JP2676889B2 - Method for manufacturing semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Outline] The present invention relates to a method of manufacturing a semiconductor device in which cleaning of a wafer after full cutting and irradiation of ultraviolet rays are performed at the same time. For the purpose of, after fully cutting the wafer attached to the UV tape,
The wafer is formed by simultaneously washing the wafer with water and irradiating it with ultraviolet rays.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor device in which a wafer after full cutting and a UV irradiation are simultaneously performed.

In recent years, along with high integration of integrated circuits, high reliability is required.

Therefore, in the dicing process of the wafer, the method of fully cutting the wafer and picking up the chips is the mainstream, but the throughput is long, and when the UV tape for dicing used during dicing is irradiated with ultraviolet rays, When UV tape is heated, it stretches and bends, causing the edges of the chips to collide and chip.

Further, at the time of pickup, a silicon piece in the groove pops out, which causes a problem of short circuit between the electrode pads, and it is necessary to eliminate these problems.

[Conventional technology]

 FIG. 3 is a diagram illustrating the order of steps of a conventional example.

25 is UV tape, 26 is a frame, 27 is a wafer, 28 is a spinner table, 29 is a water pipe, 30 is a feed table, 31
Is a lamp house, 32 is an ultraviolet lamp, 33 is a needle for picking up, 34 is a tip, and 35 is a collet.

First, as shown in FIG. 3A, the UV tape 25 is attached to the frame 26 without wrinkling, and the back surface of the wafer 27 is attached to the UV tape 25.

Next, as shown in FIG. 3B, the frame 26 is set on the dicer, and the wafer 27 is fully cut by a tool.

The full-cut wafer 27 is set on the spinner table 28 of the spinner cleaning machine for each frame 26 while being attached to the UV tape 25, and the cleaning water sprayed from the water supply pipe 29 is shown in FIG. The surface of the wafer 27 is washed with.

As shown in FIG. 3 (d), the cleaned wafer 27 is set on the feeding table 30 above the ultraviolet irradiation machine, and while moving laterally, the ultraviolet lamp 32 in the lamp house 31 is turned on. , UV rays are applied to the back surface of the wafer 27 to lose the adhesive force of the UV tape 25.

Subsequently, as shown in an enlarged view in FIG. 3 (e), the UV tape 25 is passed through, and the chips 34 are pushed up one by one from the back surface of the wafer 27 by the pick-up needle 33, and the chip suction collet 35 is picked up. Pick up chips 34 in sequence.

Thus, in the conventional full-cut process, after full-cut dicing, spinner cleaning, followed by UV irradiation,
After that, it becomes a pickup.

Therefore, since the throughput is long and the UV tape is also heated when the ultraviolet rays are irradiated, there is a problem that when the tape is stretched, the tape is bent and the chips come into contact with each other and the edges are chipped.

In addition, when picking up, as shown in the partially enlarged view of FIG. 3 (g), the silicon pieces in the grooves between the chips pop out vigorously together with the chips, and the phenomenon of sticking here and there occurs. there were.

[Problems to be solved by the invention]

For this reason, in the conventional full-cut process, it is difficult to improve the throughput, the adhesion of silicon pieces, the temperature rise of the tape, and the like, and the above problems occur.

The present invention is provided for the purpose of reducing the throughput, preventing the adhesion of silicon pieces, and preventing the temperature of the tape from rising.

[Means for solving the problem]

 FIG. 1 is a diagram illustrating the principle of the present invention.

In the figure, 1 is a wafer, 2 is a UV tape, 3 is a frame, 4
Is a spinner table, 5 is quartz glass, 6 is a stopper, 7 is a water supply pipe, 8 is a lamp house, and 9 is an ultraviolet lamp.

Full-cut wafers are currently cleaned by a spinner table attached to a dicer or a dedicated cleaning machine having a spinner table. After that, the back side of the full-cut wafer is irradiated with a dedicated UV irradiation machine, and then pickup is performed.

Therefore, we installed a UV lamp under the spinner table,
By performing wafer cleaning and UV irradiation at the same time,
The above problems are solved.

That is, according to the present invention, as shown in FIG. 1, a UV tape 2 having a full-cut wafer 1 attached thereto is fixed to a frame 3, and the surface of the wafer 1 is faced up, and a spinner table 4 on the upper part of the apparatus is used. The frame 3 is mounted on the quartz glass 5 fitted in the above, and the frame 3 is fixed to the spinner table 4 with the stoppers 6.

Next, the spinner table 4 is rotated to rotate the wafer 1
Also rotates at the same time and sprays the cleaning water sent from the water supply pipe 7 above the wafer 1 to fully cut the wafer 1.
Thoroughly clean the chip surface and the space between chips to remove the residue and dirt on the silicon pieces.

And while washing, at the same time, the lamp house 8
The UV lamp 9 in the inside is turned on, and the UV tape 2 on the back surface of the wafer 1 is irradiated with ultraviolet rays for a short time to polymerize the photosensitive resin in the UV tape 2 to almost eliminate the adhesive force of the UV tape 2. Residues and the like of the silicon pieces attached to the dicing gap between the chips are completely removed.

[Action]

In the present invention, as shown in FIG. 1, since the ultraviolet lamp is arranged under the spinner table which transmits UV light,
Wafer cleaning after full cutting and UV irradiation can be performed at the same time, and since UV irradiation is performed while washing with water, the temperature of the tape and wafer does not rise, and tape elongation can be prevented.

Also, since the silicon pieces in the grooves lose their adhesive power to the UV tape when irradiated with ultraviolet rays, they can be removed by the washing pressure and the centrifugal force of rotation.

〔Example〕

 FIG. 2 shows a device configuration diagram of an embodiment of the present invention.

In the figure, 10 is a UV tape, 11 is a frame, 12 is a wafer, 13 is a bearing, 14 is a spinner table, 15 is a motor, 16 is a pulley, 17 is a belt, 18 is quartz glass, 19 is a stopper, and 20 is a jet. Nozzle, 21 is a water supply pipe, 22 is a lamp house, 23 is an ultraviolet lamp, and 24 is a shutter.

 First, the structure of the device of the present invention will be described.

This device is composed of an upper water washing section and a lower UV irradiation section.

That is, there is a spinner table 14 on the upper part, and the spinner table 14 is placed on the main body of the device via a bearing 13. The spinner table 14 is rotated by a belt 17 via a pulley 16 rotated by a motor 15.

The center of the spinner table 14 is hollowed out, and a transparent thick quartz glass 18 is fitted therein.

The full-cut wafer 13 attached to the UV tape 10 is
Each frame 11 is fixed to the spinner table 14 with fasteners 19.

In addition, above the spinner table 14, the injection nozzle 20
Is installed, and washing water is ejected through the water pipe 21. Further, the water supply pipe pipe 21 can be swung to the left and right, and the cleaning water can be sprayed to any position on the wafer 12.

Below the quartz glass 18 is a UV lamp house 22,
A 120 W mercury lamp or a metal halide lamp is set as the ultraviolet lamp 23. Further, the inner surface of the lamp house 22 is a reflector so that the back surface of the wafer can be efficiently irradiated with ultraviolet rays. Further, the shutter 24 can be opened and closed by remote scanning from outside the lamp house 22.

 Next, an embodiment of the present invention will be described.

A commercially available UV tape 10 for dicing is attached to a stainless steel frame 11 while pulling it without wrinkles, and the edge of the UV tape 10 is cut along the frame of the frame 11 with a cutter.

The back surface of the wafer 12 on which the 5-inch elements are to be diced is placed on the work table with the back surface facing upward, and the adhesive surface of the UV tape 10 is placed on the wafer 12 with the frame 11 facing downward. Gently apply the UV tape 10 to the back surface of the wafer 12 with a roller. At this time, so that no bubbles remain
Roll the roller gently from the center of 12 to the edge.

Then, the frame 11 is set on the dicer, and the diamond tool is used to perform full cutting from the surface of the wafer 12 along the dicing line. In this case, the wafer 12 is fully cut, and at the same time, the UV tape 10 is also cut with a tool up to 40 μ, which is half the thickness of the UV tape 10 of 80 μ.

The fully cut wafer 12 is set in the apparatus of the present invention for each frame 11. First, with the surface of the wafer 12 facing upward, the frame 11 is set according to the positioning of the spinner table 14, and the frame 11 is fixed to the spinner table 14 with the fasteners 19.

Next, the motor 15 is rotated to rotate the belt 17 via the pulley 16, and the spinner table 14 is rotated at 1,800 rpm / m.
While rotating at in, pure water is sprayed onto the wafer 12 from the water supply pipe 21 at a water amount of 1 / min to wash the surface for 30 seconds to wash away residues such as silicon pieces.

At the same time, the shutter 24 of the UV lamp house 22 is opened, and the UV light is passed through the quartz glass 18 to the UV on the back surface of the wafer 12.
Irradiate the tape 10 for 2-3 seconds to weaken the adhesive strength of the UV tape 10 adhesive.

As a result, the silicon pieces adhering to the dicing line grooves between the chips are repelled and removed by the pressure at the time of washing with water and the centrifugal force of rotation.

〔The invention's effect〕

As described above, according to the present invention, by simultaneously performing wafer cleaning and ultraviolet irradiation, it is possible to prevent adhesion of silicon pieces, shorten the process, and prevent chips from being chipped due to elongation of the UV tape. It greatly contributes to quality improvement.

[Brief description of the drawings]

 FIG. 1 is an explanatory view of the principle of the present invention, FIG. 2 is an apparatus configuration diagram of an embodiment of the present invention, and FIG. In the figure, 1 is a wafer, 2 is a UV tape, 3 is a frame, 4 is a spinner table, 5 is quartz glass, 6 is a stopper, 7 is a water supply pipe, 8 is a lamp house, 9 is an ultraviolet lamp, 10 is UV tape. , 11 is a frame, 12 is a wafer, 13 is a bearing, 14 is a spinner table, 15 is a motor, 16 is a pulley, 17 is a belt, 18 is quartz glass, 19 is a stopper, 20 is a spray wafer, 21 is a water pipe, 22 is a lamp house, 23 is an ultraviolet lamp, and 24 is a shutter.

Claims (1)

(57) [Claims] 1. A method of manufacturing a semiconductor device, comprising: fully cutting a wafer (1) attached to a UV tape (2), and then simultaneously rinsing the wafer (1) with a spinner and irradiating ultraviolet rays.