JP2669875B2 - Electronic component recognition device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Use The present invention detects an acceptability judgment and a positional deviation of an electronic component whose surface is irradiated with light from a light source, by imaging the electronic component. The present invention relates to an electronic component recognition device.

(B) Conventional technology In general, as a recognition device of this type, Japanese Unexamined Patent Publication No. 62-104047 discloses a dice whose surface is illuminated by a light source (electronic component referred to in the present application) by a camera to obtain a non-defective dice. A technique for identifying is disclosed.

However, depending on the type of the dice having different surface conditions, there was a case that the light reflected from the dice was not evenly incident on the camera with a light source of the same direction and a light source of the same illuminance, and thus accurate imaging could not be performed.

Further, Japanese Patent Application Laid-Open No. 62-22510 discloses a technique of arranging two sets of illuminating units which are substantially orthogonal to each other to an inspection object and selecting one of the sets to illuminate. However, there is a disadvantage that the number of parts increases.

(C) Problem to be Solved by the Invention Therefore, the present invention is to accurately image even electronic components of different types and to minimize the number of components.

(D) Means for Solving the Problem Therefore, the present invention is an electronic component recognition device for detecting the quality of a component or a positional deviation of the component by imaging an electronic component whose surface is irradiated with light from a light source with a camera. In the above, a main lighting device that illuminates the component, an auxiliary lighting device that assists the main lighting device, and a storage device that stores each illuminance value data of the main lighting device and the auxiliary lighting device for each type of the component. A control device for controlling the lighting device according to the illuminance value data stored in the storage device.

(E) Operation With the above configuration, the control device changes the illuminance of the main lighting device and the auxiliary lighting device according to the illuminance value data corresponding to various electronic components stored in the storage device.

(F) Example Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

 FIG. 4 is a plan view of an essential part of the electronic component automatic mounting apparatus.

(1) is a main body of the electronic component automatic mounting apparatus. The main body (1) has a conveyor (2) for transporting a printed board (including a thick film substrate) (P), a lead frame, and the like, and a conveyer (2). A pair of substrate positioning devices (3) and (4) provided on the way, and four wafer tables (5) and (6)
And a wafer support (7) (8) that can move in the XY direction and rotate in the plane direction, and XY suspended from the top plate (9).
And a mounting head (10) (other hand not shown) movable in the direction.

The conveyor (2) has a pair of driving sprockets (1
2) (12), consisting of a pair of chains (14A) (14B) stretched between driven sprockets (13) (13), placed on the chains (14A) (14B), and mounted on the substrate (P). ) From upstream to downstream. At this time, the chain (14A) (14
B) is provided with an engaging piece (15) that is engaged with the rear end of the board (P) in the feed direction at a predetermined interval, and the board (P) is mounted on both chains (14A) (14B). On each other and each engaging piece (15)
Is transported intermittently from the upstream side to the downstream side in the state locked by.

Next, a pair of substrate positioning devices (3) and (4) will be described.
Will be described only. The positioning device (3) (4)
Performs positioning in the feed direction of the substrate (P), the width direction orthogonal thereto, and the thickness direction of the substrate (P). Hereinafter, only the positioning in the feed direction of the substrate (P) will be described. .

The shaft (18) penetrating the pair of bearings (16) (17)
A clamp cam (19) is provided, and a belt (23) is stretched between a pulley (20) at the left end of the shaft (18) and an output shaft pulley (22) of the positioning motor (21). Accordingly, when the shaft (18) is rotated by energization of the motor (21), the cam (19) rotates, and the vertical member (25) moves up and down via the cam follower (24). ) Also moves up and down.

When the cam lever (26) moves upward, the movable clamp (27A) pivots outward via the pin (28), and the reference clamp (27B) also disengages via the pin (30) via the spring (29). And the clamps (27A) and (27B) are located below the substrate (P). Therefore, since the cam follower (24) at the end of the upper and lower member (25) is pressed against the clamp cam (19), the upper and lower member (25) moves up and down according to the shape of the cam (19).

Next, the wafer supports (7) and (8) will be described in detail, but both have the same structure, and only the support (7) will be described. (31) is an XY table, and an X-axis motor (32)
The Y-axis motor (33) is movable in a plane direction along the X-axis direction guide (34) and the Y-axis direction guide (35). The wafer table (5) placed on the XY table (31) can be rotated forward and backward by a θ motor (36).

(37) is a push-up needle device that pushes up electronic components (hereinafter referred to as pellets (39)) of the wafer sheet (38) from below, and while the push-up needle device (37) pushes up the push-up needle device, the pellet (39) is attached to the mounting head. Adsorbed and held by (10).

Hereinafter, the electronic component recognition device (40) (the other one not shown) arranged near the mounting head (10) (the other one not shown) will be described in detail with reference to FIGS. 1, 2 and 5. I will describe. Here, FIG. 5 shows the electronic component recognition device (40) on the right side.
FIG. 4 is a view showing the mounting head (10) on the left side in the back direction of the electronic component recognition device which is not originally shown.

Reference numerals (42) and (42) denote a vertical illuminating device as a main illuminating device and an inclined illuminating device as an auxiliary illuminating device for illuminating the pellet (39) of the wafer sheet (38). The stored data shown in FIGS. 6 and 7 are output through the D / A converter (43) according to the optimum illuminance value for each pellet.

Reference numeral (44) denotes a filter plate to which a diffuser filter (45) made of fog glass for diffusing light from the vertical lighting device (41) is attached, and the diffuser filter (45) and the filter plate as shown in FIG. It is composed of a diffusion filter (46) having a different diffusivity from the (45) and a transmission filter (47) made of transparent glass that transmits light.

The filter plate (44) is a filter switching motor (48)
Of the motor (48)
The filter plate (44) is rotated by the forward / reverse rotation of
A desired filter (45) (46) (47) suitable for the pellet (39) is selected according to the data shown in the figure.

Reference numeral (50) is a camera for capturing an image of the pellet (39) illuminated by the vertical illumination device (41) and the tilt illumination device (42), and the motor (51) is rotated by forward and reverse rotation of the zoom switching motor (51). The drive pulley (53) attached to the rod (52) of the belt is rotated, and the rotation of the pulley (53) is changed to the belt (5).
Driven pulley (56) loosely inserted into lens barrel (55) via 4)
The lens barrel (55) is expanded and contracted by its rotation, and the zoom magnification is set according to the pellet (39) to be imaged according to the data shown in FIG.

 FIG. 3 is a configuration circuit diagram of the electronic component recognition device.

(57) is a keyboard (58) as an input device for setting various data, and a screen selection key (6
0), an operation section including a start key (61) for starting the mounting operation, and various data is generated by operating each key of the keyboard (58).

Reference numeral (62) is a CPU as a control device, which performs given control relating to various data settings and control relating to mounting operation based on various information in response to each key operation.

Reference numeral (63) is a RAM as a storage device for storing various setting data set by the keyboard (58).

(64) is a ROM that stores programs related to mounting operation
It is.

 (65) is an interface.

 Hereinafter, the operation will be described in detail.

When a drive motor (not shown) is energized, the drive sprockets (12) and (12) rotate, and the driven sprocket (13)
According to (13), the substrate (P) on the chain (14A) (14B)
Are intermittently conveyed, and after reaching the position of the positioning device (3), the drive motor is de-energized and the conveyance of the substrate (P) is stopped.

Then, the positioning motor (21) is energized and the belt (2
Since the shaft (18) rotates through 3), the clamp cam (19) also rotates, and each of the upper and lower members (25) is moved through the cam follower (24) according to the shape of the cam (19). It will move up and down. As a result, the position of the substrate (P) in the feed direction is regulated.

That is, when the upper and lower members (25) descend in accordance with the clamp cam (19) which rotates by energization of the motor (21), the movable clamp (27A) resists the spring (29) and the reference clamp (27B) respectively. By rotating, the position of the substrate (P) in the feed direction is regulated.

As described above, the pellets (39) are mounted on the substrate (P) whose position is regulated. Before the mounting, the desired wafer sheet (38) on the wafer table (5) is mounted.
The wafer support (7) is rotated in either forward or reverse directions by the θ motor (36) so that the wafer moves to the station (A).

Next, the X-axis motor (32) and the Y-axis motor (33) move the XY table (31) and the support base (7) in the plane direction along the guides (34) (35) to push them up. The pellet (39) of the desired wafer sheet (38) is positioned above the needle position (37). The mounting head (10) is located above the wafer sheet (38).

Then, the electronic component recognition device (40) provided in the vicinity of the mounting head (10) detects the quality of the pellet (39), the positional deviation, and the θ deviation. At this time, the electronic component recognition device (40) illuminates (41) (for each type of pellet (39) (including the difference in the coating state of the surface) according to the data in FIGS. 6 to 9. The illuminance value of 42), the filters (45) (46) (47) of the filter plate (44) and the zoom magnification of the camera (50) are changed. That is, first, a pellet (39) having a pellet name of 2SC536 is placed on the substrate (P).
When mounted on the CPU, the CPU (62) controls the output of the D / A converter (43) according to each data so that the illuminance of the vertical lighting device (41) and the tilted lighting device (42) are 90 [l _x ] and 30, respectively. [L _x ], and the filter switching motor (48) is rotated to form a predetermined filter (45), and the zoom switching motor (51) is rotated to set the zoom magnification to 100 [times]. To change. Then, the pellet (39) in a state where light is irradiated by the vertical lighting device (41) and the tilted lighting device (42).
Is captured by the camera (50). This image and RAM (63)
With each data of the regular pellets (39) stored in
A comparison device (not shown) in the CPU (62) makes a comparison, and if judged appropriate, the pellet (39) is adsorbed by the mounting head (10) and mounted at a predetermined position on the substrate (P). Further, since the pellet (39) determined to be inappropriate at the time of the recognition is not sucked, the next pellet (39) is recognized and the mounting operation is continued.

Next, when recognizing different pellets (39) with the pellet name LA1234, the D / A converter (so that the illuminance becomes 200 [l _x ] and 0 [l _x ] respectively according to the pellet (39) Control the output of 43), select the transmission filter (47), and change the zoom magnification to 200 times.
Then, the pellets (39) determined to be suitable are sequentially mounted.

(G) Effect of the Invention With the above configuration, by changing the illuminance of each illuminating device according to the type of electronic component having a different surface condition, it becomes possible to reliably detect whether the component is defective or defective, or misaligned. .

[Brief description of the drawings]

1 and 3 are a side view and a circuit diagram of a main part of an electronic component recognition apparatus according to an embodiment of the present invention, FIG. 2 is a front view showing a filter plate, and FIGS. 4 and 5 are electronic components. Main part plan view and front view of the electronic component automatic mounting device to which the recognition device is applied,
6 to 9 are views showing data related to the recognition operation. (10) (11)… Mounting head, (39)… Pellets,
(40) …… Electronic component recognition device, (41) …… Vertical lighting device, (42) …… Inclined lighting device, (43) …… D / A converter, (44) …… Filter plate, (45) ( 46) …… Diffuse filter, (47) …… Transmission filter, (48) …… Filter switching motor, (50) …… Camera, (51) …… Zoom switching motor, (62) …… CPU, (63) ……RAM.

Continuation of the front page (56) Reference JP 62-299709 (JP, A) JP 62-76642 (JP, A) JP 61-294302 (JP, A) JP 60-195405 (JP , A) Actually opened 63-2149 (JP, U) Actually opened 62-22510 (JP, U) Actually opened 62-135949 (JP, U)

Claims (1)

(57) [Claims] 1. An electronic component recognizing device for illuminating an electronic component, the surface of which is illuminated with light from a light source, for deciding whether the component is good or bad or detecting a positional deviation. Device, an auxiliary lighting device that assists the main lighting device, a storage device that stores each illuminance value data of the main lighting device and the auxiliary lighting device for each type of the component, and an illuminance value stored in the storage device An electronic component recognition device comprising: a control device that controls the lighting device according to data.