JP2654111B2 - Component mounting method on printed circuit board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial application field) The present invention relates to a method for mounting components on a printed wiring board, and is particularly used for facilitating confirmation of a place where electronic components are not mounted. It is something that can be done.

(Prior art) Conventionally, after mounting electronic components on one printed circuit board using an automatic insertion machine or the like, a worker has to make a connection between the printed wiring board and the drawing in order to prevent mounting leaks and insertion differences. Checking. Further, when there are two or more types of component mounting specifications on the same board, the locations where the electronic components are not mounted are previously written on the printed board according to the drawings of each specification, and then the electronic components are mounted. Also, when checking the specification configuration before mounting the components, the drawing and the printed circuit board are visually compared for each component, and furthermore, a mounting component and a mounting component unnecessary portion are checked.

(Problems to be Solved by the Invention) According to such a method for confirming printed circuit board mounted parts, since confirmation work is performed visually for each drawing, confirmation omission occurs, and the work time becomes longer. There is. To address this problem, there is a method to increase the types of printed circuit boards to produce printed wiring boards with the parts mounting parts clearly specified for each specification. Problems arise.

SUMMARY OF THE INVENTION The present invention has been made in view of such a problem, and an object of the present invention is to provide a method of mounting components on a printed circuit board, which can surely perform an operation of checking a portion where no component mounting is required in a short time.

[Configuration of the invention]

(Means for Solving the Problem) The present invention relates to a component mounting method for a printed circuit board including a process of applying an adhesive onto a substrate at a mounting position of a surface mounted component on the printed circuit board and bonding and fixing the surface mounted component. The adhesive is applied to the component mounting land at a position where component mounting is unnecessary, simultaneously with the application of the adhesive onto the base material.

(Operation) According to the present invention, first, an adhesive is applied onto a base material at a mounting position of a printed circuit board, and then the electronic component is bonded and fixed.
At the same time, the adhesive is applied to the component mounting land at the component mounting unnecessary position. After that, when the worker checks the mounting state, the fixing adhesive is applied to the surface of the land where the electronic component is not mounted, so that it is possible to check the bonding leak without referring to the drawing. . Furthermore, the mounting location and the non-mounting location are different in the location where the fixing adhesive is applied, so that both can be easily distinguished.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the drawings, the component denoted by the symbol a indicates the component mounting location,
The reference numeral b indicates a component unnecessary mounting location. First, as shown in FIG. 1, an epoxy-based fixing adhesive 2 of, for example, an ultraviolet curing agent is applied to the surface of a substrate 1 of a printed circuit board on which electronic components are mounted by a dispenser. At the same time, the fixing adhesive 2 is applied to the surface of the land 3 where the electronic component is not mounted. The reason why the application state is distinguished between the two in this way is to discriminate between a part where the electronic component is not mounted and a part where the electronic component is not originally mounted when checking the component mounting state later. Next, as shown in FIG. 2, the lead 5 of the electronic component 4 is placed on the land 3 so as to be positioned. After mounting all the electronic components 4, as shown in FIG. 3, ultraviolet rays U are applied to the fixing adhesive 2 applied to the printed circuit board to cure the surface, and then heated to fix the fixing adhesive 2. Cure to the inside of After the fixing adhesive 2 has been cured, a location where the electronic component 4 is not mounted is confirmed in the state of FIG.
At this time, since the fixing adhesive 2 is applied to the surface of the land 3 at the non-mounting portion, the electronic component 4 is present at that location, and the electronic component 4 is not present at that location. However, the operator can confirm at a glance that the position is a non-mounting position. In addition, the place where the electronic component 4 is leaked is
Since the unnecessary mounting location and the location where the fixing adhesive 2 is applied are different, they can be easily distinguished and found quickly. The confirmation operation is performed visually or, in the case of an automatic device, by television monitoring. After the mounting of all the components is completed, reflow soldering by heating is performed to fix the electronic components 4. FIG. 5a shows a partial cross-sectional view after the completion of the soldering. In the drawing, reference numeral 4 denotes an electronic component of a surface mount component. The electronic component 4 is fixed on a printed circuit board 1 with a fixing adhesive 2, and its leads 5 are soldered to the lands 4. On the other hand, FIG. 5B shows a portion where mounting is unnecessary, and the fixing adhesive 2 is applied to the surface of the land 4.

As described above, according to the present embodiment, the fixing adhesive 2 is applied to the surface of the land 3 where the electronic component 4 is not mounted when the mounting state is checked after mounting the electronic component 4 on the printed circuit board. Therefore, the operator does not need to check the drawings and can perform the checking operation very easily with a single visual inspection.

The method of mounting components (lead components) on a printed circuit board for surface mount type components has been described above. However, as another embodiment, a method of mounting components on a printed circuit board using both surface mount components and through-hole insertion components is also described. ,
The same checking operation can be performed by applying a fixing adhesive to the through-hole at a position where the lead component is not mounted. FIG. 6A is a cross-sectional view showing a mounting part of a lead component, and FIG. 6B is a cross-sectional view showing a non-mounting part. When a surface mount component and a lead component are used together, the lead component is generally retrofitted. Therefore, when applying the adhesive to the surface mount component shown in FIG. 1, the fixing adhesive 9 is applied by a dispenser to one entrance of the through hole 7 where the lead component 6 is not mounted. At this time, the fixing adhesive 9 is not applied to the through holes 7 at the insertion positions. As described above, the fixing adhesive 9 is irradiated with ultraviolet rays, the surface is cured, and then the whole is cured by heating. Then, the lead components 6 and the leads 7 are inserted into predetermined through holes 7 of the printed circuit board. At this time, the fixing adhesive 9 is applied to one of the through holes 7 where the lead component 6 is not mounted, so that the position can be easily confirmed. Further, since the fixing adhesive 9 is cured, the lead component 6 is substantially removed.
Cannot be inserted into the through hole 7, and no insertion error occurs.

Next, as an application example, the following confirmation operation may be performed by changing the location on the printed circuit board to which the fixing adhesive is applied. First, the number printed on the printed circuit board is applied with a fixing adhesive, and the date of manufacture is displayed. When there is a specification change, a fixing adhesive is applied to a place where the number of changes (version number) and the contents thereof are displayed. By such means, it is possible to confirm the date of manufacture, the change in specifications, the number of changes, and the contents by simply checking the marking location.

〔The invention's effect〕

As described above, according to the present invention, since the fixing adhesive is applied to the surface of the land at the position where the component mounting of the printed circuit board is not required, the work of comparing and checking the drawing is unnecessary, and the work of checking for mounting leakage and the like can be shortened in a short time. , And omission of confirmation can be further reduced.

[Brief description of the drawings]

1 to 6 show an embodiment of the present invention.
FIG. 1 is a partial perspective view showing a state where a fixing adhesive is applied to the surface of a printed circuit board, FIG. 2 is a partial perspective view showing a state where an electronic component is mounted on a land, and FIG. Partial perspective view showing a state of being cured by ultraviolet rays, FIG.
FIG. 5 is a partial perspective view of the printed circuit board when checking the component mounting state, FIG. 5 is a partial cross-sectional view of the printed circuit board after soldering is completed, and FIG. 6 is a printed circuit board showing an embodiment including lead components. Partial sectional view. 1 ... printed circuit board base material 2, 9 ... fixing adhesive,
3 Lands 4 Electronic components 5, 7 Leads

Claims (1)

(57) [Claims] 1. A method for mounting a component on a printed circuit board, the method comprising: applying an adhesive onto a base material at a mounting position of the surface mounted component on the printed circuit board; and bonding and fixing the surface mounted component. A method for mounting a component on a printed circuit board, wherein the adhesive is applied to a component mounting land at a non-mounting position of the component together with application to a material.