JP2680204B2 - Method for manufacturing cap body for semiconductor laser device etc. - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a cap body provided with a glass plate, such as a cap body forming a Canseal type semiconductor laser device or a cap body forming an optical sensor.

[0002]

2. Description of the Related Art A can-seal type semiconductor laser device 1 comprises:
Generally, as shown in FIG. 4 of Japanese Utility Model Laid-Open No. 62-58066, and as shown in FIG.
And a cap body 4 formed by fixing a glass plate 5 to the inward flange 4a, and the semiconductor laser chip 6 is die-bonded to the side surface of the block body 3 in the stem 2 while the cap body 4 is blocked. It is well known that the laser beam from the semiconductor laser chip 6 is emitted from the glass plate 5 of the cap body 4 to the outside so that the laser beam from the semiconductor laser chip 6 is sealed so as to cover the stem 3. On the street.

The flange 4a of the cap body 4
As a means for fixing the glass plate 5 in a sealed state to the above, conventionally, as shown in FIG. 4, ring-shaped glass is prepared by pressing powdery glass solder into a ring shape with a press die and then calcining it. While forming the solder 7, a large number of unit glass plates 5 are formed from a material glass plate having an appropriate size, and the ring-shaped glass solder 7 and the unit glass plate 5 are arranged with the ring-shaped glass solder 7 first. A method has been employed in which the cap body 4 is inserted into the cap body 4 and then heated in a heating furnace to perform main firing.

[0004]

However, in this manufacturing method, the calcined ring-shaped glass solder 7 and the unit glass plate 5 are used.
Since it is necessary to separately treat the ring-shaped glass solder 7 and the ring-shaped glass solder 7, the apparatus in the process from the preliminary baking process to the main baking process becomes complicated, and the powdery glass solder is scattered to the surroundings to significantly deteriorate the cleanliness of the surroundings As a result, since the cap body 4 cannot be manufactured in a consistent process in a clean room, the productivity of the cap body 4 is poor and the manufacturing cost is high.

It is an object of the present invention to provide a method capable of inexpensively manufacturing a cap body for such a semiconductor laser device.

[0006]

In order to achieve this object, in the present invention, in a plurality of locations on one side of the raw glass plate,
After applying paste glass solder in a ring shape, the material glass plate is cut along the outer periphery of the ring glass solder to form a unit glass plate provided with a ring glass solder on one surface. Then, the unit glass plate was supplied to the flange of the cap body so that the ring-shaped glass solder was in contact with the flange, and then heated and fired.

[0007]

According to this method, since the ring-shaped glass solder is provided on one side of the unit glass, the ring-shaped glass solder and the unit glass plate can be integrally handled, and thus the ring as in the conventional ring is used. Since the device for transferring the glass solder paste and the device for inserting it into the cap body are not required, the manufacturing equipment can be simplified and the manufacturing speed can be increased, and the paste glass solder deteriorates the surrounding environment. Therefore, all the steps can be performed as an integrated step in the clean room.

Therefore, according to the present invention, the manufacturing apparatus can be simplified, the manufacturing speed can be increased, and all the steps can be performed as a single integrated step, so that the manufacturing efficiency can be remarkably improved. Has the effect of being able to reduce significantly.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of the present invention is shown in the drawings (FIGS. 1 and 2).
It will be described based on. First, as shown in FIG. 1, a material glass plate A having an appropriate width is prepared, a mask is overlaid on the upper surface of the material glass plate A, paste glass solder is applied to the upper surface thereof, and then an extra portion is squeegeeed. A large number of ring-shaped glass solders 7 are formed in a state of being aligned vertically and horizontally by a technique such as thick film printing called scraping, and the material glass plate A is placed in a heating furnace and heated to form each ring-shaped glass solder. 7
The ring-shaped glass solder 7 is fixed to the material glass plate A by calcination.

Next, for example, vertical and horizontal score lines 9 and 10 are engraved in a region between the rows of the ring-shaped glass 7 on one surface of the raw glass plate A, and a break is made along the vertical score lines 9. A rectangular glass piece A1 is formed by breaking the formed piece along the horizontal score line 10, and the glass piece A1 is cut with a diamond cutter along the outer circumference of the ring-shaped glass solder 7, The unit glass plate 5 with the ring-shaped glass solder 7 is obtained.

From the raw glass plate A to the unit glass plate 5
It goes without saying that other means such as irradiating with a laser beam for fusing along the outer circumference of each ring-shaped glass solder 7 may be used as a means for obtaining the above. Then, the unit glass plate 5 thus formed
2 is sucked by a vacuum suction collet or the like, and as shown in FIG. 2, the ring-shaped glass solder 7 is inserted into the cap body 4 first, and then placed in a heating furnace to heat the ring-shaped glass solder. The unit glass 5 is fixed to the inner surface of the flange 4a by the main firing of 7.

In the above structure, the calcined ring-shaped glass solder 7 is adhered to the unit glass 5, and the ring-shaped glass solder 7 can be handled integrally with the unit glass plate 5, so that the ring-shaped solder as in the conventional case can be handled. Since a device for handling the glass solder 7 is not required, the manufacturing apparatus can be simplified and the manufacturing speed can be increased. In addition to this, the paste glass solder does not deteriorate the surrounding environment. As a result, all the steps can be performed as an integrated step in the clean room, so that the manufacturing efficiency can be improved and the manufacturing cost of the cap body 4 can be greatly reduced.

When the ring-shaped glass solder 7 is formed by the thick film printing method as in the above embodiment, the ring-shaped glass solder 7 is provided on the material glass plate A by an inexpensive thick film printing apparatus. Moreover, since it can be performed efficiently, the manufacturing cost can be further reduced. Further, if the ring-shaped glass solder 7 is formed by the thick film printing method and then the ring-shaped glass solder 7 is pre-baked, a large number of ring-shaped glass solders 7 are formed.
The ring-shaped glass solder 7 was protected by the unit glass plate 5 because the calcined ring-shaped glass solder 7 was fixed to the unit glass 5. The state that the ring-shaped glass solder 7 touches an object and chipping or cracking can be remarkably reduced, so that variations in sealing performance can be reduced and the quality of the cap body 4 can be maintained at high quality. Have.

Although the above embodiment is applied to the cap body for the semiconductor laser device, it goes without saying that the present invention can also be applied to a method of manufacturing the cap body in an optical sensor or the like.

[Brief description of the drawings]

FIG. 1 is a diagram showing a substantially first half of a process of the present invention.

FIG. 2 is a diagram showing a substantially latter half of the process of the present invention.

FIG. 3 is a partially cutaway perspective view of a semiconductor laser device.

FIG. 4 is a diagram showing an outline of a conventional manufacturing method.

[Explanation of symbols]

 A material glass plate 1 semiconductor laser device 4 cap body 4a flange 5 unit glass plate 7 ring-shaped glass solder

Continuation of the front page (56) Reference JP 62-98649 (JP, A) JP 4-116508 (JP, A) JP 4-84475 (JP, A) JP 3-265806 (JP , A)

Claims (1)

(57) [Claims] 1. At a plurality of locations on one side of a raw glass plate,
After applying paste glass solder in a ring shape, the material glass plate is cut along the outer periphery of the ring glass solder to form a unit glass plate provided with a ring glass solder on one surface. Then, the unit glass plate is supplied to the flange of the cap body so that the ring-shaped glass solder is brought into contact with the flange, and then heated and baked. A method for manufacturing a cap body for an apparatus or the like.