JPH0571130B2 - - Google Patents
Info
- Publication number
- JPH0571130B2 JPH0571130B2 JP61023036A JP2303686A JPH0571130B2 JP H0571130 B2 JPH0571130 B2 JP H0571130B2 JP 61023036 A JP61023036 A JP 61023036A JP 2303686 A JP2303686 A JP 2303686A JP H0571130 B2 JPH0571130 B2 JP H0571130B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- chemical
- supply tank
- liquid
- chemical solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000126 substance Substances 0.000 claims description 64
- 238000000034 method Methods 0.000 claims description 47
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000012545 processing Methods 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 11
- 238000012993 chemical processing Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 description 44
- 239000000243 solution Substances 0.000 description 16
- 239000003507 refrigerant Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- IRPGOXJVTQTAAN-UHFFFAOYSA-N 2,2,3,3,3-pentafluoropropanal Chemical compound FC(F)(F)C(F)(F)C=O IRPGOXJVTQTAAN-UHFFFAOYSA-N 0.000 description 1
- KLZUFWVZNOTSEM-UHFFFAOYSA-K Aluminum fluoride Inorganic materials F[Al](F)F KLZUFWVZNOTSEM-UHFFFAOYSA-K 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
- Weting (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は半導体等の電子材料や精密機器部品等
の薬液処理工程に用いられる各種薬液の供給方法
に関し、さらに詳しくは、薬液処理工程に供給す
る薬液を予め薬液処理工程で使用される温度に連
続的に精度良く調節したのち、薬液処理工程に供
給する半導体製造用薬液の供給方法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for supplying various chemical solutions used in chemical treatment processes for electronic materials such as semiconductors, precision equipment parts, etc. The present invention relates to a method for supplying a chemical liquid for semiconductor manufacturing, in which the temperature of a chemical liquid for semiconductor manufacturing is adjusted in advance to the temperature used in the chemical liquid processing process continuously and accurately, and then supplied to the chemical liquid processing process.
従来の技術
集積回路、トランジスターの微細加工技術の進
歩は目覚ましいものがある。その製造に使用され
る各種薬液はレジストパターン形成の現像、酸化
膜シリコン、アルミニウム等のエツチング、ウエ
ハーの洗浄等に用いられ、その薬液処理工程にお
ける処理条件は製品の歩留り、信頼性に直接影響
することから、厳密に制御されており、特に処理
工程での温度調節が重要となる。例えば、半導体
処理工程で行なわれるレジストパターンの形成に
おいて、特にノボラツク系ポジ型レジストの有機
アルカリ系現像液の温度が現像時に変化すると、
所定のパターンを安定して形成することができな
いといつた問題があつたり、シリコンウエハー上
の酸化膜の厚み調整に用いるフツ酸及びフツ化ア
ルミニウム水溶液の温度がエツチング時に変化す
ると所定の酸化膜を精度良く形成することができ
ないといつた問題がある。Conventional Technology Advances in microfabrication technology for integrated circuits and transistors have been remarkable. The various chemical solutions used in its manufacturing are used for developing resist patterns, etching silicon oxide films, aluminum, etc., cleaning wafers, etc., and the processing conditions in the chemical processing process directly affect the yield and reliability of the product. Therefore, it is strictly controlled, and temperature control in the treatment process is especially important. For example, when forming a resist pattern in a semiconductor processing process, if the temperature of an organic alkaline developer for a novolak positive resist changes during development,
There are problems such as the inability to stably form a predetermined pattern, and if the temperature of the hydrofluoric acid and aluminum fluoride aqueous solution used to adjust the thickness of the oxide film on the silicon wafer changes during etching, the predetermined oxide film may be formed. There is a problem in that it cannot be formed with high precision.
このため、薬液処理工程に供給される薬液を所
定の温度に精度良く調節して、変動なく随時に供
給することができることは半導体製造において安
定した製品を製造することができると共に、薬液
処理工程を連続的に稼動させることができる生産
性の向上を図る上でも重要である。 For this reason, being able to accurately adjust the temperature of the chemical supplied to the chemical processing process and supplying it at any time without fluctuation allows for the production of stable products in semiconductor manufacturing, as well as the ability to control the chemical processing process. This is also important for improving productivity by allowing continuous operation.
従来、薬液処理工程での温度調節方法として薬
液処理工程内の作業用槽に薬液を投入した後、槽
内で温度調節をする方法や、薬液処理工程に供給
する前工程として温度調節用の供給槽を設けて温
度調節された薬液を供給する方法が採られてい
る。前者の方法では薬液処理工程で温度調節を行
なうという時間的な無駄を生じ、後者の場合は供
給槽の薬液が減少し所定温度と温度差の大きな薬
液が補給されると、供給槽内の温度が変動して、
所定の温度に供給槽の薬液温度を復帰させるため
に、継続または連続的に行なう薬液処理工程への
供給を一旦停止しなければならないという不都合
が生じる。 Conventionally, as a temperature control method in the chemical liquid treatment process, there has been a method in which the temperature is adjusted in the tank after the chemical liquid is put into the working tank in the chemical liquid treatment process, and a method in which the temperature is adjusted as a pre-process for supplying the chemical liquid to the chemical liquid treatment process. A method is adopted in which a tank is provided and a temperature-controlled chemical solution is supplied. In the former method, there is a waste of time in adjusting the temperature during the chemical treatment process, and in the latter case, when the chemical in the supply tank decreases and a chemical with a large temperature difference from the predetermined temperature is replenished, the temperature in the supply tank increases. fluctuates,
In order to restore the temperature of the chemical solution in the supply tank to a predetermined temperature, there arises an inconvenience that the supply to the continuous or continuous chemical treatment process must be temporarily stopped.
発明が解決しようとする問題点
そこで、発明者らは、前記問題点を解決すべく
鋭意研究の結果、薬液処理工程に継続的及び連続
的に精度良く調節して行なうと共に、薬液処理工
程への供給を随時に行なうことができる半導体製
造用薬液の供給方法を見い出し、本発明を完成す
るに到つた。Problems to be Solved by the Invention Therefore, as a result of intensive research in order to solve the above-mentioned problems, the inventors have made continuous and continuous adjustments to the chemical treatment process with high accuracy, and have developed a new technology to improve the chemical treatment process. The present inventors have discovered a method for supplying chemical solutions for semiconductor manufacturing that can be supplied at any time, and have completed the present invention.
問題点を解決するための手段及び作用
本発明のかかる目的は、半導体製造用薬液処理
工程に薬液を供給するに際し、予め薬液を熱交換
器を通して、処理工程所定温度を目標として薬液
温度を調節すると共に薬液供給槽中の薬液量が一
定範囲内に維持される如く送液し、前記薬液供給
槽中で処理工程所定温度に精度制御することを特
徴とする半導体製造用薬液の供給方法によつて達
成することができる。Means and Effects for Solving the Problems It is an object of the present invention to, when supplying a chemical solution to a chemical treatment process for semiconductor manufacturing, pass the chemical liquid through a heat exchanger in advance to adjust the temperature of the chemical liquid to a predetermined temperature in the treatment process. A method for supplying a chemical solution for semiconductor manufacturing, characterized in that the amount of the chemical solution in the chemical solution supply tank is maintained within a certain range, and the temperature in the chemical solution supply tank is precisely controlled to a predetermined temperature for the processing process. can be achieved.
ここで、「薬液を熱交換器を通して、処理工程
所定温度を目標として薬液温度を調節する」とは
熱交換器による調節温度を処理工程所定温度に設
定するが、供給すべき薬液の温度、薬液処理工程
での使用に従つて送液すべき薬液の薬液流量には
変動があり、かつ熱交換器の伝熱面積等にも限度
があるので、設定温度と等しい温度に熱交換させ
ることがでいない場合がある。おおよそ設定温度
に近い温度になれば良いという意味である。 Here, "adjusting the temperature of the chemical solution by passing the chemical solution through a heat exchanger, aiming at a predetermined temperature in the treatment process" means that the temperature adjusted by the heat exchanger is set to the predetermined temperature in the treatment process, but the temperature of the chemical solution to be supplied, The flow rate of the chemical to be delivered varies depending on its use in the treatment process, and there are limits to the heat transfer area of the heat exchanger, so it is not possible to exchange heat to the same temperature as the set temperature. There may be no. This means that the temperature should be approximately close to the set temperature.
即ち、予め熱交換器で薬液を所定温度を目標と
して大雑把に温度調節して薬液供給槽に送液する
と共に、薬液供給槽内の液量を所定量範囲内に維
持することにより、薬液供給槽において精密な温
度制御を行ない、かつ所定温度に復帰させるため
の待ち時間を解消せしめるものである。 That is, by roughly adjusting the temperature of the chemical liquid in advance to a predetermined temperature using a heat exchanger and sending the liquid to the chemical liquid supply tank, and by maintaining the liquid amount in the chemical liquid supply tank within a predetermined range, the chemical liquid supply tank is heated. This is to perform precise temperature control and eliminate the waiting time for returning to a predetermined temperature.
本発明方法を、具体化した装置の概略フローチ
ヤートに基いて説明すると、第１図において、貯
槽１の薬液は送液ポンプ２により熱交換器３を経
て温度調節計および液面面調節計６を備えた薬液
供給槽４に送られ、ここで所定温度に調節された
薬液は薬液処理工程５に送られる。 The method of the present invention will be explained based on a schematic flowchart of an embodiment of the apparatus. In FIG. The chemical liquid is sent to a chemical liquid supply tank 4 equipped with a chemical liquid supply tank 4, and the chemical liquid whose temperature is adjusted to a predetermined temperature is sent to a chemical liquid processing step 5.
薬液処理工程の所定温度を目標温度として温度
調節する熱交換器３は、熱媒及び冷媒を循環して
行なう円板−ドウナツツ型、欠円型、オリフイス
型及び薄型等の公知のものが使用できる。熱交換
器３を通して供給槽に送液する送液ポンプ２とし
て、一般に用いられるダイヤフラム型、ベローズ
型等のポンプが用いられる。ポンプに代え、ガス
加圧による圧送方法も用いることができる。供給
槽への送液は供給槽に設けた液面調節計６により
例えば薬液面が高液位になると送液を停止し、低
液位になると送液するように送液ポンプに作用さ
せる。供給槽はジヤケツトに温度調節用の熱媒お
よび冷媒を流す方式およびコイルを槽内に設け、
コイル内部に熱媒および冷媒を流す方式等が用い
られ、薬液温度を精度良く調節できる構造を有す
るものであれば良く、特に限定されるものではな
い。供給槽の大きさ、熱媒、冷媒の循環量、及び
供給槽中の高液面、低液面の位置は、薬液処理工
程に供給する単位時間当りの薬液量に応じて設定
することができる。 As the heat exchanger 3 that adjusts the temperature using a predetermined temperature in the chemical treatment process as a target temperature, known types such as a disk-doughnut type, a hollow circle type, an orifice type, and a thin type, which circulate heat medium and coolant, can be used. . As the liquid sending pump 2 that sends the liquid to the supply tank through the heat exchanger 3, a commonly used diaphragm type pump, bellows type pump, or the like is used. Instead of a pump, a pressure feeding method using gas pressurization can also be used. For feeding the liquid to the supply tank, a liquid level controller 6 provided in the supply tank causes the liquid sending pump to stop feeding when the chemical liquid level reaches a high liquid level, and to feed the liquid when the liquid level becomes low. The supply tank has a method of flowing heat medium and refrigerant for temperature adjustment through a jacket, and a coil is installed in the tank.
It is not particularly limited as long as it uses a method of flowing a heating medium and a refrigerant inside the coil and has a structure that allows the temperature of the chemical solution to be adjusted with high accuracy. The size of the supply tank, the circulation amount of heat medium and refrigerant, and the positions of high and low liquid levels in the supply tank can be set according to the amount of chemical solution supplied to the chemical treatment process per unit time. .
本発明における熱媒及び冷媒を用いて行なう熱
交換器及び供給槽内の薬液の温度調節は、一般に
公知の熱交換器の出口の温度及び供給槽内の温度
を検知し、熱媒及び冷媒の量を制御して行なう方
法が採られる。供給槽の薬液の温度は薬液処理装
置での処理温度に応じて設定される。 In the present invention, the temperature of the chemical solution in the heat exchanger and supply tank is controlled using a heat medium and a refrigerant by detecting the temperature at the outlet of a generally known heat exchanger and the temperature inside the supply tank. A method of controlling the amount is adopted. The temperature of the chemical liquid in the supply tank is set according to the processing temperature in the chemical liquid processing device.
発明の効果
従来の温度調節用の供給槽では、薬液量の変動
による液温の変化、所定温度への復帰に要する待
ち時間を免れることができなかつたが、本発明方
法によれば、薬液は、予め熱交換器を通して所定
温度に近い温度に調節されて供給槽に送られ、か
つ供給槽内の液量の変動は一定範囲内に抑えられ
る、従つて、熱交換器を通して送られた薬液の多
少の温度の変動は供給槽内で吸収され、しかも供
給槽中の液量の変動も一定範囲内であるため、供
給槽における精密温度調節が達成される。温度制
御の範囲は、所定温度に対し、±２℃〜±0.5℃の
範囲に保つことが可能である。Effects of the Invention In conventional temperature control supply tanks, changes in liquid temperature due to fluctuations in the amount of chemical liquid and waiting time required for the temperature to return to a predetermined temperature could not be avoided, but according to the method of the present invention, chemical liquid The temperature of the chemical liquid sent through the heat exchanger is adjusted in advance to a temperature close to a predetermined temperature before being sent to the supply tank, and fluctuations in the amount of liquid in the supply tank are suppressed within a certain range. Since some fluctuations in temperature are absorbed within the supply tank, and the fluctuations in the amount of liquid in the supply tank are also within a certain range, precise temperature control in the supply tank is achieved. The temperature control range can be maintained within the range of ±2°C to ±0.5°C with respect to the predetermined temperature.
本発明方法により、精密に温度調節された薬液
を随時、継続的または連続的に薬液処理工程に供
給することができ、半導体製造上、品質管理およ
び生産性向上に寄与するところ、多大なるものが
ある。 The method of the present invention makes it possible to continuously or continuously supply a chemical liquid with a precisely controlled temperature to the chemical liquid processing process at any time, which greatly contributes to improving quality control and productivity in semiconductor manufacturing. be.
第１図は、本発明方法を具体化した装置の概略
フローチヤートである。
１……貯槽、２……送液ポンプ、３……熱交換
器、４……供給槽、５……薬液処理工程、６……
液面調節計。
FIG. 1 is a schematic flowchart of an apparatus embodying the method of the present invention. 1... Storage tank, 2... Liquid pump, 3... Heat exchanger, 4... Supply tank, 5... Chemical treatment process, 6...
Liquid level controller.
Claims (1)
に際し、予め薬液を熱交換器を通して、処理工程
所定温度を目標として薬液温度を調節すると共に
薬液供給槽中の薬液量が一定範囲内に維持される
如く送液し、前記薬液供給槽中で処理工程所定温
度に精密制御することを特徴とする半導体製造用
薬液の供給方法。1. When supplying a chemical solution to a chemical processing process for semiconductor manufacturing, the chemical solution is passed through a heat exchanger in advance to adjust the temperature of the chemical solution with a target of a predetermined temperature for the processing process, and the amount of the chemical solution in the chemical solution supply tank is maintained within a certain range. 1. A method for supplying a chemical solution for semiconductor manufacturing, characterized in that the solution is conveyed at a certain temperature, and the temperature is precisely controlled to a predetermined temperature in the processing process in the chemical solution supply tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2303686A JPS62183123A (en) | 1986-02-06 | 1986-02-06 | Method of supplying chemical for manufacture of semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2303686A JPS62183123A (en) | 1986-02-06 | 1986-02-06 | Method of supplying chemical for manufacture of semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62183123A JPS62183123A (en) | 1987-08-11 |
| JPH0571130B2 true JPH0571130B2 (en) | 1993-10-06 |
Family
ID=12099240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2303686A Granted JPS62183123A (en) | 1986-02-06 | 1986-02-06 | Method of supplying chemical for manufacture of semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62183123A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01228533A (en) * | 1988-03-09 | 1989-09-12 | Mitsubishi Electric Corp | Liquid source controller |
| KR100505060B1 (en) * | 1998-02-11 | 2005-10-19 | 삼성전자주식회사 | Drug supply system |
| CN101940895A (en) * | 2010-09-03 | 2011-01-12 | 江苏华伦化工有限公司 | Continuous feeding system of propylene oxide |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS582425A (en) * | 1981-06-29 | 1983-01-08 | Toyota Motor Corp | Flow-passage control system in helical type suction port |
| JPS6015926A (en) * | 1983-07-08 | 1985-01-26 | Hitachi Tokyo Electronics Co Ltd | Semiconductor manufacturing device |
| JPS6016427A (en) * | 1983-07-08 | 1985-01-28 | Toshiba Corp | Oxide film etching apparatus |
| JPS6084137A (en) * | 1983-10-17 | 1985-05-13 | Nippon Zeon Co Ltd | Chemical liquid supply monitoring apparatus from hermetically closed goods-delivery can |
-
1986
- 1986-02-06 JP JP2303686A patent/JPS62183123A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS582425A (en) * | 1981-06-29 | 1983-01-08 | Toyota Motor Corp | Flow-passage control system in helical type suction port |
| JPS6015926A (en) * | 1983-07-08 | 1985-01-26 | Hitachi Tokyo Electronics Co Ltd | Semiconductor manufacturing device |
| JPS6016427A (en) * | 1983-07-08 | 1985-01-28 | Toshiba Corp | Oxide film etching apparatus |
| JPS6084137A (en) * | 1983-10-17 | 1985-05-13 | Nippon Zeon Co Ltd | Chemical liquid supply monitoring apparatus from hermetically closed goods-delivery can |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62183123A (en) | 1987-08-11 |
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