JP2683754B2 - Sample fixing plate - Google Patents
Sample fixing plateInfo
- Publication number
- JP2683754B2 JP2683754B2 JP21696788A JP21696788A JP2683754B2 JP 2683754 B2 JP2683754 B2 JP 2683754B2 JP 21696788 A JP21696788 A JP 21696788A JP 21696788 A JP21696788 A JP 21696788A JP 2683754 B2 JP2683754 B2 JP 2683754B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- sample
- case
- processing
- fixing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Details Of Measuring And Other Instruments (AREA)
- Jigs For Machine Tools (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、電子部品等の如く極めて高精度な性能が要
求される試料を加工し或いは各種物性を測定する為に載
置・固定する試料固定用プレートに関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention is a sample to be mounted / fixed in order to process or measure various physical properties of a sample such as an electronic component which requires extremely high precision performance. Regarding the fixing plate.
（従来の技術） 電子部品等の小部品について、平面に関する物性測定
（寸法測定等も含む）及び各種加工を行なう装置に於い
ては、一般的に試料又は測定子、加工用刃物などを平面
的に移動させる為の所謂Ｘ・Ｙテーブルが用いられてい
る。そして、半導体ウエハー等の電子部品の場合、極め
て高精度の加工及び測定が要求されるようになった。こ
れに伴い、斯かる試料を接触的に載置・固定するプレー
トに於いても、その高精度の平面度が長期間に亘り維持
がされ、また加工及び測定場所の雰囲気に対しても安定
していることが要求されるに至った。その為、上記プレ
ートは金属系材料から耐候性、耐摩耗性を有するセラミ
ック材料に置き換えられつつある。(Prior Art) In a device that performs physical property measurement (including dimension measurement, etc.) about a flat surface for small parts such as electronic parts and various kinds of processing, in general, a sample or a probe, a cutting tool, and the like are flat. A so-called XY table is used to move the table. In the case of electronic parts such as semiconductor wafers, extremely high precision processing and measurement have been required. As a result, even in the plate on which such a sample is placed and fixed in a contact manner, its highly accurate flatness is maintained for a long period of time, and it is stable against the atmosphere of the processing and measurement locations. Has come to be required. Therefore, the plate is being replaced by a ceramic material having weatherability and wear resistance, instead of a metal material.
ところで、上記の如く試料を固定したプレートとして
は、測定子或いは加工用工具等が一定位置に保たれてい
る場合には、別に設けた駆動装置により単独で平面上を
移動する方式、或いは別に設置されたケースに固定され
該ケースと共に平面移動するようにした方式が採用され
る。逆に測定子或いは加工用工具等が平面移動し、試料
を一定位置に固定させるようにした方式もある。いずれ
の場合も、試料を別の手段によりプレート上に供給し、
各種測定或いは加工後、プレート上から除去され、この
ような作業が繰り返しなされる。By the way, as the plate on which the sample is fixed as described above, when the tracing stylus, the processing tool, etc. are held at a fixed position, a separately provided driving device is used to move independently on a plane, or a separate plate is installed. A method is adopted in which it is fixed to the case and is moved in a plane with the case. On the other hand, there is also a system in which the probe or the processing tool is moved in a plane to fix the sample at a fixed position. In each case, the sample is applied to the plate by another means,
After various measurements or processing, it is removed from the plate, and such work is repeated.
（発明が解決しようとする課題） 上記のような測定・加工作業に於いては、試料とプレ
ート、或いはプレートとケースとの接触的相対摺動は不
可避である。その為、摺動部分での静電気の発生は避け
られず、特に電気の不導体である通常のセラミックスを
素材とした試料固定用プレートを使用した場合、プレー
トに静電気が蓄積され、プレート、ケース更には試料の
表面に微細な塵埃が付着し、後加工や測定に悪影響を及
ぼすこととなる。近年、これらの作業室は真空無塵室と
されるようになったが、残された塵埃がなお静電気によ
り吸引されて付着する為、上記悪影響を皆無とするとこ
ろまでは至っていなかった。(Problems to be Solved by the Invention) In the above-described measurement / processing work, it is inevitable that the sample and the plate, or the plate and the case, slide in contact with each other. For this reason, static electricity is unavoidable in the sliding area.In particular, when using a sample fixing plate made of normal ceramics, which is an electrical non-conductor, static electricity accumulates on the plate and Causes fine dust to adhere to the surface of the sample, which adversely affects post-processing and measurement. In recent years, these working chambers have become vacuum-free chambers, but the remaining dust is still attracted and adhered by static electricity, so that the above adverse effects have not been completely eliminated.
（発明の目的） 本発明は、静電気の蓄積を抑制して塵埃の付着を防止
し、高精度な測定或いは加工を約束する新規な試料固定
用プレートを提供せんとするものである。(Object of the Invention) An object of the present invention is to provide a novel sample fixing plate that suppresses accumulation of static electricity to prevent adhesion of dust and promises highly accurate measurement or processing.
（課題を解決する為の手段） 上記目的を達成する為の本発明の試料固定用プレート
は、電子部品等の試料を加工し或いは各種物性を測定す
る為に載置・固定するプレートであって、該プレートが
体積固有抵抗値10〜105Ω・cmの半導電性セラミックス
より成ることを特徴とするものである。(Means for Solving the Problems) The sample fixing plate of the present invention for achieving the above object is a plate for mounting and fixing a sample such as an electronic component for processing or measuring various physical properties. The plate is made of a semiconductive ceramic having a volume resistivity of 10 to 10 5 Ω · cm.
半導電性セラミックスとしては、窒化チタン或いは炭
化チタンを含有するサーメット材、酸化チタン、窒化チ
タン或いは炭化チタンを含有するアルミナセラミック
ス、炭化珪素セラミックス及び窒化珪素セラミックス等
が採用される。これらは、いずれも体積固有抵抗値が10
〜105Ω・cmであるが、10Ω・cm未満の場合は電導性が
あり電気的な障害（例えば、外部の高圧電源により悪影
響を受ける）が惹起される傾向となり、一方105Ω・cm
を超えると静電気が蓄積され易くなる。As the semiconductive ceramics, cermet materials containing titanium nitride or titanium carbide, alumina ceramics containing titanium oxide, titanium nitride or titanium carbide, silicon carbide ceramics, silicon nitride ceramics and the like are adopted. Each of these has a volume resistivity value of 10
It is ~ 10 5 Ωcm, but if it is less than 10 Ωcm, it tends to cause electrical troubles (for example, it is adversely affected by an external high-voltage power supply) and it is 10 5 Ωcm.
If it exceeds, static electricity is easily accumulated.
（作用） 上記構成の試料固定用プレートは、導電線をこれに直
接接続し、或いは前記ケース上に固定する場合はプレー
トとケースとを電気的に導通状態とし且つケースに導電
線を接続し、これら導電線をアースした上で前述の如き
試料の測定或いは加工に供せられる。この測定或いは加
工の際、試料とプレート、又はプレートとケース間での
相対摺動により静電気が発生しても、プレートが半導電
性であるから、静電気は上記導電線を経て逐次流出し、
プレートに蓄積されることがない。従って、試料、プレ
ート或いはケースの表面に塵埃が吸引付着することが著
減される。(Operation) In the sample fixing plate having the above-mentioned structure, a conductive wire is directly connected to the plate, or when fixing on the case, the plate and the case are electrically connected and the conductive wire is connected to the case, These conductive wires are grounded and then used for measuring or processing the sample as described above. During this measurement or processing, even if static electricity is generated due to relative sliding between the sample and the plate, or between the plate and the case, since the plate is semi-conductive, the static electricity sequentially flows out through the conductive wire,
It does not accumulate on the plate. Therefore, suction and adhesion of dust to the surface of the sample, plate or case is significantly reduced.
（実施例） 次に実施例について述べる。第１図は本発明プレート
の応用例を示す縦断面図である。図に於いて、符号１は
200mm角、厚さ20mmで、体積固有抵抗値が102Ω・cmの半
導電性炭化珪素セラミックスより成り、その表面には試
料固定用の板バネ11が固設されている。この板バネ11に
よりシリコンウエハー（測定若しくは加工試料）２を固
定したプレート１を、真空に保たれた装置本体（不図
示）内のケース３上に設置し、一定時間後に取り出すよ
うにした。ケース３は、正確な位置決めが出来るように
高精度に加工された当り面31が形成され、また試料を傷
付けることなく固定する為外周部からバネ32で固定する
ようになされている。更に、ケース３を上記同様の半導
電性炭化珪素セラミックス又は金属により構成し、該ケ
ース３に導電線33を接続してこれをアースした。(Example) Next, an example is described. FIG. 1 is a vertical sectional view showing an application example of the plate of the present invention. In the figure, reference numeral 1 is
It is made of semiconductive silicon carbide ceramics having a size of 200 mm square, a thickness of 20 mm, and a volume resistivity value of 10 2 Ω · cm, and a leaf spring 11 for fixing a sample is fixedly mounted on the surface thereof. The plate 1 to which the silicon wafer (measurement or processed sample) 2 was fixed by the leaf spring 11 was set on the case 3 in the apparatus main body (not shown) kept in vacuum, and taken out after a fixed time. The case 3 is formed with a contact surface 31 that is processed with high precision so that accurate positioning can be performed, and is fixed by a spring 32 from the outer peripheral portion in order to fix the sample without damaging it. Further, the case 3 is made of the same semiconductive silicon carbide ceramic or metal as described above, and a conductive wire 33 is connected to the case 3 to ground it.
而して、絶縁性セラミックスにより上記と同一大きさ
の比較用プレートを準備してこれにシリコンウエハー２
を固定し且つ上記装置内のケース３上に別途設置し、一
定時間放置後取り出し、塵埃付着量を比較した。その結
果、本発明の半導電性プレート１の場合の塵埃付着量
は、上記比較プレートの場合の1/20程度であった。Then, a comparative plate having the same size as the above is prepared by using insulating ceramics, and the silicon wafer 2
Was fixed and separately installed on the case 3 in the above apparatus, left for a certain period of time and then taken out to compare the amount of attached dust. As a result, the amount of dust attached to the semiconductive plate 1 of the present invention was about 1/20 of that of the comparative plate.
尚、上記実施例では、半導体ウエハーを加工或いは測
定する場合について述べたが、その他の高精度な性能が
要求される物品についても適用可能であることは云うま
でもない。In the above embodiments, the case of processing or measuring a semiconductor wafer has been described, but it goes without saying that the invention can also be applied to other articles requiring high-precision performance.
（発明の効果） 叙上の如く、本発明の試料固定用プレートは、半導電
性セラミックスより成るから、該プレート上に載置固定
された試料について各種物性の測定或いは加工を行なう
場合、試料とプレート、プレートとこれを保持するケー
ス間で相対的な摺動があっても、プレートには静電気が
蓄積されず、塵埃の吸引・付着が著減される。しかも、
セラミックスの特性によりプレート自体の安定性に優
れ、雰囲気条件や長期の使用に於いてもその初期の平面
度等の精度が維持される。このように、本考案のプレー
トは電子部品の如く極めて高精度が要求される測定或い
は加工に好適であり、その実用価値は高く評価されるも
のである。(Effects of the Invention) As described above, since the sample fixing plate of the present invention is made of semiconductive ceramics, when the sample fixed and mounted on the plate is measured for various physical properties or processed, Even if there is relative sliding between the plate and the plate and the case that holds the plate, static electricity is not accumulated on the plate, and suction and adhesion of dust are significantly reduced. Moreover,
The stability of the plate itself is excellent due to the characteristics of ceramics, and the accuracy of the initial flatness and the like is maintained even under atmospheric conditions and long-term use. Thus, the plate of the present invention is suitable for measurement or processing that requires extremely high precision such as electronic parts, and its practical value is highly evaluated.
第１図は本発明プレートの応用例を示す縦断面図であ
る。 （符号の説明） １……試料固定用プレート、11……板バネ、２……シリ
コンウエハー、３……ケース、31……当り面、32……バ
ネ、33……導電線。FIG. 1 is a vertical sectional view showing an application example of the plate of the present invention. (Explanation of symbols) 1 ... Plate for fixing sample, 11 ... Leaf spring, 2 ... Silicon wafer, 3 ... Case, 31 ... Contact surface, 32 ... Spring, 33 ... Conductive wire.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 鈴木 洋司 京都府京都市山科区東野北井ノ上町５番 地の22 京セラ株式会社内 (72)発明者 渡辺 信博 群馬県高崎市栄町14―１ 京セラ株式会 社高崎営業所内 (56)参考文献 特開 昭63−32948（ＪＰ，Ａ) 特開 昭62−175691（ＪＰ，Ａ) 特開 昭61−154830（ＪＰ，Ａ) 実開 昭55−44481（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yoji Suzuki 22 Kyocera Co., Ltd. 5-5 Higashinokitainouemachi, Yamashina-ku, Kyoto Prefecture (72) Inventor Nobuhiro Watanabe 14-1 Sakaemachi, Takasaki-shi, Gunma Kyocera shares Takasaki Sales Office (56) Reference JP-A-63-32948 (JP, A) JP-A-62-175691 (JP, A) JP-A-61-154830 (JP, A) JP, U)
Claims (1)
性を測定する為に載置・固定するプレートであって、該
プレートが体積固有抵抗値10〜105Ω・cmの半導電性セ
ラミックスより成ることを特徴とする試料固定用プレー
ト。1. A plate for mounting or fixing a sample such as an electronic component for processing or measuring various physical properties, the plate being semi-conductive with a volume resistivity of 10 to 10 5 Ω · cm. A sample fixing plate, which is made of ceramics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21696788A JP2683754B2 (en) | 1988-08-31 | 1988-08-31 | Sample fixing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21696788A JP2683754B2 (en) | 1988-08-31 | 1988-08-31 | Sample fixing plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0264498A JPH0264498A (en) | 1990-03-05 |
| JP2683754B2 true JP2683754B2 (en) | 1997-12-03 |
Family
ID=16696726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21696788A Expired - Fee Related JP2683754B2 (en) | 1988-08-31 | 1988-08-31 | Sample fixing plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2683754B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09509285A (en) * | 1994-02-15 | 1997-09-16 | バーグ・テクノロジー・インコーポレーテッド | Connector module for shielded wiring board |
| JP4544706B2 (en) * | 2000-06-29 | 2010-09-15 | 京セラ株式会社 | Board holder |
-
1988
- 1988-08-31 JP JP21696788A patent/JP2683754B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0264498A (en) | 1990-03-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |