JP2668393B2 - Dielectric filter - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a dielectric filter used for a small electronic circuit or the like.

<Problems to be Solved by Prior Art and Invention> A dielectric filter having a strip line pattern formed by arranging a plurality of resonance lines in parallel on a contact surface of two laminated dielectric substrates is small in size. Because of its simple structure, it is suitably used for small electronic circuits.

In this dielectric filter, in order to improve its filtering characteristics, the number of resonance lines is increased and a filter including a large number of resonance lines such as 4 poles and 5 poles is provided.

By the way, in the conventional configuration, a large number of resonant lines 1 are arranged in a row at a predetermined interval between the input terminal portion i and the output terminal portion o on the contact surface of the two dielectric substrates d. It is.
In this configuration, as shown in FIG. 4, a comb type in which the resonance line 1 is projected in parallel in the same direction from the ground conductive film f formed on the edge of the dielectric substrate d, and as shown in FIG. There is an interdigital type in which the resonance lines 1 are staggered from different directions, but in each case, the mounting area increases along the arrangement direction.

Therefore, the installation area on the printed circuit board becomes large, the difference from the integrated block type filter disappears, the circuit design on the printed circuit board is restricted, or the electronic circuit is downsized. was there.

An object of the present invention is to realize a multi-pole dielectric filter without increasing the mounting area.

<Means for Solving the Problems> According to the present invention, a strip line pattern formed by arranging a plurality of resonance lines in parallel is arranged on the contact inner surfaces of the upper and lower portions of three laminated dielectric substrates. An input terminal portion and an output terminal portion are formed on one side edge portion of the lower dielectric substrate so as to be exposed, and the input terminal portion is formed on a lower contact inner surface between the lower dielectric substrate and the intermediate dielectric substrate. Of the plurality of resonance lines arranged in parallel, the output line is connected to a resonance line adjacent to one side edge of the lower dielectric substrate, and the output terminal portion is provided on the inner surface of the upper contact between the upper dielectric substrate and the intermediate dielectric substrate. Of the plurality of resonance lines arranged in parallel, the lower dielectric member is connected to the resonance line adjacent to one side edge portion of the lower dielectric substrate, and of the plurality of resonance lines arranged in parallel on the lower contact inner surface. A resonance line adjacent to the other side edge of the substrate; Among the plurality of resonance lines thus formed, the other side edge portion of the upper dielectric substrate and the adjacent resonance line are connected to each other by the connecting connection path formed on the other side edge portion of the intermediate dielectric substrate. The present invention relates to a dielectric filter, wherein a ground conductive film is formed on each outer surface of a substrate and a lower dielectric substrate.

<Operation> The three dielectrics are superimposed to form a resonance line group on the lower contact inner surface and a resonance line group on the upper contact inner surface,
Each of the resonance line groups is connected in series between the input terminal portion and the output terminal portion, which are connected by the connecting connection path and are exposed to the lower dielectric.

In this case, for example, by forming two resonance lines on the inner surface of the lower contact and forming two resonance lines on the inner surface of the upper contact, a four-pole type filter is realized, and various multi-pole filters are realized. Can be done.

<Example> An example of the present invention will be described with reference to the accompanying drawings.

FIGS. 1 to 3 show a four-pole filter formed by laminating dielectric substrates 1, 2, and 3. FIG.

That is, a strip line pattern in which a resonance line 4a and a resonance line 4b are arranged in parallel on each of the opposing surfaces of the lower contact inner surface A on which the two lower dielectric substrates 1 and the intermediate dielectric substrate 2 are superposed. 5 are formed so as to have a mirror image relationship. Ground conductive films 6a, 6a are formed on both front and rear edges of the strip line pattern 5, respectively. An insulating space is formed between the end and the ground conductive film 6a on the other side. The length of the resonance lines 4a and 4b is 1
Set to / 4 wavelength. The resonance line 4a and the resonance line 4b may be extended in parallel from the ground conductive film 6a on different sides.

A mirror image-related strip line pattern 15 formed by arranging a resonance line 14a and a resonance line 14b on opposite surfaces of an upper contact inner surface B on which the laminated intermediate dielectric substrate 2 and upper dielectric substrate 3 are superposed. Are formed respectively. Further, ground conductive films 16a, 16a are also formed on both front and rear edges of the strip line pattern 15, and the extension base end of the resonance line 14a is formed on one side of the ground conductive film 16a and the extension base end of the resonance line 14b is formed. Is connected to the ground conductive film 16a on the other side, and an insulating space is formed between the open end thereof and the ground conductive film 16a on the other side. The length of each of the resonance lines 14a and 14b is set to 1/4 wavelength. Note that the resonance lines 14a and 14b may be extended from the ground conductive film 16a on the same side.

A ground conductive film 6b is formed continuously on the lower surface (outer surface) of the lower dielectric substrate 1 and a ground conductive film 16a is formed on the upper surface (outer surface) of the upper dielectric substrate 1. Thus, the ground conductor 16b is formed.

Further, on one side edge of the lower surface of the dielectric substrate 1, an input terminal portion 7a is formed which partitions a ground conductive film 6b and connects to a required conductive path of the printed circuit board. This input terminal section 7a
Via a conductive path 7b, a connection end 7c on one end side of the dielectric substrates 1 and 2,
Resonance line connected to 7d and formed in parallel with the lower contact inner surface A of the lower dielectric substrate 1 and the intermediate dielectric substrate 2 in a laminated state, in this case, a resonance line close to one side of the lower dielectric substrate 1. Connect to line 4a. The conductive path 7b is formed by depressing the side surface of the dielectric substrate 1 in a semicircular arc shape, and applying a conductive film to the depressed surface.

An output terminal 8a is formed independently on one side edge of the ground conductive film 6b adjacent to the input terminal 7a.
The output terminal portion 8a is connected to the dielectric substrate 1 and a conductive substrate 8 via a conductive path 8b formed by depressing the side surface into a semicircular arc.
Are connected to connection ends 8c and 8d formed on one end side.

Further, the connecting end 8d is formed in parallel with the upper contact inner surface B via the conductive path 8e formed by recessing the side surface of the intermediate dielectric substrate 2 and the connecting end 8f at the upper end position of the intermediate dielectric substrate 2. In this case, the resonance line is connected to the resonance line 14a adjacent to one side of the upper dielectric substrate 3.

The input terminal portion 7a and the output terminal portion 8a are formed on the side surface of the dielectric substrate 1 so as to enable connection with the outside.
It just needs to be exposed.

Further, the resonance line 4b on the inner surface A of the lower contact, which is close to the other side of the lower dielectric substrate 1, is connected to the intermediate connecting end 9a formed at the edge of the lower surface of the intermediate dielectric substrate 2 to form the intermediate dielectric. The other side of the upper dielectric substrate 3 on the inner surface B of the upper contact via the conductive path 9b formed by recessing the side surface of the body substrate 2 and the intermediate connecting end portion 9c formed at the end portion of the upper surface of the dielectric substrate 2. Connected to the resonance line 14b close to the unit. That is, the connection end 9a, the conductive path 9b, and the connection end 9c constitute the connection connection path 9, and the strip line pattern 5 and the strip line pattern 15 are connected in series. And the input terminal section 7a,
The resonance lines 4a, 4b, 14b, 14a are arranged in series between the output terminal portions 8a, and a four-pole structure is achieved.

In addition, the lower contact inner surface A of the two-pole structure in which the resonance lines 4a and 4b are projected from the same direction (comb type) and the resonance lines 14a and 14b are projected from different directions (interdigital type) 2 In the combination with the upper contact inner surface B of the roll structure, as described above, the output terminal portion electrically extended from a predetermined position with respect to the length of the resonance lines 14a and 14b.
Since the extension direction of the resonance line 14a and that of the resonance line 4a are opposite to each other, the position of the input terminal portion 7a can be necessarily avoided at the position of 8a, and the input on the lower surface of the lower dielectric substrate 1 can be avoided. The terminal section 7a and the output terminal section 8a can be arranged side by side.

Then, by laminating the respective dielectric substrates 1, 2, and 3, the resonance line group on the lower contact inner surface A and the resonance line group on the upper contact inner surface B are connected in series via the connecting connection path 9. Each resonance line is connected to an input / output terminal of a required conductive path on the printed circuit board via the input terminal section 7a and the output terminal section 8a to form a filtering circuit.

The contact inner surfaces A and B can be provided with a desired number of resonance lines, thereby making it possible to form a filter having a large number of poles such as five poles and six poles.

<Effect of the Invention> According to the present invention, as described above, a filter having the total number of poles can be formed by laminating three dielectric substrates, thereby increasing the mounting area. It is possible to form a filter having many poles without the need, and there are excellent effects such as simplification of circuit design on a substrate and miniaturization of an electronic circuit.

[Brief description of the drawings]

The accompanying drawings show an embodiment of the present invention. Fig. 1 is a perspective view of a 4-pole dielectric filter as seen from above, Fig. 2 is a perspective view as seen from below, and Fig. 3 is a laminated state. It is a perspective view. 4 and 5 are perspective views of a conventional configuration. 1,2,3; Dielectric substrate, 4a, 4b; Resonance line, 5; Strip line pattern, 6a, 6b; Ground conductive film, 7a; Input terminal part, 8a; Output terminal part, 9; Connection connection path, 14a , 14b; resonance line, 15; strip line pattern, 16a, 16b; ground conductive film, A; lower contact inner surface, B; upper contact inner surface

Claims (1)

(57) [Claims] 1. A strip line pattern formed by arranging a plurality of resonance lines in parallel is provided on the contact inner surfaces of the upper and lower portions of three laminated dielectric substrates, and one of the lower dielectric substrates is provided. A plurality of resonance lines in which an input terminal portion and an output terminal portion are formed to be exposed at a side edge portion, and the input terminal portion is arranged in parallel on a lower contact inner surface of the lower dielectric substrate and the intermediate dielectric substrate. Of the plurality of resonance lines connected to a resonance line adjacent to one side edge of the lower dielectric substrate and having the output terminal portions arranged in parallel on the inner surface of the upper contact between the upper dielectric substrate and the intermediate dielectric substrate. Of the plurality of resonance lines connected to the resonance line adjacent to one side edge of the lower dielectric substrate and adjacent to the lower contact inner surface,
A resonance line adjacent to the other side edge of the lower dielectric substrate;
Of the plurality of resonance lines parallel to the upper contact inner surface,
The other side edge portion of the upper dielectric substrate and the adjacent resonance line are connected by the connecting connection path formed on the other side edge portion of the intermediate dielectric substrate, and the upper dielectric substrate and the lower dielectric substrate are connected. A dielectric filter comprising a ground conductive film formed on an outer surface.