may fall when the chemical solution F must not be supplied. In the present embodiment, in order to prevent the fear, when the chemical solution F is shut off by the chemical solution valve 11, the compressed air flows into the cylinder lower chamber 39 of the anti-drip valve to move the valve body 23 and the diaphragm 24 upward. And the chemical solution F is sucked into the nozzle.

Thus, it is possible to prevent the chemical solution F from dropping from the nozzle of the chemical solution F when it is unnecessary.

As described above, according to the chemical liquid valve with the temperature adjusting circuit of the present invention, the predetermined temperature of the chemical liquid F can be accurately maintained. Further, the temperature of the chemical solution can be quickly adjusted to a predetermined temperature. In addition, the generation of impurities and particles is smaller than that of a SUS machined body.

In the present embodiment, the chemical liquid valve has been described. However, the present invention can be used not only for the chemical liquid but also for all fluid valves such as chemical gas. Further, it can be used not only in the lithography process but also in the wet process. It can also be used as a means for preventing dew condensation.

[0032]

As is apparent from the above description, according to the chemical liquid valve with the temperature adjusting circuit of the present invention, the body forming the input port, the output port, and the fluid passage is formed of resin and the body is formed. Has a temperature control circuit in which a fluid for temperature control flows near the fluid passage, so that the predetermined temperature of the chemical solution F can be accurately maintained at the same time.
Since the generation of impurities and particles is less than that of a machined US body, the yield of semiconductor products can be increased without affecting the semiconductor process.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a configuration of a chemical liquid valve according to an embodiment of the present invention.

FIG. 2 is a sectional view showing an AA section of the chemical liquid valve shown in FIG.

FIG. 3 is a sectional view showing a section BB of the chemical liquid valve shown in FIG. 1;

FIG. 4 is a data diagram showing a temperature drop of a chemical solution remaining in a chemical solution valve.

FIG. 5 is a perspective view showing a configuration of a conventional temperature adjusting circuit of a chemical liquid valve.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Chemical liquid valve 12 Anti-dripping valve 13 Temperature control block 14 Temperature control block 15 Temperature control water input port 16 Temperature control water output port 17 Temperature control circuit 18 Input port 19 Output port 20 Valve 21 Diaphragm 22 Valve seat 26 Return spring 29 Fluid passage 32 Piston rod 35 Cylinder lower chamber 36 Cylinder upper chamber 40 Valve drive unit 41 Valve body

 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shigeru Osugi 850 Horinouchi-cho, Kasugai-shi, Aichi CKD Co., Ltd. (56) References JP-A-60-237272 (JP, A) Jpn. JP, U)

Claims (1)

(57) [Claims] 1. An input port through which a fluid flows, an output port through which a fluid flows out, a fluid passage communicating between the input port and the output port, and a diaphragm on the fluid passage and driven by the pressure of a working gas. Wherein the body forming the input port, the output port, and the fluid passage is formed of resin, and the body is formed of a resin, and the valve is opened and closed by the valve to switch the communication between the input port and the output port. A chemical liquid valve with a temperature adjustment circuit, wherein the body has a temperature adjustment circuit in which a fluid for temperature adjustment flows near the fluid passage.